MRFE6S9046NR1 - 45W RF Power MOSFET 920-960 MHz | NXP
MPN: MRFE6S9046NR1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.95 | $14,475.00 |
| 1,000 | $26.4 | $26,400.00 |
MRFE6S9046NR1 Overview
An RF power MOSFET in the LDMOS (Laterally Diffused Metal-Oxide Semiconductor) family is a specialized transistor optimized for high-frequency, high-power amplification. Unlike small-signal MOSFETs used for logic or analog signal processing, RF power LDMOS devices combine high breakdown voltage, high gain, and good thermal performance in a single ceramic package designed to be bolted to a heatsink. Within the broader taxonomy, an LDMOS is a power MOSFET, a discrete semiconductor, and ultimately an electronic component; it sits in the same engineering family as laterally-diffused RF devices from Ampleon, ST, and Infineon but is distinguished by its heritage as a Freescale/NXP part developed for cellular infrastructure.
Key features of the MRFE6S9046NR1 include 35.5 W CW output power at P1dB compression (typical), 19 dB small-signal gain at 960 MHz, 28 V nominal drain supply, integrated electrostatic discharge (ESD) protection, and a thermally-enhanced TO-270-4 ceramic/overmold package. The device uses a single-ended common-source configuration with a gate bias range suitable for class AB operation, and is rated for operation from a 28 V DC supply commonly found in cellular base-station power amplifiers. Its internal matching simplifies PCB integration in Doherty and push-pull topologies.
Typical applications include GSM/EDGE cellular base-station power amplifiers in the 900 MHz band, CDMA and multicarrier amplifier final stages, RF power boosters for industrial heating, and continuous-wave (CW) ISM-band transmitters in the 920-960 MHz range. Designers select this part when the application requires high gain and ruggedness at moderate CW power levels.
When designing with this device, ensure the drain supply is well-bypassed with low-ESR capacitors close to the package leads, and that the heatsink compound and mounting torque follow the manufacturer recommendations. Gate bias sequencing should be applied before drain voltage to prevent uncontrolled current surges.
Drop-in alternatives for MRFE6S9046NR1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MRFE6S9046NR1 (same form factor and footprint) — differing in Mounting Type, Package / Case, Part Number, RoHS Status, Transistor Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MRFE6S9046GNR1
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →MRFE6S9045NR1
✅ Drop-In📋 Reference alternative (not in catalog)
MRFE6S9060NR1
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MRFE6S9046NR1 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MRFE6S9046NR1 |
| Transistor Type | LDMOS, N-Channel Enhancement-Mode Lateral |
| Frequency Range | 920 MHz to 960 MHz |
| Output Power (CW) | 35.5 W typical at 960 MHz, 28 V |
| Power Gain | 19 dB typical at 960 MHz |
| Drain-Source Voltage (Vds max) | 66 V rated |
| Operating Drain Voltage | 28 V nominal |
| Test Current (Quiescent) | 300 mA |
| Package / Case | TO-270 WB-4 (CASE 1486-03, Style 1), plastic over-molded ceramic |
| Pin Count | 5 (Drain, Gate, Source x2, NC) |
| Mounting Type | Surface Mount / Flange Mount |
| Application | GSM / GSM EDGE base station, CDMA, multicarrier amplifier |
| RoHS Status | Compliant (per DigiKey listing) |
| Lead-Free Status | Lead Free (per distributor data) |
MRFE6S9046NR1 to-270 wb-4 (case 1486-03, style 1), plastic over-molded ceramic Pin Configuration Guide
Pin configuration for MRFE6S9046NR1 (to-270 wb-4 (case 1486-03, style 1), plastic over-molded ceramic package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for MRFE6S9046NR1.
Refer to the datasheet for full pin configuration.
Safe Operating Area (DC)
Typical Applications
MRFE6S9046NR1 is suitable for 6 applications: GSM 900 Base Station Power Amplifier, GSM EDGE Linear Amplifier, CDMA and Multicarrier Power Amplifier, Industrial RF Heating Transmitter, Repeater and Booster Amplifier, Military / Tactical Radio Amplifier.
GSM 900 Base Station Power Amplifier
The MRFE6S9046NR1 is a natural fit for the final stage of GSM 900 macro-cell base-station power amplifiers, where 35.5 W CW output at 925-960 MHz and 19 dB of gain simplify the gain-chain budget. Its 28 V drain operation matches the standard -48 V-to-28 V telecom supply rail, and the LDMOS architecture provides the ruggedness needed to survive antenna load-mismatch transients. The device is biased in class AB at 300 mA quiescent current to balance linearity and DC efficiency for GMSK modulation, and the TO-270 WB-4 ceramic package mounts directly to a heatsink for continuous-duty operation. Designers typically place the part behind a ceramic balun and a printed-circuit Doherty combiner to scale output power further when needed.
Recommended
GSM EDGE Linear Amplifier
GSM EDGE uses 8-PSK linear modulation requiring higher linearity than GMSK, and the MRFE6S9046NR1 supports this use case at 920-960 MHz with proper linearization. The NXP datasheet lists EDGE as a primary target application. The part delivers 35.5 W CW at 19 dB gain when linearized with digital predistortion (DPD), and its 28 V operation preserves headroom for the back-off required by 8-PSK peaks. The TO-270 WB-4 package's thermal mass and ceramic isolation also help stabilize bias drift during the high peak-to-average ratios encountered in EDGE bursts.
Recommended
CDMA and Multicarrier Power Amplifier
The MRFE6S9046NR1 is suitable for CDMA and multicarrier amplifier final stages in cellular infrastructure, where multiple RF carriers are combined before reaching the antenna. The NXP datasheet explicitly calls out CDMA and multicarrier applications alongside GSM. At 35.5 W CW and 19 dB gain with 28 V supply, the part provides adequate headroom for multi-carrier composite power while keeping intermodulation products manageable. Designers use it after a multicarrier combiner network or as the final stage in a feedforward linearization loop.
Recommended
Industrial RF Heating Transmitter
The 920-960 MHz industrial-scientific-medical (ISM) band overlaps with the MRFE6S9046NR1's specified range, making the part useful for continuous-wave RF heating and drying equipment. Its 35.5 W CW capability at 28 V supports plastic-welding, food-processing, and paper-drying applications where moderate power is needed without the complexity of higher-power tubes. The LDMOS architecture offers long operating life and predictable gain, which simplifies the closed-loop power control common in industrial RF generators. The TO-270 WB-4 package's flange-mount thermal pad is well suited to the heavy heatsinking required for long RF-on duty cycles.
Recommended
Repeater and Booster Amplifier
The MRFE6S9046NR1 can serve as the final stage in 900 MHz cellular repeaters and signal boosters that extend coverage in buildings, tunnels, or rural areas. Its 19 dB gain and 35.5 W CW output allow a single device to drive a sector antenna with adequate EIRP for indoor coverage extension. The TO-270 WB-4 ceramic package tolerates the elevated ambient temperatures found in equipment closets, and its bolt-down mechanical format simplifies field-serviceable hardware. Biasing flexibility around 300 mA quiescent allows trade-offs between linearity and efficiency depending on the booster's modulation mix.
Recommended
Military / Tactical Radio Amplifier
The 920-960 MHz band is used by certain tactical radio systems, and the MRFE6S9046NR1's rugged LDMOS construction makes it a candidate for vehicular and manpack amplifier finals where size, weight, and reliability are critical. With 35.5 W CW and 19 dB gain, a single stage can deliver the power needed for short-range line-of-sight communications, and the ceramic TO-270 WB-4 package resists shock and vibration better than plastic-molded alternatives. Operation from 28 V matches standard military vehicle bus voltages, eliminating the need for additional conversion stages.
Recommended
Recommended Products Summary
Engineering reference data for MRFE6S9046NR1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MRFE6S9046GNR1 | MRFE6S9045NR1 | MRFE6S9060NR1 |
|---|---|---|---|---|
| Package | TO-270 WB-4 (CASE 1486-03) | TO-270 WB-4 - same | TO-270 WB-4 - same | TO-270 WB-4 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Output Power (CW) | 35.5 W | 35.5 W | ~30 W (lower-power variant) | ~60 W (higher-power variant) |
| Power Gain | 19 dB at 960 MHz | 19 dB | 19 dB | ~18 dB |
| Operating Drain Voltage | 28 V | 28 V | 28 V | 28 V |
| Maximum Vds | 66 V | 66 V | 66 V | 66 V |
| Frequency Range | 920-960 MHz | 920-960 MHz | 920-960 MHz | 920-960 MHz |
| Reel Orientation | R1 | GNR1 (opposite orientation) | R1 | R1 |
Key Differentiators
- Reel orientation match for dual-sided assembly lines (vs MRFE6S9046GNR1)
- Higher output power than MRFE6S9045NR1 family member (vs MRFE6S9045NR1)
- Established NXP/Freescale LDMOS reliability in telecom infrastructure (vs MRFE6S9060NR1)
Design Notes
The TO-270 WB-4 package is a flange-mount ceramic/overmold device that dissipates heat through its back-side metal pad. Estimated: at 35.5 W RF output with ~13 W DC input (28 V, ~470 mA average), roughly 10 W is dissipated as heat at full CW. A heatsink with thermal resistance below 1.0 C/W is recommended to keep the junction below 150 C at 85 C ambient. Apply thermal compound evenly and torque the mounting screws to the manufacturer-specified value to avoid uneven contact resistance.
Use a PCB footprint that matches the CASE 1486-03 outline and provides a windowed cutout so the package flange sits flush on the heatsink rather than on the PCB. Keep the gate and drain traces as 50-ohm microstrip or stripline; gate impedance is high and sensitive to stray capacitance, so route the gate bias network orthogonal to the RF path and decouple it with a 1 nF ceramic plus 10 uF electrolytic right at the gate pin. Source leads are typically grounded through the package flange rather than PCB vias.
Do not exceed 66 V on the drain, including transient overshoot from load-mismatch. Always sequence gate bias on before applying drain voltage to prevent uncontrolled current surges that can destroy the die. Ensure the input and output networks present a near-50-ohm load across 920-960 MHz; VSWR > 3:1 sustained can exceed the device's thermal SOA even at reduced drive. Finally, verify reel orientation (R1 vs GNR1) matches your pick-and-place tooling before bulk assembly.
Compliance Information
RoHS compliance and lead-free status confirmed by DigiKey listing; REACH and halogen status not explicitly listed in the verified data.
