MC7448VU1400ND - 1.4GHz PowerPC G4 MPU | NXP 360-FCCBGA
MPN: MC7448VU1400ND ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.4 | $78.40 |
| 10 | $72.1 | $721.00 |
| 100 | $64.5 | $6,450.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $52.75 | $52,750.00 |
MC7448VU1400ND Overview
A microprocessor (MPU) is the central execution unit of an embedded computing system, fetching instructions, performing arithmetic and logic operations, and coordinating data flow between memory and peripherals. Within the broader taxonomy, the MPC7448 belongs to the PowerPC processor family -> embedded MPU -> 32-bit microprocessor -> semiconductor IC. The MC7448VU1400ND is part of the Power Architecture ecosystem and is pin-compatible with other MPC7448 variants that share the same 360-FCCBGA package, enabling system designers to scale CPU performance across product lines.
Key specifications include a 1.4 GHz core clock, a 200 MHz bus-to-core ratio of 7x, dedicated L1 caches (32 KB instruction and 32 KB data), a unified 1 MB L2 cache with built-in ECC, and the AltiVec 128-bit vector execution unit. The part operates from a 1.15 V core supply with separate 1.5 V / 1.8 V / 2.5 V I/O rails and supports junction temperatures up to 105 °C, making it well-suited for thermally constrained embedded chassis.
Architecturally, the MPC7448 is the first high-performance PowerPC processor built on a 90 nm SOI process, which reduces dynamic power versus bulk CMOS while maintaining clock headroom. It implements the Power Architecture instruction set and includes speculative out-of-order execution, a 128-bit memory bus, and on-chip thermal management for adaptive clock throttling. The MC7448VU1400ND variant specifies the higher 1.4 GHz speed grade compared with the 1.267 GHz (1267) and 1.0 GHz (1000) speed bins in the same family.
Typical applications include network routers and switches, telecom line cards, high-end printers and imaging equipment, aerospace mission computers, military signal-processing subsystems, and storage controllers that benefit from AltiVec acceleration. The MPX/60x bus permits integration with established PowerPC chip sets, including the MPC107/MPC8641 host bridges.
When designing with the MC7448VU1400ND, follow NXP Application Note AN2185 (thermal management) and provide at least four signal layers for the FCCBGA breakout with matched-length impedance for the processor bus. Decouple each voltage rail with bulk and 0.1 µF ceramic capacitors placed within 5 mm of the balls.
This page synthesizes distributor stock levels, drop-in pin-compatible alternatives, and design notes not found in a single datasheet view, giving embedded-procurement engineers a faster cross-reference for the MPC7448 family.
Drop-in alternatives for MC7448VU1400ND — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC7448VU1400ND (same form factor and footprint) — differing in Core Voltage, L2 Cache, Mounting Type, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC7448VU1400NC
✅ Drop-In📋 Reference alternative (not in catalog)
MC7448HX1400ND
✅ Drop-In📋 Reference alternative (not in catalog)
MC7448TVU1267ND
✅ Drop-In📋 Reference alternative (not in catalog)
MPC7448VS1400ND
✅ Drop-In📋 Reference alternative (not in catalog)
MPC7448THX1400ND
✅ Drop-In📋 Reference alternative (not in catalog)
MC7448VU1400ND Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Family | MPC7448 (PowerPC G4) |
| Core Architecture | PowerPC Power Architecture, 32-bit |
| Core Clock Speed | 1.4 GHz |
| Bus-to-Core Ratio | 7x |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 1 MB unified, on-chip with ECC |
| SIMD Engine | AltiVec (128-bit vector unit) |
| System Bus | MPX/60x |
| Process Technology | 90 nm SOI |
| Core Voltage | 1.15 V |
| I/O Voltages | 1.5 V / 1.8 V / 2.5 V |
| Junction Temperature (TJ) | 0 °C to 105 °C |
| Package | 360-FCCBGA (Flip-Chip Ceramic BGA) 25 x 25 mm |
| Mounting Type | Surface Mount (BGA) |
| Number of Terminals | 360 |
| Package Code (JEDEC) | LGA-style, flip-chip ceramic BGA |
| Terminal Form | No-lead (flip-chip ball) |
| Temperature Grade | Other (extended commercial/industrial) |
| RoHS Status | Compliant (lead-free) |
| Core Count | 1 |
| Bit Width | 32-bit |
| Product Lifecycle | Obsolete / End of Life |
MC7448VU1400ND lga-style, flip-chip ceramic bga Pin Configuration Guide
Pin configuration for MC7448VU1400ND (lga-style, flip-chip ceramic bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC7448VU1400ND.
Refer to the datasheet for full pin configuration.
Typical Applications
MC7448VU1400ND is suitable for 7 applications: Network Router Line Card, Aerospace and Defense Mission Computer, High-End Printer and Imaging Controller, Industrial Storage Controller (RAID / NAS), Telecom Baseband Processing Card, Single-Board Computer for Embedded Linux, Test and Measurement Instrumentation.
Network Router Line Card
The MC7448VU1400ND's 1.4 GHz PowerPC core, AltiVec SIMD, and MPX/60x bus make it a strong match for high-speed network router line cards that need deep packet inspection and encryption offload. With 32 KB L1 I-cache, 32 KB L1 D-cache, and 1 MB on-chip L2 cache with ECC, the MPC7448 sustains low-latency forwarding under heavy traffic bursts while keeping PCB thermals within 105 °C junction. Paired with the NXP MPC107 or Tsi107 host bridge, designers integrate it into PowerPC-based chassis with no firmware port. Its 1.15 V core reduces dynamic power relative to bulk-CMOS predecessors, helping line-card density per slot. Use it alongside the MPC107 for full MPX/60x bus compliance.
Recommended
Aerospace and Defense Mission Computer
The MC7448VU1400ND is widely deployed in aerospace mission computers where Power Architecture software, deterministic interrupt latency, and AltiVec signal-processing throughput are required. The 360-FCCBGA package provides robust mechanical stability for conduction-cooled ATR chassis, while the 90 nm SOI process delivers 1.4 GHz compute at low power for SWaP-constrained avionic subsystems. Its ECC-protected 1 MB L2 cache supports safety-critical software certification under DO-178C workflows. Conformal coating and underfill are recommended for high-vibration airframes. The MPC7448 family maintains long-term firmware stability, which is essential for defense programs where software revalidation costs dominate.
Recommended
High-End Printer and Imaging Controller
Office production printers leverage the MC7448VU1400ND's AltiVec engine to accelerate image rendering pipelines (RIP), JPEG 2000 decode, and color-space conversion at high page-per-minute rates. The 1 MB on-chip L2 cache holds compressed band buffers without external memory pressure, while the 128-bit AltiVec SIMD unit provides parallel pixel operations at rates unattainable on integer-only cores. The MPX/60x bus easily connects to DDR memory controllers and Gigabit Ethernet PHYs, enabling networked printer controllers. Its 1.15 V core keeps thermal dissipation low enough for compact printer housings, supporting 24/7 duty cycles.
Recommended
Industrial Storage Controller (RAID / NAS)
The MC7448VU1400ND fits enterprise RAID and NAS controllers that need strong sequential and random I/O throughput combined with on-chip ECC for data integrity. The 1.4 GHz core handles XOR acceleration, parity computation, and filesystem metadata operations, while AltiVec SIMD accelerates CRC32 and Reed-Solomon codecs used in storage arrays. The MPX/60x bus interfaces to multi-channel SATA/SAS HBAs, and the 1 MB L2 cache supports large stripe-cache structures. ECC on the L2 cache is essential for enterprise data integrity SLAs. Drop it onto existing MPC7448 reference designs with minimal board rework.
Recommended
Telecom Baseband Processing Card
The MC7448VU1400ND powers telecom baseband line cards where AltiVec accelerates FFT/iFFT, turbo/Viterbi decoding, and channel-coding algorithms used in 3G/4G signal chains. Its 1.4 GHz clock and Power Architecture vector throughput deliver deterministic throughput per DSP workload, while the MPX/60x bus connects to TDM framer and DSP co-processors. The 90 nm SOI process keeps per-card power under typical NEBS thermal limits. Industrial junction temperature (0-105 °C) supports outdoor cabinet deployment. Field-proven in legacy carrier equipment where firmware porting is the dominant cost.
Recommended
Single-Board Computer for Embedded Linux
The MC7448VU1400ND runs Power Architecture Linux distributions (Yellow Dog, Debian PowerPC, ELDK toolchains) on legacy VME/VPX single-board computers used in scientific instruments, test equipment, and military hardware. Its 1.4 GHz performance sustains real-time data acquisition and onboard analysis, while the 1 MB ECC L2 cache maintains data integrity in long-running DSP or instrument-control workloads. The MPX/60x bus integrates cleanly with legacy VME bridges (Tundra Tsi148), preserving backward compatibility with installed bases. Designers extending product life without full board redesign use the MPC7448's drop-in upgrade path.
Recommended
Test and Measurement Instrumentation
The MC7448VU1400ND suits high-end oscilloscopes, logic analyzers, and protocol analyzers that demand real-time DSP throughput for FFT, eye-diagram analysis, and signal de-embedding. AltiVec SIMD accelerates waveform math, while the 1.4 GHz PowerPC core coordinates display, GUI, and remote-control tasks. The MPX/60x bus connects to high-bandwidth ADC front-ends via PCI-X bridges, and the 1 MB L2 cache stores deep capture buffers. ECC-protected cache preserves measurement integrity for regulatory and calibration workflows. Long-term firmware support is critical for instruments with multi-decade field deployments.
Recommended
Recommended Products Summary
Engineering reference data for MC7448VU1400ND — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC7448VU1400NC | MC7448HX1400ND | MC7448TVU1267ND | MPC7448VS1400ND | MPC7448THX1400ND |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Core Clock Speed | 1.4 GHz | 1.4 GHz | 1.4 GHz | 1.267 GHz | 1.4 GHz | 1.4 GHz |
| L2 Cache | 1 MB unified, ECC | 1 MB unified, ECC | 1 MB unified, ECC | 1 MB unified, ECC | 1 MB unified, ECC | 1 MB unified, ECC |
| AltiVec SIMD | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Core Voltage | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V |
| Junction Temperature | 0 to 105 °C | 0 to 105 °C | 0 to 105 °C | 0 to 105 °C | 0 to 105 °C | 0 to 105 °C |
| Process Technology | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
Key Differentiators
- Highest clock speed in the MPC7448 line (vs MC7448TVU1267ND)
- VU stepping offers lower power than HX stepping (vs MC7448HX1400ND)
- Industrial temperature grade variant (vs MC7448VU1400NC)
Design Notes
Estimated: at Vcore = 1.15 V and typical core power ~15 W at 1.4 GHz full load, junction temperature rise for a 360-FCCBGA in still air (theta_JA ~10 °C/W with thermal slug) is ~150 °C above ambient. Provide a heatsink, heat-spreader lid, or chassis conduction path to keep Tj under 105 °C. Reference NXP Application Note AN2185 for MPC7448 thermal design guidance.
Use at least four signal layers and a dedicated power plane for the 360-FCCBGA breakout. Match bus trace lengths within +/-50 mil for the MPX/60x bus to maintain timing margin. Place bulk + 0.1 µF ceramic decoupling within 5 mm of each power ball, and provide stitching vias around the BGA field for return-path integrity.
The MC7448VU1400ND is obsolete. Do not design new production systems on this part. Use NXP QorIQ (LS1021A, T1042) or Layerscape for new designs to avoid future EOL risk. For legacy board refresh, qualify at least one drop-in alternate (MC7448HX1400ND or MC7448VU1400NC) and validate firmware at first silicon revision.
Series-terminate the MPX/60x bus with 22-33 Ω resistors placed within 250 mil of the MPC7448 driver balls. Use a 4-layer stack-up with controlled-impedance (50 Ω single-ended, 100 Ω differential) for the address/data bus. Validate with IBIS simulation against the MPC107/Tsi107 host bridge load model before committing layout.
Compliance Information
RoHS and lead-free per NXP product page. AEC-Q100 not applicable for MPU. Halogen-free status not explicitly stated in provided data; treat as unknown.
