SN74AUP1T34DSFR - 1-Bit Level Translator X2SON-6 | Texas Instruments
MPN: SN74AUP1T34DSFR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.76 | $0.76 |
| 10 | $0.68 | $6.80 |
| 100 | $0.52 | $52.00 |
| 500 | $0.44 | $220.00 |
| 1,000 | $0.38 | $380.00 |
Drop-in alternatives for SN74AUP1T34DSFR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
SN74AUP1T34DRYR
β Drop-Inπ Reference alternative (not in catalog)
SN74AUP1T34DSFR Maximum Ratings & Electrical Characteristics
| Function | 1-bit non-inverting voltage-level translator / buffer |
| Channels | 1 |
| Configuration | 1 Ch A to B, 0 Ch B to A (unidirectional) |
| Supply Rails | Dual, independent (VCCA and VCCB) |
| Output Type | Push-Pull |
| Polarity | Non-Inverting |
| Technology Family | AUP1T (Advanced Ultra-low Power) |
| Applications | GPIO level translation |
| Operating Temperature | -40C to +85C |
| Package | X2SON (DSF), 6 pins, 1x1 mm |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (R suffix) |
| RoHS Status | Compliant (per distributor listing) |
| Unit Price | $0.7550 (as of 2026-09-04, Heisener reference) |
SN74AUP1T34DSFR Pin Configuration
| Pin 1 | A β Input port, referenced to VCCA |
| Pin 2 | GND β Ground reference |
| Pin 3 | NC β Not connected (per datasheet) |
| Pin 4 | VCCB β B-port supply rail |
| Pin 5 | B β Output port, referenced to VCCB (push-pull) |
| Pin 6 | VCCA β A-port supply rail |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
SN74AUP1T34DSFR is suitable for 6 applications: MCU GPIO Level Translation, Wearable and Mobile Consumer Electronics, IoT Battery-Powered Sensor Nodes, Embedded Industrial Control I/O, Test and Measurement Probe Interfaces, Networking and Communication Modules.
MCU GPIO Level Translation
Modern microcontrollers increasingly run their I/O at 1.8V or lower, while displays, actuators, and legacy peripherals still expect 3.3V logic. The SN74AUP1T34DSFR bridges these domains by referencing its A port to VCCA and its B port to VCCB using two independent supply rails. Because the output stage is push-pull, no external pull-up resistor is needed, and the non-inverting function preserves GPIO polarity exactly. The AUP family's ultra-low dynamic power matters when many GPIO lines are translated in battery-powered systems, where per-line leakage and transition energy compound across dozens of channels. Place the translator physically close to the connector or peripheral to keep stub lengths short on the higher-voltage side.
Recommended
Wearable and Mobile Consumer Electronics
Wearables and smartphone-adjacent accessories are dominated by sub-2mm board stacks and sub-1V core domains, making the 1x1 mm X2SON (DSF) footprint of the SN74AUP1T34DSFR a decisive advantage. The device translates signals from ultra-low-voltage sensor or PMIC domains up to system I/O levels while drawing minimal dynamic power, directly extending battery life in always-on designs. Its -40C to +85C operating range covers body-worn environmental extremes, and the tape-and-reel format supports high-volume SMT placement on fine-pitch assembly lines. Because the part is unidirectional push-pull, designers should verify that every translated line is genuinely single-direction, or pair it with a direction-controlled variant for shared buses.
Recommended
IoT Battery-Powered Sensor Nodes
Battery-powered IoT nodes commonly mix a 1.8V sensor/RF domain with a 3.3V peripheral domain, and every microwatt of quiescent and dynamic power reduces field lifetime. The SN74AUP1T34DSFR, from TI's Advanced Ultra-low Power (AUP) family, translates sensor interrupts, enable lines, and status flags between these domains with minimal transition energy. The push-pull output drives the higher-voltage side cleanly without pull-up resistors, which also removes a static current path that open-drain solutions would impose. Its tiny footprint fits dense sensor-node PCBs alongside antenna keep-out areas. For best results, gate unused translators through board-level power switching and keep both rails decoupled with 100 nF ceramics.
Recommended
Embedded Industrial Control I/O
Industrial controllers mix 3.3V or 2.5V microcontroller logic with 5V-tolerant field interfaces, optocoupler front ends, and PLC-style I/O cards. The SN74AUP1T34DSFR serves as a compact, deterministic single-line translator for enable, fault, and status signals that must cross domains without level ambiguity. The -40C to +85C commercial-industrial temperature range suits control cabinets and distributed I/O, while the X2SON package allows placement directly at the connector edge of dense carrier boards. Because industrial environments involve long cables and transients, designers typically add series resistance and TVS protection on the translated line ahead of the translator input, and verify that the input clamp ratings from the datasheet cover expected surge conditions.
Recommended
Test and Measurement Probe Interfaces
Bench instruments, logic analyzers, and probe pods frequently need to accept inputs from targets running at widely different supply levels, from sub-1V core signals to 3.3V and beyond. A dual-rail translator like the SN74AUP1T34DSFR lets the front-end condition each channel's logic thresholds by setting VCCA and VCCB independently, so a single hardware revision covers multiple target families. The AUP family's low propagation-delay dispersion and push-pull drive preserve signal edges for timing-sensitive measurements, and the 1x1 mm X2SON packaging lets designers place one translator per channel with tight channel-to-channel matching. Calibrate per-channel skew after layout, as channel-to-channel delay in dense probe pods depends on trace geometry as much as the translator itself.
Recommended
Networking and Communication Modules
Wi-Fi, BLE, and cellular modules commonly expose 1.8V I/O banks, while host platforms, LEDs, and status circuitry run at 3.3V. The SN74AUP1T34DSFR translates module control lines - such as RESET, REG_ON, HOST_IRQ, and UART-side enables - between these domains with clean push-pull edges and very low dynamic power, which matters for always-listening modules with duty-cycled wake logic. The compact X2SON (DSF) footprint fits the constrained keep-out regions around RF modules and antenna feed areas. Keep translated control traces short and reference them to a solid ground plane to avoid coupling RF noise into the level-shifted signals, and decouple both supply rails locally with 100 nF capacitors.
Recommended
Recommended Products Summary
Engineering reference data for SN74AUP1T34DSFR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SN74AUP1T34DRYR | SN74AUP1T34DCKR |
|---|---|---|---|
| Package | X2SON-6 (DSF) 1x1 mm | X2SON-6 (DRY) - outline variant of DSF | SC-70-5 (DCK) - different footprint |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Function | 1-bit non-inverting translator | 1-bit non-inverting translator | 1-bit non-inverting translator |
| Configuration | 1 Ch A to B, 0 Ch B to A | 1 Ch A to B, 0 Ch B to A | 1 Ch A to B, 0 Ch B to A |
| Applications Class | GPIO | GPIO | GPIO |
| Technology Family | AUP1T | AUP1T | AUP1T |
| Operating Temperature | -40C to +85C | [DATA_NEEDED] | [DATA_NEEDED] |
| Unit Price (qty 1, as of 2026-09-04) | $0.7550 (Heisener ref) | [DATA_NEEDED] | [DATA_NEEDED] |
| Drop-in Interchangeability | - | Near drop-in - verify DRY vs DSF outline | Not drop-in - PCB footprint change required |
Key Differentiators
- Smallest footprint option in the AUP1T34 family (vs SN74AUP1T34DCKR)
- Push-pull output removes external pull-ups (vs Open-drain translator alternatives)
- Ultra-low-power AUP process family (vs 74LVC1T45 (cross-brand LVC family))
Design Notes
The X2SON (DSF) package is only 1x1 mm, so land-pattern accuracy is critical. Follow TI's X2SON footprint application note exactly: pad geometry, solder-mask expansion, and the center pad connection (typically GND) must match the datasheet recommendation, or reflow opens and tombstoning become likely at high-volume assembly. Use solder paste with fine-pitch stencil (apertures scaled to ~80-90% of pad) and consider a slight paste reduction on the center pad to prevent the device floating during reflow.
Power the two supply rails (VCCA and VCCB) independently and decouple each with a 100 nF ceramic capacitor placed within 1-2 mm of the pins. Observe the datasheet power-up sequencing recommendation - generally bring up VCCA before or simultaneously with VCCB - to avoid back-powering through input clamp structures during multi-rail startup. In systems with hot-plug connectors, add a small series resistor on the A-side input to limit injection current if the input can be driven while its rail is unpowered.
The SN74AUP1T34 is unidirectional with a push-pull output. Do not connect multiple push-pull outputs together, and do not use it for bidirectional buses such as I2C - use TI's TXS/TCA family instead. Also, when second-sourcing, remember that the DCKR (SC-70) variant is electrically identical but NOT pin-compatible with the DSF footprint; swapping requires a PCB respin. The DRY package variant shares the X2SON family but outline dimensions differ slightly - verify against your land pattern before qualifying.
Compliance Information
RoHS compliant per distributor listings. REACH, halogen-free, and conflict-minerals declarations should be downloaded from TI's product page Quality & Environmental section.
