PIC24FV32KA301T-I/SO - 32KB Flash XLP 16-bit MCU | Microchip
MPN: PIC24FV32KA301T-I/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.84 | $3.84 |
| 10 | $3.45 | $34.50 |
| 100 | $3.1 | $310.00 |
| 500 | $2.78 | $1,390.00 |
| 1,000 | $2.49 | $2,490.00 |
PIC24FV32KA301T-I/SO Overview
A 16-bit microcontroller (MCU) is a single-chip processor with an internal datapath 16 bits wide, sitting in the product-type hierarchy microcontroller -> MCU -> embedded processor -> semiconductor IC. Microchip's PIC24F XLP family targets battery-powered and energy-harvesting systems, where sleep-mode current, wake-up latency and peripheral autonomy in deep sleep are first-class design parameters. The 'FV' prefix denotes the wide-Vdd variant (1.8 V - 3.6 V) suitable for 2xAA, Li-coin, and unregulated 3.3 V rails.
Key features include eXtreme Low Power (XLP) technology with sub-uA deep-sleep retention, dedicated Deep-Sleep BOR (DSBOR) and Deep-Sleep WDT (DSWDT) that keep running when core clocks are gated, a Real-Time Clock Calendar (RTCC) operating from a 32 kHz source in sleep, an integrated 12-bit ADC and a Charge Time Measurement Unit (CTMU) for capacitive touch and current measurement. The 17 digital I/O pins include peripherals such as UART, SPI, I2C and PWM.
The PIC24FV32KA301T-I/SO uses a modified Harvard RISC architecture with a 16-bit instruction word and 24-bit address space, supported by MPLAB X IDE, MPLAB XC16 compiler and the MPLAB Code Configurator for peripheral setup. The wide-Vdd core avoids the need for an external LDO in many battery applications, while the SOIC-20 footprint allows hand-solderable prototypes and standard 1.27 mm pitch PCB layouts.
Typical applications include wearable fitness and medical sensors, IoT sensor nodes, remote controls, low-power wireless sensor nodes (ZigBee/BLE host MCUs), electronic shelf labels, smart meters, and battery-backed instrumentation that benefits from always-on RTCC and brown-out monitoring.
Design consideration: keep the ADC reference decoupling tight to the MCU and route RTCC crystal traces short and guarded; the wide-Vdd variant eases battery-direct designs but still benefits from bulk + 100 nF + 10 nF local decoupling at each supply pin.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes that are not duplicated in the manufacturer datasheet summary.
Drop-in alternatives for PIC24FV32KA301T-I/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FV32KA301T-I/SO (same form factor and footprint) — differing in Package, ADC, Maximum CPU Speed, EEPROM, I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FV32KA301-I/SO
✅ Drop-In✓ In Stock
$2.16 / Unit
View Datasheet →PIC24FV32KA301T-I/SO
✅ Drop-In✓ In Stock
$2.49 / Unit
View Datasheet →PIC24F32KA301-I/SO
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC24FV32KA302-I/SO
✅ Drop-In✓ In Stock
$2.14 / Unit
View Datasheet →PIC24FV32KA301T-I/SO Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit RISC (modified Harvard) |
| Program Flash | 32 KB (11K x 24) |
| SRAM | 2 KB |
| EEPROM | 512 B |
| Maximum CPU Speed | 32 MIPS at 32 MHz |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V |
| I/O Pins | 17 |
| ADC | 12-bit, multi-channel |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes, runs in Deep Sleep |
| Deep-Sleep BOR (DSBOR) | Yes |
| Deep-Sleep WDT (DSWDT) | Yes |
| Package | 20-pin SOIC (7.50 mm / 0.295 in body width) |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| XLP Family Feature | eXtreme Low Power (sub-uA deep sleep retention) |
PIC24FV32KA301T-I/SO Pin Configuration
| Pin 1 | RA0 — Analog/Digital I/O, ULPWU-capable |
| Pin 2 | RA1 — Analog/Digital I/O |
| Pin 3 | RA2 — Analog/Digital I/O |
| Pin 4 | RA3 — Analog/Digital I/O |
| Pin 5 | RA4 — Analog/Digital I/O, SOSCO option |
| Pin 6 | RA5 — Analog/Digital I/O, SOSCI option |
| Pin 7 | RA6 — Analog/Digital I/O, OSC1 option |
| Pin 8 | RA7 — Analog/Digital I/O, OSC2 option |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive supply 1.8 V to 3.6 V |
| Pin 11 | RB0 — Digital I/O, SDA1 |
| Pin 12 | RB1 — Digital I/O, SCL1 |
| Pin 13 | RB2 — Digital I/O |
| Pin 14 | RB3 — Digital I/O |
| Pin 15 | RB4 — Digital I/O |
| Pin 16 | RB5 — Digital I/O |
| Pin 17 | RB6 — Digital I/O, ICS-PGC |
| Pin 18 | RB7 — Digital I/O, ICS-PGD |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply 1.8 V to 3.6 V |
Typical Applications
PIC24FV32KA301T-I/SO is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Fitness and Health Devices, Smart Meter and Home Energy Monitoring, Electronic Shelf Labels (ESL) and Retail Displays, Remote Controls and Wireless Key Fobs, Industrial Sensor Transmitters (Loop-Powered).
Battery-Powered IoT Sensor Node
The PIC24FV32KA301T-I/SO is well suited as the host MCU for low-duty-cycle IoT sensor nodes running on 2xAA or Li-coin cells. Its 1.8 V to 3.6 V wide-Vdd FV variant removes an external LDO and its XLP deep-sleep current is sub-uA with RTCC + DSBOR + DSWDT remaining active. The 32 KB Flash fits ZigBee/BLE host stacks and sensor fusion code; the 12-bit ADC plus CTMU handle temperature, light and capacitive-touch measurements.
Recommended
Wearable Fitness and Health Devices
For wearable fitness bands and patches, the PIC24FV32KA301T-I/SO offers the always-on RTCC, low-power sleep modes and 12-bit ADC with CTMU needed for heart-rate, SpO2 and motion signal conditioning. The wide 1.8-3.6 V supply range supports direct Li-coin battery connection. Industrial -40 C to +85 C operation covers skin-temperature extremes and the SOIC-20 7.50 mm body is hand-solderable for low-volume clinical prototypes.
Recommended
Smart Meter and Home Energy Monitoring
Smart electricity, gas and water meters need the PIC24FV32KA301T-I/SO's RTCC for tariff scheduling, the 12-bit ADC for current/voltage sensing and the wide-Vdd FV core for direct 3.6 V lithium battery backup. DSBOR and DSWDT provide brown-out and watchdog supervision without external components, while 32 KB Flash accommodates DLMS/COSEM or wireless-M-Bus protocol stacks. The SOIC-20 7.50 mm package is suitable for through-hole-style reflow on the meter main board.
Recommended
Electronic Shelf Labels (ESL) and Retail Displays
Electronic shelf labels depend on sub-uA sleep current, integrated RTCC for synchronized refresh windows and a small MCU that can run from a CR2032 coin cell. The PIC24FV32KA301T-I/SO matches these requirements with its XLP deep-sleep current, RTCC and wide 1.8-3.6 V supply. The 32 KB Flash supports ESL protocol stacks (e.g. BLE or sub-GHz) and the 12-bit ADC plus CTMU enable capacitive touch buttons for label interaction.
Recommended
Remote Controls and Wireless Key Fobs
Battery-powered IR/RF remote controls benefit from the PIC24FV32KA301T-I/SO's deep-sleep current in the nA range and the RTCC for wake-on-button press detection. The wide-Vdd FV variant allows direct 3 V CR2032 operation without an LDO, the CTMU supports capacitive-touch buttons, and 32 KB Flash is enough for IR protocols (RC5/RC6, NEC, SIRC) and proprietary RF firmware.
Recommended
Industrial Sensor Transmitters (Loop-Powered)
4-20 mA loop-powered industrial transmitters need wide supply tolerance, low quiescent current and an integrated ADC. The PIC24FV32KA301T-I/SO's 1.8-3.6 V FV core with sub-uA XLP deep-sleep current and 12-bit ADC with continuous process signals. DSBOR/DSWDT provide fault supervision and the industrial -40 C to +85 C grade covers factory-floor environments. The 20-pin SOIC footprint supports standard 1.27 mm pitch PCB layouts.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FV32KA301T-I/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FV32KA301-I/SO | PIC24F32KA301-I/SO | PIC24FV32KA302-I/SO |
|---|---|---|---|---|
| Package | 20-pin SOIC (7.50 mm) | 20-pin SOIC (7.50 mm) - same | 20-pin SOIC (7.50 mm) - same | 20-pin SOIC (7.50 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V (FV wide-Vdd) | 1.8 V to 3.6 V (FV wide-Vdd) | 3.3 V typical (F standard) | 1.8 V to 3.6 V (FV wide-Vdd) |
| Program Flash | 32 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 8 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B |
| CPU Speed | 32 MIPS / 32 MHz | 32 MIPS / 32 MHz | 32 MIPS / 32 MHz | 32 MIPS / 32 MHz |
| XLP / Deep Sleep RTCC | Yes | Yes | Yes (F variant) | Yes |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Approx. Unit Price (qty 1, USD) | 3.84 | 3.78 | 3.65 | 4.10 |
Key Differentiators
- Wide-Vdd 1.8 V to 3.6 V eliminates external LDO (vs PIC24F32KA301-I/SO)
- Sub-uA XLP deep sleep with RTCC + DSBOR active (vs PIC24FJ32GA102T-JU)
- 32 KB Flash + 2 KB SRAM fits typical sensor-node stacks (vs PIC24FV08KM202-I/SS)
Design Notes
The FV (wide-Vdd) variant of the PIC24FV32KA301 allows direct 1.8 V to 3.6 V battery operation without an external LDO. Place a 10 uF bulk + 100 nF + 10 nF decoupling stack directly at each VDD pin (pins 10 and 20 on SOIC-20) to keep digital transients out of the analog ADC reference. Use the on-chip DSBOR and DSWDT instead of an external supervisor to save BOM cost in low-power designs.
Estimated: the SOIC-20 (7.50 mm) and SSOP-20 (5.30 mm) packages of the PIC24FV32KA301 share silicon but DIFFER in PCB footprint - they are NOT drop-in. Always re-spin the PCB if switching between SOIC and SSOP. Also note the F (standard) vs FV (wide-Vdd) suffix: F variants typically need a 3.3 V regulator for full performance; FV variants run directly from battery. Confusing the two is a common first-prototype issue.
Keep the SOSCI/SOSCO traces (RA4/RA5) short and guarded by VSS to minimize 32 kHz RTCC oscillator pickup. Route the ADC analog signals (RA0-RA3) away from the PWM outputs (e.g. OC1 on RB0) and place the AVSS/AVDD or filtered VDD star-point at the analog-only RA bank. Use a 4-layer stack-up with continuous VDD/VSS planes under the MCU for thermal spreading and noise suppression.
Estimated: at 32 MIPS / 3.3 V, the PIC24FV32KA301T-I/SO dissipates well under 50 mW in active mode and far less in XLP deep sleep (<1 uA * 3.3 V = ~3 uW). The SOIC-20 7.50 mm body gives theta_JA ~70 C/W, so no special heatsinking is needed. Industrial -40 C to +85 C operation is therefore achievable in SFC ranges typical of indoor enclosures without forced airflow.
Compliance Information
RoHS/REACH compliant per Microchip product page (microchip.com/en-us/product/PIC24F32KA301). Not AEC-Q100 qualified - industrial grade only (-40 C to +85 C).
