Microchip Technology

PIC32MM0064GPL028T-I/ML - 25MHz 64KB Flash 32-bit MCU | Microchip

MPN: PIC32MM0064GPL028T-I/ML ✓ Active
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2.0 V to 3.6 V Vdss 500 nA typical Id 28-QFN-EP (6x6 mm) Package 25 MHz Speed 64 KB (64K x 8) Memory
From $1.52 USD / Unit
MOQ: 1 |
Price updated: 2026-09-30
Volume Pricing
Qty Unit Price Extended
1 $2.84 $2.84
10 $2.55 $25.50
100 $2.18 $218.00
500 $1.83 $915.00
1,000 $1.52 $1,520.00
ℹ️ All prices are in USD

PIC32MM0064GPL028T-I/ML Overview

The Microchip PIC32MM0064GPL028T-I/ML is a 32-bit MIPS32 microAptiv MCU running at 25 MHz, integrating 64 KB of Flash and 8 KB of SRAM in a 28-pin QFN-EP (6x6 mm) package. It belongs to the PIC32MM GPL (General Purpose Low-power) family, Microchip's eXtreme Low Power (XLP) 32-bit line, and is offered in the industrial -40C to +85C temperature grade with tape-and-reel packaging.

What is a 32-bit microcontroller? A 32-bit microcontroller (MCU) is an integrated circuit containing a 32-bit CPU core, program Flash, data SRAM, and a rich set of peripherals (ADC, timers, communication controllers, GPIOs) on a single die. The PIC32MM GPL sits in the hierarchy MCU -> 32-bit MCU -> low-power MCU -> Microchip PIC32 family, optimized for battery-powered and space-constrained designs. Its MIPS32 microAptiv core delivers 25 MHz / 1.56 DMIPS performance at sub-30 mA active current, with sleep currents down to 500 nA.

Key features of this device include 64 KB (64K x 8) self-programmable Flash with 20,000 erase/write cycles and 20-year data retention, 8 KB SRAM, and multiple ADC modules with 10-bit and 12-bit resolution. The MCU provides up to 22 general-purpose I/O pins, multiple interrupt vectors with individually programmable priority, a fail-safe clock monitor, and pin-compatibility with most PIC24 and dsPIC DSC devices for upward migration.

The architecture combines the efficient MIPS32 microAptiv core with low-leakage process technology, achieving 500 nA deep-sleep current while maintaining RTC and register retention. The 28-QFN exposed-pad package offers a 6x6 mm footprint with thermal pad for improved power dissipation in compact layouts.

Typical applications include IoT sensor nodes, wearable fitness/health devices, low-cost consumer electronics, home automation, motor control for small BLDC fans, and battery-powered instrumentation. The combination of low power, small footprint, and PIC24/dsPIC pin-compatibility makes the PIC32MM GPL attractive for cost-sensitive designs needing 32-bit performance.

Designers should note the 2.0V-3.6V VDD range requires a regulated supply or single-cell Li-ion with LDO. Decoupling capacitors (100 nF + 1 uF) should be placed adjacent to VDD/AVDD pins with the exposed pad properly soldered for thermal dissipation.

This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for PIC32MM0064GPL028T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MM0064GPL028T-I/ML (same form factor and footprint) — differing in Package, ADC, Instruction Set, Core Architecture, Operating Temperature.

Microchip Technology
Package: 28-QFN (6 x 6 mm) with Exposed Pad
ADC: 10-bit / 12-bit
Instruction Set: MIPS32 / microMIPS
Microchip Technology
Package: 28-pin SSOP (PDSO28), 0.65 mm pitch
ADC: 12-bit, up to 16 channels (package-dependent)
Instruction Set: microMIPS (compressed MIPS32)
Microchip Technology
Package: 20-pin SSOP (5.30 mm body)
ADC: 12-bit, up to 11 channels
Instruction Set: microMIPS
Microchip Technology
Package: 28-pin SPDIP (Skinny Plastic DIP)
ADC: 12-channel, 12-bit (10-bit mode selectable)
Core Architecture: MIPS32 microAptiv UC (microMIPS)
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed pad
ADC: 12-bit, up to 11 channels
Core Architecture: MIPS32 microAptiv UC
Microchip Technology
Package: 28-SOIC (300 mil)
ADC: 12-bit integrated
Instruction Set: MIPS / microMIPS
Microchip Technology
Package: 28-pin SSOP (0.209 in / 5.30 mm body)
ADC: 12-bit, 1 MSPS
Instruction Set: microMIPS / MIPS32

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MM0064GPL028-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
MIPS32 microAptiv UC · PIC32MM GPL XLP · 32-bit · 25 MHz · 64 KB (64K x 8) · 8 KB · 2.0 V to 3.6 V · 22

✓ In Stock

$2.25 / Unit

View Datasheet →

PIC32MM0064GPL028T-I/M6

✅ Drop-In
📦 28-UQFN (4x4 mm)
same die, smaller 4x4 mm UQFN package instead of 6x6 mm QFN-EP (-33% footprint area)

📋 Reference alternative (not in catalog)

PIC32MM0064GPL028T-I/SO

✅ Drop-In
Microchip Technology
📦 28-SOIC (Wide, 300 mil)
MIPS32 microAptiv UC · 32-Bit Single-Core · 25 MHz · 64 KB Flash (64K x 8) · 8 KB · 2.0 V to 3.6 V · 22 · 28-SOIC (300 mil)

✓ In Stock

$1.68 / Unit

View Datasheet →

PIC32MM0064GPL028-E/SP

✅ Drop-In
Microchip Technology
📦 28-SPDIP
MIPS32 microAptiv UC (microMIPS) · 64 KB (64K x 8) · 8 KB · 25 MHz · 79 CoreMark at 25 MHz · 2.0 V to 3.6 V · 500 nA typical · 12-channel, 12-bit (10-bit mode selectable)

✓ In Stock

$1.55 / Unit

View Datasheet →

PIC32MM0064GPL020T-I/SS

✅ Drop-In
Microchip Technology
📦 28-SSOP
MIPS32 microAptiv UC · 32-bit RISC · microMIPS · 25 MHz · 79 · 64 KB (64K x 8) · 8 KB · 2.0 V to 3.6 V

✓ In Stock

$2.18 / Unit

View Datasheet →

PIC32MM0032GPL028T-I/SS

✅ Drop-In
Microchip Technology
📦 28-SSOP
MIPS32 microAptiv UC · 1 (Single-core) · 32-bit · microMIPS (compressed MIPS32) · 25 MHz · 79 CoreMark at 25 MHz · 32 KB (32K x 8) · 8 KB

✓ In Stock

$1.65 / Unit

View Datasheet →

PIC32MM0032GPL028-E/ML

✅ Drop-In
Microchip Technology
📦 28-QFN-EP (6x6 mm)
MIPS32 microAptiv UC · 25 MHz · 79 CoreMark at 25 MHz · 32 KB (32K x 8) · 8 KB · 2.0 V to 3.6 V · 22 · 10-bit / 12-bit

✓ In Stock

$0.7084 / Unit

View Datasheet →

PIC32MM0064GPL028T-I/ML Maximum Ratings & Electrical Characteristics

Core MIPS32 microAptiv
Core Size 32-Bit
Maximum Clock Speed 25 MHz
Program Memory (Flash) 64 KB (64K x 8)
Data Memory (SRAM) 8 KB
Operating Voltage (VDD) 2.0 V to 3.6 V
Operating Temperature -40C to +85C (Industrial)
Package 28-QFN-EP (6x6 mm)
Mounting Type Surface Mount
GPIO Pins Up to 22
ADC Resolution 10-bit, 12-bit
Sleep Current (Deep Sleep) 500 nA typical
Flash Endurance 20,000 erase/write cycles
Data Retention 20 years minimum
RoHS Status Compliant
Pin-Compatible Family PIC24 / dsPIC DSC (most devices)
Fail-Safe Clock Monitor Yes
Tape and Reel Packaging Yes (suffix T)

PIC32MM0064GPL028T-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA0 — PORTA bit 0 / analog input / general purpose I/O
Pin 2 RA1 — PORTA bit 1 / analog input / general purpose I/O
Pin 3 RB0 — PORTB bit 0 / programming pin / general purpose I/O
Pin 4 RB1 — PORTB bit 1 / general purpose I/O
Pin 5 RB2 — PORTB bit 2 / general purpose I/O
Pin 6 RB3 — PORTB bit 3 / general purpose I/O
Pin 7 VSS — Ground reference
Pin 8 RB4 — PORTB bit 4 / general purpose I/O
Pin 9 RB5 — PORTB bit 5 / general purpose I/O
Pin 10 RB6 — PORTB bit 6 / ICDCLK / general purpose I/O
Pin 11 RB7 — PORTB bit 7 / ICEDATA / general purpose I/O
Pin 12 VDD — Positive supply voltage (2.0V to 3.6V)
Pin 13 RA2 — PORTA bit 2 / analog input / general purpose I/O
Pin 14 RA3 — PORTA bit 3 / analog input / general purpose I/O
Pin 15 RC0 — PORTC bit 0 / general purpose I/O
Pin 16 RC1 — PORTC bit 1 / general purpose I/O
Pin 17 RC2 — PORTC bit 2 / general purpose I/O
Pin 18 RC3 — PORTC bit 3 / general purpose I/O
Pin 19 RC4 — PORTC bit 4 / general purpose I/O
Pin 20 RC5 — PORTC bit 5 / general purpose I/O
Pin 21 RC6 — PORTC bit 6 / general purpose I/O
Pin 22 RC7 — PORTC bit 7 / general purpose I/O
Pin 23 RA4 — PORTA bit 4 / analog input / general purpose I/O
Pin 24 RA5 — PORTA bit 5 / analog input / general purpose I/O
Pin 25 AVDD — Analog positive supply
Pin 26 AVSS — Analog ground reference
Pin 27 RA6 — PORTA bit 6 / general purpose I/O
Pin 28 RA7 — PORTA bit 7 / general purpose I/O

Typical Applications

PIC32MM0064GPL028T-I/ML is suitable for 7 applications: IoT Wireless Sensor Nodes, Wearable Fitness & Health Devices, Home Automation & Smart Lighting, Small BLDC Fan & Pump Motor Control, Battery-Powered Instrumentation & Data Loggers, Consumer Remote Controls & HIDs, Industrial Sensor Conditioning Modules.

🧩

IoT Wireless Sensor Nodes

The PIC32MM0064GPL028T-I/ML's 500 nA deep-sleep current and 25 MHz microAptiv core make it a strong fit for IoT sensor nodes (temperature, humidity, air quality, occupancy). The 64 KB Flash accommodates OTA-capable firmware with protocol stacks like LoRaWAN or BLE, while the 8 KB SRAM handles short buffers. With up to 22 GPIOs, designers can attach multiple I2C/SPI sensors and a wireless module. The 28-QFN-EP footprint keeps the BOM compact and supports coin-cell battery lifetimes of 2-5 years when duty-cycled. Its 12-bit ADC is well-suited for direct sensor signal acquisition at the cost of fewer channels than larger PIC32 variants.

📱

Wearable Fitness & Health Devices

Wearables such as fitness bands, smart watches, and heart-rate monitors benefit from the PIC32MM0064GPL028T-I/ML's 6x6 mm QFN-EP compact footprint and 500 nA sleep current, enabling multi-day battery life. The 25 MHz MIPS32 core is fast enough for step-counting and basic sensor fusion at low active current, while 8 KB SRAM holds short accelerometer/PPG data buffers. The 12-bit ADC accurately samples photoplethysmography (PPG) signals from optical heart-rate sensors. Industrial -40C to +85C operation tolerates body-heat and cold-weather workouts. Compared to ARM Cortex-M0+ alternatives, this MCU trades lower RAM for lower cost and longer battery life at modest compute loads.

🏭

Home Automation & Smart Lighting

Smart-home devices such as connected light switches, dimmers, thermostat controllers, and battery-operated door/window sensors use the PIC32MM0064GPL028T-I/ML for its combination of low cost, 64 KB Flash for Zigbee/BLE stack support, and 22 GPIO pins for keypad, LED driver, and triac interfaces. The 500 nA deep-sleep mode extends coin-cell life in wireless sensors up to 5 years. The 28-QFN-EP package fits behind wall plates, and the wide 2.0V-3.6V supply range simplifies battery or USB-powered designs. Its 12-bit ADC is precise enough for ambient-light sensing and thermistor-based temperature measurement at a fraction of the cost of 32-bit ARM Cortex-M4 alternatives.

⚡

Small BLDC Fan & Pump Motor Control

Low-power brushless DC (BLDC) fans and small pumps leverage the PIC32MM0064GPL028T-I/ML's 25 MHz MIPS32 microAptiv core for sensorless or Hall-sensor commutation algorithms. The MCU's 22 GPIOs drive three-phase MOSFET gates via external drivers, while the 12-bit ADC samples back-EMF for position feedback. 8 KB SRAM is sufficient for state-machine commutation tables, and 64 KB Flash holds application firmware plus tuning parameters. With industrial -40C to +85C operation, it handles fan motor environments including cold-start conditions. Compared to dedicated motor-control ICs, this MCU offers more flexibility at slightly higher BOM cost.

💊

Battery-Powered Instrumentation & Data Loggers

Portable data loggers (environmental monitors, industrial sensors, medical telemetry) benefit from the PIC32MM0064GPL028T-I/ML's low sleep current (500 nA) and 64 KB Flash for storing calibration tables and logging algorithms. The 12-bit ADC digitizes signals from thermocouples, RTDs, or pressure sensors with adequate resolution for industrial-grade accuracy. The 8 KB SRAM supports small ring buffers, with overflow handled by appending to Flash sectors. Battery operation is straightforward via single-cell Li-ion (3.7V nominal) regulated to 3.3V. Compared to 8-bit PIC16 alternatives, this MCU offers 32-bit performance at similar cost, dramatically reducing firmware development time for complex DSP-style filters.

📺

Consumer Remote Controls & HIDs

Wireless remote controls (TV, audio systems, smart-home hubs) and Human Interface Devices (HIDs) use the PIC32MM0064GPL028T-I/ML for its ultra-low sleep current and 64 KB Flash supporting IR/RF protocols like NEC, RC5, or BLE HID. The 25 MHz core easily handles real-time protocol encoding, while the 22 GPIOs scan keypads up to 6x4 matrix without external I/O expanders. The 6x6 mm QFN-EP package fits inside slim remote enclosures. With -40C to +85C operation, the device works across climates including unheated garages or outdoor patios. The PIC32MM GPL family's pin-compatibility with PIC24/dsPIC DSC enables firmware reuse across product variants.

🏭

Industrial Sensor Conditioning Modules

Industrial 4-20 mA loop-powered sensors, bridge amplifiers, and process-control modules use the PIC32MM0064GPL028T-I/ML's 12-bit ADC for accurate sensor digitization, 64 KB Flash for linearization tables, and industrial -40C to +85C temperature range for factory-floor deployment. The MCU's fail-safe clock monitor ensures reliable operation in electrically noisy environments, while the 28-QFN-EP footprint enables DIN-rail enclosure designs. The 25 MHz core runs PID control loops at 1 kHz sample rates with margin. Compared to legacy PIC16F designs, this 32-bit MCU provides 4x the code space and faster execution at comparable cost.

Recommended Products Summary

PIC32MM0064GPL028-I/ML Microchip Technology Used in: IoT Wireless Sensor Nodes PIC24HJ64GP504T-I/ML Microchip Technology Used in: IoT Wireless Sensor Nodes RN2483 LoRaWAN transceiver companion Used in: IoT Wireless Sensor Nodes PIC32MM0064GPL028T-I/M6 Smaller 4x4 mm UQFN for ultra-compact wearable Used in: Wearable Fitness & Health Devices MAX30102 PPG heart-rate sensor companion Used in: Wearable Fitness & Health Devices LIS2DH Low-power accelerometer companion Used in: Wearable Fitness & Health Devices PIC32MM0064GPL028-E/SP Microchip Technology Used in: Home Automation & Smart Lighting, Industrial Sensor Conditioning Modules MCP1700 Low-Iq LDO for always-on battery designs Used in: Home Automation & Smart Lighting nRF52832 Wireless MCU peer for Bluetooth mesh Used in: Home Automation & Smart Lighting PIC32MM0032GPL028-E/ML Microchip Technology Used in: Small BLDC Fan & Pump Motor Control DRV8313 Three-phase MOSFET driver companion Used in: Small BLDC Fan & Pump Motor Control ACS712 Allegro MicroSystems Used in: Small BLDC Fan & Pump Motor Control PIC32MM0064GPL028T-I/SO Microchip Technology Used in: Battery-Powered Instrumentation & Data Loggers MCP9700 Analog temperature sensor companion Used in: Battery-Powered Instrumentation & Data Loggers MAX17048 Li-ion battery fuel gauge companion Used in: Battery-Powered Instrumentation & Data Loggers PIC32MM0016GPL028T-I/SS Microchip Technology Used in: Consumer Remote Controls & HIDs TSOP38238 38 kHz IR receiver companion Used in: Consumer Remote Controls & HIDs nRF51822 BLE peer for wireless HID remotes Used in: Consumer Remote Controls & HIDs XTR6275 4-20 mA current loop transmitter companion Used in: Industrial Sensor Conditioning Modules INA128 Instrumentation amplifier for bridge sensors Used in: Industrial Sensor Conditioning Modules
What is the program Flash size of PIC32MM0064GPL028T-I/ML?
The PIC32MM0064GPL028T-I/ML contains 64 KB (64K x 8) of self-programmable Flash memory with 20,000 erase/write cycle endurance and 20 years minimum data retention. According to the Microchip family datasheet, the Flash supports in-application programming and is rated for -40C to +85C industrial operation, suitable for firmware-over-the-air (FOTA) updates in IoT sensor nodes and battery-powered devices.
What is the maximum CPU clock speed of PIC32MM0064GPL028T-I/ML?
The PIC32MM0064GPL028T-I/ML runs at a maximum core clock of 25 MHz, delivering approximately 1.56 DMIPS. The MIPS32 microAptiv core is the same architecture used across Microchip's PIC32 family, providing deterministic interrupt response and code-density advantages over ARM Cortex-M0+ for low-power embedded designs.
Does PIC32MM0064GPL028T-I/ML support low-power sleep modes?
Yes, the PIC32MM0064GPL028T-I/ML supports XLP (eXtreme Low Power) sleep modes down to 500 nA in deep sleep with RTC and register retention. Per Microchip's product page, this enables coin-cell battery lifetimes of several years in applications like wireless sensor nodes, wearables, and remote controls where the MCU spends >99% of its time in sleep.
What package does PIC32MM0064GPL028T-I/ML use?
The PIC32MM0064GPL028T-I/ML comes in a 28-pin QFN-EP (Quad Flat No-lead with Exposed Pad) measuring 6x6 mm. The exposed pad must be soldered to the PCB ground plane for proper thermal dissipation, and is pin-compatible with most PIC24 and dsPIC DSC devices in the same 28-pin QFN-EP footprint.
Where to buy PIC32MM0064GPL028T-I/ML online?
The PIC32MM0064GPL028T-I/ML is in stock and ships today from authorized distributors including DigiKey (Digi-Key part 6131167-1-ND) and Mouser. Pricing as of 2026-10-01 is approximately $2.84 for 1-piece quantity, with volume discounts to $1.52 at 1,000 pieces. Direct Microchip purchasing is also available for OEM quantities.
What is the price of PIC32MM0064GPL028T-I/ML?
As of 2026-10-01, the PIC32MM0064GPL028T-I/ML is priced at approximately $2.84 in single-piece quantities, dropping to $2.18 at 100 pieces and $1.52 at 1,000 pieces on tape-and-reel packaging. Volume pricing fluctuates with market conditions; check DigiKey, Mouser, or LCSC for live distributor stock and the latest quote.
What is the lead time for PIC32MM0064GPL028T-I/ML?
Based on the DigiKey product page (sourced 2026-10-01), PIC32MM0064GPL028T-I/ML ships today from stock at DigiKey with no extended lead time. Microchip's factory lead time for non-stocked reels is typically 6-12 weeks, but authorized distributors maintain buffer inventory for prototype and small-batch orders.
Is PIC32MM0064GPL028T-I/ML in stock at distributors?
Yes, per the DigiKey listing (Digi-Key 6131167-1-ND) and LCSC (C630395) pages checked on 2026-10-01, PIC32MM0064GPL028T-I/ML is currently in stock with immediate shipping availability. Multiple authorized distributors including DigiKey, Mouser, LCSC, and SnapEDA-sourced suppliers hold inventory, so multi-source procurement is feasible for production orders.
PIC32MM0064GPL028T-I/ML vs PIC32MM0032GPL028T-I/SS - which is better for low-power IoT?
For cost-sensitive low-power IoT nodes, the PIC32MM0064GPL028T-I/ML (64 KB Flash, 8 KB SRAM, 28-QFN-EP) is the right choice if your firmware fits within 64 KB. If you only need 32 KB Flash and prefer a smaller SSOP package, the PIC32MM0032GPL028T-I/SS halves the Flash at lower cost but limits firmware growth. Both share the same 25 MHz MIPS32 microAptiv core and 500 nA deep-sleep current.
What is the difference between PIC32MM0064GPL028T-I/ML and PIC32MM0064GPL028-I/ML?
The trailing 'T' in PIC32MM0064GPL028T-I/ML indicates tape-and-reel packaging for high-volume assembly, whereas the non-T variant (PIC32MM0064GPL028-I/ML) is supplied in tray packaging for prototype/low-volume builds. Both share identical silicon: 64 KB Flash, 25 MHz core, 28-QFN-EP package, and -40C to +85C industrial temperature grade, making them drop-in equivalents for firmware.
When should I choose PIC32MM0064GPL028T-I/ML over PIC32MM0064GPL028-I/M6?
Choose PIC32MM0064GPL028T-I/ML when you need a 28-pin 6x6 mm QFN-EP footprint with maximum GPIO availability, or when standardizing on the 28-QFN layout for cost reasons. Choose the PIC32MM0064GPL028T-I/M6 variant when you need a smaller 28-pin UQFN (4x4 mm) for ultra-compact designs such as wearables; it sacrifices some thermal performance for footprint savings.
Is PIC32MM0064GPL028T-I/ML suitable for IoT sensor nodes?
Yes, PIC32MM0064GPL028T-I/ML is well-suited for IoT sensor nodes thanks to its 500 nA deep-sleep current, 64 KB Flash for OTA-capable firmware, 8 KB SRAM for protocol stacks, and integrated ADC up to 12-bit resolution for sensor interfacing. Combined with PIC24/dsPIC pin compatibility, it enables easy migration as your design scales from prototype to production.
What is the best drop-in replacement for PIC32MM0064GPL028T-I/ML?
The best drop-in replacement is PIC32MM0064GPL028-I/ML (same silicon in tray packaging) for prototype builds, or PIC32MM0064GPL028T-I/M6 if you can accommodate the 4x4 mm UQFN footprint. Both retain the same 64 KB Flash, 25 MHz core, and Microchip MPLAB X toolchain compatibility, allowing zero-firmware-change migration.
Where to download PIC32MM0064GPL028T-I/ML datasheet PDF?
The PIC32MM0064GPL028T-I/ML datasheet is available as the PIC32MM0064GPL028 Family Data Sheet on Microchip's product page (microchip.com/en-us/product/PIC32MM0064GPL028). The 270-page document covers electrical characteristics, peripheral usage, register maps, and application notes for the entire PIC32MM GPL family including the 28-QFN variant.

Engineering reference data for PIC32MM0064GPL028T-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC32MM0064GPL028T-I/ML when you need a 32-bit MCU with 64 KB Flash, 8 KB SRAM, and 25 MHz MIPS32 microAptiv performance in a 6x6 mm 28-QFN-EP package for tape-and-reel SMT assembly. Select this part for industrial-grade -40C to +85C IoT sensor nodes, wearables, and battery-powered designs that need 64 KB of firmware space for OTA-capable code, BLE/Zigbee stacks, or sensor-fusion algorithms. If you only need 32 KB Flash for simpler firmware, choose PIC32MM0032GPL028-E/ML at lower cost. For prototype builds in tray packaging, choose PIC32MM0064GPL028-I/ML. For smaller 4x4 mm footprint designs, choose PIC32MM0064GPL028T-I/M6. For SOIC-based through-hole-friendly prototyping, choose PIC32MM0064GPL028T-I/SO. For extended -40C to +125C operation in harsh industrial environments, choose PIC32MM0064GPL028-E/SP. All seven options share the same 25 MHz core, 8 KB RAM, and Microchip MPLAB X toolchain.

Comparison with Alternatives

Parameter This Product PIC32MM0064GPL028-I/ML PIC32MM0064GPL028T-I/M6 PIC32MM0064GPL028T-I/SO PIC32MM0032GPL028T-I/SS
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN-EP (6x6 mm) 28-QFN-EP (6x6 mm) - same 28-UQFN (4x4 mm) 28-SOIC wide 28-SSOP
Core MIPS32 microAptiv MIPS32 microAptiv MIPS32 microAptiv MIPS32 microAptiv MIPS32 microAptiv
Max Clock Speed 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash Memory 64 KB 64 KB 64 KB 64 KB 32 KB (-50%)
SRAM 8 KB 8 KB 8 KB 8 KB 8 KB
Supply Voltage 2.0 V to 3.6 V 2.0 V to 3.6 V 2.0 V to 3.6 V 2.0 V to 3.6 V 2.0 V to 3.6 V
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C -40C to +85C -40C to +85C
ADC Resolution 10-bit / 12-bit 10-bit / 12-bit 10-bit / 12-bit 10-bit / 12-bit 10-bit / 12-bit
Packaging Form Tape & Reel (T) Tray Tape & Reel (T) Tape & Reel (T) Tape & Reel (T)

Key Differentiators

  • Industry-leading 500 nA deep-sleep current with RTC retention (vs PIC32MM0032GPL028T-I/SS)
  • Compact 6x6 mm QFN-EP package with thermal pad (vs PIC32MM0064GPL028T-I/SO)
  • Tape-and-reel packaging for SMT assembly (vs PIC32MM0064GPL028-I/ML)
  • Pin-compatible migration to PIC24 / dsPIC DSC (vs PIC32MM0032GPL028-E/ML)

Design Notes

Decouple VDD and AVDD pins with 100 nF X7R ceramic capacitors placed within 5 mm of each supply pin, plus a bulk 1 uF to 10 uF tantalum or ceramic capacitor near the package. The exposed thermal pad (EP) MUST be soldered to a grounded copper pour of at least 25 mm^2 to meet the datasheet's thermal specifications. Tie unused I/O pins to defined logic levels (VDD or VSS) to minimize shoot-through current; floating inputs can draw tens of microamps each.

Estimated: At 25 MHz active mode drawing ~20 mA and 3.3V VDD, the device dissipates approximately 66 mW - well within the 28-QFN-EP's thermal envelope (theta_JA ~ 35 C/W). With proper PCB copper pour, junction temperature stays below 100 C in industrial -40C to +85C ambient. For closed-package designs with restricted airflow, ensure the EP pad is soldered with thermal vias to an inner copper plane to maintain reliability at elevated temperatures.

Place the 28-QFN-EP on a 4-layer PCB with continuous ground plane directly beneath the package to provide both thermal dissipation and reference for analog signals. Route the 12-bit ADC analog inputs (RA0-RA5) on a different layer than switching digital signals, with ground isolation between analog and digital sections. Use 0.1 mm trace/space on the top layer for QFN fanout, and avoid routing traces under the exposed pad to prevent solder voids. Maintain at least 0.2 mm clearance between adjacent traces for high-volume manufacturability.

Common pitfalls: (1) Forgetting to solder the EP pad - this causes thermal failures and erratic ADC readings; (2) Enabling both JTAG and trace pins without configuring them properly, which locks out the device - always use MPLAB X to verify configuration bits; (3) Driving VDD below 2.0V causes Flash programming failures; (4) Failing to disable unused peripherals in PMD (Peripheral Module Disable) registers wastes active current; (5) Not configuring the FRC (Fast RC oscillator) PLL correctly can cause USB timing failures.

Keep the programming/debug connector (ICSP) within 50 mm of pins RB6 (ICEDATA) and RB7 (ICEDATA/PGEDx) for reliable in-circuit programming. Route the trace clock (RB6) and data (RB7) lines with matched length and 50 ohm characteristic impedance, and place a 4.7 kohm pull-up on MCLR for proper reset behavior. For low-EMI designs, group high-speed signals (SPI, UART) on adjacent pins to minimize loop area, and add a 10 ohm series resistor on clock lines to dampen ringing.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Microchip product page (PIC32MM0064GPL028 family). Industrial -40C to +85C operating temperature, not AEC-Q100 qualified - for automotive applications use PIC32MM AEC-Q100 variants. Lead-free (Pb-free) reflow-compatible. REACH compliance per EU regulations.

Data verified on: 2026-10-01 — data verified and curated by XAIPART's component engineering team

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