RTAX4000D-CQ352EV - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
MPN: RTAX4000D-CQ352EV β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX4000D-CQ352EV β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
RTAX4000D-CQ352E
β Drop-Inπ Reference alternative (not in catalog)
RTAX4000D-1CQ352V
β Drop-Inπ Reference alternative (not in catalog)
RTAX4000D-1CQ352E
β Drop-Inβ In Stock
$3000 / Unit
View Datasheet βRTAX4000D-1CQ352B
β Drop-Inπ Reference alternative (not in catalog)
RTAX4000SL-CQ352E
β Drop-Inβ In Stock
$2620 / Unit
View Datasheet βRTAX4000D-CQ352EV Maximum Ratings & Electrical Characteristics
| Family | RTAX-DSP Radiation-Tolerant FPGA |
| Equivalent System Gates | 4,000,000 |
| Logic Cells | 33,600 |
| CLB Organization | 36,960 CLBs |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| Package | 352-Pin Ceramic CQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | -55C to +125C |
| Embedded Memory | Embedded SRAM with FIFO control logic |
| Configuration | Live at power-up, single-chip |
RTAX4000D-CQ352EV 352-pin ceramic cqfp Pin Configuration Guide
Complete pinout information for RTAX4000D-CQ352EV (352-pin ceramic cqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000D-CQ352EV.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000D-CQ352EV is suitable for 6 applications: Satellite Payload Data Processing, Onboard Data Handling and Spacecraft Bus Avionics, Telemetry, Tracking and Command (TT&C) Interfaces, Radiation-Exposed Instrumentation and Sensor Interfaces, Launch Vehicle and Reentry Avionics, Space-Grade DSP Coprocessing and Image Processing.
Satellite Payload Data Processing
In satellite payload chains, the RTAX4000D-CQ352EV performs front-end framing, channelization, and pre-processing of sensor and communication data. Its RTAX-DSP fabric embeds multiply/accumulate structures suited to digital filtering, FFT pre-staging, and FEC-related tasks, while 4M equivalent gates and 33,600 logic cells provide headroom for protocol bridging. Because the device is live at power-up with a single-chip form factor, the payload can begin acquiring data without waiting for a configuration PROM load, improving availability after launch or safing events. Embedded SRAM with built-in FIFO control simplifies buffering between high-rate ADC outputs and downlink formatting logic. Radiation tolerance is inherent to the family, and designers typically add TMR on control state machines, budgeting ~20-30% fabric overhead while retaining ample capacity in this 4M-gate device.
Recommended
Onboard Data Handling and Spacecraft Bus Avionics
Spacecraft bus electronics - command and data handling (C&DH), telemetry/telecommand formatting, and platform control - benefit from the RTAX4000D-CQ352EV's deterministic, one-time-programmable fabric. The 0.15 um CMOS process at a 1.5 V core keeps static and dynamic power low, which matters on power-constrained buses, and live-at-power-up operation ensures housekeeping logic is active immediately when the spacecraft recovers from an eclipse-triggered reset. The device interfaces with rad-tolerant processors and memory over standard I/O banks, and its embedded SRAM/FIFO blocks stage CCSDS packets between modules. The 352-pin ceramic CQFP with -55C to +125C operation suits conventional spacecraft board assembly with ceramic-packaged memories. Designers should verify timing at worst-case temperature and voltage corners (1.425-1.575 V) in Libero SoC before flight review.
Recommended
Telemetry, Tracking and Command (TT&C) Interfaces
TT&C front ends require reliable, low-rate but fault-tolerant logic between RF transceivers and the spacecraft data system. The RTAX4000D-CQ352EV handles PCM/PSK formatting, frame synchronization, and command decoding with generous capacity (4M gates against typically small TT&C logic usage), leaving margin for redundancy schemes such as cold- or hot-spared dual-FPGA implementations on one board. Its radiation-tolerant fabric plus designer-applied TMR on decoders meets the stringent availability targets of command chains, and embedded FIFO logic bridges asynchronous clock domains between the receiver baseband and bus controller. The ceramic CQFP-352 package supports the hermetic, high-reliability assembly flows common in TT&C units. Segmentable clock conditioning circuitry eases generation of multiple low-jitter sampling and bit clocks from a single oscillator reference.
Recommended
Radiation-Exposed Instrumentation and Sensor Interfaces
Scientific instruments on explorers and observatories - particle detectors, spectrometers, imagers - place logic close to sensors where shielding is minimal. The RTAX4000D-CQ352EV's radiation-tolerant RTAX-DSP fabric withstands this environment while performing event counting, coincidence logic, time-stamping, and DSP filtering before data reduction. Its 33,600 logic cells absorb detector-specific interfaces that evolve late in instrument development, and the one-time-programmable configuration prevents configuration upsets that plague SRAM-based space FPGAs - no configuration scrubber is required. Low 1.5 V core power limits self-heating inside thermally constrained instrument housings. Embedded SRAM buffers histogram data between acquisition bursts and downlink windows. Engineers commonly prototype with PROTO units, which per the Microchip datasheet share the same timing attributes as flight units in non-hermetic ceramic packages.
Recommended
Launch Vehicle and Reentry Avionics
Launch vehicles and reentry systems demand logic that is immediately operational through high-vibration, high-radiation flight phases. The RTAX4000D-CQ352EV provides live-at-power-up sequencing, event timing, and redundancy voting logic; its antifuse-style one-time-programmable fabric means the flight configuration cannot be corrupted by SEU in a configuration memory, only fabric state - mitigated by TMR on voting and abort-decision paths. The 352-terminal ceramic CQFP withstands automotive- and military-grade reflow and socketing flows used in avionics boards, with -55C to +125C operation covering unconditioned bays. With 4M gates, designers implement triple-redundant flight computers' glue logic, bus arbitration, and discrete I/O on one device, reducing part count and solder-joint failure exposure compared to multiple smaller FPGAs.
Recommended
Space-Grade DSP Coprocessing and Image Processing
For Earth-observation and reconnaissance payloads, the RTAX-DSP family's multiply blocks accelerate image convolution, correlation, and compression pre-processing alongside the general fabric. The RTAX4000D-CQ352EV's 4M-gate capacity hosts parallel filter banks feeding embedded SRAM FIFOs, which decouple the sensor readout rate from the mass-memory interface. Running from a 1.5 V core on a 0.15 um CMOS process, the device offers a power-efficient alternative to SRAM-based space FPGAs for fixed-function DSP pipelines, since no configuration power-up sequence or scrubbing power is needed. For designs whose arithmetic exceeds the fabric, it still serves well as the control and buffering layer around an external processing ASIC. The engineering-evaluation (-EV) screening of this exact ordering code suits qualification builds before committing flight lots at V or B screening.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000D-CQ352EV β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000D-CQ352E | RTAX4000D-1CQ352V | RTAX4000D-1CQ352E | RTAX4000D-1CQ352B | RTAX4000SL-CQ352E |
|---|---|---|---|---|---|---|
| Package | 352-Pin Ceramic CQFP | 352-Pin Ceramic CQFP - same | 352-Pin Ceramic CQFP - same | 352-Pin Ceramic CQFP - same | 352-Pin Ceramic CQFP - same | 352-Pin Ceramic CQFP - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | [DATA_NEEDED] |
| Logic Cells | 33,600 | 33,600 | 55,440 (same die class, per Microchip USA) | 33,600 | 33,600 | [DATA_NEEDED] |
| Speed Grade | Standard | Standard | -1 (faster) | -1 (faster) | -1 (0.99 ns max CLB delay) | Standard |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| DSP Multiply Blocks | Yes (RTAX-DSP fabric) | Yes | Yes | Yes | Yes | No (RTAX-SL, logic only) |
| Screening / Temperature | EV suffix, -55C to +125C | E suffix, -55C to +125C | V (military temp), -55C to +125C | E suffix, -55C to +125C | B screening flow, -55C to +125C | E suffix, -55C to +125C |
Key Differentiators
- DSP multiply fabric for onboard signal processing (vs RTAX4000SL-CQ352E)
- Faster -1 timing option in identical footprint (vs RTAX4000D-1CQ352B)
- Engineering-evaluation screening for pre-flight builds (vs RTAX4000DCQ352V)
Design Notes
Apply triple-module redundancy (TMR) to all control state machines and safety-critical paths in the RTAX4000D fabric; typical fabric overhead is 20-30%, which is comfortably absorbed by the 4M-gate capacity. Add EDAC on embedded SRAM/FIFO blocks used for packet storage. Use Libero SoC worst-case timing corners (-55C, 1.425 V and +125C, 1.575 V) before sign-off; standard-grade parts show ~1.1 ns class CLB delays while -1 grades reach ~0.99 ns. Simulate SEU response with Microchip radiation application notes for the RTAX-S/SL and RTAX-DSP family.
The 1.5 V core must stay within 1.425-1.575 V under all load transients; use a precision space-rated point-of-load regulator with remote sensing and generous bulk capacitance near the CQFP-352 power pins. Distribute power and ground via dedicated CQFP planes or buried layers - the 352-terminal package has numerous VCC/GND pins that must all be connected per the datasheet pin table, not treated as spares. Estimate static plus dynamic core power with the Microchip power calculator for your specific design; do not extrapolate from other RTAX densities.
RTAX-DSP devices are one-time-programmable: a programming error in flight hardware cannot be reworked, so program and fully verify a PROTO or engineering unit first - per the Microchip datasheet, PROTO units share the same timing attributes as flight units. Do not interchange screening suffixes (E, EV, V, B) on a flight program without reviewing your qualification flow, since each denotes a different test flow. Reserve JTAG access (TDI/TDO/TMS/TCK) with series isolation resistors for programming and debug while maintaining harness constraints.
Compliance Information
Space-grade ceramic CQFP packaging; hermetic flow. RoHS/REACH declarations not present in provided data - request Microchip environmental certification sheets from XAIPART sales.
