MC33XS2410ELR2 - Quad 100mOhm 60V SPI High-Side Switch | NXP
MPN: MC33XS2410ELR2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.92 | $5.92 |
| 10 | $5.33 | $53.30 |
| 100 | $4.62 | $462.00 |
| 500 | $4.1 | $2,050.00 |
| 1,000 | $3.68 | $3,680.00 |
MC33XS2410ELR2 Overview
A high-side switch is a power-switching element placed between the supply rail and the load, controlling power delivery while keeping the load referenced to ground. Within the power management hierarchy - semiconductor, power driver IC, load switch, smart high-side switch - devices like the MC33XS2410 combine the power MOSFET, gate driver, and protection logic into one surface-mount component, replacing discrete protection circuits.
Key features include the wide 3.0 V to 60 V operating supply range, SPI-based digital control and diagnostics, an integrated 12-bit A/D converter for on-chip monitoring of load current and voltages, and comprehensive protection functions typical of self-protected smart switches. This integration drastically simplifies hardware design and MCU software overhead, as NXP states in the product data sheet (Rev. 8, 7 July 2023).
The device has been qualified to the appropriate automotive standard, making it suitable for in-vehicle electronic control units. Digital current sensing through the embedded ADC allows precise load diagnostics, open-load and short-circuit detection without external shunt resistors or amplifiers, reducing bill-of-material cost in automotive and industrial power distribution modules.
Typical applications include automotive body-control module relay and LED loads, resistive and inductive loads in power distribution boxes, and industrial 24 V load switching where diagnostic feedback over SPI is required.
Design consideration: because the part supports both 100 mOhm quad and 50 mOhm dual-channel configurations, verify the parallel-channel configuration and thermal design against worst-case continuous load current early in the design.
This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with prices as of 2026-09-13.
Drop-in alternatives for MC33XS2410ELR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC33XS2410EL
✅ Drop-In✓ In Stock
$6.86 / Unit
View Datasheet →MC34XS2410ELR2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
MC33XS2410ELR2 Maximum Ratings & Electrical Characteristics
| Function | Four-channel self-protected high-side switch |
| Configuration | Quad 100 mOhm / dual 50 mOhm (configurable) |
| On-Resistance | 100 mOhm per channel (50 mOhm in parallel mode) |
| Operating Supply Voltage | 3.0 V to 60 V |
| Channel Count | 4 (1:4 power switch/driver) |
| Output Current | 3.6 A (per distributor listing) |
| Control Interface | SPI with digital monitoring and control |
| ADC | Embedded 12-bit analog-to-digital converter |
| Protection | Self-protected (integrated protection functions) |
| Packaging Option | Rail (ELR2 reel/tube suffix per Mouser listing) |
| Package | 28-pin HTSSOP (TSSOP28) |
| Mounting Type | Surface Mount |
| Qualification | Automotive qualified (per NXP product page) |
| Data Sheet Revision | Rev. 8, 7 July 2023 |
| Lifecycle Status | NRND (per NXP product page for MC33XS2410EL) |
MC33XS2410ELR2 28-pin htssop (tssop28) Pin Configuration Guide
Pin configuration for MC33XS2410ELR2 (28-pin htssop (tssop28) package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for MC33XS2410ELR2.
Refer to the datasheet for full pin configuration.
Typical Applications
MC33XS2410ELR2 is suitable for 6 applications: Automotive Body Control Module Load Driving, Automotive LED Lighting Modules, Industrial 24 V Power Distribution, Resistive, Inductive and Capacitive Load Switching, Power Distribution Box / Smart Fuse Applications, ECU Battery Reverse-Polarity Protected Supplies.
Automotive Body Control Module Load Driving
The MC33XS2410ELR2 fits body control modules (BCM) where multiple relays, lamps, and resistive loads must be switched from a 12 V automotive rail. Its four integrated 100 mOhm channels replace four discrete MOSFET-plus-protection circuits, and the 3.0 V to 60 V operating range covers jump-start and load-dump transients without additional clamping in many designs. The embedded 12-bit ADC reports per-channel load current over SPI, enabling lamp open/short detection demanded by automotive diagnostic requirements. Because the device is automotive qualified per NXP, it suits AEC-qualified BCM platforms. Configuration flexibility - quad 100 mOhm or dual 50 mOhm - lets one part number serve both light and heavier load channels, simplifying sourcing.
Recommended
Automotive LED Lighting Modules
For LED daytime running lights, position lamps, and interior lighting, the MC33XS2410ELR2 provides low 100 mOhm on-resistance channels that minimize conduction loss in continuous LED load operation. Per Digi-Key listings the device supports up to 3.6 A per channel, adequate for medium-power LED strings, and paralleled 50 mOhm dual-channel mode serves higher current lamps. The 12-bit ADC and SPI diagnostics detect LED open-circuit and short-to-ground faults digitally, meeting lighting failure-indication requirements without external sense resistors. The 60 V maximum rating protects against automotive transient events. Thermal design must account for I-squared times Rds(on) dissipation; the exposed-pad HTSSOP package transfers heat to the PCB copper pour.
Recommended
Industrial 24 V Power Distribution
In industrial control panels and machinery running 24 V rails, the MC33XS2410ELR2 switches four loads with a single 28-pin HTSSOP device controlled by SPI from the host MCU. The 3.0 V to 60 V supply range comfortably covers 24 V nominal systems with transient margin, while 100 mOhm channels keep dissipation low - at 2 A continuous, each channel dissipates an estimated 0.4 W. The self-protected architecture provides integrated fault management, and the 12-bit ADC delivers per-channel current telemetry for predictive-maintenance analytics. Compared with discrete MOSFET solutions such as IRFZ48NSTRLPBF plus driver circuitry, this integrated switch saves board area, protection design effort, and software development time.
Recommended
Resistive, Inductive and Capacitive Load Switching
The MC33XS2410ELR2 is specified by NXP as a self-protected switch for all three load classes: resistive (heaters, relays), inductive (solenoids, motors, relay coils), and capacitive (lamp inrush, decoupling loads). Inductive turn-off energy is managed by the device's integrated clamp/protection, eliminating external freewheeling components in many low-energy solenoid cases. Capacitive inrush is handled by the smart-switch current-limiting behavior, and diagnostic flags report anomalous inrush over SPI. This makes the part a general-purpose power distribution element in ECUs where a single family must cover heterogeneous load types. Designers should confirm clamp energy ratings in the NXP data sheet against worst-case solenoid or motor load energy before release.
Recommended
Power Distribution Box / Smart Fuse Applications
Replacing conventional blade fuses, the MC33XS2410ELR2 acts as a resettable electronic fuse in power distribution boxes. Its 12-bit ADC measures real-time channel current, allowing the MCU to implement I2t trip curves, selective load shedding, and fault logging - functions a melting fuse cannot provide. Four channels per device increase distribution density; the SPI bus daisy-chains diagnostics to the vehicle or machine controller. Because the channels share one package, thermal interaction between adjacent channels should be evaluated at full simultaneous load. The NRND status of the base MC33XS2410EL warrants a lifecycle check before committing new distribution-box platforms, though distributor stock remained available as of 2026-09-13.
Recommended
ECU Battery Reverse-Polarity Protected Supplies
The wide 3.0 V to 60 V input rating and self-protected design of the MC33XS2410ELR2 allow it to sit directly on automotive battery rails feeding switched sub-supplies, tolerating reverse-battery and transient conditions handled by its protection functions per the NXP data sheet. The 28-pin HTSSOP exposed pad provides a low-impedance thermal path to ground planes, essential when all four channels carry simultaneous load. SPI control lets the central MCU sequence and gate power to sub-modules, supporting sleep-current budgets in vehicles. Estimated: at 12 V system voltage and 3 A per channel, conduction loss per channel is approximately 0.9 W (I^2 x 100 mOhm), so copper pour sizing and airflow must be verified at maximum simultaneous loading.
Recommended
Recommended Products Summary
Engineering reference data for MC33XS2410ELR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC33XS2410EL | MC34XS2410ELR2 |
|---|---|---|---|
| Package | 28-pin HTSSOP (TSSOP28) | 28-pin HTSSOP - same | 28-pin HTSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Channel Count | 4 | 4 | 4 (same family) |
| Control Interface | SPI + integrated 12-bit ADC | SPI + integrated 12-bit ADC | SPI + integrated 12-bit ADC |
Key Differentiators
- Four channels in one 28-pin HTSSOP with shared SPI diagnostics (vs BTS70021EPPXUMA1)
- Configurable 100 mOhm quad / 50 mOhm dual architecture (vs MC33XS2410EL)
- Wide 3.0 V to 60 V operating range with integrated ADC (vs IRFZ48NSTRLPBF)
Design Notes
Each 100 mOhm channel dissipates I^2 x 0.1 Ohm. Estimated: at 3 A continuous per channel, that is 0.9 W per channel; with all four channels loaded simultaneously, total dissipation approaches 3.6 W, so the exposed pad of the 28-pin HTSSOP must be soldered to a substantial ground copper pour with multiple thermal vias. Verify junction temperature against the data sheet theta_JA for your PCB stack-up, and derate in high under-hood ambient temperatures before releasing the design.
Route the SPI bus (CSB, SCLK, SI, SO) away from the high-current output traces to prevent switching transients from coupling into the digital interface, and keep the RSTB line properly pulled to its inactive level so the device does not float into an undefined state during MCU reset. Place the device so the four high-side output pins have short, wide traces to the load connectors to minimize voltage drop and radiated area.
The MC33XS2410EL base part is NRND on the NXP product page - before designing into a new platform, confirm lifecycle status and secure last-time-buy quantities if needed. Additionally, when configuring dual 50 mOhm parallel-channel mode, confirm the SPI configuration registers match the intended channel mapping; mismatched configuration can leave channels unswitched. Always validate the full SPI command map and diagnostic reporting behavior against the NXP data sheet Rev. 8 (7 July 2023) firmware specification.
Compliance Information
NXP product page states the MC33XS2410 has been qualified to the appropriate automotive standard; specific AEC-Q100 grade level and RoHS/REACH declarations were not present in the provided verified data.
