RTAX250SL-1CG624B - 250K-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-1CG624B ✓ Active| Qty | Unit Price | Extended |
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| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX250SL-1CG624B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-1CG624E
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$1 / Unit
View Datasheet →RTAX250SL-CG624E
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$1375 / Unit
View Datasheet →RTAX250SL-CG624V
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$10000 / Unit
View Datasheet →RTAX250SL-CG624B
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$3950 / Unit
View Datasheet →RTAX250SL-CG624PROTO
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View Datasheet →RTAX250SL-1CG624B Maximum Ratings & Electrical Characteristics
| Family | RTAX-SL (RTAX-S/SL RadTolerant FPGAs) |
| Equivalent System Gates | 250000 gates |
| Logic Cells (CLBs) | 2816 CLBs |
| Maximum Clock Frequency | 649 MHz |
| CLB Combinatorial Delay (Max) | 0.930 ns |
| Process Technology | 0.15 um |
| Core Supply Voltage | 1.5 V |
| Package | 624-Pin CCGA (Ceramic Column Grid Array) |
| Speed Grade | -1 |
| Ordering Format | Box |
| Programming Technology | Antifuse (one-time programmable, live-at-power-up) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Mounting Type | Surface Mount |
RTAX250SL-1CG624B 624-pin ccga (ceramic column grid array) Pin Configuration Guide
Complete pinout information for RTAX250SL-1CG624B (624-pin ccga (ceramic column grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-1CG624B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-1CG624B is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and TM/TC, Onboard Software-Defined Radio, Instrument Control for Space Science Missions, Launch Vehicle Avionics Glue Logic, FPGA Prototyping and Design Migration.
Satellite Payload Data Processing
The RTAX250SL-1CG624B fits payload data-processing chains because its 250,000 gates and 2816 CLBs provide enough fabric for framing, channel coding, and compression glue logic, while the 649 MHz capability and 0.930 ns CLB combinatorial delay sustain high-throughput parallel datapaths. Embedded SRAM blocks with built-in FIFO control absorb rate mismatches between sensors and downlink modulators. Placed as the single-chip host for the payload interface, it removes external configuration PROMs from the BOM, since antifuse configuration is live-at-power-up and immune to configuration-memory upset. The 624-pin CCGA package supplies the I/O count and ceramic robustness needed for payload board assemblies in launch and orbital thermal environments.
Recommended
Spacecraft Bus Control and TM/TC
For telemetry and telecommand handling, the RTAX250SL-1CG624B implements CCSDS-style framing, decoders, and housekeeping interfaces in a single rad-tolerant chip. The 1.5V core keeps static power low - important for power-limited bus electronics - while live-at-power-up operation guarantees command reception immediately after power application during launch and safe-mode sequences. The 624-pin CCGA offers abundant I/O for redundant MIL-STD-1553, UART, and discrete lines with cross-strapping. Segmentable clocks let one FPGA serve both the slow bus interface and faster housekeeping DSP tasks. Designers should verify timing at flight-temperature corners in Libero SoC before programming, as the antifuse fabric is one-time programmable.
Recommended
Onboard Software-Defined Radio
Space SDR front ends benefit from the RTAX250SL-1CG624B's combination of 649 MHz maximum clock rate, embedded SRAM FIFOs, and 0.930 ns CLB delay, which support sample-rate conversion, filtering, and modulator/demodulator control logic in one rad-tolerant device. The 2816 CLBs host half-band filters, NCOs, and framing state machines, while chip-wide highway routing moves high-rate sample streams between functional blocks with predictable timing. Because antifuse configuration cannot be corrupted by SEUs in configuration memory, the SDR's fixed signal-chain topology remains intact throughout the mission; only register-based mitigation (TMR on state machines) is required. Design and verify at -1 speed grade timing before committing flight units.
Recommended
Instrument Control for Space Science Missions
Science instruments - imagers, spectrometers, particle detectors - use the RTAX250SL-1CG624B as the sequencer and interface controller tying detectors to the spacecraft data system. The 250K-gate capacity covers detector timing generators, co-addition logic, and compression pre-processing; embedded SRAM with FIFO control buffers exposure data between the detector readout and the mass-memory unit. Radiation tolerance protects the fixed configuration through TID and single-event exposure over multi-year missions. The 624-pin CCGA supports the many detector bias, clock, and LVDS-style I/O lines instruments typically need. Segmentable clock resources allow independent timing domains for detector readout and spacecraft interface, simplifying timing closure in Libero SoC.
Recommended
Launch Vehicle Avionics Glue Logic
Avionics assemblies in launch vehicles consolidate discrete flight-terminated logic into the RTAX250SL-1CG624B: redundant voter circuits, mode-control state machines, and bus bridges between flight computers and telemetry encoders. The rad-tolerant antifuse fabric removes configuration-upset concerns for brief but high-radiation flight phases, and live-at-power-up behavior guarantees logic availability from power-on, which is mandatory for flight-critical sequencing. The 0.930 ns CLB combinatorial delay supports deterministic voting paths, and the ceramic CCGA624 package withstands the severe vibration and thermal profiles of ascent. Implement TMR on all flight-critical registers and close timing at -1 speed grade corners before programming the one-time-programmable device.
Recommended
FPGA Prototyping and Design Migration
Microchip's documented prototyping methodology for RTAX-S/SL devices pairs the RTAX250SL-CG624PROTO prototyping unit with the flight RTAX250SL-1CG624B via a footprint-compatible adaptor board and an EDIF netlist and pinout converter. Engineers validate RTL, pin assignments, and timing on the prototyping device, then convert the netlist for the flight antifuse part - critical because flight units cannot be reprogrammed. This flow reduces program risk and scrap cost on expensive flight-screened devices. The same methodology scales across densities (RTAX1000SL to RTAX4000SL), enabling design reuse: a 250K-gate design proven on RTAX250SL migrates to larger family members if payload requirements grow, using the identical Libero SoC toolchain.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-1CG624B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1CG624E | RTAX250SL-CG624E | RTAX250SL-CG624V | RTAX250SL-CG624B | RTAX250SL-CG624PROTO |
|---|---|---|---|---|---|---|
| Package | 624-Pin CCGA | 624-Pin CCGA - same | 624-Pin CCGA - same | 624-Pin CCGA - same | 624-Pin CCGA - same | 624-Pin CCGA - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 250,000 gates | 250,000 gates | 250,000 gates | 250,000 gates | 250,000 gates | 250,000 gates |
| Logic Cells (CLBs) | 2816 CLBs | 2816 CLBs | 2816 CLBs | 2816 CLBs | 2816 CLBs | 2816 CLBs |
| Maximum Clock Frequency | 649 MHz | 649 MHz (-1 speed) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -1 | -1 | Standard | Standard | Standard | Prototyping flow |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| CLB Combinatorial Delay (Max) | 0.930 ns | 0.930 ns | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Primary Use | Flight unit (B screening, boxed) | Flight unit (E flow) | Engineering/build flow | Qualification flow | Flight unit (standard speed) | Prototyping/verification |
Key Differentiators
- Fastest -1 speed grade in the 250K CCGA624 line (vs RTAX250SL-CG624B)
- Flight-flow boxed unit for production builds (vs RTAX250SL-CG624PROTO)
- Single-chip, live-at-power-up operation (vs SRAM-based space FPGAs (general))
Design Notes
The RTAX250SL is a one-time-programmable antifuse FPGA: once programmed, logic cannot be corrected. Always complete RTL verification, static timing analysis at all temperature/voltage corners, and a full pinout review before generating the programming file for a flight unit. Use the manufacturer's documented prototyping flow (footprint-compatible adaptor board with EDIF netlist and pinout conversion, per the 'Prototyping for RTAX-S and RTAX-SL Devices' application note referenced in the datasheet) to validate on the RTAX250SL-CG624PROTO first.
The 1.5V core supply must be clean and well-regulated; provide adequate bulk and ceramic decoupling at the CCGA624 core and I/O supply pins per the RTAX-S/SL datasheet power-supply recommendations. Estimated: because this is a -1 speed grade at up to 649 MHz, dynamic power scales with toggle rate - run Libero SoC power analysis with your actual design activity factors rather than worst-case assumptions to size the core rail budget correctly for the spacecraft power system.
The CCGA (ceramic column grid array) package requires column-compatible land patterns and assembly profiles distinct from plastic BGA reflow: column solder integrity and thermal-cycle reliability depend on following the ceramic-column land-pattern and inspection guidance in the datasheet mechanical section. Define the footprint from the manufacturer land-pattern data, not generic BGA rules, and account for the boxed (single-unit) delivery format in receiving inspection - column damage during handling is a common cause of solder defects on CCGA assemblies.
Compliance Information
No RoHS/REACH/lead-free declarations were found in the verified distributor data for this flight-flow MPN. Space-grade ceramic CCGA packages may use leaded column metallurgy under exemption; request certificate of conformance from distributor or Microchip.