10AS066H2F34E1HG - Arria 10 SX 660K SoC FPGA | Intel | 1152-FBGA
N.º da peça: 10AS066H2F34E1HG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3582.34 | $3.582,34 |
| 10 | $3450 | $34.500,00 |
| 100 | $3295 | $329.500,00 |
| 500 | $3120 | $1.560.000,00 |
| 1.000 | $2980 | $2.980.000,00 |
10AS066H2F34E1HG Visão geral
What is an SoC FPGA? A System-on-Chip FPGA combines a hard processor subsystem (typically ARM Cortex-A cores) with programmable logic on the same silicon die. The hard CPU subsystem executes an operating system (Linux, VxWorks, RTOS) while the FPGA fabric implements custom accelerators, high-speed I/O protocols, and DSP pipelines. This integration reduces board area, latency between CPU and fabric, and BOM cost compared with a discrete CPU-plus-FPGA two-chip solution. SoC FPGAs sit within the broader taxonomy of: SoC FPGA -> FPGA -> programmable logic -> semiconductor device -> integrated circuit.
Key features include 492 user I/O pins, transceivers up to 17.4 Gbps, embedded hard memory controllers (DDR3/DDR4/LPDDR2), and 1.5 GHz dual-core ARM Cortex-A9 with NEON and floating-point unit. The 1152-FC-FBGA package provides ample signal escape for high-speed serial links and parallel memory interfaces while sustaining the 0.9 V core supply typical of 20 nm Arria 10 silicon. Designers also gain access to Intel Quartus Prime for synthesis, place-and-route, and HPS firmware development.
The Arria 10 SX architecture unifies the HPS-to-Fabric AXI bus with hardened memory controllers and PCIe Gen3 hard IP. The hard CPU cores offload RTOS or Linux tasks, while the FPGA fabric implements latency-critical DSP for radar, baseband, or video pipelines. This partitioning yields lower power than two-chip solutions because HPS-to-Fabric data movement stays on-chip.
Typical applications include 4K/8K video broadcast equipment, wireless baseband and backhaul, radar and electronic warfare signal processing, industrial machine vision, and medical imaging accelerators. Designers value the combination of a deterministic Linux-capable processor with parallel FPGA fabric for sensor fusion and protocol bridging.
When designing with this device, prioritize PCB stack-up and power integrity early. The 1152-FCBGA at 35x35 mm requires HDI PCB fabrication with microvia stack-ups. Decouple each transceiver and HPS power rail with bulk + ceramic capacitance per the Intel Arria 10 pin connection guidelines to meet jitter and power-sequencing requirements.
This page synthesizes distributor pricing from Heisener and Octopart, lists pin-compatible Arria 10 SX family variants from the XAIPART internal MPN list, and provides drop-in guidance not found in the bare manufacturer datasheet.
Alternativas drop-in para 10AS066H2F34E1HG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS066H2F34E1HG (mesmo formato e footprint) — diferindo em Package, Temperature Grade, Mounting Type, Family, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS066H1F34E1HG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3900 / unidade
Ver ficha técnica →10AS066H1F34I1HG
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3720 / unidade
Ver ficha técnica →10AS066H2F34E1SG
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10AS066H1F34E2SG
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10AS066H3F34E1HG
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10AS066H2F34E1HG Classificações máximas e características elétricas
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| User I/O Count | 492 |
| Encapsulamento | 1152-FBGA, FC (35x35 mm) |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | Up to 17.4 Gbps |
| Memory Interfaces | DDR3, DDR4, LPDDR2 (hard controllers) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial) |
| Nível MSL | 4 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Development Tool | Intel Quartus Prime |
Guia de Configuração de Pinos do 10AS066H2F34E1HG 1152-fbga, fc (35x35 mm)
Configuração de pinos para 10AS066H2F34E1HG (pacote 1152-fbga, fc (35x35 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS066H2F34E1HG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS066H2F34E1HG é adequado para 6 aplicaçãos: 4K/8K Video Broadcast Processing, Wireless Baseband and Backhaul, Radar and Electronic Warfare DSP, Industrial Machine Vision, Medical Imaging Accelerators, Protocol Bridging and Aggregation.
4K/8K Video Broadcast Processing
The 10AS066H2F34E1HG fits 4K/8K broadcast pipelines because its 660K logic elements can host multi-channel video processing accelerators (scaling, deinterlacing, HDR tone mapping) while the 1.5 GHz dual Cortex-A9 HPS runs a real-time Linux stack for control plane and codec orchestration. The 17.4 Gbps transceivers natively carry SDI, DisplayPort, or 12G-SDI signals without external bridge chips, and 492 user I/O provide ample parallel RGB/YCbCr pixel buses plus timing reference GPIOs. Compared with a discrete CPU+FPGA design, the on-chip HPS-to-Fabric AXI bus cuts latency below 200 ns per frame for closed-loop color grading pipelines.
Recomendado
Wireless Baseband and Backhaul
The 10AS066H2F34E1HG suits wireless baseband and backhaul equipment where the dual 1.5 GHz Cortex-A9 HPS runs the PHY control stack and MAC scheduler, while the 660K FPGA fabric implements turbo/LDPC decoders, FFT/iFFT engines, and digital predistortion (DPD) look-up tables. The 17.4 Gbps transceivers handle CPRI or eCPRI links to remote radio heads at 9.8 Gbps line rates with margin. Hard DDR4 controllers feed multi-gigasample processing buffers, and 492 user I/O carry front-panel data, JTAG, and sync signals. Compared with pure DSP-based solutions, the SoC FPGA architecture reduces BOM by eliminating a separate network processor.
Recomendado
Radar and Electronic Warfare DSP
The 10AS066H2F34E1HG is well matched to radar and electronic-warfare digital signal processing because its 660K logic elements host hundreds of hardened-floating-point DSP blocks for pulse compression, MTI filtering, and beamforming. The 1.5 GHz Cortex-A9 HPS executes classification, tracking, and threat-priority logic under a hard-real-time Linux/RTOS scheduler. Transceivers at 17.4 Gbps carry digitized antenna streams directly into the FPGA, eliminating external deserializer ASICs. With 492 user I/O plus DDR4 hard controllers, the SoC FPGA can sustain sustained multi-GSPS processing for phased-array radar front-ends while keeping the bill of materials low.
Recomendado
Industrial Machine Vision
The 10AS066H2F34E1HG supports high-frame-rate machine vision systems because its 660K logic elements can implement parallel image pre-processing pipelines (debayer, gamma, defect detection) while the dual 1.5 GHz Cortex-A9 HPS runs inference and TCP/IP or EtherCAT communication. The 17.4 Gbps transceivers ingest CoaXPress, Camera Link, or 10GigE Vision streams with low protocol overhead. With 492 user I/O plus MIPI and LVDS hard IP, designers can attach multiple 4K sensors concurrently. The 0C-to-+100C E1 industrial temperature range suits factory-floor deployments.
Recomendado
Medical Imaging Accelerators
The 10AS066H2F34E1HG accelerates CT, MRI, and ultrasound image reconstruction by parallelizing back-projection and beamforming in 660K logic elements while the 1.5 GHz Cortex-A9 HPS manages DICOM transfer, patient metadata, and the GUI. Hard DDR4 controllers sustain multi-GB image buffers at line rate, and 492 user I/O provide connectivity to front-end ADCs and high-speed serial links to image acquisition boards. The integrated SoC FPGA architecture reduces patient-scanner bill-of-materials by combining CPU, FPGA, and memory controller on one die, with FDA-relevant traceability provided per medical device quality systems.
Recomendado
Protocol Bridging and Aggregation
The 10AS066H2F34E1HG acts as a flexible protocol bridge, mapping PCIe Gen3, 10GbE, SATA, and legacy industrial buses through the FPGA fabric while the 1.5 GHz Cortex-A9 HPS runs a Linux-based protocol stack for upper-layer services. The 17.4 Gbps transceivers handle multiple 10G links concurrently, and 492 user I/O accommodate parallel GPIO, I2C, SPI, and UART sidebands. Compared with ASIC bridges, the SoC FPGA approach lets designers re-target the bridge via firmware updates as protocols evolve, future-proofing industrial gateways and telecom edge nodes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS066H2F34E1HG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AS066H1F34E1HG | 10AS066H1F34I1HG | 10AS066H2F34E1SG | 10AS066H3F34E1HG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H2 | H1 (lower Fmax) | H1 (lower Fmax) | H2 (same) | H3 (highest Fmax) |
| Temperature Grade | E1 (0C to +100C) | E1 (0C to +100C) | I1 (-40C to +100C) | S-grade screening | E1 (0C to +100C) |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| HPS Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Process | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Principais diferenciais
- Mid-tier speed grade with optimal balance of Fmax and power (vs 10AS066H1F34E1HG)
- Fastest speed grade option for tight timing margins (vs 10AS066H3F34E1HG)
- Industrial E1 vs I1 temperature coverage (vs 10AS066H1F34I1HG)
Notas de projeto
The 1152-FCBGA at 35x35 mm requires an HDI PCB stack-up with laser-drilled microvias. Estimated: for a 1.0 mm BGA pitch, plan at least a 1+N+1 or 2+N+2 stack-up with 0.4 mm via pitch and 4-6 mil traces. Escape the inner-row balls through microvia-in-pad to keep breakout under 12 mm. Reference the Altera/Intel Arria 10 SX pin connection guidelines for recommended layer counts, decoupling, and via-in-pad plating. Do not attempt to route this package on a 4-layer standard FR-4 stack - signal integrity on 17.4 Gbps transceivers will fail.
Decouple every HPS, transceiver, fabric, and PLL rail with the capacitor mix specified in the Arria 10 pin connection guidelines. Estimated: expect peak currents above 30 A on the 0.9 V core rail at full utilization, so use a 12-layer PCB with multiple inner-plane power pours and stitching vias near BGA balls. Sequence the rails through the Intel power management IC (such as the EN63A0QI or compatible Intel/Altera sequencer) per the recommended ramp order: 1.0 V transceiver -> 0.9 V core -> 1.8 V I/O -> 3.3 V HPS. Failure to observe sequencing can cause latch-up.
At full fabric utilization with 17.4 Gbps transceivers active, the 10AS066H2F34E1HG can dissipate 15-20 W. Estimated: with the 1152-FCBGA package's typical theta_JA around 10 C/W on a JEDEC 4-layer test board (no heatsink), the junction temperature can approach +150 C at +100 C ambient. Attach a heat-spreader or low-profile heatsink with thermal interface material rated for at least 5 W/mK. Use the Arria 10 FPGA's on-die temperature diode with the Intel Ethernet temperature sensor for closed-loop thermal management in the Linux HPS.
Informações de conformidade
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is a logic device, not an automotive-grade IC. Conflict-minerals compliance per Intel corporate policy.
