RTAX250SL-CG624V - 250k-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-CG624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11875 | $118,750.00 |
| 100 | $11250 | $1,125,000.00 |
| 500 | $10625 | $5,312,500.00 |
| 1,000 | $10000 | $10,000,000.00 |
Drop-in alternatives for RTAX250SL-CG624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX250SL-1CG624E
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$1 / Unit
View Datasheet →RTAX250SL-CG624B
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View Datasheet →RTAX250SL-LG624B
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View Datasheet →RTAX250SL-1LG624V
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$950 / Unit
View Datasheet →RTAX250S-CG624E
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Contact for price
View Datasheet →RTAX250S-LG624V
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View Datasheet →RTAX250SL-CG624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 250000 |
| Logic Cells | 4224 |
| CLB Count | 2816 |
| User I/O (Inputs) | 248 |
| User I/O (Outputs) | 248 |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Process Technology | CMOS |
| Program Technology | Antifuse (one-time programmable) |
| Package | 624-pin Ceramic Column Grid Array (CG624) |
| Embedded SRAM | Yes (with built-in FIFO control logic) |
| Configuration Device Required | No (live at power-up) |
| Radiation Tolerance | Radiation-tolerant (space flight qualified family) |
| Family | RTAX-S/SL and RTAX-DSP RadTolerant FPGAs |
| Speed Grade | Standard (C) commercial flight grade; -1 speed variant available |
| Mounting Type | Surface Mount |
RTAX250SL-CG624V 624-pin ceramic column grid array (cg624) Pin Configuration Guide
Complete pinout information for RTAX250SL-CG624V (624-pin ceramic column grid array (cg624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-CG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-CG624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Housekeeping, Telemetry and Telecommand Interface, Instrument Sensor Interface and Glue Logic, Launch Vehicle and Avionics Interface Electronics, Radiation Test and Prototype Development.
Satellite Payload Data Processing
The RTAX250SL-CG624V fits payload data-path processing because its 4224 logic cells and 250,000 equivalent gates implement framing, error correction, and protocol bridging at flight-relevant throughput, while 248 inputs and 248 outputs support wide parallel data buses to ADCs, memories, and downchain ASICs. Embedded SRAM blocks with built-in FIFO control logic buffer asynchronous data-rate domains without external FIFO chips, reducing parts count on the payload board. Its antifuse, live-at-power-up architecture ensures the payload logic is operational the moment spacecraft power is applied, eliminating configuration-readout single-point failures in orbit. The SL-generation SEU-resistant flip-flops lower the upset rate in the data path, improving mission-level availability. Designers typically clock the core from segmentable clock resources per processing chain, trading a modest routing-effort increase for clock-domain isolation and lower simultaneous-switching noise.
Recommended
Spacecraft Bus Control and Housekeeping
For spacecraft bus controllers, the RTAX250SL-CG624V implements command decoding, telemetry formatting, and interface glue between the onboard computer and power, attitude, and thermal subsystems. The 1.425V to 1.575V core supply and CMOS process keep static power low, which matters for eclipse-period power budgets on small buses. True single-chip, live-at-power-up operation means bus control logic is alive during the critical launch-separator release and initial power-on sequence, with no boot device to fail. The hermetic CG624 ceramic package withstands vacuum outgassing and thermal cycling requirements of GEO missions. With 2816 CLBs, one device consolidates discrete 1553-style glue, discrete I/O conditioning, and watchdog functions, freeing the flight processor for application software. Carry-chain logic supports efficient counters and CRC generation for telemetry integrity at low gate cost.
Recommended
Telemetry and Telecommand Interface
The RTAX250SL-CG624V serves TT&C interface electronics by bridging the RF transponder baseband with the spacecraft data bus: the 248 inputs and 248 outputs connect parallel telecommand decoders and telemetry encoders, while embedded FIFO-backed SRAM smooths burst downlink data into the modulator. SL SEU-resistant flip-flops protect command decoding state machines from single-event upsets that could otherwise generate spurious commands - a mission-critical requirement per spacecraft reliability practice. The 250,000-gate capacity implements CCSDS-class framing and scrambling at moderate rates without external ASSPs, and the antifuse architecture guarantees that programmed command logic cannot be corrupted in flight, unlike SRAM FPGAs that require continuous scrubbing. Designers benefit from chip-wide highway routing to fan a single clock to distributed encoder blocks with low skew.
Recommended
Instrument Sensor Interface and Glue Logic
Scientific instruments on science and Earth-observation missions use the RTAX250SL-CG624V as the sensor front-end FPGA: 248 outputs generate CCD/CMOS imager timing, 248 inputs capture high-speed digitized samples, and carry logic builds fast accumulators for on-board co-adding. The 1.5V-class core keeps dynamic power low in thermally constrained instruments, and the CMOS 4224-logic-cell fabric fits the detector sequencer, ADC interface, and packetizer in one hermetic device. Live-at-power-up behavior matters at instrument turn-on after eclipse, since detector sequencing must begin deterministically with no configuration latency. Embedded FIFO-controlled SRAM buffers imaging frames between acquisition and downlink clocks without external memory devices, improving reliability. Because antifuse devices are one-time programmed, instrument teams validate sequencer timing exhaustively in Libero SoC simulation before flight-lot programming.
Recommended
Launch Vehicle and Avionics Interface Electronics
Avionics interface boards in launch vehicles and space transportation systems deploy the RTAX250SL-CG624V to consolidate discrete discretes-to-digital conversion, safe-and-arm bus monitoring, and redundancy management voting logic. The antifuse configuration is immune to configuration-memory upsets from the heavy radiation environment of high-altitude flight, and live-at-power-up operation supports the immediate logic availability required from battery activation to liftoff. The hermetic 624-pin ceramic column grid array satisfies the mechanical robustness and thermal-cycle expectations of launch vibration and ascent environments. With 2816 CLBs and 4224 logic cells, one device implements triple-modular-redundant voting across 248 input channels, and the SL SEU-resistant flip-flops further harden state machines. Segmentable clocks isolate critical timing chains from non-critical housekeeping logic to bound worst-case skew.
Recommended
Radiation Test and Prototype Development
Before flight-lot commitment, teams use PROTO-class RTAX250SL units and engineering lots of the RTAX250SL-CG624V family for radiation testing, characterization, and software bring-up. Per the Microchip RTAX-S/SL datasheet, PROTO prototype units have the same timing attributes as flight units but are offered in non-hermetic ceramic packages, enabling cost-effective board bring-up on identical footprints. The same 250,000-gate, 2816-CLB architecture lets the Libero SoC bitstream developed on the prototype carry directly to the flight device, de-risking the design cycle. Teams typically populate TID and SEU test boards with both prototype and flight-flow units to bound performance spread. The CG624 footprint common across V, E, B, and L flows allows a single test PCB to qualify multiple screening flows, reducing qualification hardware cost.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-CG624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1CG624E | RTAX250SL-CG624B | RTAX250S-CG624E |
|---|---|---|---|---|
| Package | 624-pin CGA (CG624) | CG624 - same | CG624 - same | CG624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250000 | 250000 | 250000 | 250000 |
| Logic Cells | 4224 | 4224 | 4224 | 4224 |
| User I/O | 248 in / 248 out | 248 in / 248 out | 248 in / 248 out | 248 in / 248 out |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| SEU-Enhanced Flip-Flops (SL) | Yes | Yes | Yes | No (S generation) |
| Speed Grade | Standard | -1 (faster) | Standard | Standard |
| Flow / Screening Class | C/V flight flow | E flow | B flow | E flow |
Key Differentiators
- Faster timing margin in same footprint (vs RTAX250SL-1CG624E)
- SEU-resistant flip-flops of SL generation (vs RTAX250S-CG624E)
- Flight V flow qualification (vs RTAX250SL-CG624B)
Design Notes
With 248 inputs and 248 outputs on a 624-ball footprint, plan I/O bank assignment early in Libero SoC to balance bank currents and group same-standard signals. The 1.425V-1.575V core and CMOS output drivers produce simultaneous-switching noise when wide parallel buses toggle; distribute returns across multiple ground columns in the CG624 pattern and stagger bus edge rates within the -1 or standard speed grade timing budget. Simulate series-terminated lines against IBIS models before flight-lot programming since the device is one-time programmable and board respins are costly on flight programs.
Estimate core current from Libero SoC SmartPower reports at the standard or -1 speed grade and design the 1.5V rail within the 1.425V-1.575V window including rail droop during simultaneous switching. Because the antifuse FPGA is live at power-up, ensure the 1.5V and I/O supplies ramp monotonically and within the datasheet slew constraints - no reset controller will mask a marginal power-on sequence. Budget eclipse-period static power separately; the CMOS antifuse fabric has near-zero configuration leakage but I/O termination current on 496 possible user pins can dominate small-satellite power budgets.
The most common program risk with RTAX250SL devices is committing to flight-lot programming before timing closure: antifuse devices cannot be reprogrammed, so a late timing failure forces new die and months of aerospace lead time. Complete static timing analysis at the temperature and voltage extremes, run SEU mitigation (TMR on control state machines where SL flip-flops alone are insufficient), and freeze the netlist before ordering V/E/B/L flow parts. Note that SEU behavior differs between SL and S generation silicon - verify upset-rate budgets against the correct generation when substituting RTAX250S parts.
Compliance Information
Aerospace hermetic ceramic-packaged flight components are often procured to flight-flow specifications rather than commercial RoHS declarations; request material declarations from Microchip or the distributor with each quote.
