PIC18LF25J11T-I/ML - 8-bit 32KB Flash MCU, 28-QFN | Microchip
MPN: PIC18LF25J11T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.1 | $4.10 |
| 10 | $3.78 | $37.80 |
| 100 | $3.32 | $332.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.62 | $2,620.00 |
PIC18LF25J11T-I/ML Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, program memory, timers, and peripherals into one package. PIC18 RISC MCUs sit within Microchip's 8-bit hierarchy: 8-bit MCU -> PIC microcontroller -> PIC18 family -> PIC18LFxxJxx low-voltage sub-family. The reduced instruction set architecture yields deterministic timing suitable for real-time control, while the modified Harvard bus separates program and data memory for predictable instruction fetch and simultaneous access.
Key features include 32KB Flash, 4KB SRAM, 10-bit ADC, multiple PWM channels, USART, SPI, I2C, and ultra-low-power sleep modes. The "J11" sub-family adds CTMU (Charge Time Measurement Unit) for capacitive touch, nanoWatt XLP sleep, and an internal 8 MHz oscillator with PLL to 48 MHz. The 28-pin QFN-EP exposed-pad package enhances thermal dissipation, allowing sustained 12 MIPS throughput without active cooling. According to the manufacturer datasheet, 34 digital I/O lines are available across ports A, B, and C in 28-pin QFN/ML packages.
Architecturally, the PIC18LF25J11 uses a 16-bit instruction word with 8-bit data path, hardware multiply, hardware stack of 31 levels, and C-optimizing architecture. The PIC18LF prefix indicates 2.0V-3.3V operation optimized for lithium-battery applications; the "T" suffix denotes tape-and-reel packaging, "I" denotes industrial temperature range -40C to +85C, and "/ML" denotes the 28-pin QFN package with exposed pad.
Typical applications include battery-powered sensor hubs, USB device controllers, capacitive touch user interfaces, low-power wireless sensor nodes, and consumer white goods. The wide operating voltage, on-board peripherals, and nanoWatt XLP modes make it well-suited for products where extended battery life and rich peripheral integration matter more than absolute CPU throughput.
When designing with this device, ensure that the PICkit or ICD programmer is connected to the ICSP pins (PGC/PGD) and that the VCAP pin is decoupled with a low-ESR capacitor for the internal 2.5V regulator. The "LF" 2.0V minimum supply enables direct connection to single-cell lithium cells without external LDO. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC18LF25J11T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18LF25J11T-I/ML (same form factor and footprint) — differing in Package, Core Architecture, Timers, ADC, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18LF25J11-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18LF25J10-I/ML
✅ Drop-In✓ In Stock
$1.62 / Unit
View Datasheet →PIC18LF25J10T-I/ML
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →PIC18LF25K50-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25J11-I/ML
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →PIC18F25K22-I/ML
✅ Drop-In✓ In Stock
$2.74 / Unit
View Datasheet →PIC18LF25J11T-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC18, 8-bit RISC, modified Harvard |
| Program Memory (Flash) | 32 KB |
| Data Memory (SRAM) | 4 KB |
| Maximum CPU Speed | 12 MIPS (48 MHz internal clock, 40 MHz external) |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| I/O Pin Count | 34 (per manufacturer datasheet) / 21 multiplexed on 28-pin QFN |
| Communication Interfaces | UART/USART, SPI, I2C |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 28-pin QFN-EP (ML) 6x6 mm |
| Mounting Type | Surface Mount, Tape and Reel |
| Power-Saving Technology | nanoWatt XLP |
| Instruction Word | 16-bit |
| Hardware Stack | 31 levels |
| RoHS Status | Compliant |
PIC18LF25J11T-I/ML Pin Configuration
| Pin 1 | MCLR/RE3 — Master Clear (reset) input or digital I/O RE3 |
| Pin 2 | RA0 — Digital I/O RA0 / analog input |
| Pin 3 | RA1 — Digital I/O RA1 / analog input |
| Pin 4 | RA2 — Digital I/O RA2 / analog input |
| Pin 5 | RA3 — Digital I/O RA3 / analog input |
| Pin 6 | RA4 — Digital I/O RA4 / analog input |
| Pin 7 | RA5 — Digital I/O RA5 / analog input |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RA7 — Digital I/O RA7 / oscillator input |
| Pin 10 | RA6 — Digital I/O RA6 / oscillator output |
| Pin 11 | VDD — Positive supply voltage 2.0V to 3.6V |
| Pin 12 | VSS — Ground reference |
| Pin 13 | RB0 — Digital I/O RB0 / analog input / interrupt-on-change |
| Pin 14 | RB1 — Digital I/O RB1 / analog input / interrupt-on-change |
| Pin 15 | RB2 — Digital I/O RB2 / analog input / interrupt-on-change |
| Pin 16 | RB3 — Digital I/O RB3 / analog input / interrupt-on-change |
| Pin 17 | RB4 — Digital I/O RB4 / analog input / interrupt-on-change |
| Pin 18 | RB5 — Digital I/O RB5 / analog input / interrupt-on-change |
| Pin 19 | VCAP — Internal regulator output - decouple with low-ESR cap |
| Pin 20 | PGC — ICSP clock input for programming/debug |
| Pin 21 | PGD — ICSP data I/O for programming/debug |
| Pin 22 | RC0 — Digital I/O RC0 |
| Pin 23 | RC1 — Digital I/O RC1 |
| Pin 24 | RC2 — Digital I/O RC2 |
| Pin 25 | RC3 — Digital I/O RC3 |
| Pin 26 | RC4 — Digital I/O RC4 |
| Pin 27 | RC5 — Digital I/O RC5 |
| Pin 28 | RC6 — Digital I/O RC6 / USB D- in J11 family |
| Pin 29 | EP — Exposed pad - must be soldered to ground |
Typical Applications
PIC18LF25J11T-I/ML is suitable for 6 applications: USB HID Peripheral Devices, Battery-Powered Sensor Hubs, Capacitive Touch User Interfaces, Consumer Appliance Control Boards, Industrial Sensor Transmitters, Low-Speed Data Acquisition Modules.
USB HID Peripheral Devices
The PIC18LF25J11T-I/ML integrates a USB 2.0 full-speed device controller with on-chip transceiver, making it well suited for low-cost USB peripherals such as HID keyboards, mice, custom sensors, and bootloaders. With 32 KB Flash and 4 KB SRAM it can host a CDC or HID class driver plus application code, while the 2.0V minimum VDD allows direct connection to a single-cell lithium or USB bus power through a low-drop regulator. The 12 MIPS CPU and 16-bit instructions support polling rates up to 1 kHz with sub-millisecond interrupt latency. Place a 0.1 uF decoupling capacitor near VDD and follow USB-IF 90-ohm differential impedance on the D+/D- traces for compliance.
Recommended
Battery-Powered Sensor Hubs
The PIC18LF25J11T-I/ML's 2.0 V minimum VDD and nanoWatt XLP sleep modes (under 1 uA in deep sleep) make it ideal for battery-powered sensor hubs running from a single CR2032 or two-cell alkaline supply. The 10-bit ADC with multiple input channels reads temperature, humidity, and battery voltage while the hardware ULP wake-up timer triggers periodic measurements. With 32 KB Flash, a small RTOS or state-machine firmware can manage multiple sensor stacks and BLE-uart handoff. Compared to 32-bit MCUs, the 8-bit PIC18 reduces active power to roughly 2 mA at 12 MIPS, extending battery life by 30-50 percent in typical 1-second duty-cycle applications.
Recommended
Capacitive Touch User Interfaces
The PIC18LF25J11T-I/ML's CTMU (Charge Time Measurement Unit) and mTouch peripheral enable robust capacitive touch button, slider, and wheel sensing at zero BOM cost. The CTMU provides sub-picofarad resolution and hardware-driven timing, offloading touch scanning from the CPU so the application can remain in low-power sleep between scans. With 34 I/O and 32 KB Flash, a single MCU can scan a 12-key keypad, drive an LCD via I2C segment controller, and host BLE-uart communication to a smartphone. The industrial -40C to +85C temperature range ensures reliable touch performance in outdoor and automotive interior environments.
Recommended
Consumer Appliance Control Boards
In consumer appliances such as washing machines, coffee makers, and smart kitchen scales, the PIC18LF25J11T-I/ML serves as the main user-interface and sensor aggregation MCU. Its 12 MIPS throughput easily handles PWM-driven LED feedback, rotary encoder input via QEI, and UART communication to a Wi-Fi or BLE module. The wide operating voltage and industrial temperature range meet appliance standards. With 4 KB RAM it can buffer display strings and process sensor averages before forwarding state to a network coprocessor. The exposed-pad QFN package supports hand-solder rework for low-volume SKUs and reflow soldering for high-volume production.
Recommended
Industrial Sensor Transmitters
Industrial 4-20 mA loop-powered sensor transmitters benefit from the PIC18LF25J11T-I/ML's wide temperature range, robust ESD tolerance on I/O, and 10-bit ADC for transducer readout. With nanoWatt XLP sleep, the MCU can duty-cycle itself to draw less than 1.5 mA from the loop, leaving at least 3.5 mA for the sensor bridge and signal conditioning. The 28-pin QFN fits on 12 mm-diameter circular PCBs typical of field-mounted instrumentation. Optional features like hardware timers support HART modulation when paired with an external HART modem, allowing migration from analog to digital industrial networks without redesigning the sensor front-end.
Recommended
Low-Speed Data Acquisition Modules
Low-speed data acquisition modules for HVAC controllers, energy meters, and environmental monitors rely on the PIC18LF25J11T-I/ML to sample analog inputs, compute averages, and forward results via UART, SPI, or I2C. The 10-bit ADC at 200 kSPS handles up to 8 channels with hardware averaging, while the 32 KB Flash accommodates lookup tables for calibration and linearization. The 16-bit timer and PWM outputs enable simultaneous closed-loop control of fan speed or valve position. With industrial temperature grade and industrial-grade ESD protection on every I/O, the PIC18LF25J11 survives harsh factory-floor installations where consumer MCUs would fail.
Recommended
Recommended Products Summary
Engineering reference data for PIC18LF25J11T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18LF25J11-I/ML | PIC18LF25J10-I/ML | PIC18LF25K50-I/ML | PIC18F25K22-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin QFN-EP (ML) | 28-pin QFN-EP (ML) - same | 28-pin QFN-EP (ML) - same | 28-pin QFN-EP (ML) - same | 28-pin QFN-EP (ML) - same |
| Flash Memory | 32 KB | 32 KB | 16 KB | 32 KB | 32 KB |
| SRAM | 4 KB | 4 KB | 3.7 KB | 2 KB | 1.5 KB |
| Maximum CPU Speed | 12 MIPS (48 MHz) | 12 MIPS | 12 MIPS | 16 MIPS (48 MHz) | 16 MIPS (64 MHz) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 5.5 V | 1.8 V to 5.5 V |
| USB Support | USB 2.0 Full-Speed Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | No USB |
| ADC | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. Qty-1000 Price (USD) | 2.62 | 2.55 | 2.40 | 2.85 | 2.30 |
Key Differentiators
- Lowest minimum VDD in the J11 family (vs PIC18F25J11-I/ML)
- Higher Flash memory than J10 sibling (vs PIC18LF25J10-I/ML)
- On-chip USB 2.0 with crystal-less operation (vs PIC18F25K22-I/ML)
- nanoWatt XLP sleep modes below 1 uA (vs PIC18F25J11-I/ML)
Design Notes
The PIC18LF25J11T-I/ML integrates an internal 2.5V regulator whose output must be bypassed on the VCAP pin (pin 19) with a low-ESR ceramic capacitor (4.7 uF X7R minimum, 1.0 uF extra at high temperatures) to maintain regulator stability. Place the VCAP capacitor within 2 mm of the pin with a short trace; long traces add ESL and can cause the core voltage to droop during load transients. Without proper VCAP decoupling the part may experience brown-out resets under heavy USB traffic.
Estimated: at 12 MIPS active CPU load with USB suspend, the PIC18LF25J11T-I/ML dissipates roughly 24 mW. The 28-pin QFN with exposed pad (EPAD) has a junction-to-ambient thermal resistance of approximately 30 C/W when the EPAD is soldered to a 1 square inch 2-oz copper pour. This yields a junction temperature rise of about 0.7 C above ambient, well within the industrial -40C to +85C range. Failure to solder the EPAD increases theta_JA by 50 percent or more and may cause thermal accumulation during long USB transmit bursts.
Follow USB-IF routing guidelines on D+ and D- lines: 90 ohm differential impedance, matched length within 150 mil, no splits or vias, and a guard ground on each side of the pair. Place 15 kohm pull-down resistors on each USB line if the design supports USB-IF battery-charging detection. Keep ICSP traces PGC and PGD away from switching regulators and high-current traces to avoid programming errors and ensure reliable in-circuit debug with PICkit or ICD.
Do not power the PIC18LF25J11T-I/ML above 3.6V on VDD - the LF variant is not 5V tolerant on the core. If 5V I/O tolerance is required, migrate to the PIC18F25J11 or PIC18F25K22. MCLR must be tied to VDD through a 10 kohm resistor (or left open only if not used); never leave MCLR floating, as noise can cause spurious resets. Configuration bits must be set early in firmware or via ICSP; default unprogrammed bits may disable the PLL or select the wrong oscillator mode.
Compliance Information
RoHS compliant per manufacturer datasheet; not AEC-Q100 qualified. Industrial temperature grade -40C to +85C; refer to manufacturer datasheet for absolute maximum ratings.
