10AS048H1F34I1HG - Arria 10 SX 480K LE SoC FPGA | Intel
N.º da peça: 10AS048H1F34I1HG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3986.86 | $3.986,86 |
| 10 | $3680 | $36.800,00 |
| 100 | $3250 | $325.000,00 |
| 500 | $2890 | $1.445.000,00 |
| 1.000 | $2650 | $2.650.000,00 |
10AS048H1F34I1HG Visão geral
What is an SoC FPGA? An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines a traditional FPGA fabric with a hard processor system on a single die. The hard processor system - in this case dual ARM Cortex-A9 cores - executes operating systems and control code deterministically, while the FPGA fabric implements custom accelerators, DSP pipelines, and high-speed interfaces. This integration reduces bill-of-material cost, lowers latency between processor and fabric, and shrinks board area compared to a discrete CPU-plus-FPGA two-chip solution.
Key features include 480,000 logic elements, an integrated dual-core ARM Cortex-A9 MPCore with CoreSight debug, 1.5 GHz maximum processor frequency, and a 1152-ball Fine-pitch Ball Grid Array (FC-FBGA) package suitable for high-density PCB designs. The Arria 10 SX architecture supports high-speed transceivers, embedded DSP blocks, and substantial on-chip memory, enabling designers to consolidate DSP, packet processing, and control functions onto one device.
Technical depth: the Arria 10 SX family is built on TSMC's 20 nm process, providing a balanced trade-off between power efficiency, performance, and cost. The hard processor subsystem integrates NEON media processing engines, single/double-precision floating-point units, L1 and L2 caches, and a rich set of peripherals (EMAC, USB, NAND, SD/MMC, SPI, I2C, UART). The FPGA fabric communicates with the HPS through high-bandwidth AXI bridges, allowing hardware accelerators in the fabric to be memory-mapped into the CPU address space.
Typical applications include high-performance industrial imaging, radar and electronic warfare signal processing, 5G baseband prototyping, military secure communications, and broadcast video infrastructure. The combination of dual ARM cores plus 480K logic elements suits mid- to high-density embedded systems where deterministic real-time control and parallel DSP processing coexist.
Design consideration: the 1152-ball FC-FBGA requires high-layer-count PCB stack-ups (typically 12+ layers) with microvia technology, controlled-impedance routing for the HPS DDR3/4 interfaces, and careful power-rail decoupling. Designers must also budget for the device's thermal envelope: high transceiver utilization can drive junction temperatures near the 100 C limit without a heatsink or airflow.
This page synthesizes distributor stock data, pricing, and drop-in same-family alternatives for the Arria 10 SX family - practical context not found in the manufacturer datasheet alone.
Alternativas drop-in para 10AS048H1F34I1HG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS048H1F34I1HG (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Transceivers, Mounting Type, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS048H1F34E1HG
✅ Drop-In✓ Em estoque
$3048.91 / unidade
Ver ficha técnica →10AS032H1F34I1HG
✅ Drop-In✓ Em estoque
$2077.26 / unidade
Ver ficha técnica →10AS048E4F29I3SG
✅ Drop-In✓ Em estoque
$1150 / unidade
Ver ficha técnica →10AS048E4F29I3LG
✅ Drop-In✓ Em estoque
$2980 / unidade
Ver ficha técnica →10AS048H1F34I1HG Classificações máximas e características elétricas
| Family | Arria 10 SX |
| Device Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| I/O Count | 492 user I/O |
| Encapsulamento | 1152-ball FC-FBGA (35x35 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | -40 C to +100 C (industrial) |
| Speed Grade | 1 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do 10AS048H1F34I1HG 1152-ball fc-fbga (35x35 mm)
Configuração de pinos para 10AS048H1F34I1HG (pacote 1152-ball fc-fbga (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS048H1F34I1HG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS048H1F34I1HG é adequado para 6 aplicaçãos: High-Performance Industrial Imaging and Machine Vision, Radar and Electronic Warfare Signal Processing, 5G Baseband and Radio Prototyping, Military Secure Communications, Broadcast Video Infrastructure and Studio Processing, Medical Imaging Systems (CT, Ultrasound, MRI Back-End).
High-Performance Industrial Imaging and Machine Vision
The 10AS048H1F34I1HG suits multi-camera machine-vision systems where image preprocessing must run at line rate before inspection decisions. Its 480K logic elements implement parallel pipelines for Bayer demosaicing, lens-distortion correction, and CNN inference, while the dual ARM Cortex-A9 HPS at 1.5 GHz runs Linux for PLC coordination, HMI, and protocol stacks (EtherCAT, PROFINET). The 492 user I/O handle Camera Link, CoaXPress, or GigE Vision interfaces, and the FC-FBGA package sustains industrial -40 C to +100 C operation. Estimated: at 70% logic utilization the device draws approximately 18-22 W, so designers budget a 25 W thermal envelope with 200 LFM airflow.
Recomendado
Radar and Electronic Warfare Signal Processing
The 10AS048H1F34I1HG targets phased-array radar baseband and electronic-countermeasure systems where FFT, pulse compression, and digital beamforming must execute in microseconds. The 480K logic elements map to thousands of 18x19 multipliers and embedded DSP blocks, while the dual ARM cores handle scheduling, calibration, and Ethernet control planes. The Arria 10 SX architecture supports 17 Gbps transceivers for direct ADC interfacing and reduced latency to downstream processing. Industrial temperature grade allows deployment in ruggedized enclosures. Designers typically pair this SoC with external DDR4 for capture buffers.
Recomendado
5G Baseband and Radio Prototyping
The 10AS048H1F34I1HG is well suited to 4G/5G baseband prototyping, where massive MIMO and LDPC decoding demand thousands of DSP operations per subframe. The 480K logic elements host channel encoders, FFT/IFFT cores, and crest-factor-reduction engines, while the dual ARM Cortex-A9 HPS runs the MAC scheduler and upper-layer stacks. The 1152-ball FC-FBGA package supports the high pin density required for multi-antenna transceiver fan-out. Operating up to 100 C junction, the device fits thermally constrained indoor radio units. Expect approximately 25 W device dissipation at full transceiver utilization.
Recomendado
Military Secure Communications
The 10AS048H1F34I1HG supports tactical radio and secure-comm gateway designs where cryptographic acceleration and software-defined-radio waveforms coexist on a single device. The dual ARM cores handle Type-1 crypto APIs, key management, and IP routing, while the 480K logic fabric implements waveform-specific modulators, channelizers, and FEC decoders. Industrial temperature range suits vehicle and field-deployable enclosures, and the FC-FBGA package supports high-vibration environments with underfilled BGA attachment. Designers pair this SoC with external secure-boot Flash and battery-backed RAM.
Recomendado
Broadcast Video Infrastructure and Studio Processing
The 10AS048H1F34I1HG supports broadcast studio equipment such as video routers, multiviewers, and UHD format converters where real-time pixel processing exceeds GPU practicality. The 480K logic elements implement color-space conversion, scaling, frame-rate conversion, and overlay composition, while the dual ARM HPS runs control software and IP-based studio networks (SMPTE 2110, NMOS). The 1152-ball FC-FBGA provides the user I/O count required for multi-channel SDI and 12G-SDI inputs. Estimated: at 60% logic utilization with four 12G-SDI streams, the device draws approximately 15 W.
Recomendado
Medical Imaging Systems (CT, Ultrasound, MRI Back-End)
The 10AS048H1F34I1HG targets medical-imaging back-end processing, where raw sensor data requires real-time beamforming, image reconstruction, and noise filtering. The 480K logic elements implement parallel DSP pipelines for ultrasound beamforming or CT back-projection, while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and clinician-facing software. Industrial temperature range allows integration into stationary imaging carts and OR equipment. The SoC architecture eliminates the need for a separate host CPU, reducing system cost and patient-data latency.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS048H1F34I1HG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS048H1F34E1HG | 10AS032H1F34I1HG | 10AS048E4F29I3SG | 10AS048E4F29I3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35 mm) | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 480,000 | 480,000 | 320,000 | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | 1 (fastest) | 1 | 1 | 3 (slower) | 3 (lower power) |
| Temperature Grade | Industrial (-40 C to +100 C) | Extended | Industrial | Industrial | Industrial |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Principais diferenciais
- Highest logic density in the same 1152-ball FC-FBGA footprint (vs 10AS032H1F34I1HG)
- Fastest speed grade in the Arria 10 SX 480K family (vs 10AS048E4F29I3SG)
- Industrial temperature grade with full -40 C to +100 C support (vs 10AS048H1F34E1HG)
- True SoC integration eliminates external host CPU (vs 10AS048 (GX variant without HPS))
Notas de projeto
The 1152-ball FC-FBGA package at 1.0 mm ball pitch requires a high-layer-count PCB stack-up (12 layers or more) with laser-drilled microvias for fan-out. Use a symmetric stack-up to prevent BGA warpage during reflow, and follow Intel's via-in-pad recommendations for the inner rows of the BGA. Allocate at least 4 internal layers to solid ground and 2 to power for return-path integrity on the high-speed HPS DDR3/4 interfaces.
Estimated: at 70% logic utilization with active transceivers, the 10AS048H1F34I1HG dissipates 18-22 W; at full utilization with all transceivers active, dissipation can reach 30+ W. The 35x35 mm FC-FBGA has a thermal resistance of approximately 1.0 C/W with the recommended thermal via array and thermal interface material. Use a heatsink plus 200 LFM airflow for industrial-grade reliability, and simulate the junction-to-ambient thermal path in your mechanical CAD before committing to layout.
The Arria 10 SX SoC requires multiple power rails: 0.9 V core, 1.1 V auxiliary, 1.5 V/1.8 V/2.5 V/3.0 V user I/O banks, 1.2 V DDR3/4 for the HPS, and 1.8 V/2.5 V for transceiver channels. Use a PowerTree-aware sequencing controller (such as the LTC2977 or LTM4677) to enforce Intel's power-up and power-down sequencing requirements; incorrect sequencing can latch-up the device. Decouple every rail with bulk ceramic and polymer capacitors placed within 100 mil of each BGA power pin.
HPS DDR3/4 interfaces require matched-length routing within +/-25 mil across the byte lane and matched impedance of 50 ohm single-ended (100 ohm differential for DDR4). The FPGA fabric's high-speed transceivers need 85-100 ohm differential routing with length matching within +/-0.1 mm across the P and N pairs. Use Intel's Quartus Prime Pin Planner and the Arria 10 EMIF Toolkit to validate DDR timing closure before fabrication.
Do not confuse the H (industrial temperature) suffix with the E (extended) suffix when sourcing - the E variant is for harsher ambient conditions. Also avoid the F35 vs F34 package code distinction - F35 indicates a different transceiver lane count, which changes the BGA ball map. Always verify the exact MPN against Intel's ordering information guide before issuing a purchase order. Note: cross-package alternatives such as the 10AS048H4F35I3SG (1517-ball BGA) are NOT drop-in and require PCB rework.
Informações de conformidade
RoHS and lead-free compliance confirmed via distributor listings. AEC-Q100 not applicable (industrial/extended-grade part, not automotive-qualified). Conflict-minerals compliance per Intel corporate policy.
