XC7A35T-2FGG484C - Artix-7 FPGA 33280 Cells | AMD
MPN: XC7A35T-2FGG484C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.74 | $22.74 |
| 10 | $21.5 | $215.00 |
| 100 | $19.8 | $1,980.00 |
| 500 | $18.2 | $9,100.00 |
| 1,000 | $16.9 | $16,900.00 |
Drop-in alternatives for XC7A35T-2FGG484C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7A35T-1FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC7A50T-2FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC7A35T-2FGG484C Maximum Ratings & Electrical Characteristics
| Family | Artix-7 |
| Number of Logic Cells | 33280 |
| Number of LABs/CLBs | 2600 |
| Total RAM Bits | 1843200 |
| Number of I/O | 250 |
| Number of User I/O Banks | [DATA_NEEDED: Number of User I/O Banks] |
| Number of GTX Transceivers | [DATA_NEEDED: Number of GTX Transceivers] |
| Number of MMCMs | [DATA_NEEDED: Number of MMCMs] |
| Number of PLLs | [DATA_NEEDED: Number of PLLs] |
| Operating Temperature | 0C to +85C |
| Package | 484-BBGA (FGG484) |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
| Process Technology | 28nm |
| Supply Voltage | 1V |
| RoHS Status | Compliant |
XC7A35T-2FGG484C Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCINT β Internal core supply voltage (1.0V) |
| Pin C2 | GND β Ground |
| Pin D1 | VCCAUX β Auxiliary supply voltage (1.8V) |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | IO_L4P_T0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_T0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A35T-2FGG484C is suitable for 6 applications: Industrial Motor Control, Software-Defined Radio, Medical Imaging, Video Processing, Communications Infrastructure, Aerospace and Defense.
Industrial Motor Control
The XC7A35T-2FGG484C is well-suited for industrial motor control applications due to its 33,280 logic cells and 250 I/Os, which can handle multiple PWM channels and encoder interfaces. The 28nm process ensures low power consumption, which is critical for thermally constrained industrial environments. The device's DSP slices can be used for implementing field-oriented control (FOC) algorithms, while the MMCMs and PLLs provide precise clock generation for synchronized motor commutation. The 484-FBGA package offers enough I/Os to interface with gate drivers, current sensors, and communication interfaces like EtherCAT or PROFINET. The -2 speed grade provides sufficient performance for high-frequency PWM switching without excessive power draw.
Recommended
Software-Defined Radio
In software-defined radio (SDR) applications, the XC7A35T-2FGG484C provides the logic capacity and I/O bandwidth needed for digital down-conversion, filtering, and demodulation. Its 1,843,200 bits of block RAM can buffer samples, while the DSP slices handle complex multiply-accumulate operations. The 250 I/Os can interface with high-speed ADCs and DACs, and the MMCMs/PLLs generate the required sampling clocks. The low power consumption of the 28nm process is beneficial for portable or battery-operated SDR devices. The -2 speed grade ensures that the FPGA can keep up with real-time signal processing requirements, making it a cost-effective choice for mid-range SDR platforms.
Recommended
Medical Imaging
The XC7A35T-2FGG484C is used in medical imaging systems such as ultrasound and X-ray machines for real-time image processing. Its 33,280 logic cells can implement image filtering, edge detection, and other algorithms, while the block RAM stores image frames. The 250 I/Os connect to image sensors and display interfaces. The device's low power consumption and small footprint are advantages in portable medical devices. The -2 speed grade provides the performance needed for high-resolution image processing at frame rates. The FPGA's reconfigurability allows for algorithm updates without hardware changes, which is valuable in a rapidly evolving medical technology field.
Recommended
Video Processing
For video processing applications, the XC7A35T-2FGG484C offers the logic capacity to handle video scaling, color space conversion, and overlay generation. Its 1,843,200 bits of block RAM can buffer multiple video lines, and the DSP slices can perform pixel-level operations. The 250 I/Os can interface with HDMI, LVDS, or MIPI video interfaces. The 28nm process ensures low power consumption, which is important for fanless video processing devices. The -2 speed grade supports 1080p video processing at 60fps, making it suitable for video walls, surveillance systems, and video conferencing equipment. The FPGA's parallel processing capability is ideal for real-time video manipulation.
Recommended
Communications Infrastructure
In communications infrastructure, the XC7A35T-2FGG484C can be used for protocol bridging, packet processing, and signal conditioning. Its 33,280 logic cells and 250 I/Os allow it to interface with various PHY chips and backplane logic. The block RAM can store packet buffers, and the DSP slices can handle error correction or modulation. The device's low power consumption is critical for line cards and remote radio heads. The -2 speed grade provides the performance needed for gigabit Ethernet or CPRI links. The FPGA's flexibility enables support for multiple protocols, making it a versatile component in base stations and network switches.
Recommended
Aerospace and Defense
The XC7A35T-2FGG484C is suitable for aerospace and defense applications such as radar signal processing, flight control, and secure communications. Its 33,280 logic cells can implement complex algorithms, and the 250 I/Os interface with sensors and actuators. The device's low power consumption is beneficial for airborne systems where power is limited. The -2 speed grade provides the performance needed for real-time processing. The FPGA's reconfigurability allows for in-field updates, which is valuable for evolving mission requirements. The 484-FBGA package is robust enough for harsh environments, and the device is available in industrial temperature grades for extended operating ranges.
Recommended
Recommended Products Summary
Engineering reference data for XC7A35T-2FGG484C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A35T-1FGG484C | XC7A50T-2FGG484C | XC7A35T-2CSG324C |
|---|---|---|---|---|
| Package | 484-BBGA (FGG484) | 484-BBGA (FGG484) - same | 484-BBGA (FGG484) - same | 324-CSBGA (CSG324) - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 33280 | 33280 | 52160 | 33280 |
| Number of I/O | 250 | 250 | 250 | 210 |
| Speed Grade | -2 | -1 | -2 | -2 |
| Block RAM (bits) | 1843200 | 1843200 | 2700000 | 1843200 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Process Technology | 28nm | 28nm | 28nm | 28nm |
Key Differentiators
- Cost-effective logic density (vs XC7A50T-2FGG484C)
- Higher speed grade (vs XC7A35T-1FGG484C)
- More I/Os than smaller package (vs XC7A35T-2CSG324C)
Design Notes
The XC7A35T-2FGG484C requires multiple supply rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by bank). Use a dedicated power management IC to sequence these rails properly. Place 100nF decoupling capacitors close to each power pin and a 10uF bulk capacitor per rail. Refer to the Artix-7 power supply design guidelines in UG933 for detailed recommendations.
For the 484-ball FBGA package, use a 4-layer or more PCB with a solid ground plane. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential). Ensure the BGA fanout is done correctly, using via-in-pad if necessary. Follow the PCB design guidelines in UG483 for the FGG484 package.
A common pitfall is incorrect configuration. The FPGA requires a configuration source (e.g., SPI flash) and a configuration mode (e.g., Master SPI). Ensure the mode pins are set correctly and the bitstream is generated for the correct device. Also, verify that all VCCO banks are powered to the correct voltage for the I/O standard used.
Compliance Information
RoHS compliant per distributor data. Not AEC-Q100 qualified as it is not an automotive-grade part.