TXB0304RSVR - 4-Bit Bidirectional Level Translator 100Mbps | TI
MPN: TXB0304RSVR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.95 | $0.95 |
| 10 | $0.86 | $8.60 |
| 100 | $0.68 | $68.00 |
| 500 | $0.55 | $275.00 |
| 1,000 | $0.44 | $440.00 |
TXB0304RSVR Overview
A voltage-level translator is a crucial component in modern electronics, allowing communication between ICs operating at different voltage levels. For example, a 1.8V microcontroller can interface with a 3.3V sensor or memory device without risking damage or logic errors. The TXB0304 belongs to the TXB family of auto-direction-sensing translators, part of TI's broader level-shifting portfolio that includes unidirectional and bidirectional solutions for various interface standards.
Key features include a fully symmetric supply range (0.9V to 3.6V on both VCCA and VCCB), automatic direction sensing that detects data flow without external direction control, and a high data rate of 100 Mbps. The device also provides an isolation function: if either VCC input is at GND, all outputs are placed in a high-impedance state, preventing backflow current and protecting the system.
Technically, the TXB0304 uses a one-shot circuit to accelerate rising edges, ensuring fast signal propagation even with capacitive loads. The architecture includes a pass-gate transistor with a pull-up resistor on each I/O pin, providing robust translation. The device is specified from -40C to +85C, is RoHS compliant and lead-free.
Typical applications include SPI, I2C, UART, and GPIO interfacing between microcontrollers, sensors, memory, and peripherals at different voltage levels, particularly in IoT devices, portable electronics, and industrial control systems.
Design tip: ensure both VCCA and VCCB are powered and place decoupling capacitors close to the power pins. Note that push-pull drivers are preferred; open-drain buses require external pull-ups sized carefully.
Drop-in alternatives for TXB0304RSVR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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| Function | 4-bit bidirectional voltage-level translator with auto-direction sensing |
| Channels | 4 |
| Supply Voltage VCCA | 0.9 V to 3.6 V |
| Supply Voltage VCCB | 0.9 V to 3.6 V |
| Data Rate | 100 Mbps |
| Translation Type | Bidirectional, automatic direction sensing |
| Output Type | Push-pull (pass-gate with pull-up) |
| Isolation Feature | Outputs high-impedance when either VCC is at GND |
| Operating Temperature | -40C to +85C |
| Package | 16-UQFN (RSV), 2.6 mm x 1.8 mm |
| Mounting Type | Surface Mount |
| Polarity | Non-inverting |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Output Enable | Yes (OE pin, supplied by VCCA) |
TXB0304RSVR Pin Configuration
| Pin 1 | VCCA — A-side supply, 0.9V to 3.6V |
| Pin 2 | A1 — A-side data I/O channel 1 |
| Pin 3 | A2 — A-side data I/O channel 2 |
| Pin 4 | A3 — A-side data I/O channel 3 |
| Pin 5 | A4 — A-side data I/O channel 4 |
| Pin 6 | GND — Ground |
| Pin 7 | B4 — B-side data I/O channel 4 |
| Pin 8 | B3 — B-side data I/O channel 3 |
| Pin 9 | B2 — B-side data I/O channel 2 |
| Pin 10 | B1 — B-side data I/O channel 1 |
| Pin 11 | OE — Output enable, supplied by VCCA |
| Pin 12 | VCCB — B-side supply, 0.9V to 3.6V |
Typical Applications
TXB0304RSVR is suitable for 6 applications: SPI Level Translation, UART Interface Bridging, IoT Sensor Node GPIO Expansion, Portable and Wearable Electronics, Industrial Control Mixed-Voltage Logic, Automotive Gateway and Telematics Modules.
SPI Level Translation
The TXB0304RSVR's 100 Mbps data rate and auto-direction sensing make it a natural fit for SPI interfaces between a low-voltage MCU (e.g., 1.2V or 1.8V core domain) and 3.3V flash, ADC, or display peripherals. All four channels map directly to MOSI, MISO, SCLK, and CS, with no direction pin needed even though SPI lines reverse flow. Placing the device close to the peripheral with 0.1uF decoupling on VCCA and VCCB preserves edge integrity; the internal one-shot accelerators restore fast rise times across the series pass-gate.
Recommended
UART Interface Bridging
UART runs point-to-point push-pull signals, exactly the signal type the TXB0304's pass-gate plus pull-up architecture is optimized for. Translating between a 1.8V sensor-hub processor and a 3.3V radio module keeps both domains safe while preserving the 100 Mbps capability that far exceeds typical UART baud rates. Because TX and RX are unidirectional fixed-direction lines, the auto-direction sensing introduces no contention. Designers should keep the trace length short and add a small series resistor if long cables drive capacitive loading beyond the one-shot acceleration range.
Recommended
IoT Sensor Node GPIO Expansion
Battery-powered IoT nodes frequently mix a 0.9V-1.2V ultra-low-power MCU domain with 1.8V or 3.3V sensors. The TXB0304's fully symmetric 0.9V to 3.6V rails are uniquely suited to this, since few translators accept a 0.9V side. The isolation feature places all outputs in high-impedance when either rail is grounded, letting the system power-gate the peripheral domain without backfeed current. Four channels cover sensor data, interrupt, and enable lines; the 2.6mm x 1.8mm UQFN keeps board area minimal in wearables and asset trackers.
Recommended
Portable and Wearable Electronics
In phones, earbuds, and wearables, board space is the scarcest resource. The TXB0304RSVR's 16-UQFN 2.6mm x 1.8mm package occupies roughly 4.7mm2, among the smallest footprints for a 4-bit translator. It bridges 1.2V/1.8V application processors with 3.3V peripherals such as touch controllers and audio codecs at rates up to 100 Mbps, comfortably covering I2S, GPIO, and control buses. The low rail support also matches modern 0.9V core-domain signaling. Keep decoupling capacitors within 2mm of the VCCA and VCCB pads for best edge fidelity.
Recommended
Industrial Control Mixed-Voltage Logic
Industrial boards combine legacy 3.3V/5V-tolerant peripherals with modern 1.8V controllers. The TXB0304 safely translates control GPIO and serial signals across domains, and its high-impedance isolation state during power-up sequencing prevents damaging backflow when one domain powers before the other - a common failure mode in 24V-fed control cabinets with cascaded regulators. Rated -40C to +85C, it meets industrial ambient requirements. Place the device near the connector boundary so all four channels route from a single, compact translation zone.
Recommended
Automotive Gateway and Telematics Modules
Automotive telematics units pair 1.8V system-on-chips with 3.3V CAN transceivers, memory, and GNSS modules. For new automotive designs, TI offers TXB-family AEC-Q100 qualified siblings such as the TXB0104QRUTRQ1 and TXS0108EQPWRQ1 in the site catalog; the standard TXB0304RSVR serves non-Q1 builds or prototypes. The 100 Mbps capability supports high-speed SPI connections to flash and modems. Note the TXB0304's minimum rail of 0.9V uniquely supports 1.0V-domain signaling used in some advanced SoC banks, which TXB0104 cannot serve.
Recommended
Recommended Products Summary
Engineering reference data for TXB0304RSVR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TXB0304RUT | TXB0304ZXYR | TXB0104QRUTRQ1 |
|---|---|---|---|---|
| Package | UQFN-16 (RSV) 2.6x1.8 mm | UQFN-12 (RUT) | DSBGA-12 (ZXY) | UQFN-12 (RUT) |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Bit Width | 4-bit | 4-bit | 4-bit | 4-bit |
| VCCA / VCCB Range | 0.9V to 3.6V (symmetric) | 0.9V to 3.6V | 0.9V to 3.6V | 1.2V to 3.6V |
| Max Data Rate | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps |
| Direction Control | Automatic | Automatic | Automatic | Automatic |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C |
| AEC-Q100 Qualification | No | No | No | Yes (Q1) |
Key Differentiators
- Lowest rail support: 0.9V on both sides (vs TXB0104QRUTRQ1)
- Smallest 4-bit footprint option (vs TXB0104QRUTRQ1)
- Four channels with no direction pin (vs LSF0101)
Design Notes
Power VCCA and VCCB from separate 0.1uF ceramic decoupling capacitors placed within 2mm of each pin, plus a bulk 1uF per rail. The TXB0304's isolation circuitry requires both rails present for active outputs; if either rail is at GND, all I/O go high-impedance. Ensure rail sequencing inrush through the internal pull-ups is acceptable - during partial power-down, Ioff prevents backflow but the internal 4-10 kOhm pull-ups can leak from one rail to the other if only one domain is alive.
The one-shot edge accelerators drive rising edges fast, so keep traces short and series-terminate long lines to limit overshoot; the pull-up plus one-shot combination was designed for point-to-point push-pull buses such as SPI, UART, and GPIO. Do not use the TXB0304 on multi-drop or open-drain buses (multi-master I2C) without external pull-ups sized per the datasheet application section - contention between the internal pull-up and an external low-side driver slows edges and can mis-trigger the one-shot.
The 16-UQFN (RSV) 2.6mm x 1.8mm footprint requires fine-pitch land pattern per TI datasheet mechanical section; use a 4-mil solder mask opening and NSMD pads. Route A-side and B-side traces on the same layer to avoid via stubs on 100 Mbps signals. The exposed pads on the 0.5mm-pitch perimeter need standard reflow profile - hand soldering is impractical at this pitch, so plan rework with hot-air and stencil printing.
Compliance Information
RoHS compliant and lead-free per TI product page and internal database. Not an AEC-Q100 qualified part - use TXB0104QRUTRQ1 or other Q1 variants for automotive.
