MRF8S9170NR3 vs MRF377HR3 비교
다음의 상세 나란히 비교: MRF8S9170NR3 제조: NXP Semiconductors 및 MRF377HR3 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MRF8S9170NR3 | MRF377HR3 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | MOSFETs | MOSFETs |
| 수명 주기 상태 | 활성 | 활성 |
| Manufacturer | NXP Semiconductors | — |
| 트랜지스터 유형 | LDMOS, N-Channel Enhancement-Mode Lateral MOSFET | N-Channel Enhancement-Mode Lateral MOSFET |
| Technology | RF Power LDMOS | Lateral RF Power MOSFET (Silicon) |
| Frequency Range | 920 MHz to 960 MHz | 470 MHz to 860 MHz |
| Output Power (Average, W-CDMA) | 50 W | — |
| Power Gain (Typical) | 19.3 dB at 920 MHz, 28 V, 1 A quiescent bias | — |
| Drain-Source Voltage Rating (Vdss) | 70 V | — |
| Operating Drain Voltage (Test Condition) | 28 V | — |
| Quiescent Bias Current (Idq, Test Condition) | 1 A | — |
| Drain Current (Operating) | [DATA_NEEDED: typical operating Id at 50 W Pout] | — |
| 패키지 | OM-780-2 (ceramic flange) | NI-860C3 (ceramic flange) |
| 실장 유형 | Surface Mount / Flange Mount (bolt-down thermal pad) | Flange / Screw Mount (Surface Mount variant per HR3 suffix) |
| 동작 온도 | [DATA_NEEDED: Tj max and operating range from datasheet] | -40 C to +200 C (junction) |
| Class of Operation | Class AB, Class C (W-CDMA) | — |
| Lead-Free / RoHS | Lead Free (per digchip listing) | Lead Free / RoHS Compliant |
| ESD Protection | [DATA_NEEDED: ESD class rating from datasheet] | — |
| Impedance Characterization | Series-equivalent large-signal impedance parameters provided | — |
| Test Conditions Note | 100% PAR tested for guaranteed output power capability | — |
| Drain-Source Voltage (V DSS) | — | 65 V (max) |
| Operating Drain Voltage | — | 32 V (typical) |
| Continuous Output Power (P out) | — | 45 W (CW, push-pull) |
| Power Gain (G ps) | — | 18.2 dB (typical at 860 MHz) |
| Drain Efficiency | — | [DATA_NEEDED: drain efficiency %] |
| Test Current | — | 2 A |
| Configuration | — | Push-Pull (internally matched) |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Case Connection | — | Source |
| Maximum Power Dissipation | — | 648 W (per Partstack listing) |