SPC5604BF2VLQ6R - 32-bit MCU, 512KB Flash, 64MHz, Automotive | NXP
MPN: SPC5604BF2VLQ6R ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.62 | $166.20 |
| 100 | $14.1 | $1,410.00 |
| 500 | $12.55 | $6,275.00 |
| 1,000 | $11.2 | $11,200.00 |
SPC5604BF2VLQ6R Overview
A 32-bit microcontroller (MCU) is a programmable processor on a single IC that integrates a CPU core, volatile RAM, non-volatile Flash, and a heterogeneous set of analog and digital peripherals. Power Architecture (originally PowerPC) MCUs from NXP Qorivva tier target real-time deterministic control where automotive OEMs require predictable interrupt latency, on-chip ECC, and lockstep safety features; these MCUs sit at the same tier of the embedded hierarchy as ARM Cortex-M4/M7 devices, below application processors (Cortex-A) but above 8/16-bit microcontrollers in both compute and peripheral richness.
Key differentiating features of the SPC5604BF2VLQ6R include its 64 MHz single-core e200z0h with hardware multiply/divide, 512 KB Flash with ECC, automotive-grade temperature qualification (Grade 2, +105C), and the 144-LQFP package that exposes a wide peripheral pin-out for body and chassis applications. The MPC560xB/C/D family is engineered for body-control modules (BCMs), HVAC blowers, lighting controllers, electric window regulators, seat controllers, and similar moderately-aspirational automotive subsystems where cost, deterministic performance, and long-term automotive supply continuity matter more than raw CPU throughput.
The architecture combines the Power Architecture Book-E instruction set with a memory-protection unit and on-chip voltage regulators; on this specific 512 KB member, the smaller Flash budget (versus the 1 MB / 1.5 MB siblings) keeps cost low while still fitting LIN/CAN stacks, AUTOSAR MCAL drivers, and application firmware for typical body modules. The 144-LQFP (20x20) footprint preserves strong thermal performance and is widely accepted by automotive PCB assembly lines.
Typical applications include automotive body control modules, HVAC/climate control, lighting ECUs, seat and mirror controllers, instrument clusters (entry-level), industrial PLC digital/analogue I/O modules, CAN-LIN gateway nodes, and chassis subsystems requiring AEC-Q100 reliability up to +105C junction. Designers select this part when the firmware footprint fits within 512 KB and the 64 MHz e200z0h compute is sufficient for the real-time control loop.
When designing with this part, ensure that the 3.3 V external regulator meets the inrush current of the MCU's internal core LDO during start-up and Flash programming. Place 100 nF decoupling capacitors on every VDD/VSS pin pair and a bulk 4.7 uF cap near the supply pins; respect the 144-LQFP thermal pad connection (where present) to reduce junction-to-case thermal resistance in high-duty-cycle actuator drives.
This page synthesizes distributor pricing, AEC-Q100 guidance, and pin-compatible drop-in alternatives within the SPC5604 family that are not always summarized on distributor product pages, giving automotive engineers a defensible selection rationale in one view.
Drop-in alternatives for SPC5604BF2VLQ6R — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SPC5604BF2VLQ6R (same form factor and footprint) — differing in Package, Program Memory Size, Supply Voltage, Core Processor, Connectivity.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5604BF2VLH6R
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5602BF2MLL6
✅ Drop-In✓ In Stock
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View Datasheet →SPC5644AF0MLU2
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$12.5 / Unit
View Datasheet →SPC5746BSK1MKU2
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$17.25 / Unit
View Datasheet →SPC5642AF2MLU1
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$21.23 / Unit
View Datasheet →SPC5516GBMLQ66
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →SPC5604BF2VLQ6R Maximum Ratings & Electrical Characteristics
| Core | e200z0h (Power Architecture Book-E) |
| Core Size | 32-bit single-core |
| Maximum Clock Frequency | 64 MHz |
| Program Memory Size | 512 KB Flash (512K x 8) |
| Program Memory Type | Flash with ECC |
| Supply Voltage | 3.3 V (single supply) |
| Operating Temperature Range | -40C to +105C (Automotive Grade) |
| Temperature Grade | Industrial / Automotive Grade 2 |
| Package | 144-LQFP (20x20 mm) - LFQFP, gull wing |
| Number of Terminals | 144 |
| Terminal Form | GULL WING |
| Package Shape | Square |
| Series | MPC560xB/C/D Qorivva; SPC5604 sub-family |
| Mounting Type | Surface Mount |
| Product Category | 32-bit Microcontrollers - MCU |
| Architecture Class | Automotive body electronics, industrial control |
| RoHS Status | Compliant |
SPC5604BF2VLQ6R square Pin Configuration Guide
Pin configuration for SPC5604BF2VLQ6R (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SPC5604BF2VLQ6R.
Refer to the datasheet for full pin configuration.
Typical Applications
SPC5604BF2VLQ6R is suitable for 7 applications: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Lighting ECU, Industrial CAN/LIN Gateway Node, Electric Window / Seat / Mirror Controller, Instrument Cluster (Entry-Level), Chassis Sensor Cluster / Suspension Node.
Automotive Body Control Module (BCM)
The SPC5604BF2VLQ6R fits automotive body control modules because the e200z0h core delivers deterministic 64 MHz performance for CAN/LIN body networking while keeping current draw low for always-on cabin electronics. With 512 KB of Flash with ECC the part fits AUTOSAR MCAL plus body firmware (door locks, wipers, lighting, alarm). The 144-LQFP footprint exposes multiple CAN, LINFlex and PWM channels that map cleanly onto BCM pin budgets, and the AEC-Q100-qualified +105C rating covers cabin-temperature requirements directly without derating.
Recommended
HVAC Climate Control ECU
HVAC climate-control ECUs benefit from the SPC5604BF2VLQ6R's e200z0h core with deterministic interrupt latency for PWM-driven blower and blend-door control. The 512 KB Flash stores AUTOSAR BSW plus HVAC application firmware including sensor conditioning for NTC inputs. Multiple eMIOS timer channels drive variable-frequency motor control, and the +105C rating survives high ambient temperatures in dash-top installations. The 144-LQFP supplies the I/O width required for stepper drivers, blower FETs, and CAN/LIN transceivers on a single ECU.
Recommended
Automotive Lighting ECU
Lighting ECUs (headlamp levelling, adaptive driving beam indicators, rear LED controllers, daytime running lights) use the SPC5604BF2VLQ6R to generate LED-driver PWMs while running LIN slave nodes that headlamp-and-tail communication relies upon. The 64 MHz e200z0h core handles slow CAN body network diagnostics concurrently with high-frequency LED PWM outputs. 512 KB Flash with ECC stores LIN/UDS stacks, and the 144-LQFP layout exposes sufficient GPIO for multi-channel LED matrices. AEC-Q100 Grade 2 temperature reliability suits under-bonnet-near lamps applications for turn signals.
Recommended
Industrial CAN/LIN Gateway Node
Industrial CAN-to-LIN gateways and remote I/O nodes benefit from the SPC5604BF2VLQ6R's flexCAN and LINFlex peripherals, which run concurrently with minimal CPU loading on the e200z0h core. The 512 KB Flash holds full CANopen or DeviceNet protocol stacks plus application configuration, and the 144-LQFP provides enough CAN channels for redundant fieldbus architectures. Industrial-grade temperature qualification (-40C to +105C) supports outdoor cabinets and factory-automation panels, while AEC-Q100 brings field-proven reliability for industrial OEMs adopting automotive-grade components.
Recommended
Electric Window / Seat / Mirror Controller
Door-module and seat-controller applications map well onto the SPC5604BF2VLQ6R: the e200z0h core drives anti-pinch algorithms and LIN/CAN body-network communication while the eMIOS channels generate H-bridge PWM for window regulators and mirror adjusters. AEC-Q100 Grade 2 with +105C rating survives prolonged sun-load conditions on door modules. 512 KB Flash accommodates LIN 2.x slave firmware plus diagnostic UDS handlers. The 144-LQFP leaves headroom for additional I/O and CAN-FD termination circuits on space-tight door boards.
Recommended
Instrument Cluster (Entry-Level)
Entry-level instrument clusters that do not need full TFT graphics use the SPC5604BF2VLQ6R to drive stepper gauges, indicator lamps and CAN-based body-network diagnostic service. The 64 MHz e200z0h core handles cluster refresh and stepper rate-table lookups with margin, and the 512 KB Flash stores cluster graphics descriptors and diagnostic UDS handlers. The 144-LQFP provides generous GPIO for gauge stepper drivers and the AEC-Q100 +105C rating endures sun-soaked dashboard environments.
Recommended
Chassis Sensor Cluster / Suspension Node
Chassis nodes such as wheel-speed aggregation modules and active suspension sensors use the SPC5604BF2VLQ6R for deterministic CAN-FD and LIN communication plus sensor-signal conditioning. The 512 KB Flash comfortably stores CAN/CAN-FD stacks and chassis fault-handling firmware. With +105C ambient rating and 144-LQFP package the part fits wheel-hub PCBAs where temperature swings and space constraints are common. The e200z0h core supports lockstep-friendly software partitioning for ASIL-B chassis subsystems in migration paths to SPC564x/SPC574x.
Recommended
Recommended Products Summary
Engineering reference data for SPC5604BF2VLQ6R — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5604BF2VLH6R | SPC5644AF0MLU2 | SPC5746BSK1MKU2 | SPC5642AF2MLU1 | SPC5516GBMLQ66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | e200z0h (32-bit) | e200z0h - same | e200z4 - upgrade | e200z4 dual-core lockstep | e200z4 - upgrade | e200z6 - legacy |
| Clock Frequency | 64 MHz | 64 MHz - same | 120 MHz | 180 MHz | 80 MHz | 66 MHz |
| Flash Size | 512 KB | 512 KB - same | 4 MB | 2 MB | 2 MB | 1 MB |
| Automotive Grade | Yes (+105C) | Yes (+105C) | Yes (+125C) | Yes (+125C) | Yes (+125C) | Yes (+105C) |
| Lockstep / Dual Core | No | No | No | Yes (dual-core lockstep) | No | No |
Key Differentiators
- Cost-optimized 512 KB Flash with full automotive grade (vs SPC5644AF0MLU2)
- Same sub-family footprint as lockstep safety migration path (vs SPC5746BSK1MKU2)
- Deterministic Power Architecture Book-E core for real-time control (vs SPC5642AF2MLU1)
- Active - FRESH supply-chain channel (vs SPC5516GBMLQ66)
Design Notes
The SPC5604BF2VLQ6R requires a stable 3.3 V supply with bulk decoupling of at least 4.7 uF near the package plus 100 nF ceramic capacitors on every VDD/VSS pair. In-rush during Flash programming can exceed 100 mA on the internal core LDO; ensure the upstream regulator (for example an MCZ33889 SBC or discrete LDO) holds margin above 250 mA peak. Add a TVS diode such as SMBJ5.0CA on the 12 V VBAT rail that feeds the regulator to survive load-dump transients to 40 V per ISO 7637-2.
Estimated: At 64 MHz with all peripherals enabled, the SPC5604BF2VLQ6R's on-chip dissipation is in the low-hundred-milliwatt range, so 144-LQFP thermal resistance is rarely the limiting factor for body-comfort modules. However, in door or wheel-hub modules where ambient can reach +85C sustained, verify that theta_JA of the populated PCB plus nearby power-FET heat-soak keeps junction below +150C. Heat-spread copper pours beneath the LQFP and thermal vias to inner layers help when total board power rises above 500 mW.
For automotive CAN/LIN body modules, route CAN_H and CAN_L as a differential pair with 120 ohm characteristic impedance and keep at least 2x dielectric gap to nearby noisy signals. Place the 144-LQFP's decoupling pair with 1-2 mm loop area to minimize supply droop during eMIOS switching. Keep JTAG/NPC pins accessible for in-circuit firmware updates; many body ECUs expose a 14-pin JTAG header or Tag-Connect footprint. Long-trace the RESET pin to a manually-resettable supervisor and provide a 100 nF cap plus 10 kohm pull-up per NXP hardware design guide.
Do not assume the SPC5604BF2VLH6R and SPC5604BF2VLQ6R are bit-identical at the pin level - always cross-check the SPC5604B sub-family pin-mux table before substituting one for the other on an existing PCB layout. Also, do not exceed the 5 V absolute maximum rating on any 5 V-tolerant GPIO when interfacing industrial sensors; use a level translator where needed. When migrating from MPC55xx family (for example SPC5516GBMLQ66) confirm RTC and PLL configuration toolchain updates are absorbed into your AUTOSAR MCAL layer.
Stack-up recommendation for an automotive ECU using the SPC5604BF2VLQ6R: 4-layer with 35 um copper, ground plane on layer 2 directly under the 144-LQFP, power plane on layer 3 with split islands for analog and digital supplies, signals on top and bottom. Use length matching of 100 mil tolerance for CAN signals and 50 mil for SPI clocks above 8 MHz. Add stitching vias around the board perimeter every 5 mm for chassis-module EMI immunity per OEM EMC requirements.
Compliance Information
AEC-Q100 qualified with -40C to +105C operating temperature (Automotive Grade 2) per NXP MPC560xB/C/D product family literature. RoHS and lead-free confirmed via authorized distributor listings. Halogen-free status not stated in the verified web data - left as 'unknown'.
