MT62F1536M32D4DS-023 - 48Gbit LPDDR5X SDRAM | Micron Technology
MPN: MT62F1536M32D4DS-023 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.78 | $34.78 |
| 10 | $33.5 | $335.00 |
| 100 | $31.2 | $3,120.00 |
| 500 | $29.5 | $14,750.00 |
| 1,000 | $27.9 | $27,900.00 |
Drop-in alternatives for MT62F1536M32D4DS-023 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
MT62F1536M32D4DS-023 AUT:C
β Drop-Inπ Reference alternative (not in catalog)
MT62F1536M32D4DS-023 AAT:C
β Drop-Inπ Reference alternative (not in catalog)
MT62F1536M32D4DS-023 AIT:C
β Drop-Inπ Reference alternative (not in catalog)
MT62F1536M32D4DS-023 WT:D
β Drop-Inπ Reference alternative (not in catalog)
MT62F1536M32D4DS-023 WT ES:C
β Drop-Inπ Reference alternative (not in catalog)
MT62F1536M32D4DS-023 Maximum Ratings & Electrical Characteristics
| Memory Type | Mobile LPDDR5X SDRAM (volatile) |
| Memory Size | 48 Gbit (6 GB) |
| Memory Organization | 1.5G x 32 |
| Clock Frequency | 4.266 GHz |
| Memory Interface | LVSTL |
| Supply Voltage | 1.01 V to 1.12 V |
| Operating Temperature | -25C to +85C (TC) |
| Package | 315-TFBGA (12.4 mm x 15 mm) |
| Mounting Type | Surface Mount |
| Data Bus Width | 32 bit |
| Speed Grade Code | -023 (LPDDR5X 4.266 GHz class) |
| Temperature Grade Code | WT (extended commercial, -25C to +85C) |
| AEC-Q100 | Not qualified (see AUT:C variant for automotive grade) |
| Packaging Option | Tray (TR tape-and-reel variant available) |
MT62F1536M32D4DS-023 315-tfbga (12.4 mm x 15 mm) Pin Configuration Guide
Complete pinout information for MT62F1536M32D4DS-023 (315-tfbga (12.4 mm x 15 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MT62F1536M32D4DS-023.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT62F1536M32D4DS-023 is suitable for 6 applications: Flagship Smartphone Main Memory, Edge AI Inference Modules, Automotive Infotainment and ADAS Domain Controllers, Tablets and XR Headset Compute, Networking and 5G Small-Cell Equipment, Test, Measurement and Prototype Platforms.
Flagship Smartphone Main Memory
The MT62F1536M32D4DS-023 is purpose-built for flagship smartphone main memory, where its 48 Gbit (6 GB) density and 4.266 GHz LPDDR5X speed provide the bandwidth that modern SoCs demand for multitasking, gaming, and on-device image processing. The 1.5G x 32 organization pairs directly with application processors supporting 32-bit LPDDR5X channels, and the 315-TFBGA (12.4 x 15 mm) footprint fits dense mobile PCB stackups. LVSTL signaling and the 1.01 V to 1.12 V supply minimize power per bit, protecting battery life. Circuit-wise, the DRAM connects to the SoC memory controller over length-matched fly-by routed data groups; the trade-off versus lower-speed LPDDR5 is tighter signal-integrity margins, so controller training must be validated across the -25C to +85C range.
Recommended
Edge AI Inference Modules
Edge-AI accelerators and smart-camera SoCs stream large neural-network weight arrays from main memory, making bandwidth the limiting factor for frames per second. The MT62F1536M32D4DS-023's 4.266 GHz LPDDR5X interface delivers substantially more bandwidth than LPDDR5-class parts (such as the related 3.2 GHz WT:B), directly improving inference throughput for quantized CNN and transformer models. The 48 Gbit capacity holds multi-hundred-megabyte model binaries plus activation buffers without external storage round-trips. In typical deployments the DRAM sits on the same package substrate or a short HDI board trace from the NPU, with PMIC rails regulated into the 1.01 V to 1.12 V window; the power-per-bit savings of LPDDR5X reduce thermal throttling in fanless enclosures.
Recommended
Automotive Infotainment and ADAS Domain Controllers
Automotive cockpit and ADAS domain controllers require high-bandwidth, temperature-robust DRAM. The MT62F1536M32D4DS-023 AUT:C variant, verified as AEC-Q100 qualified by Microchip USA, provides the identical 48 Gbit LPDDR5X 4.266 GHz die for navigation rendering, surround-view camera fusion, and driver-monitoring workloads. The 1.5G x 32 organization supports the wide memory channels used by automotive SoCs, and the 315-TFBGA package survives the vibration and reflow profiles of automotive assembly. Designers should select the AUT or AAT suffix rather than the consumer WT suffix, validate controller training across the full automotive temperature range, and budget power-delivery impedance for sustained 4.266 GHz operation in hot environments such as dash-mounted enclosures.
Recommended
Tablets and XR Headset Compute
Tablets and XR (VR/AR) headsets combine high-resolution displays, multi-camera sensor pipelines, and demanding graphics - workloads that saturate memory bandwidth. The MT62F1536M32D4DS-023 supplies 6 GB of LPDDR5X at 4.266 GHz, giving SoCs headroom for 4K video buffers and low-latency frame rendering, where the 1.01 V to 1.12 V supply also reduces the heat budget in thermally constrained wearable enclosures. The 12.4 x 15 mm 315-TFBGA package enables compact stacked or side-by-side DRAM placements on rigid-flex assemblies common to headsets. Because XR systems train the memory controller at boot for every speed bin, include the -023 timing tables in firmware validation; the benefit versus LPDDR5 is roughly a one-third bandwidth increase at comparable power.
Recommended
Networking and 5G Small-Cell Equipment
5G small cells, industrial gateways, and edge routers use LPDDR5X as packet-buffer and control-plane memory, where line-rate forwarding depends on sustained random-access bandwidth. The MT62F1536M32D4DS-023's 4.266 GHz interface and 32-bit bus give network processors the read/write concurrency needed for deep packet buffers, while the 48 Gbit capacity absorbs burst traffic between MAC and CPU. Its LVSTL interface keeps I/O switching noise low near mixed-signal PHY circuitry. In these designs the DRAM runs from board-level PMIC rails regulated into the 1.01 V to 1.12 V specification, with the -25C to +85C industrial-compatible range (WT grade) covering outdoor enclosures; for harsher environments, the AIT:C industrial suffix is the appropriate drop-in.
Recommended
Test, Measurement and Prototype Platforms
Validation engineers use the MT62F1536M32D4DS-023 WT ES:C engineering-sample variant on bring-up boards to qualify memory-controller training, signal integrity, and thermal behavior before production silicon is released, and the same footprint permits seamless migration to the WT:C production part. The 315-TFBGA (12.4 x 15 mm) package on an HDI test coupon lets teams probe LPDDR5X eye diagrams at 4.266 GHz and verify PMIC sequencing into the 1.01 V to 1.12 V window. Because ES parts are not production-qualified, limit their use to lab validation. This workflow shortens time-to-market by de-risking the two hardest LPDDR5X integration tasks - controller training tables and fly-by routing - ahead of volume commits.
Recommended
Recommended Products Summary
Engineering reference data for MT62F1536M32D4DS-023 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT62F1536M32D4DS-023 AUT:C | MT62F1536M32D4DS-023 AAT:C | MT62F1536M32D4DS-023 WT:D |
|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 315-TFBGA (12.4x15 mm) | 315-TFBGA (12.4x15 mm) - same | 315-TFBGA (12.4x15 mm) - same | 315-TFBGA (12.4x15 mm) - same |
| Memory Size | 48 Gbit | 48 Gbit | 48 Gbit | 48 Gbit |
| Organization | 1.5G x 32 | 1.5G x 32 | 1.5G x 32 | 1.5G x 32 |
| Clock Frequency | 4.266 GHz | 4.266 GHz | 4.266 GHz | 4.266 GHz class |
| Interface | LVSTL | LVSTL | LVSTL | LVSTL |
| AEC-Q100 Qualification | No (WT grade) | Yes | Yes (automotive grade) | No |
| Supply Voltage | 1.01 V to 1.12 V | 1.01 V to 1.12 V | 1.01 V to 1.12 V | [DATA_NEEDED] |
| Operating Temperature | -25C to +85C (TC) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- LPDDR5X 4.266 GHz speed class (vs MT62F1536M32D4DS-023 WT:B)
- Automotive drop-in variant available (vs MT62F1536M32D4DS-023 AUT:C)
- Single-package 6 GB density (vs MT53E1G64D4HJ-046)
Design Notes
LPDDR5X at 4.266 GHz leaves narrow read/write eye margins. Route data groups as tightly length-matched pairs with ground-referenced fly-by topology on the address/command bus, and follow the manufacturer's reference design for via stub minimization on the HDI stackup. Simulate the full channel (SoC, package, PCB, DRAM package) before tape-out; re-training tables in the memory controller must include the -023 speed bin. Skipping channel simulation is the most common cause of failed training at temperature extremes.
The 1.01 V to 1.12 V VDD/VDDQ domain requires a PMIC rail with tight DC tolerance and fast transient response, since LPDDR5X termination current changes abruptly between idle and burst. Place bulk and 0.1 uF decoupling ceramic capacitors adjacent to the 315-TFBGA power ball clusters, and follow the datasheet power-up sequencing order to avoid controller latch conditions. Budget rail impedance for sustained 4.266 GHz activity to prevent droop-induced training failures.
Do not substitute the WT:B (200-WFBGA, 3.2 GHz LPDDR5) on a WT:C footprint - the ball maps differ. When a design may ship in automotive or industrial variants, lay out for the 315-TFBGA and order the AUT:C/AAT:C/AIT:C suffix so the same PCB serves all temperature grades. Also confirm the ES:C engineering-sample parts are excluded from production BOMs; they are validation silicon only.
Compliance Information
The standard WT:C grade is not AEC-Q100 qualified; the AUT:C variant is AEC-Q100 qualified per Microchip USA. RoHS/REACH status must be confirmed from the Micron part-detail page.
