MRF5S19060MBR1 vs MRF5S19060NBR1 Comparação

Comparação detalhada lado a lado de MRF5S19060MBR1 por NXP Semiconductors e MRF5S19060NBR1 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MRF5S19060MBR1 MRF5S19060MBR1 - 12W RF Power LDMOS 1990MHz | NXP/Freescale

MRF5S19060MBR1 - 12W RF Power LDMOS 1990MHz | NXP/Freescale

MRF5S19060MBR1 Obsolete
NXP Semiconductors
MRF5S19060NBR1 MRF5S19060NBR1 - 60W RF Power MOSFET 1930-1990 MHz | NXP

MRF5S19060NBR1 - 60W RF Power MOSFET 1930-1990 MHz | NXP

MRF5S19060NBR1 ✓ Ativo

Comparação de especificações

Parâmetro MRF5S19060MBR1 MRF5S19060NBR1
Marca NXP Semiconductors NXP Semiconductors
Categoria RF Amplifiers MOSFETs
Status do ciclo de vida Obsolete Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $16,40 $25,40
Tipo de transistor LDMOS, N-Channel Enhancement-Mode Lateral MOSFET N-Channel Enhancement-Mode Lateral MOSFET (LDMOS RF Power)
Technology RF Power Field Effect Transistor Silicon LDMOS
Frequency Band 1.93 GHz to 1.99 GHz 1930 MHz to 1990 MHz
Typical Operating Frequency 1990 MHz —
Drain-Source Voltage (Rated) 65 V —
Nominal Drain Operating Voltage 28 V —
Output Power (Average) 12 W 12 W avg.
Power Gain 14 dB 14 dB at 1.99 GHz
Test Current (Drain) 750 mA —
Drain Current Rating (Leakage Spec) 10 uA —
VSWR Tolerance 5:1 @ 28 Vdc, 1990 MHz, 12 W avg —
Input Matching Internally matched —
ESD Protection Integrated —
Encapsulamento TO-270 WB-4 (overmolded plastic, also listed as TO-272 WB-4) TO-272 WB-4 (overmolded plastic)
Package Outline Case 1486-03, Style 1 —
Estilo de montagem Flange / surface mount with thermal pad —
Maximum Junction Temperature 200 degree C —
Packaging Tape and Reel, 500 units per 44 mm 13-inch reel (R1 suffix) —
Target Application PCN/PCS 1900 MHz, 2 x N-CDMA base station PA final/driver stage —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Configuration — Dual Die (2 x N), Common Source
Output Power (P1dB) — 60 W (CW/peak)
Drain Supply Voltage — 28 V (typical)
Drain-Source Voltage (Vdss) — 65 V (max)
Drain Current — 750 mA (typical operating DC)
Tipo de montagem — Surface Mount (SMD)
Contagem de pinos — 5
Peak Reflow Temperature — 260 C
Maximum Power Dissipation (Absolute) — 218.8 W
Status RoHS — [DATA_NEEDED: RoHS compliance status]
Nível MSL — [DATA_NEEDED: MSL moisture sensitivity level]

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