MRF8S9170NR3 vs MRF377HR3 Comparação
Comparação detalhada lado a lado de MRF8S9170NR3 por NXP Semiconductors e MRF377HR3 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MRF8S9170NR3 | MRF377HR3 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | MOSFETs | MOSFETs |
| Status do ciclo de vida | Ativo | Ativo |
| Manufacturer | NXP Semiconductors | — |
| Tipo de transistor | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET | N-Channel Enhancement-Mode Lateral MOSFET |
| Technology | RF Power LDMOS | Lateral RF Power MOSFET (Silicon) |
| Frequency Range | 920 MHz to 960 MHz | 470 MHz to 860 MHz |
| Output Power (Average, W-CDMA) | 50 W | — |
| Power Gain (Typical) | 19.3 dB at 920 MHz, 28 V, 1 A quiescent bias | — |
| Drain-Source Voltage Rating (Vdss) | 70 V | — |
| Operating Drain Voltage (Test Condition) | 28 V | — |
| Quiescent Bias Current (Idq, Test Condition) | 1 A | — |
| Drain Current (Operating) | [DATA_NEEDED: typical operating Id at 50 W Pout] | — |
| Encapsulamento | OM-780-2 (ceramic flange) | NI-860C3 (ceramic flange) |
| Tipo de montagem | Surface Mount / Flange Mount (bolt-down thermal pad) | Flange / Screw Mount (Surface Mount variant per HR3 suffix) |
| Temperatura de operação | [DATA_NEEDED: Tj max and operating range from datasheet] | -40 C to +200 C (junction) |
| Class of Operation | Class AB, Class C (W-CDMA) | — |
| Lead-Free / RoHS | Lead Free (per digchip listing) | Lead Free / RoHS Compliant |
| ESD Protection | [DATA_NEEDED: ESD class rating from datasheet] | — |
| Impedance Characterization | Series-equivalent large-signal impedance parameters provided | — |
| Test Conditions Note | 100% PAR tested for guaranteed output power capability | — |
| Drain-Source Voltage (V DSS) | — | 65 V (max) |
| Operating Drain Voltage | — | 32 V (typical) |
| Continuous Output Power (P out) | — | 45 W (CW, push-pull) |
| Power Gain (G ps) | — | 18.2 dB (typical at 860 MHz) |
| Drain Efficiency | — | [DATA_NEEDED: drain efficiency %] |
| Test Current | — | 2 A |
| Configuration | — | Push-Pull (internally matched) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Case Connection | — | Source |
| Maximum Power Dissipation | — | 648 W (per Partstack listing) |