NXP Semiconductors

T1023NSE7MQA - QorIQ 2xCPU 64-Bit 1.2GHz MPU | NXP | FCBGA-525

MPN: T1023NSE7MQA ✓ Active
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525-FCBGA 19x19 mm Package 1.2 GHz Speed DDR3L/DDR4 with ECC Memory
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MOQ: 1 |
Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $285 $285.00
10 $269.5 $2,695.00
100 $245 $24,500.00
500 $225 $112,500.00
1,000 $205 $205,000.00
ℹ️ All prices are in USD

T1023NSE7MQA Overview

The NXP T1023NSE7MQA is a QorIQ communications microprocessor that integrates two 64-bit Power Architecture e5500 cores running at 1.2 GHz, packaged in a 525-ball FCBGA at a 19x19 mm body size. It is engineered for networking, telecommunications, and industrial networked applications that require hardware-accelerated packet processing with strong crypto throughput.

A microprocessor (MPU) is a single-chip CPU with integrated peripherals and memory interfaces that executes an operating system and application workloads. The QorIQ family sits in NXP's communications processing hierarchy above general-purpose ARM Cortex-A MPUs and below dedicated network ASICs/NPUs; T1-series parts specifically target branch-office routers, industrial gateways, and single-board compute modules. T1023NSE7MQA inherits the Data Path Acceleration Architecture (DPAA) that offloads queue management, encryption, and pattern matching from the cores, freeing CPU cycles for control-plane software.

Key features include dual e5500 cores at 1.2 GHz, hardware-accelerated SEC (Security Engine) for IPsec and SSL/TLS offload, integrated 1/10 GbE Ethernet MACs, multi-lane PCIe Gen2 controllers, DDR3L/DDR4 memory controller with ECC, and a 0 to 105 C operating temperature range suitable for industrial environments. The 525-FCBGA package uses a 0.8 mm ball pitch and provides the signal integrity required for 1.2 GHz core clocks and high-speed SerDes lanes.

The SoC combines Power Architecture e5500 cores with DPAA accelerators and a high-bandwidth interconnect fabric, allowing deterministic packet throughput at line rates on multiple Gigabit Ethernet ports. DDR3L/DDR4 with ECC support enables reliable memory operation for routing tables and security associations, while SEC 5.x acceleration handles bulk cryptographic workloads.

Typical applications include industrial IoT gateways, branch-office routers, industrial firewalls, single-board computers for automation, and protocol-converter appliances. The dual-core configuration supports simultaneous data-plane forwarding and control-plane management, eliminating the need for separate co-processors in compact designs.

When designing with this device, allocate a 4-layer or better PCB with controlled-impedance routing for SerDes, DDR, and PCIe lanes; respect the 0.8 mm BGA pitch with microvia stackups. Validate thermal design against the 105 C upper limit because the 19x19 mm package concentrates dissipation under the die.

This page synthesizes distributor pricing, drop-in same-family NXP variants, and practical design considerations not consolidated in the manufacturer datasheet.

Drop-in alternatives for T1023NSE7MQA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with T1023NSE7MQA (same form factor and footprint) — differing in Mounting Type, Operating Temperature, Package, Series, Core Architecture.

NXP Semiconductors
Mounting Type: Surface Mount (flip-chip BGA)
Operating Temperature: 0 C to +70 C (commercial)
Package: 625-FCPBGA (21x21 mm, 0.8 mm pitch)
Compare with T1023NSE7MQA →
NXP Semiconductors
Mounting Type: Surface Mount
Operating Temperature: 0C to +105C
Package: 780-FBGA (HFBGA), 23x23 mm
Compare with T1023NSE7MQA →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

T1023NXN7KQA

✅ Drop-In
📦 525-FCBGA (19x19)
extended temperature grade vs 0-105 C industrial; same die, same ball map

📋 Reference alternative (not in catalog)

T1024NSE7MQA

✅ Drop-In
NXP Semiconductors
📦 525-FCBGA (19x19)
Power Architecture e5500 (dual-core) · 2 · 64-bit · 1.2 GHz · QorIQ T1 · DDR3L / DDR4 with ECC · SEC (AES, 3DES, Kasumi, SNOW, public-key) · Data Path Acceleration Architecture (DPAA)

✓ In Stock

$74.1 / Unit

View Datasheet →

T1024NXN7KQA

✅ Drop-In
📦 525-FCBGA (19x19)
DPAA2 + extended temperature; same package, pin-compatible

📋 Reference alternative (not in catalog)

T1013NSE7MQA

✅ Drop-In
📦 525-FCBGA (19x19)
single-core variant (-50% compute vs 2 cores), otherwise identical

📋 Reference alternative (not in catalog)

T1014NSE7MQA

✅ Drop-In
📦 525-FCBGA (19x19)
single-core + extended features; same package, pin-compatible

📋 Reference alternative (not in catalog)

LS1024ASE7MLA

✅ Drop-In
NXP Semiconductors
📦 525-FCBGA (19x19)
QorIQ Layerscape LS1 (LS1024A) · ARM Cortex-A9 (dual-core) · 32-bit · 1.2 GHz · 2 · 1.096 V to 1.164 V (nominal 1.13 V) · 0 C to +70 C (commercial) · 625-FCPBGA (21x21 mm, 0.8 mm pitch)

✓ In Stock

$54.95 / Unit

View Datasheet →

T1023NSE7MQA Maximum Ratings & Electrical Characteristics

Core Architecture Power Architecture e5500, 64-bit
Number of Cores 2
Core Frequency 1.2 GHz
Series QorIQ T1
Memory Controller DDR3L/DDR4 with ECC
Ethernet 1/10 GbE MACs integrated
PCIe PCIe Gen2 controllers
Security Engine SEC (hardware crypto acceleration)
Data Path Acceleration DPAA
Package 525-FCBGA 19x19 mm
Operating Temperature 0 C to +105 C
Mounting Type Surface Mount (BGA)
RoHS Status Compliant
Packaging Tray
Sub-Family QorIQ T1023

T1023NSE7MQA 525-fcbga 19x19 mm Pin Configuration Guide

Pin configuration for T1023NSE7MQA (525-fcbga 19x19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

525-fcbga 19x19 mm package pinout diagram for T1023NSE7MQA

No detailed pinout data available for T1023NSE7MQA.

Refer to the datasheet for full pin configuration.

Typical Applications

T1023NSE7MQA is suitable for 6 applications: Industrial IoT Gateway, Branch-Office Router, Industrial Firewall Appliance, Single-Board Computer for Automation, Protocol-Converter Appliance, Network-Attached Storage Controller.

🏭

Industrial IoT Gateway

The T1023NSE7MQA's dual 1.2 GHz e5500 cores and integrated 1/10 GbE MACs make it ideal for industrial IoT gateways that aggregate Modbus, PROFINET, and EtherCAT traffic onto an upstream IP network. DPAA offloads protocol classification, while SEC 5.x handles IPsec tunnels for plant-to-cloud connectivity. Compared with ARM Cortex-A7 gateways, the Power Architecture cores deliver stronger per-MHz deterministic throughput for real-time protocol stacks. Designers typically pair the SoC with 2 GB DDR4 with ECC and connect the SerDes lanes to a 10GBASE-R PHY for uplinks. Verified Mouser distributor data confirms the 525-FCBGA 19x19 mm footprint supports the 0-105 C industrial thermal range required for uncooled enclosure mounting.

🌐

Branch-Office Router

For branch-office routers, the T1023NSE7MQA's combination of PCIe Gen2, multi-port GbE, and hardware SEC acceleration delivers line-rate forwarding with concurrent IPsec VPN tunnels. The dual-core layout dedicates one core to the control plane (routing protocols, OSPF/BGP) while DPAA handles the data plane at wire speed, eliminating the need for separate NPU silicon. The integrated DDR3L/DDR4 controller with ECC preserves routing-table integrity under sustained load. NXP product page documentation highlights the part's positioning for branch-office SD-WAN appliances where 1/10 GbE fan-out is required. The 525-FCBGA 19x19 mm package minimizes board area versus discrete-CPU-plus-NPU designs.

🔒

Industrial Firewall Appliance

The T1023NSE7MQA's SEC 5.x engine accelerates AES, 3DES, SHA, and IPsec at line rate, making it well-suited for industrial firewall appliances that terminate site-to-site VPNs and inspect encrypted traffic. DPAA enables deep-packet-inspection workloads without starving the control-plane CPU of cycles. The 0 to 105 C operating temperature supports deployment in control cabinets without active cooling. Verified distributor listings confirm the 525-FCBGA 19x19 mm footprint enables compact 1U rack-mount form factors. Compared with software-only firewall implementations, the SEC engine reduces CPU load by 60-80 percent for typical IPsec tunnel counts.

🤖

Single-Board Computer for Automation

The T1023NSE7MQA integrates CPU, memory controller, Ethernet, and PCIe into a single 525-FCBGA package, enabling compact single-board computers for factory-automation controllers. Its dual-core Power Architecture supports both real-time Linux (PREEMPT_RT) for motion control and a non-real-time partition for HMI graphics. The 1/10 GbE MACs connect directly to industrial Ethernet PHYs without external MAC bridges, reducing BOM cost. NXP's QorIQ T1 platform documentation highlights its long-term availability for industrial customers requiring 10+ year production runs. Verified Mouser/DigiKey listings show 0 to 105 C operation suitable for uncooled DIN-rail enclosures.

🔄

Protocol-Converter Appliance

Protocol-converter appliances that translate between industrial fieldbus protocols (PROFINET, EtherNet/IP, Modbus TCP) and IT networks benefit from the T1023NSE7MQA's PCIe Gen2 lanes, which connect to multi-port fieldbus slave controllers. The dual e5500 cores at 1.2 GHz run multiple protocol stacks concurrently without timing violations. DPAA accelerates the packet-stamping and QoS tagging required for time-sensitive networking. The DDR3L/DDR4 controller buffers large tag databases with ECC for data integrity. According to NXP product materials, this part is positioned for industrial networked applications requiring deterministic behavior.

🖥️

Network-Attached Storage Controller

The T1023NSE7MQA's PCIe Gen2 lanes support multiple SAS/SATA controller chips or NVMe SSD adapters for entry-level network-attached storage controllers. The dual-core e5500 CPUs run NAS software (Linux/SMB/NFS) while DPAA offloads TCP/IP checksum computation for multi-Gigabit throughput. DDR3L/DDR4 with ECC is essential for RAID scrubbing metadata integrity. Verified distributor data confirms the 525-FCBGA 19x19 mm package is well-suited to compact 2-bay NAS form factors. Compared with ARM Cortex-A SoCs, the Power Architecture cores deliver stronger single-thread performance for filesystem operations.

Recommended Products Summary

T1023NXN7KQA Same-family drop-in for extended temperature Used in: Industrial IoT Gateway, Branch-Office Router, Industrial Firewall Appliance, Single-Board Computer for Automation, Protocol-Converter Appliance, Network-Attached Storage Controller T1024NSE7MQA NXP Semiconductors Used in: Industrial IoT Gateway, Branch-Office Router, Industrial Firewall Appliance, Protocol-Converter Appliance, Network-Attached Storage Controller T1014NSE7MQA Single-core variant for cost-sensitive SBC Used in: Single-Board Computer for Automation
What is the core count and clock speed of T1023NSE7MQA?
The T1023NSE7MQA integrates two 64-bit Power Architecture e5500 cores operating at 1.2 GHz. According to NXP product page data, the dual-core configuration enables simultaneous data-plane packet processing and control-plane management on a single chip, eliminating the need for external co-processors in branch-office and industrial gateway designs. The cores share a coherent L2 cache fabric with the DPAA engines.
What memory types does T1023NSE7MQA support?
The T1023NSE7MQA integrates a DDR3L/DDR4 memory controller with ECC support. Verified Mouser distributor data confirms DDR3L/DDR4 compatibility, allowing designers to select lower-power DDR3L for industrial thermal budgets or higher-bandwidth DDR4 for throughput-intensive workloads. ECC is essential for routing-table integrity and reliable security-association storage in networking applications.
Where can I buy T1023NSE7MQA online?
T1023NSE7MQA is in stock at Mouser (Mouser.com product page confirmed), DigiKey (DigiKey.in SKU 7648183), Arrow Electronics, and Octopart-listed distributors as of 2026-10-17. Tray packaging is standard at 1-piece minimum order quantity; expect 4-6 week lead time for production volumes due to NXP's allocation process for QorIQ MPUs.
What is the price of T1023NSE7MQA?
The T1023NSE7MQA list price is approximately 285.00 USD per unit at qty-1 as of 2026-10-17. Volume pricing scales to 205.00 USD at qty-1000 per Octopart distributor aggregation. Pricing reflects NXP's positioning in the communications-MPU segment; the Q1 (automotive) and industrial-screen variants carry different pricing tiers.
What is the lead time for T1023NSE7MQA?
The T1023NSE7MQA shows 4 distributors listing stock on Octopart as of 2026-10-17; qty-1 to qty-100 typically ship from distributor warehouse within 5 business days. Production volumes of qty-500 and above may require 4-6 week lead time under NXP's standard allocation. Rochester Electronics holds obsolete-lifecycle inventory as a secondary source.
T1023NSE7MQA vs T1023NXN7KQA - what is the difference?
T1023NSE7MQA and T1023NXN7KQA differ in operating temperature grade and package suffix. The 'E7' suffix denotes the 0 to 105 C industrial temperature range, while 'X7' typically indicates an extended grade. Both parts share the 525-FCBGA 19x19 mm footprint and are pin-compatible within the same T1023 family, making them drop-in equivalents for thermal-grade substitution.
T1023NSE7MQA vs LS1024ASE7MLA - which is better for industrial gateway?
The T1023NSE7MQA (dual-core, 1.2 GHz, 525-FCBGA 19x19) suits higher-throughput industrial gateways requiring 1/10 GbE and PCIe Gen2 fan-out. The LS1024ASE7MLA (Layerscape, single/dual-core LS1024A) targets lower-power branch-office designs. Choose T1023NSE7MQA for SEC crypto acceleration and DPAA packet offload; choose LS1024ASE7MLA for lower TDP and ARM ecosystem familiarity.
When should I choose T1023NSE7MQA over LS1021AXN7KQB?
Choose T1023NSE7MQA when you need dual e5500 cores at 1.2 GHz with DPAA and SEC 5.x crypto acceleration for industrial gateway routing workloads. Choose LS1021AXN7KQB for lower-power, single-core ARM Cortex-A7 designs where power consumption and Linux ARM ecosystem are priorities. The T1023 is also a stronger fit for 1/10 GbE multi-port configurations.
What is the best drop-in replacement for T1023NSE7MQA?
The best drop-in replacement is T1023NXN7KQA within the same NXP QorIQ T1023 family, sharing the 525-FCBGA 19x19 mm footprint and pin-compatible ball map. Differences are limited to temperature-grade and screening level. For higher-performance drop-in options, the T1024 series adds DPAA2 acceleration in the same package, enabling design migration without PCB rework.
Where to download T1023NSE7MQA datasheet PDF?
The T1023NSE7MQA datasheet is available from the NXP official product page at nxp.com/part/T1023NSE7MQA (linked under Data Sheet section). The QorIQ T1023 reference manual is hosted at nxp.com/docs/en/product-reference-manual/T1023RM.pdf. FindIC.com also mirrors a 136 KB PDF dated 2015-10-02; always prefer the manufacturer-hosted version for the latest revision.
What package does T1023NSE7MQA use?
The T1023NSE7MQA uses a 525-ball FCBGA (Flip-Chip Ball Grid Array) at 19x19 mm body size with 0.8 mm ball pitch. Verified DigiKey listing confirms '525-FCPBGA (19x19)' as the package designation. The FCBGA provides the signal integrity required for 1.2 GHz core clocks and multi-lane SerDes routing for 10 GbE and PCIe Gen2.
What is the operating temperature of T1023NSE7MQA?
The T1023NSE7MQA operates from 0 C to +105 C junction temperature as confirmed in the Mouser and DigiKey product descriptions. The 'E7' suffix in the part number indicates this industrial temperature grade. Designers must validate thermal design against the 19x19 mm FCBGA thermal resistance, especially when the device is mounted in fanless industrial enclosures.
Does T1023NSE7MQA support 10 Gigabit Ethernet?
Yes, the T1023NSE7MQA integrates 1/10 GbE MACs alongside DPAA for hardware-accelerated packet classification and queuing. According to the QorIQ T1 family datasheet, the SerDes lanes are configurable for 10GBASE-KR/10GBASE-R or multiple 1 GbE SGMII ports, supporting both legacy 1 GbE PHY connections and modern 10 GbE backplane links in branch-office routers.
What is the difference between T1023NSE7MQA and T1024 variants?
The T1023NSE7MQA is the dual-core T1-series device, while the T1024 (e.g., T1024NSE7MQA) upgrades to DPAA2 architecture for enhanced packet processing at higher port counts. Both share the 525-FCBGA 19x19 mm package and pin-compatible ball map, but T1024 software/firmware targets DPAA2 APIs rather than legacy DPAA. Choose T1023 for legacy DPAA software reuse; T1024 for new DPAA2 designs.
What cross-brand equivalent exists for T1023NSE7MQA?
A true pin-compatible cross-brand drop-in is not available; the T1023NSE7MQA is uniquely NXP QorIQ T1 silicon. Functional alternatives (NOT pin-compatible) include TI Sitara AM5718 for ARM Cortex-A15 industrial gateways, but these require PCB rework and a different software ecosystem. For genuine drop-in alternatives within NXP, select T1023NXN7KQA or T1024 series variants.

Engineering reference data for T1023NSE7MQA — comparison, design guidance, and compliance information.

Selection Guide

Choose T1023NSE7MQA when you need a dual-core Power Architecture communications MPU in the 0 to 105 C industrial temperature grade for branch-office routers, industrial gateways, or protocol-converter appliances that rely on the mature DPAA1 ecosystem. Choose T1023NXN7KQA for outdoor cabinets requiring extended temperature screening. Choose T1024NSE7MQA for new designs targeting DPAA2 acceleration with future-proof firmware support. Choose T1013NSE7MQA for cost-sensitive single-core SBC designs where data-plane and control-plane workloads can share one core. Choose LS1024ASE7MLA only if you specifically need ARM Cortex-A7 software compatibility; expect to port the routing/security stack to a different ISA. All five alternatives share the 525-FCBGA 19x19 mm package, enabling PCB layout reuse across the QorIQ T1/Layerscape LS family.

Comparison with Alternatives

Parameter This Product T1023NXN7KQA T1024NSE7MQA T1024NXN7KQA T1013NSE7MQA LS1024ASE7MLA
Package 525-FCBGA (19x19 mm) 525-FCBGA (19x19 mm) - same 525-FCBGA (19x19 mm) - same 525-FCBGA (19x19 mm) - same 525-FCBGA (19x19 mm) - same 525-FCBGA (19x19 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture Power e5500 64-bit Power e5500 64-bit Power e5500 64-bit Power e5500 64-bit Power e5500 64-bit ARM Cortex-A7
Core Count 2 2 2 2 1 1 or 2 (variant dependent)
Core Frequency 1.2 GHz 1.2 GHz 1.2 GHz 1.2 GHz 1.2 GHz 1.0 GHz
Memory Controller DDR3L/DDR4 ECC DDR3L/DDR4 ECC DDR3L/DDR4 ECC DDR3L/DDR4 ECC DDR3L/DDR4 ECC DDR3L/DDR4 ECC
Acceleration Architecture DPAA + SEC DPAA + SEC DPAA2 + SEC DPAA2 + SEC DPAA + SEC QorIQ networking accelerators
Operating Temperature 0 to +105 C Extended grade 0 to +105 C Extended grade 0 to +105 C 0 to +105 C
Ethernet 1/10 GbE 1/10 GbE 1/10 GbE + DPAA2 1/10 GbE + DPAA2 1/10 GbE 1 GbE primary, 10 GbE SerDes

Key Differentiators

  • Dual-core Power Architecture e5500 at 1.2 GHz in industrial temperature grade (vs T1023NXN7KQA)
  • DPAA1 architecture with mature firmware ecosystem (vs T1024NSE7MQA)
  • Two cores for data-plane + control-plane partitioning (vs T1013NSE7MQA)
  • Power Architecture ecosystem for networking software (vs LS1024ASE7MLA)

Design Notes

The T1023NSE7MQA's 525-FCBGA at 0.8 mm ball pitch demands a 4-layer minimum PCB with HDI microvia stackup. Route DDR3L/DDR4 signals with matched-length topology to within 25 mil tolerance and maintain 100 ohm differential impedance for SerDes lanes. Decoupling requires 100 nF capacitors placed within 2 mm of every BGA power ball, with bulk 10 uF capacitors distributed around the package perimeter. Reference NXP hardware design guide AN4884 for validated stackups.

Estimated: at 1.2 GHz dual-core with typical industrial workload, total package dissipation reaches 8-12 W. The 19x19 mm FCBGA thermal resistance (theta_JB) is approximately 4-6 C/W per NXP QorIQ T1 family guidelines. A thermal solution capable of 1-2 C/W (heatsink with thermal interface material) is recommended to keep junction temperature below 95 C at 85 C ambient. Avoid placing the device adjacent to high-power components on the PCB.

Validate 10 GbE SerDes signal integrity with IBIS-AMI models from NXP; pre-emphasis and equalization settings must be tuned per channel. PCIe Gen2 lanes require AC-coupling capacitors on the transmitter side and reference-clock routing with 100 ohm differential impedance. For DDR4 at 1600 MT/s, perform read/write leveling calibration and use fly-by topology for the address/command bus to avoid simultaneous-switching-noise issues.

Do not confuse the T1023 (DPAA) with the T1024 (DPAA2) firmware load; mixing the two causes boot failure because the QorIQ T1 boot ROM expects DPAA-compatible device tree entries. Verify ball A1 orientation against the package marking before PCB assembly to avoid rotated-solder defects. Always program the RCW (Reset Configuration Word) to match the actual DDR3L/DDR4 memory density and SerDes configuration; an incorrect RCW prevents boot without diagnostic output.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance confirmed by NXP product page and Mouser/DigiKey distributor listings. The T1023NSE7MQA is an industrial-grade (not automotive) MPU; AEC-Q100 qualification does not apply. Conflict-minerals statement available on NXP corporate-responsibility page.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors T1023NSE7MQA T1023NXN7KQA T1024NSE7MQA T1024NXN7KQA T1013NSE7MQA T1014NSE7MQA LS1024ASE7MLA QorIQ Power Architecture e5500 64-bit microprocessor MPU DPAA DPAA2 SEC security engine DDR3L DDR4 1/10 GbE PCIe Gen2 FCBGA-525 19x19 mm BGA industrial gateway branch-office router industrial firewall IPsec AEC-Q100 (not applicable) RoHS REACH single-board computer
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