RTAX1000SL-CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX1000SL-CGS624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4100 | $41,000.00 |
| 100 | $3800 | $380,000.00 |
| 500 | $3600 | $1,800,000.00 |
| 1,000 | $3400 | $3,400,000.00 |
Drop-in alternatives for RTAX1000SL-CGS624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX1000SL-CGS624E
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$3970 / Unit
View Datasheet →RTAX1000SL-1CGS624V
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$1 / Unit
View Datasheet →RTAX1000SL-1CGS624E
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$3420 / Unit
View Datasheet →RTAX1000SL-1CGS624B
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$3200 / Unit
View Datasheet →RTAX2000S-CGS624V
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Contact for price
View Datasheet →RTAX2000SL-CGS624V
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$6500 / Unit
View Datasheet →RTAX1000SL-CGS624V Maximum Ratings & Electrical Characteristics
| System Gates | 1,000,000 |
| Logic Cells | 18144 |
| CLBs | 12096 |
| Technology | Digital CMOS antifuse |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Programmability | One-Time Programmable (antifuse), live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | Segmentable clocks, chip-wide highway routing |
| Carry Logic | Yes (dedicated fast carry chain) |
| Package | CGS624 (624-column ceramic grid array) |
| Mounting Type | Surface Mount |
| Application Domain | Space-flight systems |
| Radiation Tolerance | Radiation-tolerant (TID/SEE per manufacturer qualification) |
| Max Family Density | 4,000,000 equivalent system gates |
| Base Commercial Family | Axcelerator |
RTAX1000SL-CGS624V cgs624 (624-column ceramic grid array) Pin Configuration Guide
Complete pinout information for RTAX1000SL-CGS624V (cgs624 (624-column ceramic grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX1000SL-CGS624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX1000SL-CGS624V is suitable for 6 applications: Satellite On-Board Data Handling, Payload Data Processing, Spacecraft Telemetry and Command, Radiation Environment Instrument Control, Launch Vehicle Avionics, Deep-Space Probe Electronics.
Satellite On-Board Data Handling
The RTAX1000SL-CGS624V fits satellite on-board data handling (OBDH) because its antifuse fabric is live at power-up with no configuration memory that can be corrupted by single-event upsets, a decisive advantage over SRAM FPGAs in orbit. With 1,000,000 system gates, 12,096 CLBs, and embedded SRAM featuring built-in FIFO control logic, it implements bus controllers, memory managers, and packet routing in a single-chip form factor that reduces board real estate and assembly risk. Segmentable clocks allow separate timing domains for the spacecraft bus interface and payload side. Placed at the heart of the avionics stack, it replaces glue logic, mitigates parts-count concerns, and its low-power CMOS operation directly reduces the power budget burden on solar arrays and batteries.
Recommended
Payload Data Processing
For payload data processing in observation and science missions, the RTAX1000SL-CGS624V provides 18,144 logic cells plus dedicated carry logic for high-throughput datapaths such as image compression, filtering, and front-end formatting. The chip-wide highway routing resources sustain wide data buses across the die, while embedded SRAM blocks with built-in FIFO control implement line buffers and elastic FIFOs between acquisition and downlink chains. Because the antifuse configuration cannot suffer configuration upsets, the processing chain maintains integrity during single-event passes through the South Atlantic Anomaly. Radiation-tolerant qualification targets the TID and SEE environment of low-Earth-orbit and beyond, letting payload designers meet data-rate requirements without triple-modular redundancy of the configuration layer.
Recommended
Spacecraft Telemetry and Command
Telemetry and command interfaces demand deterministic, always-available logic from the instant of separation. The RTAX1000SL-CGS624V is live at power-up, so command decoders and telemetry formatters begin operating immediately without a configuration load cycle, eliminating a failure window at the most critical mission phase. Its 1,000,000-gate capacity accommodates CCSDS framing, housekeeping aggregation, and redundant-decoder voting logic alongside the interface cores. Embedded SRAM FIFOs decouple the TM/TC serial interfaces from the internal bus. The CGS624 ceramic column grid array provides the mechanical robustness and thermal path required for launch vibration and vacuum operation, and low quiescent power keeps the survival-heater and contingency power budgets small during safe-mode operation.
Recommended
Radiation Environment Instrument Control
Science instruments that measure the space radiation environment, such as particle detectors and dosimeters, must themselves survive the flux they observe. The RTAX1000SL-CGS624V provides a radiation-tolerant control backbone with 12,096 CLBs implementing detector readout sequencing, histogramming via dedicated carry logic, and event FIFOs in embedded SRAM. One-time-programmable antifuse interconnect means the instrument's control firmware cannot be upset by the very particles it counts, an architectural advantage over reprogrammable fabrics deployed in high-fluence orbits. Segmentable clocks let slow instrument cycles coexist with fast burst-capture logic. Its low-power CMOS operation suits battery-powered small-satellite and cubesat platforms where detector front-end power dominates and the controller must consume minimally.
Recommended
Launch Vehicle Avionics
Launch vehicle flight computers and stage controllers benefit from the RTAX1000SL-CGS624V's live-at-power-up antifuse architecture: there is no boot delay or configuration-read cycle between power application and operation, and the one-time-programmed logic cannot be corrupted by the severe vibration, shock, and radiation transients of ascent. The 1,000,000-gate capacity implements redundant-voting flight logic, sequencing, and safety-critical interlocks, while chip-wide highway routing supports the wide parallel interfaces typical of inertial measurement units and telemetry encoders. The ceramic column grid array package withstands the thermo-mechanical stress of launch environments better than plastic packaging, and low power consumption simplifies battery-distributed power architecture across multiple stages.
Recommended
Deep-Space Probe Electronics
Deep-space missions face total ionizing dose accumulation and galactic cosmic-ray flux far beyond LEO levels, making radiation-tolerant silicon mandatory. The RTAX1000SL-CGS624V's antifuse fabric provides upset-immune configuration for mission-critical sequencing, fault management, and instrument multiplexing over multi-year cruises where no repair or reconfiguration is possible. Embedded SRAM with FIFO control buffers science data between acquisition windows and infrequent deep-space communication passes, and the single-chip form factor reduces the harness and board complexity that adds failure modes on missions that cannot be serviced. Low power operation is essential when solar flux falls and radioisotope or small-array power is scarce.
Recommended
Recommended Products Summary
Engineering reference data for RTAX1000SL-CGS624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX1000SL-CGS624E | RTAX1000SL-1CGS624V | RTAX2000S-CGS624V | RTAX2000SL-CGS624V |
|---|---|---|---|---|---|
| Package | CGS624 (624-column ceramic grid array) | CGS624 - same | CGS624 - same | CGS624 - same | CGS624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 2,000,000 | 2,000,000 |
| Logic Cells | 18144 | 18144 | 18144 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | Standard |
| Technology | CMOS antifuse, one-time programmable | CMOS antifuse | CMOS antifuse | CMOS antifuse | CMOS antifuse |
| Design Migration | N/A (baseline) | None - identical die | None - identical die, different grade | EDIF netlist + pinout conversion required | EDIF netlist + pinout conversion required |
| Application Target | Space-flight systems | Space-flight systems | Space-flight systems (performance-critical) | Space-flight systems (higher density) | Space-flight systems (higher density) |
Key Differentiators
- Proven 1M-gate density in the CGS624 ceramic footprint (vs RTAX2000S-CGS624V)
- Faster timing closure option on identical silicon (vs RTAX1000SL-CGS624E)
- Configuration-upset immunity versus SRAM FPGAs (vs SRAM-based space FPGAs (general))
- Trade-off: fixed capacity ceiling (vs RTAX2000SL-CGS624V)
Design Notes
The RTAX1000SL-CGS624V is one-time programmable: a programming error permanently consumes a flight device that can cost thousands of dollars and carry long lead time. Follow Microchip's documented prototyping methodology - implement and verify the design on footprint-compatible commercial silicon or a footprint-compatible adaptor board, then use the EDIF netlist and pinout converter to migrate to RTAX-S flight silicon. Never program flight parts without a fully signed-off timing report and bitstream verification flow.
The CGS624 is a ceramic column grid array, not a standard BGA: interconnect columns have different collapse behavior than solder balls, so follow the ceramic-column land pattern and reflow profile recommended in the Microchip RTAX-S/SL datasheet package section. Plan inspection access (X-ray or micro-section coupons) for column solder joints, which are critical in launch-vibration environments. Verify board warpage limits across the large 624-column body to guarantee column co-planarity during reflow.
Estimated: supply decoupling should place low-ESR ceramic capacitors (e.g., 0.1 uF per power pair plus bulk capacitance) at every voltage rail pin group of the 624-column package, since core and I/O rails must remain within tolerance during simultaneous switching of the large I/O ring. Confirm the exact per-rail pin assignments and current ratings in the Microchip RTAX-S/SL datasheet power section before finalizing the power distribution network; do not rely on generic FPGA decoupling guidance for flight hardware.
Select speed grade and lead-finish suffix (V/E/B) at order entry, since suffixes identify different screening flows. Cross-reference the ordering-code definition against the Microchip datasheet ordering-information section and the DLA Standard Microcircuit Cross-Reference entries (e.g., 5962-0422008QUA) when procuring against SMD drawings, to ensure the delivered part matches the program's qualified configuration and traceability requirements.
Compliance Information
Compliance screening for space-grade ceramic-packaged devices varies by lead-finish suffix (V/E/B). Verify RoHS/REACH status for the specific suffix on the Microchip product page or with the distributor; hermetic ceramic packages may carry exemptions.
