RTAX250SL-1CQ208V - 250k-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-1CQ208V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3400 | $3,400.00 |
| 10 | $3230 | $32,300.00 |
| 100 | $3060 | $306,000.00 |
| 500 | $2890 | $1,445,000.00 |
| 1,000 | $2720 | $2,720,000.00 |
Drop-in alternatives for RTAX250SL-1CQ208V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-CQ208V
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$1 / Unit
View Datasheet →RTAX250SL-1CQ208PROTO
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View Datasheet →RTAX250S-1CQ208V
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$1320 / Unit
View Datasheet →RTAX250S-CQ208V
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View Datasheet →RTAX250SL-1CQ208V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 250,000 gates |
| Logic Cells | 4224 |
| Combinational Logic Blocks (CLBs) | 2816 |
| Family | RTAX-S/SL Rad-Tolerant FPGAs |
| Process Technology | CMOS |
| Programming Technology | Antifuse (one-time programmable) |
| Core Supply Voltage | 1.5 V nominal |
| IO Supply Voltage | 2.5 V / 3.3 V |
| Speed Grade | -1 (standard) |
| Operating Temperature | -55C to +125C |
| Package | 208-pin Ceramic CQFP (CQ208) |
| Mounting Type | Surface Mount |
| Configuration | Live at power-up, single chip |
| Radiation Tolerance | Radiation-tolerant (space flight grade) |
| Embedded Memory | Embedded SRAM blocks |
| Prototype Equivalent | RTAX250SL-1CQ208PROTO (same timing attributes) |
RTAX250SL-1CQ208V 208-pin ceramic cqfp (cq208) Pin Configuration Guide
Complete pinout information for RTAX250SL-1CQ208V (208-pin ceramic cqfp (cq208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-1CQ208V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-1CQ208V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Telemetry and Command Interfaces, Radiation-Tolerant Glue Logic Consolidation, Attitude Control and Instrument Sequencing, Space Science Instrument Front-End Logic, Launch Vehicle and Reusable Platform Avionics.
Satellite Payload Data Processing
The RTAX250SL-1CQ208V fits satellite payload data-path designs because its 250,000 equivalent gates and 4,224 logic cells implement framing, channelization, and CCSDS-style packet formatting directly in a single rad-tolerant chip. The antifuse interconnect is immune to configuration memory upset, so payload logic survives multi-year LEO and GEO missions without scrubbers. Designers typically clock the -1 speed grade at hundreds of megahertz-class rates for telemetry formatting while drawing the low static power that the SL low-power process was created for. The hermetic 208-pin CQFP package withstands launch vibration and thermal cycling from -55C to +125C. Compared with SRAM-based space FPGAs, the single-chip form factor removes external configuration PROM mass and improves turn-on reliability at orbital sunrise.
Recommended
Spacecraft Telemetry and Command Interfaces
Spacecraft housekeeping requires a reliable bridge between sensors, Mil-Std-1553 or SpaceWire-class buses, and the onboard computer. The RTAX250SL-1CQ208V implements these protocol interfaces in its 4,224-cell fabric, with live-at-power-up operation ensuring command receivers are functional the instant the power bus activates - critical for autonomous fault recovery. Its 1.5 V core and SL low-power process keep the logic's share of the spacecraft power budget small, while the 2.5 V/3.3 V IO banks directly interface legacy 3.3 V avionics signaling without level translators. Operation from -55C to +125C covers the full external-eclipse temperature range of the equipment shelf. Because antifuse configuration cannot corrupt in orbit, the command path retains its logic definition for the entire mission life.
Recommended
Radiation-Tolerant Glue Logic Consolidation
Space boards historically accumulate dozens of rad-hard MSI devices for address decoding, bus formatting, and interrupt control. The RTAX250SL-1CQ208V consolidates this glue logic into one 250k-gate antifuse FPGA, cutting component count, board area, and the radiation lot-acceptance burden of discrete parts. The 4,224 logic cells easily absorb address decoders, timers, and bus transceivers' control logic, and the 208-pin CQFP supplies ample IO for wide memory and backplane buses. Because the device is live at power-up, decoded chip-selects are valid before the first CPU fetch, eliminating boot-order hazards. The SL low-power variant further reduces static drain versus legacy bipolar glue logic, easing power-margin analysis on small satellite buses.
Recommended
Attitude Control and Instrument Sequencing
Reaction-wheel drivers, sun-sensor decoding, and instrument exposure sequencing demand deterministic logic that never loses its configuration. The RTAX250SL-1CQ208V's antifuse fabric is inherently single-event-upset-immune at the configuration level, so sequencer state machines keep their programmed behavior through heavy-ion events. Its 2,816 CLBs implement PWM generators, quadrature decoders, and watchdog counters with registered IO timing supported by the -1 speed grade. The extended -55C to +125C rating accommodates the thermal environment of external equipment panels where actuators and sensors reside. Designers use the embedded SRAM blocks for telemetry FIFOs and gain tables, keeping the sequencing function entirely within the single-chip 208-CQFP solution and minimizing harness complexity.
Recommended
Space Science Instrument Front-End Logic
Particle detectors, spectrometers, and imaging payloads generate high-rate data streams that must be timestamped, histogrammed, and compressed before downlink. The RTAX250SL-1CQ208V provides the 250k-gate fabric needed for coincidence logic and histogram engines, with embedded SRAM buffering bursts between acquisition windows. The low static power of the SL process is decisive for instruments with strict thermal budgets on cold plates, and the 1.5 V core keeps dynamic losses manageable at acquisition rates. Hermetic CQFP-208 construction tolerates the vacuum and thermal-cycling profile of the instrument deck across -55C to +125C. Live-at-power-up behavior means the detector front end is armed as soon as payload power is applied, an advantage during limited observation windows.
Recommended
Launch Vehicle and Reusable Platform Avionics
Launch electronics face extreme vibration, wide temperature swings, and a demand for instant readiness. The RTAX250SL-1CQ208V addresses all three: the ceramic CQFP package resists mechanical stress, the -55C to +125C rating covers unconditioned avionics bays, and antifuse live-at-power-up configuration guarantees flight logic is active before ignition sequencing begins. Its 4,224 logic cells implement redundant voting logic, discretes, and timer chains, while 3.3 V IO banks connect directly to heritage MIL-std signaling. Because there is no configuration image to load, there is no boot-failure mode at the worst possible moment. For reusable platforms, RTAX250S-1CQ208V offers the same footprint where schedule demands outweigh the SL power advantage.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-1CQ208V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-CQ208V | RTAX250SL-1CQ208PROTO | RTAX250S-1CQ208V | RTAX250S-CQ208V |
|---|---|---|---|---|---|
| Package | 208-pin Ceramic CQFP (CQ208) | 208-pin Ceramic CQFP (CQ208) - same | 208-pin non-hermetic ceramic CQFP - same footprint | 208-pin Ceramic CQFP (CQ208) - same | 208-pin Ceramic CQFP (CQ208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 4224 | 4224 | 4224 | 4224 | 4224 |
| Speed Grade | -1 (standard) | Standard (non-1) | -1 (same timing attributes) | -1 | Standard (non-1) |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C (prototype screening) | -55C to +125C | -55C to +125C |
| Flight Qualification | Yes (hermetic flight unit) | Yes (hermetic flight unit) | No - prototype only, non-hermetic | Yes (hermetic flight unit) | Yes (hermetic flight unit) |
| Static Power | Low (SL low-power process) | Low (SL low-power process) | Low (SL low-power process) | Higher (base RTAX-S process) | Higher (base RTAX-S process) |
Key Differentiators
- SL low-power process reduces static power (vs RTAX250S-1CQ208V)
- Flight-qualified hermetic package (vs RTAX250SL-1CQ208PROTO)
- -1 speed grade for timing headroom (vs RTAX250SL-CQ208V)
- Single-chip live-at-power-up operation (vs SRAM-based space FPGAs)
Design Notes
RTAX-S/SL devices use one-time-programmable antifuse technology: a programming error is unrecoverable and the die must be scrapped. Always complete timing-closed design signoff in Libero SoC and validate on the RTAX250SL-1CQ208PROTO prototype unit, which the manufacturer datasheet states has the same timing attributes as flight units but ships in a non-hermetic ceramic package, before committing flight-grade RTAX250SL-1CQ208V parts to programming.
The RTAX250SL-1CQ208V uses a 1.5 V nominal core with 2.5 V/3.3 V IO banks. Sequence the core rail cleanly and decouple each supply with bulk plus 0.1 uF ceramic capacitance at the CQFP-208 power pins. Estimated: static power differences between the SL low-power process and base RTAX-S (RTAX250S-1CQ208V) become the dominant budget term in multi-year LEO missions, so confirm power-margin analysis against the datasheet tables for your specific utilization before finalizing the EPS sizing.
The 208-pin ceramic CQFP has 0.5 mm-class leads that require careful reflow profile control to avoid lead damage and solder bridging; inspect to the program's space-grade workmanship standard. Provide generous IO escape routing on the outer layers and do not route switching lines adjacent to the core supply pins. Hermetic flight units should be handled with ESD controls per the manufacturer's space-grade handling guidance, and package date codes recorded for mission traceability.
Compliance Information
Space-grade hermetic ceramic packaged device; RoHS/REACH exemptions typical for aerospace applications were not stated in the provided data and must be confirmed with Microchip.
