PIC24F08KA101-E/MQ - 16-Bit 32MHz XLP MCU | Microchip
MPN: PIC24F08KA101-E/MQ ✓ ActivePIC24F08KA101-E/MQ Overview
A microcontroller is a programmable semiconductor that combines a processor core, memory, and peripherals on one integrated circuit. In the product hierarchy, a microcontroller belongs to embedded processors and microcontrollers, while the PIC24F08KA101-E/MQ is more specifically a low-power 16-bit RISC flash MCU. Its XLP feature set is designed for applications where standby-current consumption is as important as active processing performance.
The verified device data identifies 8 KB of program memory organized as 2.75K × 24 words, 1.5K × 8 bits of RAM, 18 I/O pins, and a maximum operating speed of 32 MHz. The internal oscillator is suitable for designs that need to minimize external clock-component count. A 20-VQFN surface-mount package with an exposed pad supports compact PCB layouts, although careful thermal and layout design remains essential.
The PIC24 architecture combines a 16-bit instruction-oriented core with integrated flash memory and low-power peripherals. DSBOR addresses brown-out detection during low-power operation, DSWDT supports watchdog supervision, and the RTCC provides real-time calendar functions without requiring a separate external clock device. These capabilities allow a designer to consolidate functions and reduce the component count in low-power embedded equipment.
Typical applications include battery-operated sensors, compact industrial controllers, low-power monitoring equipment, alarm and security systems, and connected devices that spend substantial time in deep sleep. The MCU is particularly suitable when local real-time timing, programmable brown-out detection, and watchdog-based recovery are useful. Its 18 I/O pins also provide enough interface capacity for sensing, control outputs, status indicators, and communication peripherals in space-constrained products.
Designers should verify the device's operating-voltage limits, exact pin functions, exposed-pad connection, and electrical limits against the manufacturer datasheet before layout release. The exposed pad must receive an appropriate thermal and electrical layout, while decoupling and programming/debug access require careful placement. Firmware should also use the documented low-power modes and wake conditions rather than assuming that the XLP label specifies a universal current figure.
This product page combines verified manufacturer and distributor information with explicit missing-data markers, package-aware replacement analysis, and practical low-power design guidance. It distinguishes confirmed electrical facts from parameters that still require confirmation from the official datasheet, helping engineers evaluate fit without silently filling gaps with guessed values.
Drop-in alternatives for PIC24F08KA101-E/MQ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F08KA101-E/MQ (same form factor and footprint) — differing in Maximum CPU Speed, Package, Real-Time Clock.
PIC24F08KA101-I/MQ
✅ Drop-InContact for price
View Datasheet →PIC24F16KA101-I/MQ
✅ Drop-InContact for price
View Datasheet →PIC24F08KA101-E/MQ Maximum Ratings & Electrical Characteristics
| Microcontroller Type | 16-bit Flash Microcontroller |
| Product Family | PIC24F |
| Low-Power Technology | XLP eXtreme Low Power |
| Maximum CPU Speed | 32 MHz |
| Program Memory Size | 8 KB (2.75K × 24) |
| RAM Size | 1.5K × 8 bits |
| Number of I/O Pins | 18 pins |
| Oscillator Type | Internal |
| Package | 20-pin VQFN with exposed pad |
| Package Dimensions | 5 × 5 mm |
| Mounting Type | Surface Mount |
| Core Architecture | 16-bit PIC RISC |
| Brown-Out Detection | DSBOR supported |
| Watchdog Feature | DSWDT supported |
| Real-Time Clock | RTCC supported |
| Deep-Sleep Support | Supported |
PIC24F08KA101-E/MQ 5 × 5 mm Pin Configuration Guide
Pin configuration for PIC24F08KA101-E/MQ (5 × 5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC24F08KA101-E/MQ.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC24F08KA101-E/MQ is suitable for 6 applications: Battery-Powered Sensor Nodes, Low-Power Industrial Monitoring, Battery-Powered Security Sensors, Compact Control and Alarm Modules, Portable Medical and Wellness Devices, Energy Metering and Data Loggers.
Battery-Powered Sensor Nodes
The PIC24F08KA101-E/MQ fits compact battery-powered sensor nodes because its 16-bit PIC core operates up to 32 MHz while the XLP architecture supports low-power and deep-sleep operation. Its 18 I/O pins can connect a sensor, status indicators, and a low-rate communication interface without requiring a large pin-count package. DSBOR adds supply monitoring, DSWDT supports recovery from stalled firmware, and RTCC can provide timekeeping without a separate clock component. The design benefit is lower standby overhead, although the exact sleep current, wake-up time, and average-current budget must be verified in the datasheet for the selected configuration.
Recommended
Low-Power Industrial Monitoring
The PIC24F08KA101-E/MQ is suitable for low-power industrial monitoring equipment that combines local sensing with extended standby operation. Its 18 I/O pins provide capacity for digital sensors, relay or indicator controls, and status inputs, while the 32 MHz maximum speed supports responsive control and event processing. XLP low-power behavior, DSBOR brown-out detection, DSWDT watchdog supervision, and the RTCC real-time clock allow one MCU to coordinate several reliability functions. For industrial deployment, verify the E-grade temperature range, supply limits, isolation requirements, and exposed-pad thermal design before releasing the PCB.
Recommended
Battery-Powered Security Sensors
The PIC24F08KA101-E/MQ can support battery-powered security and alarm sensors by combining local decision-making with XLP deep-sleep operation. A 32 MHz 16-bit core permits rapid handling of sensor events, while 18 I/O pins can serve digital detectors, indicator outputs, and a serial communications link. DSWDT can recover the device from a firmware lockup, and RTCC can maintain event timing without relying on a continuously powered host. The measurable benefit is reduced idle burden and fewer external timing or supervisory components. Selection must still account for false-alarm logic, battery leakage, wake latency, and the required environmental temperature range.
Recommended
Compact Control and Alarm Modules
The PIC24F08KA101-E/MQ is appropriate for compact control and alarm modules that require deterministic local I/O without a high-cost application processor. Its 8 KB flash and 1.5K × 8-bit RAM provide a constrained embedded platform, while the 32 MHz speed supports responsive state-machine and timing control. The 20-VQFN package reduces board area, and the RTCC can timestamp events, while DSBOR and DSWDT improve recovery behavior. Engineers should keep firmware within verified memory limits and use the exposed pad as directed for electrical and thermal performance. For complex protocols or extensive logs, the related PIC24F16KA101 may offer more code headroom.
Recommended
Portable Medical and Wellness Devices
The PIC24F08KA101-E/MQ can fit portable medical, wellness, or personal-monitoring products where low standby power and local signal processing are valuable. Its 16-bit architecture and 32 MHz maximum speed can execute control logic and sensor handling, while XLP deep-sleep support reduces energy use between measurements. The RTCC enables time-based records, and DSBOR helps manage rail integrity during battery transitions. Eighteen I/O pins are useful for sensors, buttons, displays, and indicators in a compact 5 × 5 mm VQFN footprint. Medical use still requires application-specific risk analysis, verified operating limits, electrical isolation where applicable, and validation of every relevant safety standard.
Recommended
Energy Metering and Data Loggers
The PIC24F08KA101-E/MQ is suitable for compact energy-metering or data-logging modules that periodically sample inputs and remain idle between events. Its 32 MHz maximum processing rate supports timing and computation, while XLP low-power modes can reduce consumption between measurements. The RTCC provides a local calendar for time-stamped records, and 18 I/O pins can connect sensing inputs or a communications interface. DSBOR improves behavior during supply disturbances, and DSWDT supports unattended recovery. Designers must budget flash and RAM carefully, validate the RTCC accuracy over the intended temperature range, and confirm that the E-grade part meets the product's environmental and calibration requirements.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F08KA101-E/MQ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F08KA101-I/MQ | PIC24F16KA101-I/MQ |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-VQFN (5x5) with exposed pad | 20-VQFN (5x5) | 20-VQFN (5x5) |
| Architecture | 16-bit PIC24F RISC | 16-bit PIC24F RISC | 16-bit PIC24F RISC |
| Maximum Speed | 32 MHz | 32 MHz | Up to 16 MIPS |
| Low-Power Technology | XLP with DSBOR, DSWDT, and RTCC | XLP with DSBOR, DSWDT, and RTCC | PIC24F XLP technology |
| Temperature-Grade Suffix | E | I | I |
Key Differentiators
- Matches the closest same-family candidate's core memory and speed configuration (vs PIC24F08KA101-I/MQ)
- Greater program-memory headroom in the related alternative (vs PIC24F16KA101-I/MQ)
- Directly documented XLP peripheral set for low-power system supervision (vs PIC24F16KA101-I/MQ)
- Compact exposed-pad package supports space-constrained assemblies (vs PIC24F16KA101-I/MQ)
Design Notes
Use the manufacturer's XLP mode-selection and peripheral-suspension guidance to control the device's average consumption. Do not estimate a production sleep-current figure from the 32 MHz speed rating; verify the relevant mode, operating voltage, and temperature in the family datasheet. DSBOR, DSWDT, and RTCC can remain useful in low-power designs, but their wake-up behavior and clock-tree contributions must be included in the battery budget. Also validate whether an external regulator or pull network continues to consume power while the MCU is asleep.
The 20-VQFN package includes an exposed pad, but its presence does not automatically remove the need for thermal design. Follow the official land pattern and exposed-pad connection instructions, place thermal vias under the pad when permitted, and provide nearby ground copper to spread heat. Check the maximum operating and storage temperature against the E-grade ordering option. Actual junction temperature depends on switching activity, supply voltage, output loading, ambient temperature, and PCB copper, so a thermal calculation should use the datasheet package data rather than an assumed package rating.
Place all required decoupling capacitors directly between the appropriate supply and ground pins at the device, with the shortest and lowest-inductance path practical. Route high-current return paths away from sensitive measurement and timing inputs, and use the exposed pad as both a thermal and low-impedance ground connection exactly as specified. Because the verified excerpts do not include the pin table or layout drawing, do not finalize pin assignments or capacitor values until they have been checked against the official PIC24F08KA101 datasheet.
Avoid selecting a MCU solely because the package drawing appears compatible. The PIC24F16KA101-I/MQ shares a related package and XLP positioning but has a different speed statement and memory family position, while the -I/MQ version changes the temperature-grade suffix from -E. Before substitution, compare supply voltage, I/O limits, peripheral mapping, boot and programming behavior, interrupts, memory size, watchdog timing, RTCC behavior, and qualification. Existing firmware may also depend on linker limits, timing assumptions, and register behavior that can differ between PIC24F families.
Compliance Information
The verified excerpts do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. The component is an industrial microcontroller rather than an automotive-qualified device, so AEC-Q100 is marked not applicable; current compliance statements should be confirmed on the manufacturer product page or declaration documents.
