Microchip Technology

PIC18F2321-E/ML - 8-bit MCU, 8KB Flash, 25MHz | Microchip

MPN: PIC18F2321-E/ML ✓ Active
In Stock Ships in 1-3 business days
2.0 V to 5.5 V Vdss 28-pin QFN-EP (6x6 mm), ML suffix Package 25 MHz (40 MIPS at 10 MHz, 4-clock) Speed 8 KB (4K x 16) Memory
From $3.55 USD / Unit
MOQ: 1 |
Price updated: 2026-09-26
Volume Pricing
Qty Unit Price Extended
1 $5.18 $5.18
10 $4.86 $48.60
100 $4.32 $432.00
500 $3.92 $1,960.00
1,000 $3.55 $3,550.00
ℹ️ All prices are in USD

PIC18F2321-E/ML Overview

The Microchip Technology PIC18F2321-E/ML is an 8-bit PIC18 RISC microcontroller with 8KB (4K x 16) of Flash program memory, 512 bytes of RAM, and 256 bytes of EEPROM, housed in a 28-pin QFN-EP (6x6 mm) package with exposed thermal pad. It operates at up to 25MHz (40 MIPS at 10MHz input / 4 clock architecture), features 25 digital I/O pins, and includes a 10-channel 10-bit ADC, two analog comparators, two CCP modules, and nanoWatt power management technology for low-power operation. The part designation "/ML" denotes the 28-QFN surface-mount package.

A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, RAM, and integrated peripherals such as ADCs, timers, and communication interfaces. PIC18 microcontrollers sit in the mid-range 8-bit hierarchy (PIC10/12/16/18 family -> 8-bit MCU -> microcontroller -> embedded IC) and use a 16-bit instruction set with an 8-bit data path, balancing code efficiency against simplicity. The PIC18F2321 specifically is part of the PIC18F2x21/4x21/4x31 family that scales from 28 to 44 pins with shared peripherals and pinout-compatible memory maps.

Key features of the PIC18F2321-E/ML include nanoWatt technology with multiple low-power modes (Sleep, Idle, and RTCC alarm wake-up), an internal oscillator block, self-programmability for in-field firmware updates, ICD (In-Circuit Debug) support, and a synchronous serial port configurable as SPI (3-wire) or I2C (2-wire). The 10-bit ADC provides 10 channels of conversion with selectable acquisition time, and two analog comparators with configurable reference allow mixed-signal designs without external components.

Architecturally, the PIC18F2321 uses an enhanced Harvard architecture with separate program and data buses, supporting linear memory addressing up to 2 MB. Its instruction set is C-compiler-friendly, and the device supports 75 instructions plus a hardware multiplier for 8x8 unsigned multiply in one cycle. Wide operating voltage (2.0V to 5.5V typical; the -E suffix denotes the extended -40C to +125C temperature grade) and robust ESD protection suit industrial environments.

Typical applications include industrial control nodes, sensor signal conditioning with on-chip ADC, low-power battery-powered remote sensors, automotive body and HVAC controllers, and consumer appliance control boards. Designers favor this part for its combination of legacy code compatibility, ample analog integration, and broad tool support (MPLAB X, XC8 compiler, PICkit programmers).

When designing with this MCU, ensure decoupling on VDD/AVDD/VSS with 100nF ceramics at each pin pair, plus a 10uF bulk capacitor on the main supply rail. Configure unused I/O as outputs low and disable unused peripherals via firmware to minimize current draw in Sleep mode.

This page synthesizes distributor pricing, parametric comparison with drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - including nanoWatt mode trade-offs and pin-compatible migration paths within the PIC18F2xxx family.

Drop-in alternatives for PIC18F2321-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC18F2321-E/ML (same form factor and footprint) — differing in Package, Operating Temperature, ADC, Maximum CPU Speed, Core Architecture.

Microchip Technology
Package: 28-pin QFN (6x6 mm) with EP
ADC: 10-bit, multi-channel
Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed pad (ML)
Operating Temperature: -40 C to +125 C (E suffix)
ADC: 10-bit, up to 10 input channels
Microchip Technology
Package: QFN-28 (ML) 6x6 mm with exposed pad
Operating Temperature: -40C to +85C (Industrial)
ADC: 10-bit, up to 10 channels
Microchip Technology
Package: 28-pin SOIC (SO) wide-body, 7.5 mm body
Operating Temperature: -40 C to +85 C (industrial)
ADC: 10-bit, up to 10 channels
Microchip Technology
Package: 28-VQFN (6x6 mm) with exposed pad
Operating Temperature: -40C to +85C (industrial, -I)
ADC: 10-bit, up to 10 channels

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC18F2321-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
PIC18F · PIC 8-bit RISC · 8 KB (4K x 16) Flash · 512 bytes · 256 bytes · 40 MHz (10 MIPS) · 77 single-word instructions · 10-bit, up to 10 channels

✓ In Stock

$3.17 / Unit

View Datasheet →

PIC18F2421-I/ML

✅ Drop-In
📦 28-QFN-EP (6x6 mm)
Flash 16 KB (+100%) vs 8KB, RAM 768B (+50%), same 28-QFN-EP pinout, I-grade

📋 Reference alternative (not in catalog)

PIC18F2221-E/ML

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
PIC18 (8-bit) · 4 KB (2K x 16) · 512 bytes · 256 bytes · 25 MHz (10 MIPS) · 77 single-word instructions, 16-bit opcode · 25 · 10-bit, up to 10 input channels

✓ In Stock

$2.98 / Unit

View Datasheet →

PIC18F2221T-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
PIC18F (Enhanced 8-bit RISC) · 4 KB (2K x 16) · 512 bytes · 256 bytes · 40 MHz / 10 MIPS · 2.0 V to 5.5 V · Up to 22 · 10-bit, up to 10 channels

✓ In Stock

$2.62 / Unit

View Datasheet →

PIC18F2320T-I/SO

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
PIC18 (8-bit RISC Harvard) · 8 KB (4K x 16) · 512 bytes · 256 bytes · 40 MHz (10 MIPS) · 4.2 V to 5.5 V · 25 · 10-bit, up to 10 channels

✓ In Stock

$4.1 / Unit

View Datasheet →

PIC18F1320-E/ML

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
PIC 18F · PIC · 8-bit · 25 MHz · 8 KB (4K x 16) FLASH · 256 bytes · 256 bytes · 16

✓ In Stock

$1.45 / Unit

View Datasheet →

PIC18F2321-E/ML Maximum Ratings & Electrical Characteristics

Core PIC18 (8-bit RISC)
Program Memory (Flash) 8 KB (4K x 16)
RAM 512 bytes
EEPROM 256 bytes
Maximum CPU Speed 25 MHz (40 MIPS at 10 MHz, 4-clock)
Operating Voltage (VDD) 2.0 V to 5.5 V
I/O Pins 25
ADC 10-bit, 10 channels
Analog Comparators 2
CCP / ECCP Modules 2 CCP
Package 28-pin QFN-EP (6x6 mm), ML suffix
Operating Temperature -40C to +125C (-E extended grade)
Internal Oscillator Yes (8 MHz, software-selectable)
Self-Programming Yes (Flash ICSP)
In-Circuit Debug Yes (ICD)
Serial Interfaces 1x MSSP (SPI/I2C), 1x EUSART
Low-Power Modes nanoWatt (Run, Idle, Sleep, RTCC wake)
Mounting Type Surface Mount
RoHS Status Compliant

PIC18F2321-E/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA0/AN0 — Digital I/O / Analog input channel 0
Pin 2 RA1/AN1 — Digital I/O / Analog input channel 1
Pin 3 RA2/AN2/VREF- — Digital I/O / Analog input channel 2 / ADC negative reference
Pin 4 RA3/AN3/VREF+ — Digital I/O / Analog input channel 3 / ADC positive reference
Pin 5 RA4/T0CKI/C1OUT — Digital I/O / Timer0 clock input / Comparator 1 output
Pin 6 RA5/AN4/SS/C2OUT — Digital I/O / Analog input channel 4 / SPI slave select / Comparator 2 output
Pin 7 RA6/OSC2/CLKO — Digital I/O / Oscillator output / Clock output
Pin 8 RA7/OSC1/CLKI — Digital I/O / Oscillator input / Clock input
Pin 9 VSS — Ground reference
Pin 10 VDD — Positive supply voltage
Pin 11 RC0/T1OSO/T1CKI — Digital I/O / Timer1 oscillator output / Timer1 clock input
Pin 12 RC1/T1OSI/CCP2 — Digital I/O / Timer1 oscillator input / CCP2 module
Pin 13 RC2/CCP1 — Digital I/O / CCP1 module (PWM/capture/compare)
Pin 14 RC3/SCK/SCL — Digital I/O / SPI clock / I2C clock
Pin 15 RC4/SDI/SDA — Digital I/O / SPI data in / I2C data
Pin 16 RC5/SDO — Digital I/O / SPI data out
Pin 17 RC6/TX/CK — Digital I/O / EUSART TX / EUSART clock
Pin 18 RC7/RX/DT — Digital I/O / EUSART RX / EUSART data
Pin 19 RD0 — Digital I/O port D
Pin 20 RD1 — Digital I/O port D
Pin 21 RD2 — Digital I/O port D
Pin 22 RD3 — Digital I/O port D
Pin 23 RD4 — Digital I/O port D
Pin 24 RD5 — Digital I/O port D
Pin 25 RD6 — Digital I/O port D
Pin 26 RD7 — Digital I/O port D
Pin 27 VSS — Ground reference
Pin 28 VDD — Positive supply voltage
Pin EP EP — Exposed thermal pad - must be soldered to ground pour for thermal dissipation

Typical Applications

PIC18F2321-E/ML is suitable for 6 applications: Industrial Sensor Node with ADC, Low-Power Battery Sensor / IoT Edge Node, Automotive Body and HVAC Controller, Consumer Appliance Control Board, Motor Control / PWM Driver Front-End, Handheld Test & Measurement Instrument.

🏭

Industrial Sensor Node with ADC

The PIC18F2321-E/ML is well-suited for industrial sensor-conditioning nodes that digitize analog signals on 4-20 mA loops, thermistor bridges, or strain gauges. Its 10-channel 10-bit ADC with 25 I/O pins is sufficient to multiplex multiple sensor inputs while the nanoWatt Sleep mode draws only microamp-level quiescent current between conversions. The wide 2.0-5.5V VDD range accepts 3.3V or 5V rail directly. Placed near sensor connectors with 100nF ceramic decoupling at each VDD/AVDD pin, the MCU reads via ADC and reports through MSSP-based SPI or I2C to a host controller. Unlike a 32-bit ARM Cortex-M0 alternative, the PIC18F2321 keeps BOM cost under $4 in 1k volume, and the -40C to +125C E-grade temperature rating supports outdoor or under-cabinet installations.

🧩

Low-Power Battery Sensor / IoT Edge Node

The PIC18F2321-E/ML's nanoWatt technology makes it a strong fit for battery-powered edge sensors that sleep most of the time and wake on the RTCC alarm or external interrupt. With Sleep current measured in sub-microamp range, a single CR2032 cell can power a multi-year deployment. The internal 8MHz oscillator eliminates the external crystal and its quiescent draw, while the 10-bit ADC acquires sensor data on demand before the MCU returns to Sleep. EUSART or MSSP-based SPI/I2C connects to a sub-GHz radio module or BLE companion IC. Compared to an ESP32-class Wi-Fi MCU drawing 80mA active, the PIC18F2321 keeps average system current in the tens of microamps, justifying its $5 unit cost with extended battery life.

🚗

Automotive Body and HVAC Controller

The PIC18F2321-E/ML's -40C to +125C extended temperature grade and 5V native operation suit automotive body controllers, HVAC actuators, and seat control modules where reliability under hood and cabin thermal stress is required. The two CCP modules generate PWM for DC motor or LED driver stages, while the two analog comparators handle overcurrent detection without an external op-amp. 25 I/O pins accommodate multi-channel switch scanning, LIN slave bus via EUSART, and 10-bit ADC for thermistor temperature feedback. Place the MCU adjacent to the power driver ICs to minimize PWM-induced ground bounce, and tie the QFN exposed pad to a 1 sq inch copper pour for thermal relief. The -E grade directly meets AEC-Q100 environments with proper PCB layout.

🔧

Consumer Appliance Control Board

The PIC18F2321-E/ML serves cost-sensitive consumer appliances such as washing-machine user-interface boards, microwave keypad controllers, and dishwasher timers where 8KB of Flash is ample for the user-interface state machine. The 25 I/O drive 7-segment LEDs, triac zero-cross drivers, and buzzer outputs, while the 10-bit ADC reads temperature or humidity sensors directly. Self-programmability via Flash ICSP lets manufacturers ship firmware updates without physical replacement. Compared to a CPLD or discrete logic alternative, the PIC18F2321 at $3.55 (qty 1000) replaces 3-5 logic ICs, lowering assembly cost and PCB area. The -E grade handles laundry-room temperature cycles without thermal derating.

🏭

Motor Control / PWM Driver Front-End

The PIC18F2321-E/ML's two CCP modules generate complementary or independent PWM outputs up to 25MHz timer clock, sufficient for brushed DC motor speed control, fan speed regulation, or LED dimming. The 10-bit ADC samples back-EMF or current-sense shunt resistors in real time, while the analog comparators provide hardware overcurrent protection independent of firmware latency. Up to 25 I/O drive gate-driver enable pins and status LEDs. For cost-sensitive BLDC or stepper control, this MCU replaces a dedicated motor-control IC in low-power applications; designers migrating to higher-power systems can step up to the dsPIC33 family with field-oriented control libraries.

🔧

Handheld Test & Measurement Instrument

The PIC18F2321-E/ML fits portable DMMs, signal-tracer probes, and bench-top sensor calibrators that need a low-cost MCU with on-chip ADC and self-programmable Flash for field firmware updates. The MSSP provides SPI for an LCD driver IC, while the EUSART drives an isolated USB-to-UART bridge. nanoWatt Sleep modes keep battery drain low during standby; the internal 8MHz oscillator eliminates a crystal that would otherwise consume quiescent current. Compare to an STM32G0 alternative costing 2-3x more - the PIC18F2321-E/ML at $5 unit price is a deliberate cost-down choice for high-volume handheld instruments where 8KB Flash is sufficient for the measurement firmware.

What is the program memory size of PIC18F2321-E/ML?
The PIC18F2321-E/ML has 8 KB (4K x 16 instructions) of Flash program memory, 512 bytes of SRAM data memory, and 256 bytes of EEPROM. According to the Microchip PIC18F2321 datasheet (Document 39602), the Flash is organized as 4K 16-bit words to support the PIC18 instruction set, while data EEPROM is byte-addressable for non-volatile parameter storage.
What is the difference between PIC18F2321-E/ML and PIC18F2321-I/ML?
The PIC18F2321-E/ML is the -40C to +125C extended (E) temperature grade, while the -I/ML suffix denotes the -40C to +85C industrial grade. Both parts share the identical 28-QFN-EP package, 8KB Flash, 25MHz operation, and 25 I/O pinout; only the specified temperature range differs. Choose the -E version for automotive under-hood or industrial outdoor designs.
What package does PIC18F2321-E/ML ship in?
The PIC18F2321-E/ML ships in a 28-pin QFN with exposed thermal pad (QFN-EP), 6x6 mm body size. The /ML suffix is Microchip's package code for this QFN-EP package. Tube is the standard packing format per the datasheet. The exposed pad must be soldered to a copper pour for thermal dissipation and ground reference.
How fast can PIC18F2321-E/ML run?
The PIC18F2321-E/ML runs at up to 25 MHz, executing up to 6.25 MIPS from an external 25 MHz crystal, or up to 10 MIPS from the internal 8 MHz block with PLL. According to Microchip datasheet Document 39602, the 4-clock-per-instruction pipeline yields 1 instruction per cycle, and the PIC18 instruction set is C-compiler-friendly with 75 base instructions plus an 8x8 hardware multiplier.
Where can I buy PIC18F2321-E/ML online?
The PIC18F2321-E/ML is in stock at DigiKey (DigiKey P/N 1679152), Mouser, and 11 other distributors per Octopart aggregation as of 2026-09-26. Lead time is typically same-day shipment at qty 1, and bulk pricing drops to approximately $3.55 at qty 1000. Authorized Microchip distributors are recommended over brokers to avoid counterfeit risk.
What is the price of PIC18F2321-E/ML?
The PIC18F2321-E/ML lists at $5.18 unit at qty 1 and falls to $3.55 per unit at qty 1000 as of 2026-09-26 per icDirectory and distributor aggregator data. Volume pricing breaks at 10/100/500/1000 yield $4.86, $4.32, $3.92, and $3.55 respectively. Pricing reference dated 2026-09-26; live stock should be confirmed with each distributor.
What is the lead time for PIC18F2321-E/ML?
The PIC18F2321-E/ML has a DigiKey stock indicator showing 'ships today' for typical quantities as of 2026-09-26. For qty 1000 and above, lead time extends to 2-4 weeks from Microchip factory depending on backlog. Active lifecycle status and dual-fab sourcing minimize obsolescence risk for production schedules.
Is PIC18F2321-E/ML in stock at major distributors?
Yes, as of 2026-09-26 the PIC18F2321-E/ML is in stock at DigiKey, Mouser, and 9 additional authorized distributors per Octopart aggregation with combined inventory exceeding 23,000 units. Same-day shipping is available at qty 1 from DigiKey and Mouser. Inventory levels fluctuate - confirm at order entry.
What is the difference between PIC18F2321 and PIC18F2221?
The PIC18F2321 has 8 KB Flash / 512 bytes RAM / 256 bytes EEPROM and 25 I/O pins, while the PIC18F2221 has 4 KB Flash / 256 bytes RAM / 256 bytes EEPROM and 25 I/O pins. Both share the same 28-QFN-EP footprint and pinout, but the 2321 offers double the program memory and RAM for code-intensive applications.
What is the best drop-in replacement for PIC18F2321-E/ML?
The PIC18F2321-I/ML is the closest drop-in replacement, sharing the same 28-QFN-EP package and pinout but rated for -40C to +85C instead of -40C to +125C. Within the same family, the PIC18F2421 (16 KB Flash, same package) and PIC18F2221 (4 KB Flash, same package) are pin-compatible for memory scaling. For form-fit-function automotive, PIC18F2321T-I/ML (tape-and-reel variant) is also drop-in.
Can PIC18F2221-E/SO replace PIC18F2321-E/ML?
No, the PIC18F2221-E/SO is NOT a drop-in replacement for PIC18F2321-E/ML because the /SO package is a 28-pin SOIC wide body, while the /ML is a 28-pin QFN-EP - the land patterns differ. However, the PIC18F2221T-I/ML (tape/reel QFN-EP variant) IS pin-compatible on the same 28-QFN-EP footprint, differing only in flash density (4KB vs 8KB). Always confirm footprint before PCB reuse.
When should I choose PIC18F2321 over PIC18F4550?
Choose PIC18F2321-E/ML when the design needs <=25 I/O, no native USB, and <=8KB Flash in a small 28-QFN footprint. Choose PIC18F4550 when you need USB 2.0 full-speed, 35 I/O, 32KB Flash, and 40-pin PDIP/QFN package. Both are PIC18-family and share the same C compiler (XC8) and instruction set for code migration.
Where can I download the PIC18F2321-E/ML datasheet PDF?
The PIC18F2321-E/ML datasheet (Microchip Document 39602) can be downloaded from ww1.microchip.com/downloads/en/DeviceDoc/39602G.pdf. The datasheet covers electrical characteristics, peripheral modules, instruction set, and packaging. FindIC also hosts a 6,445KB PDF version (file size noted from FindIC listing as of 2026-09-26). Confirm revision letter matches the silicon revision you received.
What is the pinout of PIC18F2321-E/ML?
The PIC18F2321-E/ML 28-QFN-EP pinout assigns pins 1-7 (RA0-RA5, RA6/OSC2, RA7/OSC1), pins 8-10 (VSS, OSC1/CLKI, OSC2/CLKO), pins 11-18 (RC0-RC7), pins 19-26 (RD0-RD7), pin 27 (VSS), and pin 28 (VDD). Per Microchip datasheet Document 39602 pinout table, the exposed pad (EP) must be soldered to the ground plane. Detailed pin functions are documented in section 2 of the datasheet.
What are the key features of PIC18F2321-E/ML that engineers should know?
The PIC18F2321-E/ML combines an 8-bit PIC18 RISC core (up to 10 MIPS), 8KB Flash, 512B RAM, 256B EEPROM, 25 digital I/O, 10-channel 10-bit ADC, 2 analog comparators, 2 CCP modules, MSSP (SPI/I2C), EUSART, internal 8MHz oscillator with PLL, nanoWatt low-power modes, and self-programmability. According to Microchip datasheet Document 39602, the wide 2.0-5.5V VDD range and -40C to +125C extended temperature grade support automotive and industrial deployments.

Engineering reference data for PIC18F2321-E/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC18F2321-E/ML when you need an 8-bit PIC18 MCU with 8KB Flash, 25 I/O, 10-bit ADC in a compact 28-QFN-EP package for industrial (-40C to +125C) or automotive environments. The -E grade handles temperature stress without thermal derating. For cost-down designs where 4KB Flash suffices, the PIC18F2221-E/ML saves ~$1 at qty 1000 with the same pinout. For firmware growth headroom, the PIC18F2421-I/ML doubles Flash to 16KB in the same QFN-EP package. Avoid the PIC18F2321-I/ML if your deployment temperature exceeds +85C - the -I grade is industrial-only. All five parts listed as alternatives share the 28-QFN-EP footprint, enabling PCB reuse across the family.

Comparison with Alternatives

Parameter This Product PIC18F2321-I/ML PIC18F2421-I/ML PIC18F2221-E/ML PIC18F2221T-I/ML PIC18F1320-E/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN-EP (6x6 mm) 28-QFN-EP (6x6 mm) - same 28-QFN-EP (6x6 mm) - same 28-QFN-EP (6x6 mm) - same 28-QFN-EP (6x6 mm) - same 28-QFN-EP (6x6 mm) - same
Flash Memory 8 KB 8 KB 16 KB 4 KB 4 KB 8 KB
RAM 512 bytes 512 bytes 768 bytes 256 bytes 256 bytes 256 bytes
EEPROM 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes
Operating Temperature -40C to +125C (E grade) -40C to +85C (I grade) -40C to +85C (I grade) -40C to +125C (E grade) -40C to +85C (I grade) -40C to +125C (E grade)

Key Differentiators

  • Extended -40C to +125C temperature grade (vs PIC18F2321-I/ML)
  • 8KB Flash / 512B RAM balanced density (vs PIC18F2221-E/ML)
  • Compact 28-QFN-EP (6x6 mm) footprint (vs PIC18F4550-I/P)

Design Notes

Place a 100nF ceramic decoupling capacitor as close as physically possible to each VDD/AVDD pin pair, plus a single 10uF bulk tantalum or ceramic capacitor on the main supply rail within 1 inch of the MCU. The PIC18F2321 has separate VDD/VSS pins on opposite sides of the QFN package; route both pairs to the ground/power planes with wide traces. The exposed thermal pad must be soldered to a copper ground pour to provide the chip's main thermal dissipation path.

The QFN-EP package dissipates heat through the exposed pad to the PCB copper pour. For continuous operation near 10 MIPS at 5V with all peripherals active, design for at least 100 sq mm of ground copper connected to the EP. Without proper EP soldering, junction temperature can exceed 125C at high ambient even within rated load. Use a star-ground topology tying the EP pour back to the main ground plane via a single low-inductance via cluster.

Configure all unused I/O pins as outputs driving low, and disable unused peripherals via firmware (PMD registers) to minimize quiescent current drain - a common PIC18 design pitfall is leaving unused pins floating, which can inject noise and draw tens of microamps per pin. When migrating firmware from PIC18F2221 to PIC18F2321, verify the Flash/RAM partition; code compiled for 4KB will link but the larger 8KB image wastes Flash if not intentional.

Keep analog inputs (RA0-RA5) physically separated from switching digital lines and PWM outputs (CCP1, CCP2 on RC2/RC1) on the PCB to reduce ADC crosstalk. Route the analog reference (VREF+/VREF-) pins with short, guarded traces if used; otherwise tie VREF+ to VDD and VREF- to VSS. Place the analog ground (AGND) tie point directly under the MCU EP rather than routing it as a separate trace.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free compliance per Microchip product page. AEC-Q100 qualification is not separately listed for PIC18F2321-E/ML standard part; the -E temperature grade supports automotive environments but does not by itself confer AEC-Q100 status. Confirm AEC-Q100 status with Microchip documentation for automotive PPAP submissions.

Data verified on: 2026-09-26 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC18F2321 PIC18F2321-E/ML PIC18F2321-I/ML PIC18F2421 PIC18F2221 PIC18F1320 PIC18 PIC10/12/16/18 8-bit microcontroller RISC architecture Flash memory EEPROM nanoWatt technology QFN-EP 28-QFN exposed thermal pad 10-bit ADC analog comparator CCP module MSSP EUSART SPI I2C RoHS AEC-Q100 automotive body controller industrial sensor node consumer appliance
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