RTAX2000S-LG1152V - 2M-Gate Rad-Tolerant FPGA | Actel/Microchip
MPN: RTAX2000S-LG1152V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12000 | $12,000.00 |
| 10 | $11400 | $114,000.00 |
| 100 | $10800 | $1,080,000.00 |
| 500 | $10260 | $5,130,000.00 |
| 1,000 | $9750 | $9,750,000.00 |
Drop-in alternatives for RTAX2000S-LG1152V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-LG1152V
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View Datasheet →RTAX2000SL-1LG1152V
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →RTAX2000SL-CG1152V
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View Datasheet →RTAX2000S-1LG1152V
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View Datasheet →RTAX2000S-LG1152V Maximum Ratings & Electrical Characteristics
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Equivalent System Gates | 2000000 |
| Logic Cells | 32256 |
| CLBs | 21504 |
| Technology | Digital CMOS, antifuse (one-time programmable) |
| Base Architecture | Microsemi commercial Axcelerator family |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks |
| Routing | Chip-wide highway routing and carry logic |
| Power-Up Behavior | Live at power-up (no external configuration device) |
| Radiation Tolerance | Radiation-tolerant for space-flight systems |
| Package | LG1152 (1152-pin ceramic column grid array) |
| Mounting Type | Surface Mount |
RTAX2000S-LG1152V lg1152 (1152-pin ceramic column grid array) Pin Configuration Guide
Complete pinout information for RTAX2000S-LG1152V (lg1152 (1152-pin ceramic column grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-LG1152V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-LG1152V is suitable for 6 applications: Satellite On-Board Data Processing, Payload Signal Processing, Spacecraft Bus Control and Telemetry, FPGA Prototyping for Flight Designs, Radiation-Exposed Instrumentation, Launch Vehicle Avionics.
Satellite On-Board Data Processing
The RTAX2000S-LG1152V fits spacecraft on-board data handling because its antifuse fabric is immune to configuration upsets, unlike SRAM FPGAs that require constant scrubbing. With 2,000,000 gates and 32,256 logic cells, it implements CCSDS framing, memory controllers, and bus interfaces in a single live-at-power-up chip, eliminating the external configuration PROM and its SEU failure mode. Embedded SRAM blocks with built-in FIFO control handle packet buffering without external FIFO devices, reducing parts count and board mass. Placed on the spacecraft avionics board with the 1152-pin ceramic package providing hermetic sealing, the device operates reliably through the mission radiation environment; the trade-off is one-time programmability, so logic changes require new flight units rather than a simple reload.
Recommended
Payload Signal Processing
For satellite payloads processing SAR, imaging, or communication waveforms, the RTAX2000S-LG1152V provides 2,000,000 gates of RTAX-DSP-capable fabric with carry logic for MAC pipelines and chip-wide highway routing for wide data paths. The segmentable clock structure lets multiple processing domains run at independent rates, and embedded SRAM/FIFO blocks buffer data between acquisition and downlink chains without external memory. Its live-at-power-up antifuse configuration starts processing immediately after spacecraft power application, critical for time-critical acquisition windows. Designers should implement fixed-point filters at the -1 speed grade (RTAX2000S-1LG1152V) when sample rates demand shorter register-to-register delays, accepting slightly higher unit cost within the same LG1152 footprint and pinout.
Recommended
Spacecraft Bus Control and Telemetry
Spacecraft bus controllers supervising power, attitude, and telemetry links benefit from the RTAX2000S-LG1152V's deterministic, single-chip implementation. Its live-at-power-up antifuse technology means the bus controller is operational the instant power is applied - no configuration boot delay that could jeopardize safing operations after a power anomaly. The 1152-pin ceramic package supplies abundant user I/O for MIL-STD-1553, SpaceWire, and UART-style interfaces across subsystems. Embedded FIFO-controlled SRAM supports telemetry buffering at downlink rates. Because bus logic changes rarely after PDR, the one-time-programmable nature of the antifuse fabric is acceptable, and the true single-chip form factor reduces the board area, mass, and single-point failure inventory compared with SRAM-FPGA-plus-PROM solutions.
Recommended
FPGA Prototyping for Flight Designs
Because RTAX2000S antifuse units are one-time programmable and flight lots are expensive, Microchip's documented methodology prototypes the design on a commercial Axcelerator device using a footprint-compatible adaptor board, then converts the EDIF netlist and pinout to the RTAX target. The RTAX2000S-LG1152V fits this flow as the flight device: logic validated on A3PE3000-class silicon ports directly, since RTAX-S is derived from the Axcelerator architecture. This approach catches functional and timing bugs before committing antifuse flight parts, protecting schedules on long-lead space programs. The Aldec ACT-H3Ki adaptor series supports this emulation methodology for RTAX-S/SL packages up to the 2000S density, per Aldec's adaptor product documentation.
Recommended
Radiation-Exposed Instrumentation
Scientific instruments on interplanetary probes and Earth-observation satellites require logic that survives TID and single-event effects for mission-length exposures. The RTAX2000S-LG1152V's antifuse configuration cannot be corrupted by charged particles striking configuration cells - a structural advantage over SRAM FPGAs that must mitigate upsets with TMR plus scrubbing. Two million gates accommodate instrument sequencers, ADC framing, on-board reduction, and compression pipelines; embedded SRAM/FIFO blocks stage science data before downlink. The hermetic 1152-pin ceramic LG1152 package withstands launch vibration and vacuum thermal cycling. Designers should budget for SEU-tolerant logic design (triple modular redundancy in the fabric) since antifuse protection covers configuration, not user flip-flops, per family radiation design guidance.
Recommended
Launch Vehicle Avionics
Launch vehicle flight computers and stage controllers use the RTAX2000S-LG1152V where vibration, shock, and brief but intense radiation environments (Van Allen belt transits) demand rad-tolerant logic. The live-at-power-up antifuse design guarantees flight software-adjacent logic is ready at liftoff without configuration loading time, and the true single-chip form factor shortens the clock distribution and simplifies redundancy voting across channels. The 1152-pin ceramic package provides the user I/O count needed for redundant sensor buses, IMU interfaces, and destruct/telecommand links. Carry logic accelerates guidance arithmetic loops, and embedded FIFO-SRAM buffers flight-data recording streams. Cost sensitivity is lower here than in satellites, making the V-screened LG1152V lot appropriate despite premium pricing as of 2026-09-02.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-LG1152V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-LG1152V | RTAX2000SL-1LG1152V | RTAX2000SL-CG1152V | RTAX2000S-1LG1152V |
|---|---|---|---|---|---|
| Package | LG1152 (1152-pin ceramic CGA) | LG1152 - same | LG1152 - same | CG1152 - same footprint class | LG1152 - same |
| Brand | Actel / Microsemi (Microchip) | Actel / Microsemi (Microchip) | Actel / Microsemi (Microchip) | Actel / Microsemi (Microchip) | Microchip Technology |
| Equivalent System Gates | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| Logic Cells | 32256 | 32256 | 32256 | 32256 | 32256 |
| CLBs | 21504 | 21504 | 21504 | 21504 | 21504 |
| Speed Grade | Standard | Standard (SL) | -1 (faster) | Standard (SL) | -1 (faster) |
| Radiation Variant | RTAX-S standard | RTAX-SL enhanced | RTAX-SL enhanced | RTAX-SL enhanced | RTAX-S standard |
| Configuration | Antifuse, live at power-up | Antifuse, live at power-up | Antifuse, live at power-up | Antifuse, live at power-up | Antifuse, live at power-up |
Key Differentiators
- Antifuse configuration immunity (vs SRAM-based space FPGAs)
- SL radiation-enhanced drop-in option (vs RTAX2000SL-LG1152V)
- Faster -1 speed bin without redesign (vs RTAX2000S-1LG1152V)
Design Notes
RTAX2000S antifuse FPGAs are one-time programmable: a logic change after programming requires a new physical device. Never skip full functional and timing sign-off before submitting the programming file for a flight lot. Use Microchip's documented prototyping flow - implement on a commercial Axcelerator A3PE3000 via a footprint-compatible adaptor board, convert the EDIF netlist and pinout, and validate - before committing expensive V-screened units. Ordering a spare flight lot up front is standard practice on space programs given long factory lead times.
The 1152-pin ceramic column grid array has many simultaneously switching outputs; implement tight slew control on high-fanout buses and distribute bank usage across the die so return currents have adjacent ground references. Apply SEU mitigation (triple modular redundancy on state registers, Hamming coding on embedded SRAM) because the antifuse fabric protects configuration but not user flip-flops. Follow Microchip RTAX-S design and radiation-hardening application notes for recommended TMR tool flows.
The LG1152 ceramic column package requires a CGA land pattern with controlled column solder volume for thermal-cycle reliability in vacuum; do not substitute a BGA pattern. Provide generous via-fanned ground planes under the package and decouple every power bank with ceramic capacitors placed at the column field perimeter. Verify coplanarity and rework procedures with your assembly house - column arrays cannot be reworked like BGAs, and flight soldering processes require certified profiles.
Compliance Information
Space-grade ceramic-package part; compliance declarations must be obtained from the official Microchip product compliance database or distributor material declarations. Not AEC-Q100 relevant (space component, not automotive).
