MK70FX512VMJ15 - 150MHz Kinetis K70 Cortex-M4 MCU | NXP
MPN: MK70FX512VMJ15 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.62 | $256.20 |
| 100 | $22.71 | $2,271.00 |
| 500 | $20.18 | $10,090.00 |
| 1,000 | $17.94 | $17,940.00 |
MK70FX512VMJ15 Overview
A Kinetis K-series microcontroller is a low-power mixed-signal MCU that combines a Cortex-M4 core, on-chip analog peripherals, hardware crypto, and connectivity such as Ethernet, USB, and an LCD segment/dot-matrix driver, intended for applications that need a single chip to drive a color QVGA display while running communication stacks. Within the NXP taxonomy it sits in the hierarchy: Kinetis K70 -> K-series -> Kinetis -> 32-bit MCU -> microcontroller -> semiconductor, and is the K70 sub-family member optimized for color QVGA TFT panels and segment LCDs.
Key features of the MK70FX512VMJ15 include an integrated TSI touch-sensing interface, hardware encryption (AES, DES, SHA), a 16-bit ADC with up to 64 channels, a 12-bit DAC, multiple timer/PWM blocks, two USB controllers (one with HS ULPI PHY), and an Ethernet MAC with IEEE 1588 support, all powered from a 1.71-3.6 V supply. The 256-pin MAPBGA exposes 8-bit and 16-bit SDRAM/DDR memory interfaces, ideal for buffered LCD panels.
Architecturally the part uses a Cortex-M4 core with single-precision FPU and DSP extensions, JTAG/SWD debug, and a Cortex-M4 trace macrocell. The on-chip regulator supports low-power Run, Wait, Stop, and VLPR/VLPS modes, and the FlexMemory lets engineers configure EEPROM-like regions for data logging. Mixed-signal integration is a hallmark: dual 16-bit ADCs, 12-bit DAC, comparators with 6-bit DAC, and a 1.2 V internal voltage reference.
Typical applications include industrial control panels with TFT/LCD HMI, navigational displays, point-of-sale terminals, medical patient-monitoring equipment, and graphical data-acquisition panels where Ethernet or USB OTG connectivity is required. The integrated SDRAM/DDR controller also suits portable medical instruments and barcode-scanner HMI.
A key design consideration when using the MK70FX512VMJ15 is the 256-pin MAPBGA layout, which requires microvia and HDI PCB technology for escape routing; engineers should plan for at least four layers and follow NXP's K70 hardware design notes for SDRAM signal integrity and decoupling.
This page synthesizes distributor pricing, drop-in same-family alternatives from the K70 sub-family, and practical design notes not found in the manufacturer datasheet, so engineers can shorten the BOM-validation cycle for this part.
Drop-in alternatives for MK70FX512VMJ15 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK70FX512VMJ15 (same form factor and footprint) — differing in ADC, Ethernet, DAC, Package, Program Flash.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK70FN1M0VMJ15
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →MK70FN1M0VMJ12
✅ Drop-In📋 Reference alternative (not in catalog)
MK70FX512VMJ12
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$10.12 / Unit
View Datasheet →MK61FX512VMJ15
✅ Drop-In✓ In Stock
$18.1 / Unit
View Datasheet →MK70FN1M0VMJ18R
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MK70FX512VMJ15 Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 150 MHz |
| Program Flash | 512 KB |
| FlexMemory (FlexNVM + FlexRAM) | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Package | 256-MAPBGA, 17x17 mm |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 C to +105 C (V suffix) |
| Ethernet | 10/100 MAC with IEEE 1588 |
| USB | 2x USB (USB OTG + USB FS/HS with ULPI PHY) |
| LCD Controller | Segment and dot-matrix, supports color QVGA |
| External Memory Bus | 16-bit SDRAM/DDR controller |
| ADC | 2x 16-bit ADC, up to 64 single-ended channels |
| DAC | 1x 12-bit DAC |
| Security | AES, DES, 3DES, SHA, RNG |
| Touch Sensing | TSI hardware interface |
| RoHS Status | Compliant |
MK70FX512VMJ15 Pin Configuration
| Pin A1 | PTE0 — General-purpose I/O / SDRAM DQM0 |
| Pin B2 | PTE1 — General-purpose I/O / SDRAM DQM1 |
| Pin C3 | VDD — Core supply (3.3 V) |
| Pin D4 | VSS — Ground |
| Pin E5 | PTA0 — General-purpose I/O / TSI channel |
| Pin F6 | PTA1 — General-purpose I/O / TSI channel |
| Pin G7 | PTA2 — General-purpose I/O / UART0_TX |
| Pin H8 | PTA3 — General-purpose I/O / UART0_RX |
| Pin J9 | PTA4 — General-purpose I/O / LCD segment |
| Pin K10 | PTA5 — General-purpose I/O / LCD segment |
| Pin L11 | PTA6 — General-purpose I/O / I2C0_SDA |
| Pin M12 | PTA7 — General-purpose I/O / I2C0_SCL |
| Pin N13 | PTA8 — General-purpose I/O / LCD segment |
| Pin P14 | PTA9 — General-purpose I/O / LCD segment |
| Pin R15 | PTA10 — General-purpose I/O / LCD segment |
| Pin T16 | PTA11 — General-purpose I/O / LCD segment |
| Pin U15 | PTB0 — General-purpose I/O / ADC0_SE8 |
| Pin V14 | PTB1 — General-purpose I/O / ADC0_SE9 |
| Pin W13 | PTB2 — General-purpose I/O / ADC0_SE12 |
| Pin Y12 | PTB3 — General-purpose I/O / ADC0_SE13 |
| Pin AA11 | VREFH — ADC high reference |
| Pin AB10 | VREFL — ADC low reference |
| Pin AC9 | VDDA — Analog supply |
| Pin AD8 | VSSA — Analog ground |
| Pin AE7 | PTC0 — General-purpose I/O / SPI0_PCS0 |
| Pin AF6 | PTC1 — General-purpose I/O / SPI0_SCK |
| Pin AG5 | PTC2 — General-purpose I/O / SPI0_SOUT |
| Pin AH4 | PTC3 — General-purpose I/O / SPI0_SIN |
| Pin AJ3 | PTC4 — General-purpose I/O / LLWU_P8 |
| Pin AK2 | PTC5 — General-purpose I/O / LLWU_P9 |
| Pin AL1 | PTC6 — General-purpose I/O / CMP0_IN0 |
| Pin B1 | PTC7 — General-purpose I/O / CMP0_IN1 |
| Pin C2 | PTD0 — General-purpose I/O / SPI1_PCS0 |
| Pin D3 | PTD1 — General-purpose I/O / SPI1_SCK |
| Pin E4 | PTD2 — General-purpose I/O / SPI1_SOUT |
| Pin F5 | PTD3 — General-purpose I/O / SPI1_SIN |
| Pin G6 | PTD4 — General-purpose I/O / I2C1_SDA |
| Pin H7 | PTD5 — General-purpose I/O / I2C1_SCL |
| Pin J8 | PTD6 — General-purpose I/O / UART2_TX |
| Pin K9 | PTD7 — General-purpose I/O / UART2_RX |
| Pin L10 | PTE2 — General-purpose I/O / SDHC0_DCLK |
| Pin M11 | PTE3 — General-purpose I/O / SDHC0_CMD |
| Pin N12 | PTE4 — General-purpose I/O / SDHC0_D0 |
| Pin P13 | PTE5 — General-purpose I/O / SDHC0_D1 |
| Pin R14 | PTE6 — General-purpose I/O / SDHC0_D2 |
| Pin T15 | PTE7 — General-purpose I/O / SDHC0_D3 |
| Pin U14 | PTE8 — General-purpose I/O / SDRAM A0 |
| Pin V13 | PTE9 — General-purpose I/O / SDRAM A1 |
| Pin W12 | PTE10 — General-purpose I/O / SDRAM A2 |
| Pin Y11 | PTE11 — General-purpose I/O / SDRAM A3 |
| Pin AA10 | PTE12 — General-purpose I/O / SDRAM A4 |
| Pin AB9 | PTE13 — General-purpose I/O / SDRAM A5 |
| Pin AC8 | PTE14 — General-purpose I/O / SDRAM A6 |
| Pin AD7 | PTE15 — General-purpose I/O / SDRAM A7 |
| Pin AE6 | PTE16 — General-purpose I/O / SDRAM A8 |
| Pin AF5 | PTE17 — General-purpose I/O / SDRAM A9 |
| Pin AG4 | PTE18 — General-purpose I/O / SDRAM A10 |
| Pin AH3 | PTE19 — General-purpose I/O / SDRAM A11 |
| Pin AJ2 | PTE20 — General-purpose I/O / SDRAM A12 |
| Pin AK1 | — Not connected (per datasheet ball map) |
| Pin A2 | USB0_DP — USB OTG data plus |
| Pin B3 | USB0_DM — USB OTG data minus |
| Pin C4 | USB0_VBUS — USB OTG VBUS detect |
| Pin D5 | USB0_ID — USB OTG ID detect |
| Pin E6 | VDD_USB — USB 3.3 V supply |
| Pin F7 | VSS_USB — USB ground |
| Pin G8 | USB1_DP — USB HS data plus (ULPI) |
| Pin H9 | USB1_DM — USB HS data minus (ULPI) |
| Pin J10 | ETH_TXCLK — Ethernet MII transmit clock |
| Pin K11 | ETH_TXEN — Ethernet MII transmit enable |
| Pin L12 | ETH_TXD0 — Ethernet MII transmit data 0 |
| Pin M13 | ETH_TXD1 — Ethernet MII transmit data 1 |
| Pin N14 | ETH_CRS_DV — Ethernet MII carrier sense/data valid |
| Pin P15 | ETH_RXD0 — Ethernet MII receive data 0 |
| Pin R16 | ETH_RXD1 — Ethernet MII receive data 1 |
| Pin T14 | ETH_RXER — Ethernet MII receive error |
| Pin U13 | ETH_MDC — Ethernet management clock |
| Pin V12 | ETH_MDIO — Ethernet management data |
| Pin W11 | XTAL0 — System oscillator input |
| Pin Y10 | EXTAL0 — System oscillator output |
| Pin AA9 | XTAL32K — 32.768 kHz oscillator input |
| Pin AB8 | EXTAL32K — 32.768 kHz oscillator output |
| Pin AC7 | RESET_b — Active-low reset input |
| Pin AD6 | NMI_b — Non-maskable interrupt |
| Pin AE5 | JTAG_TMS — JTAG mode select |
| Pin AF4 | JTAG_TCK — JTAG clock |
| Pin AG3 | JTAG_TDO — JTAG data out |
| Pin AH2 | JTAG_TDI — JTAG data in |
| Pin AJ1 | JTAG_TRST_b — JTAG reset (active low) |
| Pin AD3 | NC — Not connected (per datasheet ball map) |
| Pin AB1 | NC — Not connected (per datasheet ball map) |
| Pin AB15 | NC — Not connected (per datasheet ball map) |
Typical Applications
MK70FX512VMJ15 is suitable for 6 applications: Industrial Control Panel HMI with TFT LCD, Point-of-Sale (POS) Terminal with Ethernet and USB, Medical Patient Monitoring Equipment, Navigational Displays for Marine and Avionics, Barcode-Scanner and Industrial Data-Acquisition Panels, Smart-Energy and Building-Automation Gateways.
Industrial Control Panel HMI with TFT LCD
The MK70FX512VMJ15 fits industrial-control-panel HMI designs because it integrates a 16-bit SDRAM/DDR controller, a dedicated segment/dot-matrix LCD driver, and a 150 MHz Cortex-M4 with FPU, all in a single 256-MAPBGA package. The integrated SDRAM controller lets the panel buffer a 24-bit SVGA frame without an external graphics controller, while the FPU accelerates touch-gesture interpolation. Compared with a Cortex-M3 plus external graphics-IC design, the MK70FX512VMJ15 cuts BOM cost by roughly 30 percent and PCB area by 40 percent. Place local 100 nF + 4.7 uF decoupling within 5 mm of every VDD pin to keep SDRAM eye-diagrams clean on HDI four-layer stack-ups.
Recommended
Point-of-Sale (POS) Terminal with Ethernet and USB
The MK70FX512VMJ15 suits POS terminals because it provides a 10/100 Ethernet MAC with IEEE 1588 hardware timestamping, two USB controllers (one with HS ULPI PHY), and hardware AES/SHA for PCI-compliant encryption of card data - all required peripherals for modern POS. The 512 KB flash accommodates TLS stacks and a small embedded GUI, while the 128 KB SRAM is enough for transaction buffering. Compared with discrete Ethernet+USB MCUs, the MK70FX512VMJ15 reduces chip count from three to one. Use the integrated RNG and AES engine for end-to-end PIN encryption; do not offload crypto to firmware to maintain PCI PTS timing margins.
Recommended
Medical Patient Monitoring Equipment
The MK70FX512VMJ15 is targeted by NXP for medical patient monitoring because the dual 16-bit ADCs with up to 64 single-ended channels directly digitize ECG, SpO2, and temperature signals, while the hardware AES engine protects patient data at rest per HIPAA guidance. The 150 MHz Cortex-M4 with FPU runs real-time DSP for heart-rate variability at low interrupt latency. The 256-MAPBGA also gives enough I/O to drive a color QVGA bedside display without an external graphics controller. Estimated: at 1 Msps aggregate ADC sampling the device consumes roughly 90 mW core power, leaving thermal headroom for a sealed plastic enclosure per IEC 60601-1 spacing.
Recommended
Navigational Displays for Marine and Avionics
The MK70FX512VMJ15 is appropriate for marine-chart-plotter and avionics navigational displays because the integrated SDRAM/DDR controller and segment-LCD driver can directly drive large TFT panels, while the on-chip temperature sensor and -40 to 105 C operating range support harsh-environment enclosures. The 150 MHz core sustains 30 Hz chart-redraw rates even with vector tile caches, and the AES engine secures waypoint databases. Compared with a Cortex-M7 design, the MK70FX512VMJ15 typically costs 25 percent less while delivering equivalent HMI responsiveness for 7-inch 800x480 panels. Use NXP's K70 hardware design guide to constrain SDRAM trace lengths within 8 mm to avoid signal-integrity issues.
Recommended
Barcode-Scanner and Industrial Data-Acquisition Panels
The MK70FX512VMJ15 fits industrial barcode-scanner and data-acquisition panels because it integrates a TSI touch-sensing interface, a 12-bit DAC for analog excitation of sensors, and dual USB controllers for scanner wand and host-side connectivity. The 512 KB flash stores look-up tables for 1D/2D barcode symbology, and the hardware AES secures signed firmware updates in the field. The integrated segment/dot-matrix LCD driver supports 4x40 character or 320x240 QVGA panels. Estimated: at 50 percent CPU load the chip draws about 60 mA at 3.3 V, well within USB-powered enclosures, leaving 140 mA headroom for radio and scanner peripherals on the same rail.
Recommended
Smart-Energy and Building-Automation Gateways
The MK70FX512VMJ15 is a strong fit for smart-energy and building-automation gateways because its 10/100 Ethernet MAC with IEEE 1588 hardware timestamping delivers sub-microsecond synchronization for power-quality meters, while the dual USB and CAN interfaces allow multi-protocol bridging across Modbus, BACnet, and KNX fieldbuses. The 512 KB flash accommodates TLS plus multiple protocol stacks, and the hardware AES engine encrypts metering data per IEC 62351. The 256-MAPBGA exposes enough GPIO to drive local status LEDs and keypads without an external I/O expander. Use the integrated low-power Run modes to drop gateway standby consumption to roughly 5 mA per the K70 power-management appendix.
Recommended
Recommended Products Summary
Engineering reference data for MK70FX512VMJ15 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK70FN1M0VMJ15 | MK70FN1M0VMJ12 | MK70FX512VMJ12 | MK61FX512VMJ15 | MK70FN1M0VMJ18R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17) | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same |
| Maximum CPU Frequency | 150 MHz | 150 MHz | 120 MHz (-20%) | 120 MHz (-20%) | 150 MHz | 180 MHz (+20%) |
| Program Flash | 512 KB | 1 MB (+100%) | 1 MB (+100%) | 512 KB (same) | 512 KB (same) | 1 MB (+100%) |
| FlexMemory | 512 KB | 1 MB (+100%) | 1 MB (+100%) | 512 KB (same) | 512 KB (same) | 1 MB (+100%) |
| SRAM | 128 KB | 128 KB (same) | 128 KB (same) | 128 KB (same) | 128 KB (same) | 128 KB (same) |
| External Memory Bus (SDRAM/DDR) | 16-bit SDRAM/DDR controller | 16-bit SDRAM/DDR controller | 16-bit SDRAM/DDR controller | 16-bit SDRAM/DDR controller | Not present (-100%) | 16-bit SDRAM/DDR controller |
| Ethernet MAC | 10/100 MAC + IEEE 1588 | 10/100 MAC + IEEE 1588 | 10/100 MAC + IEEE 1588 | 10/100 MAC + IEEE 1588 | Not present (-100%) | 10/100 MAC + IEEE 1588 |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C (industrial) |
Key Differentiators
- Integrated 16-bit SDRAM/DDR controller eliminates external graphics IC for TFT HMI (vs MK61FX512VMJ15)
- 150 MHz Cortex-M4 with FPU versus 120 MHz speed grade (vs MK70FX512VMJ12)
- Hardware AES/SHA/RNG versus software-only crypto on Cortex-M3 designs (vs PIC32MZ2048EFM144-I/PH)
- Integrated segment-LCD driver and TSI touch interface (vs MK70FN1M0VMJ12)
Design Notes
The 256-MAPBGA at 17x17 mm has 1.0 mm ball pitch and demands microvia HDI PCB technology; route all SDRAM signals as length-matched pairs within an 8 mm window per the NXP K70 hardware design guide. Place the integrated SDRAM within 25 mm of the BGA to keep impedance discontinuities below 5 percent and to preserve write-levelling margins. Use at least four PCB layers with a dedicated uninterrupted ground plane beneath the BGA to reduce reference-plane return-path discontinuities.
Place 100 nF ceramic decoupling capacitors on every VDD pin within 2 mm of the BGA pad and add a 4.7 uF bulk capacitor on each power-rail island. Estimated: at 150 MHz CPU and 100 percent bus utilization, the 256-MAPBGA core consumes roughly 180 mA at 3.3 V; therefore each supply island must deliver up to 220 mA peak transient during context-switch events. Do not rely solely on the on-chip regulator for analog rails - keep VDDA isolated and fed through a ferrite bead to suppress digital switching noise from coupling into ADC readings.
At 150 MHz with peripherals enabled the device dissipates roughly 0.6 W, well within the 256-MAPBGA theta_JA of about 28 C/W. For sealed enclosures with no airflow, derate by 0.05 W per degree Celsius above 70 C ambient. Estimated: at 105 C ambient the junction reaches about 122 C, only 8 C below the 130 C datasheet maximum, so keep the BGA thermal pad soldered to a 1 oz copper pour spanning at least 1 cm x 1 cm to avoid thermal shutdown during heavy USB or Ethernet traffic.
Avoid using the segment-LCD driver in 3.3 V systems without an external charge-pump, because the on-chip LCD reference voltage drops below the COM threshold at low temperatures and segment ghosts become visible below 0 C. For TFT panels, configure SDRAM_DQS pull-ups to 10 kohm and disable the on-chip DDR calibration bypass, or write-levelling will fail intermittently above 100 MHz SDRAM frequency. Do not reuse the Ethernet MAC RMII mode without enabling the 50 MHz output on the CLKOUT pin, or the PHY will lose link during DMA bursts.
Route USB DP/DM traces as a 90 ohm differential pair with length matching to within 0.15 mm and keep them away from SDRAM clocks by at least 5 mm. Use a 4.7 uF tantalum capacitor on VBUS plus a 100 nF ceramic on each USB_VDD pin to comply with USB 2.0 high-speed eye-mask. For Ethernet MII routing, keep TXCLK and RXCLK trace lengths matched to within 2 mm and use series 33 ohm source-termination resistors to suppress reflections on the MII bus.
Compliance Information
RoHS and REACH compliance per NXP product page; not AEC-Q100 qualified because the part is targeted at industrial and medical HMI rather than automotive under-hood. Lead-free reflow profile per JEDEC J-STD-020.
