QPM1002SR - X-Band 3W GaN T/R FEM 8.5-10.5GHz | Qorvo
MPN: QPM1002SR ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
QPM1002SR Overview
A transmit/receive module is a bidirectional RF front end that shares a single antenna between a transmitter and a receiver using a T/R switch. In the system hierarchy, it sits above individual MMIC amplifiers, combining switching, LNA, and PA functions into one module, and is a core building block of power management for radar front ends. Modules like the QPM1002 reduce component count, footprint, and assembly tolerance compared to discrete chains.
Key differentiating features include the integration of three functions (switch, LNA, PA) on a single die-level module, which minimizes interconnect losses and lattice pitch. According to Qorvo, the part is fabricated on the QGaN25 0.25 um GaN-on-SiC process, whose wide bandgap supports high power density and ruggedness. The over-mold encapsulant combined with a proprietary high-thermal-conductivity die-attach allows operation in elevated-temperature environments, and the compact 5 x 5 mm footprint supports the tight lattice spacing required by X-Band phased array radar.
Technically, the GaN-on-SiC construction offers superior thermal conductivity relative to GaAs, enabling higher channel temperatures to be tolerated and higher power density per millimeter of gate periphery. The 0.25 um gate length of the QGaN25 process supports X-Band frequencies with good efficiency, and the integrated T/R switch eliminates the insertion loss of an off-module circulator or switch in compact arrays.
Typical applications include X-Band phased array radar transmit/receive channels, military and commercial radar front ends, and airborne or ground-based surveillance radar systems. In phased arrays, the module's small size directly determines achievable element pitch at 8.5-10.5 GHz.
When designing with this module, thermal management is the primary consideration: the GaN die dissipates substantial heat at 3 W RF output, so the PCB ground vias and heat-spreading copper must be designed for the high-thermal-conductivity die-attach to work as intended. Bias sequencing and switch control timing should follow the manufacturer datasheet.
This page synthesizes distributor availability, verified datasheet parameters, and practical design guidance for the QPM1002SR not consolidated in the manufacturer datasheet.
Drop-in alternatives for QPM1002SR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with QPM1002SR (same form factor and footprint) — differing in Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesQPM1002SR Specifications (manufacturer-published)
| Function | GaN T/R Front-End Module (T/R switch + LNA + PA) |
| Frequency Range | 8.5 GHz to 10.5 GHz |
| Band | X-Band |
| Receive Gain | 25 dB |
| Receive Noise Figure | 2.2 dB |
| Transmit Small-Signal Gain | 33 dB |
| Saturated Output Power | 3 W |
| Power Added Efficiency (PAE) | 32% |
| Process Technology | Qorvo QGaN25 0.25 um GaN-on-SiC |
| Package | 5 x 5 mm QFN surface mount, over-mold encapsulant |
| Mounting Type | Surface Mount |
| Die-Attach | High thermal conductivity die-attach process |
| Primary Application | X-Band phased array radar |
QPM1002SR Interfaces & Connectors
No manufacturer-published interface list is available for QPM1002SR. Refer to the manufacturer documentation for connector and header details.
Refer to the manufacturer documentation for the full expansion header pinout and connector pin numbering.
Typical Applications
QPM1002SR is suitable for 6 applications: X-Band Phased Array Radar, Airborne and Maritime Surveillance Radar Front Ends, Ground-Based Weather and Traffic Radar, Phased Array Test and Development Systems, Satellite and UAV Compact Radar Payloads, Electronic Warfare and Active Aperture Receivers.
X-Band Phased Array Radar
The QPM1002SR is purpose-built for X-Band phased array radar transmit/receive channels operating at 8.5-10.5 GHz. Qorvo explicitly states that the compact 5 x 5 mm QFN footprint supports the tight lattice spacing requirements of phased arrays, where element pitch at X-Band is roughly half a wavelength (about 15-17 mm) and every square millimeter of the element cell is contested between the T/R module, feed network, and radiator. The integrated T/R switch, 25 dB-gain / 2.2 dB-NF LNA, and 33 dB-gain / 3 W PA reduce the front end from three or more components to one surface-mount device, cutting assembly tolerance and interconnect loss. The trade-off is that the GaN PA's heat must be extracted through the PCB, so thermal via design dominates the module layout.
Recommended
Airborne and Maritime Surveillance Radar Front Ends
In airborne and maritime surveillance radar, the QPM1002SR's combination of 3 W saturated transmit power and a 2.2 dB receive noise figure supports both detection range (receive sensitivity) and illumination power in a single module. The QGaN25 0.25 um GaN-on-SiC process provides the ruggedness expected in high-altitude and salt-air environments, and the over-molded QFN with high-thermal-conductivity die-attach, per the Qorvo datasheet, allows reliable operation in elevated-temperature platforms such as conformal antennas. Because the module is surface-mount, it can be assembled on standard multilayer PCBs rather than ceramic hybrid substrates, reducing cost and improving producibility for volume radar programs operating in the 8.5-10.5 GHz band.
Recommended
Ground-Based Weather and Traffic Radar
Ground-based X-Band radar systems for weather observation and traffic monitoring operate within the QPM1002SR's 8.5-10.5 GHz coverage. The module's integrated T/R switch enables monostatic operation through a single antenna, while the 2.2 dB noise figure LNA maximizes sensitivity for weak-return detection such as light precipitation or small targets. Transmit-path 3 W saturated power with 32% PAE reduces DC power consumption and cooling burden for continuously scanning systems. Qorvo's high-temperature-capable packaging tolerates outdoor enclosure environments without active chilling in many installations. Designers should provide a low-impedance thermal path through the PCB ground system and verify bias sequencing against the Qorvo datasheet to protect the GaN PA during power-up.
Recommended
Phased Array Test and Development Systems
For array development, the QPM1002SR's surface-mount QFN package allows engineers to build evaluation tiles on standard PCBs instead of expensive thin-film ceramic assemblies. A single tile can carry several QPM1002SR channels plus a beam-forming IC feed network, letting teams validate lattice pitch, mutual coupling, and thermal gradients early in the program. The module's 33 dB transmit gain simplifies drive requirements from the beam-former, typically requiring only modest pre-amplification, and the 25 dB receive gain provides enough output level to drive downconversion mixers directly. Because the part is available through distributors such as Mouser, prototype quantities can be sourced without full defense supply-chain lead times, as of 2026-09-14.
Recommended
Satellite and UAV Compact Radar Payloads
Size-, weight-, and power-constrained platforms such as small satellites and UAVs benefit directly from the QPM1002SR's integration. Replacing a discrete switch, LNA, and PA chain with one 5 x 5 mm module saves board area and eliminates two RF interconnects, each of which adds loss and failure points under vibration. The 32% PAE at 3 W saturated output reduces the DC load on the platform power budget, which is often the binding constraint on duty cycle for small-platform radar. The GaN-on-SiC construction tolerates the thermal environment of sealed payloads better than GaAs alternatives. Verify export-control classification and datasheet derating limits with Qorvo before flight design-in.
Recommended
Electronic Warfare and Active Aperture Receivers
In electronic support measure (ESM) and active aperture receiver front ends within 8.5-10.5 GHz, the QPM1002SR provides a fast-switching T/R function and a 2.2 dB noise figure receive amplifier, which sets the instantaneous sensitivity of the intercept chain. The 25 dB of receive gain masks the noise figure of downstream mixers and digitizers, preserving dynamic range. The same GaN process also gives the module input ruggedness advantages typical of GaN LNAs, improving survivability against strong co-band signals. Its surface-mount format permits multi-octave receiver cards built on standard FR-4 or low-loss laminate stacks. System designers should confirm switch switching-time specifications from the Qorvo datasheet for their blanking timing budgets.
Recommended
Engineering reference data for QPM1002SR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 5 x 5 mm QFN, over-mold encapsulant |
| Brand | Qorvo |
| Frequency Range | 8.5 GHz to 10.5 GHz |
| Receive Gain | 25 dB |
| Receive Noise Figure | 2.2 dB |
| Transmit Small-Signal Gain | 33 dB |
| Saturated Output Power | 3 W |
| PAE | 32% |
| Process Technology | QGaN25 0.25 um GaN-on-SiC |
Key Differentiators
- Full T/R chain integration in one module (vs Discrete T/R switch + LNA + PA chains)
- GaN-on-SiC power density (vs GaAs-based X-Band front-end modules)
- Phased-array-ready footprint (vs Larger packaged radar modules or hybrid assemblies)
Design Notes
The QPM1002SR delivers 3 W of saturated RF output from a 5 x 5 mm QFN, so the GaN PA dissipates substantial heat in a very small area. Qorvo's datasheet states the high-thermal-conductivity die-attach enables high-temperature operation, but this assumes the PCB provides a correspondingly low thermal resistance. Directly under the module's exposed paddle, place a dense field of filled thermal vias (for example a 0.3 mm drill on a 0.8-1.0 mm pitch) connecting to internal and backside copper planes. Estimate the junction temperature from the datasheet thermal resistance figures before finalizing duty cycle; this is an estimate that must be validated against the official datasheet values.
Follow the Qorvo datasheet bias-sequencing recommendations for the GaN PA: applying drain voltage before the appropriate gate/control conditions can exceed safe operating limits of the QGaN25 die. Ensure the T/R switch control lines are never left floating during power-up, since an undefined switch state can present the PA output into an open load, causing high VSWR stress at 8.5-10.5 GHz. Add RF decoupling per the datasheet typical application circuit and keep the transmit and receive matching networks exactly as recommended rather than re-tuning them without S-parameter simulation.
At 10 GHz, every millimeter of trace matters. Place the QPM1002SR as close as possible to the antenna feed and to the beam-forming network, use a grounded coplanar waveguide transmission line structure with a defined low-loss laminate (for example a Rogers-type material rather than standard FR-4 for the RF layers), and include the datasheet-recommended input and output matching components physically adjacent to the module pins. Keep the T/R switch control routing away from the RF path to avoid coupling, and stitch ground vias along both sides of every RF trace to suppress parasitic modes.
Compliance Information
Compliance status for QPM1002SR was not stated in the provided verified web data; consult the Qorvo product page or request a compliance certificate from Qorvo.
