10AS066H2F34E1HG - Arria 10 SX 660K SoC FPGA | Intel | 1152-FBGA
MPN: 10AS066H2F34E1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3582.34 | $3,582.34 |
| 10 | $3450 | $34,500.00 |
| 100 | $3295 | $329,500.00 |
| 500 | $3120 | $1,560,000.00 |
| 1,000 | $2980 | $2,980,000.00 |
Drop-in alternatives for 10AS066H2F34E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS066H1F34E1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3900 / Unit
View Datasheet →10AS066H1F34I1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3720 / Unit
View Datasheet →10AS066H2F34E1SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS066H1F34E2SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS066H3F34E1HG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS066H2F34E1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| User I/O Count | 492 |
| Package | 1152-FBGA, FC (35x35 mm) |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | Up to 17.4 Gbps |
| Memory Interfaces | DDR3, DDR4, LPDDR2 (hard controllers) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| MSL Level | 4 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Development Tool | Intel Quartus Prime |
10AS066H2F34E1HG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS066H2F34E1HG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H2F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H2F34E1HG is suitable for 6 applications: 4K/8K Video Broadcast Processing, Wireless Baseband and Backhaul, Radar and Electronic Warfare DSP, Industrial Machine Vision, Medical Imaging Accelerators, Protocol Bridging and Aggregation.
4K/8K Video Broadcast Processing
The 10AS066H2F34E1HG fits 4K/8K broadcast pipelines because its 660K logic elements can host multi-channel video processing accelerators (scaling, deinterlacing, HDR tone mapping) while the 1.5 GHz dual Cortex-A9 HPS runs a real-time Linux stack for control plane and codec orchestration. The 17.4 Gbps transceivers natively carry SDI, DisplayPort, or 12G-SDI signals without external bridge chips, and 492 user I/O provide ample parallel RGB/YCbCr pixel buses plus timing reference GPIOs. Compared with a discrete CPU+FPGA design, the on-chip HPS-to-Fabric AXI bus cuts latency below 200 ns per frame for closed-loop color grading pipelines.
Recommended
Wireless Baseband and Backhaul
The 10AS066H2F34E1HG suits wireless baseband and backhaul equipment where the dual 1.5 GHz Cortex-A9 HPS runs the PHY control stack and MAC scheduler, while the 660K FPGA fabric implements turbo/LDPC decoders, FFT/iFFT engines, and digital predistortion (DPD) look-up tables. The 17.4 Gbps transceivers handle CPRI or eCPRI links to remote radio heads at 9.8 Gbps line rates with margin. Hard DDR4 controllers feed multi-gigasample processing buffers, and 492 user I/O carry front-panel data, JTAG, and sync signals. Compared with pure DSP-based solutions, the SoC FPGA architecture reduces BOM by eliminating a separate network processor.
Recommended
Radar and Electronic Warfare DSP
The 10AS066H2F34E1HG is well matched to radar and electronic-warfare digital signal processing because its 660K logic elements host hundreds of hardened-floating-point DSP blocks for pulse compression, MTI filtering, and beamforming. The 1.5 GHz Cortex-A9 HPS executes classification, tracking, and threat-priority logic under a hard-real-time Linux/RTOS scheduler. Transceivers at 17.4 Gbps carry digitized antenna streams directly into the FPGA, eliminating external deserializer ASICs. With 492 user I/O plus DDR4 hard controllers, the SoC FPGA can sustain sustained multi-GSPS processing for phased-array radar front-ends while keeping the bill of materials low.
Recommended
Industrial Machine Vision
The 10AS066H2F34E1HG supports high-frame-rate machine vision systems because its 660K logic elements can implement parallel image pre-processing pipelines (debayer, gamma, defect detection) while the dual 1.5 GHz Cortex-A9 HPS runs inference and TCP/IP or EtherCAT communication. The 17.4 Gbps transceivers ingest CoaXPress, Camera Link, or 10GigE Vision streams with low protocol overhead. With 492 user I/O plus MIPI and LVDS hard IP, designers can attach multiple 4K sensors concurrently. The 0C-to-+100C E1 industrial temperature range suits factory-floor deployments.
Recommended
Medical Imaging Accelerators
The 10AS066H2F34E1HG accelerates CT, MRI, and ultrasound image reconstruction by parallelizing back-projection and beamforming in 660K logic elements while the 1.5 GHz Cortex-A9 HPS manages DICOM transfer, patient metadata, and the GUI. Hard DDR4 controllers sustain multi-GB image buffers at line rate, and 492 user I/O provide connectivity to front-end ADCs and high-speed serial links to image acquisition boards. The integrated SoC FPGA architecture reduces patient-scanner bill-of-materials by combining CPU, FPGA, and memory controller on one die, with FDA-relevant traceability provided per medical device quality systems.
Recommended
Protocol Bridging and Aggregation
The 10AS066H2F34E1HG acts as a flexible protocol bridge, mapping PCIe Gen3, 10GbE, SATA, and legacy industrial buses through the FPGA fabric while the 1.5 GHz Cortex-A9 HPS runs a Linux-based protocol stack for upper-layer services. The 17.4 Gbps transceivers handle multiple 10G links concurrently, and 492 user I/O accommodate parallel GPIO, I2C, SPI, and UART sidebands. Compared with ASIC bridges, the SoC FPGA approach lets designers re-target the bridge via firmware updates as protocols evolve, future-proofing industrial gateways and telecom edge nodes.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H2F34E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H1F34E1HG | 10AS066H1F34I1HG | 10AS066H2F34E1SG | 10AS066H3F34E1HG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | H2 | H1 (lower Fmax) | H1 (lower Fmax) | H2 (same) | H3 (highest Fmax) |
| Temperature Grade | E1 (0C to +100C) | E1 (0C to +100C) | I1 (-40C to +100C) | S-grade screening | E1 (0C to +100C) |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| HPS Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Process | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Mid-tier speed grade with optimal balance of Fmax and power (vs 10AS066H1F34E1HG)
- Fastest speed grade option for tight timing margins (vs 10AS066H3F34E1HG)
- Industrial E1 vs I1 temperature coverage (vs 10AS066H1F34I1HG)
Design Notes
The 1152-FCBGA at 35x35 mm requires an HDI PCB stack-up with laser-drilled microvias. Estimated: for a 1.0 mm BGA pitch, plan at least a 1+N+1 or 2+N+2 stack-up with 0.4 mm via pitch and 4-6 mil traces. Escape the inner-row balls through microvia-in-pad to keep breakout under 12 mm. Reference the Altera/Intel Arria 10 SX pin connection guidelines for recommended layer counts, decoupling, and via-in-pad plating. Do not attempt to route this package on a 4-layer standard FR-4 stack - signal integrity on 17.4 Gbps transceivers will fail.
Decouple every HPS, transceiver, fabric, and PLL rail with the capacitor mix specified in the Arria 10 pin connection guidelines. Estimated: expect peak currents above 30 A on the 0.9 V core rail at full utilization, so use a 12-layer PCB with multiple inner-plane power pours and stitching vias near BGA balls. Sequence the rails through the Intel power management IC (such as the EN63A0QI or compatible Intel/Altera sequencer) per the recommended ramp order: 1.0 V transceiver -> 0.9 V core -> 1.8 V I/O -> 3.3 V HPS. Failure to observe sequencing can cause latch-up.
At full fabric utilization with 17.4 Gbps transceivers active, the 10AS066H2F34E1HG can dissipate 15-20 W. Estimated: with the 1152-FCBGA package's typical theta_JA around 10 C/W on a JEDEC 4-layer test board (no heatsink), the junction temperature can approach +150 C at +100 C ambient. Attach a heat-spreader or low-profile heatsink with thermal interface material rated for at least 5 W/mK. Use the Arria 10 FPGA's on-die temperature diode with the Intel Ethernet temperature sensor for closed-loop thermal management in the Linux HPS.
Compliance Information
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - this is a logic device, not an automotive-grade IC. Conflict-minerals compliance per Intel corporate policy.
