UJA1018TK,118 - LIN 2.x SBC with 5V LDO & LED Drivers | NXP
MPN: UJA1018TK,118 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.05 | $30.50 |
| 100 | $2.41 | $241.00 |
| 500 | $1.92 | $960.00 |
| 1,000 | $1.55 | $1,550.00 |
UJA1018TK,118 Overview
A LIN System Basis Chip (SBC) is a mixed-signal IC that combines the physical-layer transceiver, an internal supply for the local microcontroller, and bus-switching or indicator-driving peripherals in a single die. It sits below the protocol layer (handled by software running on an external MCU) and above the physical LIN bus wire; the SBC therefore belongs to the broader class of in-vehicle networking (IVN) interface ICs in the automotive-power-tree hierarchy: SBC -> transceiver -> interface IC -> automotive semiconductor.
Key features include LIN 2.0/2.1/2.2/SAE J2602 compliance, downward compatibility with LIN 1.3, an internal LIN slave termination resistor, Slave Node Position Detection (SNPD) for daisy-chain address assignment, integrated 5 V LDO capable of 70 mA, two programmable LED drivers, and a wide operating temperature range from -40 C to +150 C suited to under-hood automotive modules.
The device is built on NXP's automotive-qualified mixed-signal BiCMOS process and uses an internal LIN slave termination that can be switched in/out to detect the node's position on the bus. This eliminates the need for an external termination resistor and simplifies ECU board layout where mechanical relay or electronic module LIN nodes are wired in series.
Typical applications include automotive body-control modules, door/window/seat/mirror LIN slave nodes, HVAC control panels, steering-column switches, and ambient interior lighting nodes that require a regulated 5 V rail plus LIN connectivity in a small PCB footprint.
When designing with this SBC, observe the maximum LIN bus load and slew-rate limits stated in the datasheet, and use the exposed pad as the primary thermal path - the LDO's 70 mA output and LED-driver current together define the package's power budget. A 100 nF decoupling capacitor placed within a few millimeters of the VCC pin is mandatory for stable LDO operation across the -40 C to +150 C range.
This page synthesizes NXP distributor pricing, drop-in HVSON alternatives, and PCB-level design notes that go beyond the manufacturer datasheet's typical-application section.
Drop-in alternatives for UJA1018TK,118 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with UJA1018TK,118 (same form factor and footprint) — differing in Integrated Voltage Regulator, Package, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
UJA1018TK/N1,118
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
UJA1018ATK/0Z,118
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TJA1028T/3V3/20
✅ Drop-In📋 Reference alternative (not in catalog)
TLE7259-3GE
✅ Drop-In📋 Reference alternative (not in catalog)
NCV7428D10R2G
✅ Drop-In📋 Reference alternative (not in catalog)
UJA1018TK,118 Maximum Ratings & Electrical Characteristics
| Product Type | LIN System Basis Chip (SBC) |
| LIN Standard Compliance | LIN 2.0 / 2.1 / 2.2 and SAE J2602 |
| LIN 1.3 Compatibility | Yes (downward compatible) |
| Integrated Voltage Regulator | 5.0 V LDO |
| LDO Output Current | up to 70 mA |
| LED Drivers | 2 integrated LED drivers |
| Internal LIN Slave Termination | Yes (switchable) |
| Slave Node Position Detection (SNPD) | Yes |
| Transceivers | 1/1 (LIN bus) |
| Package | 16-HVSON (3.5 x 5.5 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +150 C |
| RoHS Status | Compliant (per distributor data) |
| Automotive Qualification | AEC-Q100 qualified (per NXP product page) |
| Lead-Free / Halogen-Free | Lead-free (per distributor listing) |
UJA1018TK,118 Pin Configuration
| Pin 1 | LIN — LIN bus line (transceiver I/O) |
| Pin 2 | VBAT — Battery supply input |
| Pin 3 | GND — Ground |
| Pin 4 | VCC — 5 V regulator output / MCU supply |
| Pin 5 | LED1 — LED driver output 1 |
| Pin 6 | LED2 — LED driver output 2 |
| Pin 7 | TXD — Transmit data input from MCU |
| Pin 8 | RXD — Receive data output to MCU |
| Pin 9 | EN — Enable input (wake/sleep control) |
| Pin 10 | WAKE — Wake-up input |
| Pin 11 | RESET — Reset output to MCU |
| Pin 12 | INH — Inhibit output (external switch control) |
| Pin 13 | SLP_N — Sleep mode control |
| Pin 14 | SWAKE — Switched wake input |
| Pin 15 | TEST — Test mode pin |
| Pin 16 | EP — Exposed pad (thermal pad, must be soldered to GND pour) |
Typical Applications
UJA1018TK,118 is suitable for 7 applications: Automotive Door Module LIN Slave, Seat Control / Power Seat Adjuster, HVAC Control Panel / Climate Module, Steering Column Switch / Stalk Module, Ambient Interior Lighting Node, Roof / Sunroof Control Module, Rear Lighting / Tail-Light Slave.
Automotive Door Module LIN Slave
The UJA13016TK,118's combination of LIN 2.2 compliance, 70 mA 5 V LDO, and two LED drivers supports the UJA1018TK,118's selection for body-control door modules that drive mirror-fold indicator LEDs and window switches from a single LIN slave. The integrated LDO delivers up to 70 mA to the local MCU plus sensors, removing an external regulator; the LED drivers sink indicator LEDs at 5 V rail level without discrete transistors.
Recommended
Seat Control / Power Seat Adjuster
Power-seat and seat-position nodes use LIN for cost reasons versus CAN. The UJA1018TK,118's integrated 5 V / 70 mA LDO powers the local microcontroller and Hall-sensor logic directly, while its two LED drivers handle seat-occupied indicator or memory-position LEDs without adding driver ICs. The HVSON-16 3.5 x 5.5 mm footprint fits inside the seat-frame PCB envelope, and the -40 C to +150 C rating survives the under-seat thermal environment.
Recommended
HVAC Control Panel / Climate Module
HVAC climate-control modules in mid-range vehicles use LIN to connect the control panel to the blower housing. The UJA1018TK,118's integrated 5 V LDO can supply up to 70 mA to the panel MCU plus display backlight driver, while the two integrated LED drivers eliminate external transistors for knob backlight or status indicators. AEC-Q100 qualification supports cabin thermal stress, and the wide LIN compliance ensures compatibility with mixed-generation HVAC nodes.
Recommended
Steering Column Switch / Stalk Module
Steering-column switches (turn signals, wipers, high-beam flash) communicate to the BCM over LIN. The UJA1018TK,118's small 3.5 x 5.5 mm HVSON-16 footprint fits inside a stalk module housing, and its integrated 5 V LDO provides 70 mA to the local MCU plus button-matrix scan logic. The two LED drivers can be used for backlit switch illumination, while SNPD supports daisy-chained column-switch networks where multiple stalks share one LIN bus segment.
Recommended
Ambient Interior Lighting Node
LIN-controlled ambient interior lighting uses chains of small LED-driver nodes. The UJA1018TK,118 integrates two LED drivers per node and a 5 V LDO for the local control logic, letting a designer place a small PCB behind each trim piece without external drivers. SNPD helps the master assign individual color/brightness commands to each node in a daisy chain, and the -40 C to +150 C range handles the cabin thermal envelope.
Recommended
Roof / Sunroof Control Module
Sunroof and convertible-roof control modules communicate via LIN. The UJA1018TK,118's integrated 5 V / 70 mA LDO powers the local MCU plus H-bridge-driver logic supply, while its HVSON-16 footprint fits the small module housing. The two LED drivers support position-indicator LEDs, and the AEC-Q100 qualification plus -40 C to +150 C range suit the windshield header thermal environment directly under the glass.
Recommended
Rear Lighting / Tail-Light Slave
LIN-connected rear-lamp slaves replace heavy CAN wiring harnesses with a single LIN bus. The UJA1018TK,118's integrated LED drivers can drive two tail-light channels directly from the 5 V rail, while the integrated 70 mA LDO supplies the local MCU plus lamp-status logic. The -40 C to +150 C rating and HVSON-16 footprint suit sealed tail-lamp assemblies where PCB area is constrained.
Recommended
Recommended Products Summary
Engineering reference data for UJA1018TK,118 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | UJA1018TK/N1,118 | UJA1018ATK/0Z,118 | TJA1028T/3V3/20 | TLE7259-3GE | NCV7428D10R2G |
|---|---|---|---|---|---|---|
| Package | 16-HVSON (3.5 x 5.5 mm) | 16-HVSON (3.5x5.5) - same | 16-HVSON (3.5x5.5) - same | 16-HVSON (3.5x5.5) - same | 16-HVSON (3.5x5.5) - same | 16-HVSON (3.5x5.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon | onsemi |
| Integrated LDO | 5.0 V / 70 mA | 5.0 V / 70 mA | 5.0 V / 70 mA | No (transceiver only) | 5.0 V / ~50 mA | 5.0 V / ~50 mA |
| LED Drivers | 2 integrated | 2 integrated | 2 integrated | No | No | No |
| LIN Compliance | LIN 2.0/2.1/2.2 + SAE J2602 | LIN 2.0/2.1/2.2 + SAE J2602 | LIN 2.0/2.1/2.2 + SAE J2602 | LIN 2.0/2.1/2.2 + SAE J2602 | LIN 2.0/2.1/2.2 + SAE J2602 | LIN 2.0/2.1/2.2 + SAE J2602 |
| SNPD (Node Position Detection) | Yes | Yes | Yes | No | No | No |
| Operating Temperature | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C | -40 C to +150 C |
Key Differentiators
- Integrated 5V/70mA LDO + 2 LED drivers in one HVSON-16 SBC (vs TJA1028T/3V3/20)
- Higher LDO current budget than cross-brand equivalents (vs TLE7259-3GE / NCV7428D10R2G)
- Slave Node Position Detection (SNPD) for daisy-chain addressing (vs TJA1028T/3V3/20 / TLE7259-3GE)
Design Notes
The UJA1018TK,118's HVSON-16 exposed pad is the primary thermal path. At VIN = 12 V, VOUT = 5.0 V, and 70 mA full LDO load plus LED-driver current, internal dissipation is roughly (12-5) * 0.07 = 0.49 W. Estimated: with the datasheet theta_JA (~50 C/W typical for HVSON-16 with minimum pad), junction rises about 25 C above ambient - acceptable at 85 C ambient but requires at least 100 mm^2 of top-side copper pour at 1 oz in production. Never leave the EP un-soldered.
Place a 100 nF X7R ceramic decoupling capacitor on VCC within 2 mm of pin 4, with the ground return via a short trace to the EP ground pour. Place the LIN bus ESD/TVS protection (e.g., PESD1LIN) within 3 mm of the LIN pin. Keep the LIN trace away from switching nodes (DC-DC converters, motor drivers) and use a guard ground on both sides of the LIN trace to minimize radiated emissions meeting CISPR 25 Class 5.
Do NOT omit the external protection diode on the WAKE pin when the input is wired to a battery-fed switch matrix; reverse battery and load-dump transients can exceed the absolute-maximum WAKE rating. The internal LIN termination resistor is intended for SLAVE nodes only; do NOT enable it on a master node or the bus recessive level is corrupted. The EN/SLP_N timing must observe the datasheet's minimum t_filter to avoid spurious wake events from LIN bus glitches.
When the UJA1018TK,118's 70 mA LDO budget is exceeded (for example by a sensor plus MCU plus LEDs simultaneously), the LDO drops out of regulation rather than fold-back; downstream logic then operates out of spec. Estimated: a typical 32-pin automotive MCU plus two LED drivers can pull 40-60 mA combined, so budget the LDO carefully and switch high-current loads (LED strings) to a separate rail fed from VBAT, not VCC.
Compliance Information
AEC-Q100 qualified per NXP product page. RoHS and REACH compliance from distributor listing; halogen-free status not explicitly confirmed in the verified web data.
