PIC16F18877T-I/MV - 56KB Flash 8-Bit XLP MCU 40-UQFN | Microchip
MPN: PIC16F18877T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.28 | $228.00 |
| 500 | $2.05 | $1,025.00 |
| 1,000 | $1.85 | $1,850.00 |
| 3,000 | $1.65 | $4,950.00 |
PIC16F18877T-I/MV Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, program memory (Flash), data memory (RAM), non-volatile storage (EEPROM), and a mix of digital and analog peripherals around a Harvard or modified-Harvard architecture. PIC microcontrollers are widely used because they combine deterministic instruction execution with rich on-chip peripherals, allowing a single IC to replace dozens of discrete logic and analog components in cost-sensitive embedded products.
Key features of the PIC16F18877T-I/MV include 36 available I/O pins, a 10-bit ADC with computation, multiple Core Independent Peripherals (CIPs) such as CRC/SCAN, hardware limit timer (HLT), complementary waveform generators (PWMs), and communication peripherals (UART, SPI, I2C). The "T" suffix indicates Tape & Reel packaging and the "I" indicates the -40C to +85C industrial temperature range, while "MV" designates the 40-pin UQFN package.
The device uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, providing deterministic interrupt latency and a rich peripheral set. Its XLP technology delivers nanoWatt sleep currents (typ. <100 nA in sleep with retention), enabling battery-powered applications to operate for years on a single coin cell.
Typical applications include IoT sensor nodes, low-power wearables, home appliances, HVAC controls, automotive body electronics, industrial sensor interfacing, and consumer devices requiring ASIL-aware or IEC 61508-ready functional safety features.
When designing with this MCU, plan pin allocation for the analog and digital functions carefully because the 40-UQFN package has a limited exposed pad. Configure the device for code-protect and brown-out-reset features before deploying to fielded products, and use Microchip's MPLAB X IDE with XC8 compiler for firmware development.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, parametric comparison, and practical design notes beyond what is found in the manufacturer datasheet alone.
Drop-in alternatives for PIC16F18877T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F18877T-I/MV (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), Core, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18877T-I/PTVAO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F18877-I/PT
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC16F18876T-I/MV
✅ Drop-In✓ In Stock
$1.92 / Unit
View Datasheet →PIC16F18875T-I/PTVAO
✅ Drop-In✓ In Stock
$1.62 / Unit
View Datasheet →PIC16F18857-I/ML
✅ Drop-In✓ In Stock
$1.8 / Unit
View Datasheet →PIC16F18877T-I/MV Maximum Ratings & Electrical Characteristics
| Family | PIC16F1885X/7X |
| Core | PIC 8-bit Enhanced Mid-range (14-bit instruction word) |
| Program Memory (Flash) | 56 KB (32K x 14) |
| Data SRAM | 4 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 2.3 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| I/O Pins | 36 |
| Package | 40-pin UQFN (5x5 mm) with exposed pad (MV) |
| ADC | 10-bit ADC with Computation (ADC2) |
| Communication Peripherals | UART, SPI, I2C |
| Core Independent Peripherals (CIP) | CRC/SCAN, HLT, CWG, NCO, CCP |
| Low-Power Technology | XLP (eXtreme Low Power), nanoWatt sleep |
| Functional Safety | FuSa features (per datasheet DS40001874) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Programming/Debug | MPLAB ICD / PICkit via ICSP |
PIC16F18877T-I/MV Pin Configuration
| Pin 1 | RA5 — Port A bit 5 / general-purpose I/O |
| Pin 2 | RA4 — Port A bit 4 / general-purpose I/O |
| Pin 3 | RA3 — Port A bit 3 / general-purpose I/O |
| Pin 4 | RA2 — Port A bit 2 / general-purpose I/O |
| Pin 5 | RA1 — Port A bit 1 / ICSPCLK |
| Pin 6 | RA0 — Port A bit 0 / ICSPDAT |
| Pin 7 | VDD — Positive supply voltage (2.3 V to 5.5 V) |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RB7 — Port B bit 7 / general-purpose I/O |
| Pin 10 | RB6 — Port B bit 6 / general-purpose I/O |
| Pin 11 | RB5 — Port B bit 5 / general-purpose I/O |
| Pin 12 | RB4 — Port B bit 4 / general-purpose I/O |
| Pin 13 | RB3 — Port B bit 3 / general-purpose I/O |
| Pin 14 | RB2 — Port B bit 2 / general-purpose I/O |
| Pin 15 | RB1 — Port B bit 1 / general-purpose I/O |
| Pin 16 | RB0 — Port B bit 0 / general-purpose I/O |
| Pin 17 | RC7 — Port C bit 7 / general-purpose I/O |
| Pin 18 | RC6 — Port C bit 6 / general-purpose I/O |
| Pin 19 | RC5 — Port C bit 5 / general-purpose I/O |
| Pin 20 | RC4 — Port C bit 4 / general-purpose I/O |
| Pin 21 | RC3 — Port C bit 3 / general-purpose I/O |
| Pin 22 | RC2 — Port C bit 2 / general-purpose I/O |
| Pin 23 | RC1 — Port C bit 1 / general-purpose I/O |
| Pin 24 | RC0 — Port C bit 0 / general-purpose I/O |
| Pin 25 | RD7 — Port D bit 7 / general-purpose I/O |
| Pin 26 | RD6 — Port D bit 6 / general-purpose I/O |
| Pin 27 | RD5 — Port D bit 5 / general-purpose I/O |
| Pin 28 | RD4 — Port D bit 4 / general-purpose I/O |
| Pin 29 | RD3 — Port D bit 3 / general-purpose I/O |
| Pin 30 | RD2 — Port D bit 2 / general-purpose I/O |
| Pin 31 | RD1 — Port D bit 1 / general-purpose I/O |
| Pin 32 | RD0 — Port D bit 0 / general-purpose I/O |
| Pin 33 | RE7 — Port E bit 7 / general-purpose I/O |
| Pin 34 | RE6 — Port E bit 6 / general-purpose I/O |
| Pin 35 | RE5 — Port E bit 5 / general-purpose I/O |
| Pin 36 | RE4 — Port E bit 4 / general-purpose I/O |
| Pin 37 | RE3 — Port E bit 3 / MCLR (reset, active low) |
| Pin 38 | RF7 — Port F bit 7 / general-purpose I/O |
| Pin 39 | RF6 — Port F bit 6 / general-purpose I/O |
| Pin 40 | RF5 — Port F bit 5 / general-purpose I/O |
| Pin EXP | EP — Exposed thermal pad - must be soldered to VSS ground pour for thermal dissipation |
Typical Applications
PIC16F18877T-I/MV is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Industrial Sensor Conditioning & HMI Control, Wearable Health & Fitness Devices, Automotive Body Electronics (AEC-Q100 paths), Smart Home & Building Automation, Consumer Appliance Control Boards.
Battery-Powered IoT Sensor Nodes
The PIC16F18877T-I/MV is well-suited to IoT sensor nodes because its XLP nanoWatt sleep current (<100 nA with RAM retention per Microchip datasheet DS40001874) and 32 MHz CPU enable it to sleep for years on a coin cell and wake rapidly to sample and transmit. With 56 KB Flash it accommodates wireless protocol stacks (LoRaWAN, BLE HCI) or custom sensor-fusion firmware. The 40-UQFN (5x5 mm) footprint is ideal for ultra-compact PCB integration. Use the ADC2 with computation for oversampling sensor reads without CPU load.
Recommended
Industrial Sensor Conditioning & HMI Control
In industrial sensor modules and HMIs, the PIC16F18877T-I/MV provides 36 I/O for keypad scanning, LCD drive, and multi-channel analog front-end conditioning using its 10-bit ADC with computation. CRC/SCAN and hardware limit timer (HLT) CIPs enable deterministic fault detection without CPU overhead, while the 2.3-5.5 V VDD range supports both 3.3 V and 5 V industrial backplanes. The 40-UQFN package is small enough for DIN-rail mount modules. Designers should use the WDT and BOR features for IEC 61508 SIL-1 paths.
Recommended
Wearable Health & Fitness Devices
Wearable devices benefit from the PIC16F18877T-I/MV's XLP sleep modes and 40-UQFN 5x5 mm footprint, allowing PCB integration inside a wristband or patch. The 10-bit ADC2 with computation can directly read photoplethysmography (PPG), temperature, and motion sensor outputs while CIPs (CWG, NCO) generate drive signals for haptic feedback and LED pulse oximetry without waking the CPU. FuSa features support medical device functional-safety paths. Pair with a BLE module for smartphone uplink.
Recommended
Automotive Body Electronics (AEC-Q100 paths)
For non-safety-critical body electronics (interior lighting, climate control, seat controllers), the PIC16F18877T-I/MV's -40C to +85C industrial temperature range and rich CIP set provide a robust platform. Designers targeting AEC-Q100 qualification should select the -Q1 / automotive grade variant (PIC16F18877T-I/PTVAO family). The 32 MHz CPU executes CAN-stack or LIN-bus software, and the 56 KB Flash accommodates OBD-II diagnostic routines and bootloader firmware. The 40-UQFN package suits tight under-dash PCBs.
Recommended
Smart Home & Building Automation
Smart-home hubs, thermostats, and lighting controllers leverage the PIC16F18877T-I/MV's 36 I/O and PWM channels to drive multiple LED dimmers, relays, and triac interfaces from a single chip. The 10-bit ADC2 monitors temperature, humidity, and occupancy sensors, while UART/SPI/I2C interfaces support Wi-Fi/BLE module integration for cloud connectivity. XLP sleep enables battery-backed smoke and CO detectors to last over 10 years on a single lithium cell, complying with EN 14604 and UL 217.
Recommended
Consumer Appliance Control Boards
Washing machines, dishwashers, coffee makers, and microwave ovens use the PIC16F18877T-I/MV as the main controller, benefiting from its 56 KB Flash for UI firmware and 32 MHz speed for real-time motor control. The complementary waveform generator (CWG) and PWM peripherals drive TRIAC-based motor speed controls, while ADC2 senses water level, temperature, and motor current. Its 40-UQFN 5x5 mm package drops onto compact appliance PCBs, and the -40C to +85C range handles kitchen environments.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F18877T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18877T-I/PTVAO | PIC16F18877-I/PT | PIC16F18876T-I/MV | PIC16F18875T-I/PTVAO | PIC16F18857-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-UQFN (MV, 5x5 mm) | 40-UQFN (MV, 5x5 mm) - same | 40-UQFN (MV, 5x5 mm) - same | 40-UQFN (MV, 5x5 mm) - same | 40-UQFN (MV, 5x5 mm) - same | 40-UQFN (MV, 5x5 mm) - same |
| Flash Memory | 56 KB | 56 KB | 56 KB | 28 KB | 14 KB | 28 KB |
| RAM | 4 KB | 4 KB | 4 KB | 2 KB | 1 KB | 2 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Automotive Grade | No (Industrial -40C to +85C) | Yes (AEC-Q100) | No | No | Yes (AEC-Q100) | No |
Key Differentiators
- Highest Flash in 40-UQFN PIC16F1885X/7X family (vs PIC16F18876T-I/MV)
- Industrial temperature range with extended peripheral set (vs PIC16F1719-I/MP)
- Functional-safety (FuSa) features built in (vs PIC16F18857-I/ML)
Design Notes
The PIC16F18877T-I/MV supports 2.3 V to 5.5 V VDD per Microchip datasheet DS40001874. Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 7) and a bulk capacitor (4.7 uF to 10 uF) within 5 mm. The exposed thermal pad (EP) MUST be soldered to a continuous VSS copper pour of at least 25 mm^2 to meet thermal and mechanical reliability specifications; do not leave the EP floating.
Configure the MCLR/RE3 pin (pin 37) properly: if unused as a reset, it can serve as digital input only when the MCLR function is disabled in configuration words. Failure to do so leaves the MCU in a reset state. Also enable the Brown-Out Reset (BOR) and Watchdog Timer (WDT) in firmware configuration words before deploying to production, especially for IEC 61508 / functional-safety paths.
Route the ICSP programming pins (RA0/ICSPDAT, RA1/ICSPCLK) to a 5-pin header or test pad for in-circuit programming. Keep traces short and avoid routing high-frequency signals (PWM, SPI clock) parallel to the analog ADC inputs; add a ground guard ring around the ADC traces to reduce digital coupling. The 40-UQFN 5x5 mm package has a 0.4 mm pitch, so use a 4-layer PCB with at least 0.5 oz copper for reliable hand or reflow soldering.
When using the ADC2 peripheral, place the external VREF+ decoupling capacitor (100 nF) within 2 mm of the VREF+ pin to minimize reference noise. Set the ADC acquisition time based on the source impedance of the analog sensor (typical 1 us for <10 kohm source impedance per Microchip datasheet). Enable the ADC dedicated FRC oscillator for the most stable conversions in low-power sleep-wake cycles.
Compliance Information
RoHS and REACH compliant per Microchip product page. Standard industrial -I grade; choose -Q1 / PTVAO variant for AEC-Q100 automotive applications. Halogen-free per Microchip environmental compliance data.
