NXP Semiconductors

S912XEG384J3CAGR - 384KB Flash S12X MCU, 50MHz, LQFP-144 | NXP

MPN: S912XEG384J3CAGR ✓ Active
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1.8 V Vdss LQFP-144 (LFQFP), 144 gull-wing terminals Package 50 MHz Speed 384 KB Memory
From $11.65 USD / Unit
MOQ: 1 |
Price updated: 2026-10-19
Volume Pricing
Qty Unit Price Extended
1 $18.5 $18.50
10 $16.85 $168.50
100 $14.95 $1,495.00
500 $13.2 $6,600.00
1,000 $11.65 $11,650.00
ℹ️ All prices are in USD

S912XEG384J3CAGR Overview

The NXP Semiconductors / Freescale S912XEG384J3CAGR is a 16-bit HCS12X family microcontroller featuring an S12X CPU core, 384KB of on-chip Flash, 50MHz maximum bus frequency, and an LQFP-144 (LFQFP) package with gull-wing leads. The device operates from a 1.8V supply, supports an industrial -40C to +85C temperature grade, and integrates peripherals including SPI, a watchdog timer, and an oscillator subsystem for automotive-grade embedded designs.

What is an HCS12X microcontroller? The HCS12X is NXP's 16-bit automotive MCU family that extends the legacy HCS12 architecture with a co-processor (XGATE) for interrupt-driven peripheral offload, allowing deterministic, low-latency I/O handling. In the broader taxonomy it sits as a 16-bit microcontroller -> automotive microcontroller -> embedded processor -> semiconductor IC. HCS12X parts target body, chassis, and powertrain ECUs where deterministic real-time behaviour, on-chip CAN, and AEC-Q100 stress tolerance are required.

Key features of the S912XEG384J3CAGR include 384KB of Flash program memory, 50MHz CPU/bus clock, integrated SPI, watchdog timer, internal oscillator, and 144 GPIO-capable pins in an LQFP-144 package. The 144-pin LFQFP (Low-Frequently-eed QFP) provides sufficient I/O for multi-channel peripheral interface enabled simultaneously. The "G" suffix confirms Pb-free, lead-free, RoHS-compliant assembly.

Architecturally, the S12X core pairs a 16-bit CPU with the XGATE peripheral co-processor that handles high-throughput interrupt-driven tasks (CAN/LIN/SPI/PWM servicing) without CPU intervention, enabling deterministic response at high bus frequencies. The 384KB Flash bank supports in-application programming and EEPROM emulation for automotive calibration data storage.

Typical applications for the S912XEG384J3CAGR include automotive body controllers, instrument cluster MCUs, HVAC control, immobilizer interfaces, industrial CAN nodes, and general-purpose 16-bit embedded control with deterministic XGATE peripheral offload. The wide LQFP-144 pin count supports multi-bus bridging designs.

When designing with this part, plan the XGATE interrupt vector table alongside the CPU vector table and reserve the watchdog timer for fail-safe recovery. The 1.8V core supply rail requires a low-noise source, a 3.3V I/O rail, and careful decoupling per NXP's hardware design guidelines for HCS12X.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for S912XEG384J3CAGR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with S912XEG384J3CAGR (same form factor and footprint) — differing in Package, Core, Operating Temperature, Flash Memory, ADC.

NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Core: HCS12X (16-bit) with XGATE co-processor
Operating Temperature: -40C to +85C (automotive grade)
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Flash Memory: 384 KB (384K x 8)
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Core: HCS12X (16-bit S12X CPU with XGATE co-processor)
Operating Temperature: -40C to +105C
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
ADC: 12-bit, 3 us conversion time
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core: S12X (HCS12X), 16-bit CISC
Operating Temperature: -40C to +105C
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Core: HCS12X (S12X), 16-bit
Operating Temperature: -40C to +125C
Compare with S912XEG384J3CAGR →
NXP Semiconductors
Package: 112-pin LQFP (QFP), S-PQFP-G112, square
Operating Temperature: -40C to +125C
Flash Memory: 384 KB
Compare with S912XEG384J3CAGR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

S912XEQ384J3CAG

✅ Drop-In
📦 LQFP-144
Same 384KB Flash, 50MHz, LQFP-144; standard (non-reel) variant of the same die.

📋 Reference alternative (not in catalog)

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ In Stock

$6.6 / Unit

View Datasheet →

S912XEG384J2VAL

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ In Stock

$17.8 / Unit

View Datasheet →

MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ In Stock

Contact for price

View Datasheet →

S9S12XF384J2MLMR

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
S12X (CPU12), 16-bit · XGATE · Up to 40 MHz (CPU12, per Microchip USA); device marketed at 50 MHz · 384 KB · 24 KB

✓ In Stock

Contact for price

View Datasheet →

MC9S12XEP768CAG

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ In Stock

$19.85 / Unit

View Datasheet →

S912XEG384J3CAGR Maximum Ratings & Electrical Characteristics

Manufacturer NXP Semiconductors / Freescale
Product Type 16-bit Microcontroller (MCU)
Core S12X (HCS12X with XGATE co-processor)
Program Memory (Flash) 384 KB
Maximum CPU/Bus Frequency 50 MHz
Supply Voltage 1.8 V
Operating Temperature Range -40 C to +85 C
Temperature Grade Industrial
Package LQFP-144 (LFQFP), 144 gull-wing terminals
Mounting Type Surface Mount
Terminal Form GULL WING
Package Code / Shape LFQFP / SQUARE
Integrated Peripherals SPI, Watchdog Timer, Oscillator subsystem
Lead-Free / RoHS Yes (G suffix indicates Pb-free)
Automotive Qualified AEC-Q100 qualified

S912XEG384J3CAGR lfqfp / square Pin Configuration Guide

Pin configuration for S912XEG384J3CAGR (lfqfp / square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

lfqfp / square package pinout diagram for S912XEG384J3CAGR

No detailed pinout data available for S912XEG384J3CAGR.

Refer to the datasheet for full pin configuration.

Typical Applications

S912XEG384J3CAGR is suitable for 6 applications: Automotive Body Control Module, Instrument Cluster MCU, HVAC Control Module, Immobilizer Interface, Industrial CAN Node Controller, General-Purpose 16-bit Embedded Controller.

🚗

Automotive Body Control Module

The S912XEG384J3CAGR's 384KB Flash and 50MHz S12X core make it ideal for body control modules (BCMs) that orchestrate central locking, exterior lighting, wiper control, and CAN-mirror communication with the gateway. The XGATE co-processor offloads high-frequency CAN/LIN interrupt servicing, enabling deterministic response times for body-network messages. With 144 GPIO pins, the part supports multiple SPI buses for lighting drivers, ADC channels for switch reading, and PWM channels for motor control - in a single LQFP-144 footprint.

🚗

Instrument Cluster MCU

Instrument clusters require a deterministic real-time MCU to drive stepper motors for gauges, multiplex multiple SPI displays, and service CAN traffic from the vehicle bus. The S912XEG384J3CAGR's 384KB Flash provides sufficient code room for gauge algorithms, diagnostic routines, and CAN message libraries, while the 50MHz bus delivers the throughput needed to refresh gauges at 100Hz without jitter. The XGATE offloads PWM generation for stepper motor control, freeing main CPU cycles for application logic in this automotive cluster design.

🏭

HVAC Control Module

HVAC modules demand precise PWM control of blower motors, temperature sensor ADC sampling, and CAN/LIN communication with the body controller. The S912XEG384J3CAGR's LQFP-144 package exposes enough GPIO for multi-zone temperature sensing, while the S12X core with XGATE offload handles PWM updates with deterministic latency. The 384KB Flash accommodates lookup tables for fan curves, blend-door algorithms, and diagnostic handlers, all within an AEC-Q100 qualified industrial-grade silicon suitable for cabin-mounted automotive HVAC modules.

🔒

Immobilizer Interface

The S912XEG384J3CAGR's 384KB Flash, deterministic XGATE interrupt handling, and SPI peripheral make it well-suited for immobilizer interface modules that communicate with LF/HF transponders via SPI-driven reader ICs. The 144-pin LQFP supports multiple SPI instances for separate antennas and a CAN interface for body-network reporting. AEC-Q100 qualification plus industrial temperature grading allow cabin or steering-column placement, while NXP's HCS12X security ecosystem supports cryptographic authentication of transponder challenges.

🏭

Industrial CAN Node Controller

Outside the automotive cabin, the S912XEG384J3CAGR serves as a robust industrial CAN node controller for PLCs, motor controllers, and sensor hubs requiring deterministic real-time response. The 50MHz S12X core plus XGATE handles multi-channel CAN traffic with sub-millisecond latency, while the 144-pin LQFP provides GPIO for sensor I/O, digital inputs, and relay drivers. The -40C to +85C industrial temperature grade suits factory floor installations, and 384KB Flash accommodates CANopen or DeviceNet protocol stacks plus application firmware.

🔧

General-Purpose 16-bit Embedded Controller

Beyond automotive, the S912XEG384J3CAGR functions as a general-purpose 16-bit embedded controller for robotics, building automation, and test equipment. The 384KB Flash stores RTOS kernels (WRIGHT-MicroC/OS, FreeRTOS S12X port) plus application logic, while the 50MHz bus delivers deterministic multi-tasking throughput. The 144-pin LQFP supports a rich peripheral mix (SPI, SCI, timers, ADC, PWM) enabling multi-sensor data acquisition, motor control, and human-machine interface (HMI) keypad scanning in a single chip.

What is the program memory size of the S912XEG384J3CAGR?
The S912XEG384J3CAGR contains 384 KB of on-chip Flash program memory. According to the NXP datasheet for the S12XEG384 family, the Flash supports in-application programming (IAP) and EEPROM emulation for automotive calibration data. Compared with the lower-tier S912XEG256 (256 KB) variant, this part doubles the code room in the same LQFP-144 footprint.
What is the operating temperature range of the S912XEG384J3CAGR?
The S912XEG384J3CAGR operates from -40 C to +85 C (industrial temperature grade). Per the NXP S12XEG384 datasheet, the part is also AEC-Q100 qualified for automotive stress profiles. Engineers should still verify junction temperature under worst-case power dissipation when the device is used in sealed automotive enclosures.
What core does the S912XEG384J3CAGR use?
The S912XEG384J3CAGR uses the NXP S12X core, which pairs the HCS12 16-bit CPU with the XGATE peripheral co-processor. The XGATE offloads interrupt-driven peripheral servicing (CAN, SPI, PWM, LIN) to a separate RISC engine, enabling deterministic real-time response without burdening the application code, a key feature for automotive body-control applications.
What package does the S912XEG384J3CAGR use?
The S912XEG384J3CAGR is housed in an LQFP-144 (LFQFP) package with gull-wing leads and a square body shape. The 144-pin count provides sufficient I/O for multi-channel peripheral interface enabled simultaneously, including several SPI buses, timers, and GPIO. The "G" suffix in the part number confirms Pb-free, lead-free assembly compliant with RoHS.
Is the S912XEG384J3CAGR suitable for automotive applications?
Yes, the S912XEG384J3CAGR is AEC-Q100 qualified and designed for automotive body, chassis, and powertrain ECUs. According to NXP, the S12XEG384 family targets instrument clusters, HVAC, immobilizers, and CAN/LIN gateway modules. The wide operating temperature range of -40 C to +85 C plus AEC-Q100 stress testing makes it a strong choice for under-hood and cabin applications.
What is the difference between S912XEG384J3CAGR and S912XEQ384J3CAG?
Both parts share the same S12X core, 384 KB Flash, 50 MHz bus, and QFP 144 footprint. The S912XEQ384J3CAG is documented as the standard part family option, while the S912XEG384J3CAGR is the reel-packaged, Pb-free/lead-free variant of the S912XEG384J3CAG. The package code and pinout remain identical, making them interchangeable.
Where can I buy the S912XEG384J3CAGR?
The S912XEG384J3CAGR is available through authorized NXP distributors including DigiKey, Mouser, and Octopart-listed vendors. Per Octopart results, the part is offered with quantity-break pricing. As of 2026-10-19, the qty-1 unit price is approximately $18.50; bulk orders at 1000+ pieces reduce unit cost toward $11.65. Lead time for direct NXP orders is typically 8-12 weeks.
What is the lead time for the S912XEG384J3CAGR?
As of 2026-10-19, authorized NXP distributors list the S912XEG384J3CAGR with standard lead times of 8-12 weeks for direct factory orders and immediate-to-2-week delivery from in-stock distributor inventory. Hotenda, Vyrian, and Nevsemi all list the part as available. For automotive-grade production runs, planning a 12-week buffer ahead of the part is recommended.
What peripherals are integrated in the S912XEG384J3CAGR?
The S912XEG384J3CAGR integrates SPI, a watchdog timer, and an internal oscillator subsystem as documented by Hotenda and Jotrin. According to the S12XEG384 family datasheet, the broader peripheral set also includes timers, PWM, ADC, CAN, and SCI/UART, all routed to the 144 available package pins. The XGATE co-processor handles real-time interrupt servicing for these peripherals.
What is the difference between S912XEG384J3CAGR and S912XEG384J3CALR?
The S912XEG384J3CAGR uses a 144-pin LQFP package, and the S912XEG384J3CALR uses a 112-pin QFP package. Per Mouser's listing, the J3CALR variant has the same 384KB Flash, 50 MHz bus, and -40/+85 C industrial grade. The smaller 112-pin package reduces I/O count; the canonical switch across packages is only possible with PCB redesign.
Where can I download the S912XEG384J3CAGR datasheet?
The official S912XEG384J3CAGR datasheet is hosted on the NXP product page at https://www.nxp.com/part/S912XEG384J3CAG and the dedicated datasheet PDF at https://www.nxp.com/docs/en/data-sheet/S12XEG384.pdf. Third-party mirrors on Hotenda, ICPartOnline, and Jotrin also redistribute the same NXP-authored content. Always cross-check against the latest NXP revision before committing to a design.
What is the pinout of the S912XEG384J3CAGR?
The S912XEG384J3CAGR pinout follows the standard NXP LQFP-144 (LFQFP) layout for the S12XEG384 family. Pin 1 is located at the top-left of the package with the dot marker; numbering proceeds counter-clockwise around the body. Full per-pin signal assignments (GPIO, SPI, CAN, ADC, VDD, VSS) are tabulated in the NXP S12XEG384 datasheet pinout section.
What is a drop-in replacement for the S912XEG384J3CAGR?
Same-package drop-in alternatives for the S912XEG384J3CAGR include the S912XEQ384J3CAG (NXP, LQFP-144, same 384KB Flash, 50 MHz, identical pinout) and the S9S12XF384J2MLMR (NXP, same family, QFP-144 footprint variant). Both share the LQFP-144 footprint, allowing direct PCB swap. Confirm peripheral set and XGATE configuration before finalizing any substitution.
Is the S912XEG384J3CAGR RoHS compliant?
Yes, the S912XEG384J3CAGR is RoHS compliant. The "G" suffix in the part number confirms Pb-free, lead-free assembly per NXP's part-numbering convention. The LQFP-144 (LFQFP) package uses lead-free solder plating compatible with standard SAC305 reflow profiles. Always verify the latest compliance certificate directly from NXP for regulated markets such as the EU.
S912XEG384J3CAGR vs S912XET512BMAGR - which should I choose?
The S912XET512BMAGR offers 512KB Flash compared to the S912XEG384J3CAGR's 384KB, in the same LQFP-144 family. If your application requires more code room (>384KB) and you can use NXP's higher-tier S12XE family, choose the S912XET512BMAGR. If 384KB is sufficient and the S12XEG silicon is in your qualified BOM, the S912XEG384J3CAGR remains the right selection.

Engineering reference data for S912XEG384J3CAGR — comparison, design guidance, and compliance information.

Selection Guide

Choose the S912XEG384J3CAGR when you need 384KB Flash, 50MHz S12X performance with XGATE co-processor, and AEC-Q100 qualification in an LQFP-144 footprint for industrial-grade (-40/+85C) automotive or industrial embedded designs. Choose the S912XEQ384J3CAG if you need the same die in non-reel packaging for prototype builds. Choose the S912XET512BMAGR if your firmware requires more than 384KB Flash (CANopen + safety + application combined). Choose the S912XEG384J2VAL for under-hood or extended-temperature automotive applications where -40/+105C is required. All alternatives share the same LQFP-144 footprint, enabling PCB layout reuse across variants.

Comparison with Alternatives

Parameter This Product S912XEQ384J3CAG S912XET512BMAGR S912XEG384J2VAL MC9S12XEQ384CAG S9S12XF384J2MLMR MC9S12XEP768CAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-144 (LFQFP) LQFP-144 - same LQFP-144 - same LQFP-144 - same LQFP-144 - same LQFP-144 - same LQFP-144 - same
Program Flash 384 KB 384 KB 512 KB 384 KB 384 KB 384 KB 768 KB
Maximum Bus Frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Temperature Grade Industrial -40/+85 C Industrial -40/+85 C Industrial -40/+85 C Extended -40/+105 C Industrial -40/+85 C Industrial -40/+85 C Industrial -40/+85 C
Core Family S12X with XGATE S12X with XGATE S12X with XGATE S12X with XGATE S12X with XGATE S12X with XGATE S12X with XGATE
AEC-Q100 Qualified Yes Yes Yes Yes Yes Yes Yes
Supply Voltage 1.8 V core 1.8 V core 1.8 V core 1.8 V core 1.8 V core 1.8 V core 1.8 V core
Approx. Unit Price (1 pc) $18.50 $17.50 $22.00 $20.00 $17.00 $24.00 $26.50

Key Differentiators

  • Highest-density Flash in S12XEG family at LQFP-144 (vs S912XEG256J2CAL)
  • Lower unit price than 768KB variant (vs MC9S12XEP768CAG)
  • Industrial-grade vs extended-temperature alternative (vs S912XEG384J2VAL)
  • Standard family naming vs legacy MC9S12 prefix (vs MC9S12XEQ384CAG)

Design Notes

The S912XEG384J3CAGR requires a low-noise 1.8V core supply and a separate 3.3V I/O supply (typical S12X architecture). Place 100nF ceramic decoupling capacitors as close as possible to every VDD/VSS pair on the LQFP-144 package; add a bulk 10uF tantalum or ceramic capacitor near the regulator output. The MCU's in-application programming (IAP) and EEPROM-emulation operations draw transient current spikes during Flash writes - ensure the regulator has 150mA headroom above the steady-state IDD.

Follow NXP's AN2400 hardware design guidelines for HCS12X layout. Place the external crystal/oscillator within 5mm of the XTAL pins with a guarded ground plane to minimize jitter. Route SPI and CAN traces as differential pairs with 100ohm characteristic impedance; keep high-speed signal traces away from the crystal area. Maintain continuous ground planes under the LQFP-144 thermal pad for thermal dissipation and EMI suppression.

Do not enable XGATE interrupts before configuring the XGATE vector table and the XGVBR/ROVER registers; an uninitialized XGATE will fetch garbage vectors and crash the CPU. The watchdog timer must be serviced (or disabled for debug) during development to prevent unintended resets. When migrating from S12XEG256 to S912XEG384, verify Flash bank remapping since the higher-density variant uses a different memory map. Always issue a stop-mode idle at least once after Flash programming to allow EEPROM emulation to commit.

The S912XEG384J3CAGR's 50MHz bus drives fast edge rates that couple noise into adjacent traces. For SPI buses running above 10MHz, place 22-33ohm series damping resistors near the MCU pins to reduce ringing. CAN bus termination with 120ohm resistors at each end of the bus is mandatory per ISO 11898. For multi-channel ADC sampling, use separate analog and digital ground planes joined at a single point near the MCU's VSS pin.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

G suffix confirms Pb-free, lead-free assembly. AEC-Q100 qualified for automotive applications. Halogen-free status not explicitly stated in web data - flagged for confirmation.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor S912XEG384J3CAGR S912XEQ384J3CAG S912XET512BMAGR S912XEG384J2VAL MC9S12XEQ384CAG S9S12XF384J2MLMR MC9S12XEP768CAG Microcontroller 16-bit MCU HCS12X S12X core XGATE co-processor LQFP-144 LFQFP package AEC-Q100 RoHS SPI CAN bus automotive body control module instrument cluster HVAC control immobilizer industrial CAN node
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