MRF8S9170NR3 vs MRF377HR3 对比

详细并排对比 MRF8S9170NR3 出自 NXP Semiconductors 和 MRF377HR3 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MRF8S9170NR3 MRF8S9170NR3 - 50W 920-960MHz RF Power LDMOS | NXP

MRF8S9170NR3 - 50W 920-960MHz RF Power LDMOS | NXP

MRF8S9170NR3 ✓ 量产中
NXP Semiconductors
MRF377HR3 MRF377HR3 - 45W 470-860MHz RF Power MOSFET | NXP

MRF377HR3 - 45W 470-860MHz RF Power MOSFET | NXP

MRF377HR3 ✓ 量产中

规格对比

参数 MRF8S9170NR3 MRF377HR3
品牌 NXP Semiconductors NXP Semiconductors
分类 MOSFETs MOSFETs
生命周期状态 有效 有效
Manufacturer NXP Semiconductors —
晶体管类型 LDMOS, N-Channel Enhancement-Mode Lateral MOSFET N-Channel Enhancement-Mode Lateral MOSFET
Technology RF Power LDMOS Lateral RF Power MOSFET (Silicon)
Frequency Range 920 MHz to 960 MHz 470 MHz to 860 MHz
Output Power (Average, W-CDMA) 50 W —
Power Gain (Typical) 19.3 dB at 920 MHz, 28 V, 1 A quiescent bias —
Drain-Source Voltage Rating (Vdss) 70 V —
Operating Drain Voltage (Test Condition) 28 V —
Quiescent Bias Current (Idq, Test Condition) 1 A —
Drain Current (Operating) [DATA_NEEDED: typical operating Id at 50 W Pout] —
封装 OM-780-2 (ceramic flange) NI-860C3 (ceramic flange)
安装类型 Surface Mount / Flange Mount (bolt-down thermal pad) Flange / Screw Mount (Surface Mount variant per HR3 suffix)
工作温度 [DATA_NEEDED: Tj max and operating range from datasheet] -40 C to +200 C (junction)
Class of Operation Class AB, Class C (W-CDMA) —
Lead-Free / RoHS Lead Free (per digchip listing) Lead Free / RoHS Compliant
ESD Protection [DATA_NEEDED: ESD class rating from datasheet] —
Impedance Characterization Series-equivalent large-signal impedance parameters provided —
Test Conditions Note 100% PAR tested for guaranteed output power capability —
Drain-Source Voltage (V DSS) — 65 V (max)
Operating Drain Voltage — 32 V (typical)
Continuous Output Power (P out) — 45 W (CW, push-pull)
Power Gain (G ps) — 18.2 dB (typical at 860 MHz)
Drain Efficiency — [DATA_NEEDED: drain efficiency %]
Test Current — 2 A
Configuration — Push-Pull (internally matched)
Storage Temperature — [DATA_NEEDED: storage temperature range]
Case Connection — Source
Maximum Power Dissipation — 648 W (per Partstack listing)

数据手册与资源

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