10CX150YF672E5G - Cyclone 10 GX FPGA, 150K LE, 672-FCBGA | Intel
N.º da peça: 10CX150YF672E5G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $397.5 | $3.975,00 |
| 100 | $355 | $35.500,00 |
| 500 | $322.5 | $161.250,00 |
| 1.000 | $295 | $295.000,00 |
10CX150YF672E5G Visão geral
A field-programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware IP such as DSP slices, block RAM (BRAM), and high-speed serial transceivers. Unlike an application-specific integrated circuit (ASIC), an FPGA's function is defined after manufacture by loading a hardware description language (HDL) bitstream into on-chip SRAM configuration memory. The Cyclone 10 GX family sits within Intel's broader programmable logic hierarchy (FPGA -> programmable logic device -> programmable logic IC -> semiconductor), targeting applications that need higher transceiver bandwidth than Cyclone 10 LP but lower static power and cost than Arria 10 or Stratix 10.
Key features of the 10CX150YF672E5G include 150,000 logic elements (LEs), 156 hardware 18x19 multipliers, 490 variable-precision DSP blocks with hardened single-precision floating-point support, 8.5 Mbits of M20K block RAM plus 9.6 Mbits of MLAB memory, six 6.144 Gbps PLLs with fractional-N synthesis, 3.3 V-tolerant LVCMOS/LVDS/LVPECL general-purpose I/O, and a hard PCIe Gen2 x4 controller for embedded compute and storage interfacing.
Architecturally the device combines a fine-grained LE fabric with column-based DSP and M20K memory columns, a periphery of high-speed transceivers, and a hardening of common protocol IPs (PCIe, EMIF, JTAG). The 20 nm process enables a die small enough to fit into a 672-ball FCBGA while keeping static power below 1.5 W typical, suiting fanless or limited-cooling enclosures.
Typical applications include industrial machine vision and video bridging, factory automation HMI, low-density wireless backhaul modems, broadcast video processing, and PCIe-based accelerator cards. The combination of transceivers, on-chip memory, and DSP makes the part well suited to designs that previously required a discrete ASSP plus an external bridge.
When designing in the 10CX150YF672E5G, allocate at least 4 PCB layers for transceiver signal integrity, follow Intel's pin connection guidelines for unused pins and JTAG pull-ups, and use the Quartus Prime Lite/Pro design suite (Cyclone 10 GX device support) for synthesis, place-and-route, and timing closure.
Alternativas drop-in para 10CX150YF672E5G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CX150YF672E5G (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, Logic Elements, Embedded Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CX105YF672E5G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$310 / unidade
Ver ficha técnica →10CX085YF672E5G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$289 / unidade
Ver ficha técnica →10CX150YF672E6G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$124.9 / unidade
Ver ficha técnica →10CX150YF672I5G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$278.4 / unidade
Ver ficha técnica →10CX150YF672I6G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$215 / unidade
Ver ficha técnica →10CX150YF672E5G Classificações máximas e características elétricas
| Series | Cyclone 10 GX |
| Family | Intel Cyclone 10 GX (10CX150) |
| Logic Elements (LE) | 150,000 |
| Embedded Memory | 10,907,648 bits (10.9 Mbits) |
| Number of I/O | 236 |
| Supply Voltage - Core | 0.95 V (typical, internal) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (per bank) |
| Process Technology | 20 nm |
| Transceiver Data Rate | Up to 6.144 Gbps |
| DSP Blocks | 490 variable-precision DSP blocks |
| 18x19 Multipliers | 156 |
| M20K Block RAM | 8.5 Mbits |
| MLAB Memory | 9.6 Mbits |
| PLLs | 6 (fractional-N) |
| PCIe Hard IP | PCIe Gen2 x4 |
| Encapsulamento | 672-ball FCBGA (F672, 27x27 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | -40C to +100C (E5G = commercial) |
| Speed Grade | 5 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10CX150YF672E5G 672-ball fcbga (f672, 27x27 mm)
Configuração de pinos para 10CX150YF672E5G (pacote 672-ball fcbga (f672, 27x27 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10CX150YF672E5G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10CX150YF672E5G é adequado para 6 aplicaçãos: Industrial Machine Vision Systems, PCIe-Based Hardware Accelerator Cards, Video Broadcast and Format Conversion, Wireless Backhaul Modem Baseband, Factory Automation and Industrial IoT Gateways, Test and Measurement Instrumentation.
Industrial Machine Vision Systems
The 10CX150YF672E5G fits industrial machine vision because its 490 variable-precision DSP blocks (each implementing a 27x27 multiplier with accumulator) and 8.5 Mbits of M20K block RAM deliver 1-2 Mpixels/line of image processing bandwidth per pipeline stage. The hardware single-precision floating-point DSP engine accelerates Bayer demosaicing, gamma correction, and convolution kernels without consuming LE fabric. With 6 transceiver channels at up to 6.144 Gbps, the FPGA aggregates 4-6 MIPI CSI-2 or GigE Vision sensors into a single PCIe Gen2 x4 uplink to a host controller. The 0C to +100C commercial junction range supports most factory enclosures when paired with a 4-layer thermal PCB stack-up.
Recomendado
PCIe-Based Hardware Accelerator Cards
The 10CX150YF672E5G suits half-height PCIe accelerator cards thanks to its hardened PCIe Gen2 x4 endpoint controller, which saves 10-15K LEs versus a soft PCIe core and guarantees PCI-SIG-compliant link training. The 150K LE budget accommodates 1-2 custom compute kernels (FFT, encryption, AI inference), while the 9.6 Mbits of MLAB enables wide-register data paths without external SRAM. The 672-FCBGA's 1.0 mm ball pitch keeps the card short enough for half-height bracket designs, and the 6.144 Gbps transceivers provide a secondary high-speed port for inter-card or backplane links.
Recomendado
Video Broadcast and Format Conversion
Broadcast video processing leverages the 10CX150YF672E5G's 490 variable-precision DSP blocks to implement real-time SD/HD/3G-SDI scaling, deinterlacing, and color-space conversion at frame rates up to 60 Hz. The M20K block RAM holds 4-8 horizontal line buffers at 1920-pixel widths, eliminating the need for external SDRAM for typical scaler data paths. Six transceivers route in/out 3G-SDI streams, and the PCIe Gen2 endpoint links to a host SoC for content control. The 150K LE capacity fits mid-density multi-stream designs, with the FCBGA 672 ball-grid allowing 1.0 mm-pitch escape routing on standard low-cost PCBs.
Recomendado
Wireless Backhaul Modem Baseband
The 10CX150YF672E5G targets low-density wireless backhaul and small-cell baseband modems because its six transceivers support up to 6.144 Gbps CPRI or OBSAI links to a remote radio head while the DSP fabric implements channel coding (LTE turbo, 5G LDPC), FFT/iFFT, and crest-factor reduction in real time. The hard PCIe Gen2 x4 connects to a baseband SoC for L2/L3 offload, and 236 user I/O accommodate Ethernet MAC interfaces plus GPS and synchronization pins. Commercial 0C to +100C operation is adequate for indoor microcells; for outdoor radios, the industrial I-grade variant is recommended.
Recomendado
Factory Automation and Industrial IoT Gateways
The 10CX150YF672E5G is well matched to industrial IoT gateways because its 150K LE budget supports multiple real-time industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) on the same die via the Triple-Speed Ethernet IP cores. The 236 user I/O accommodate 4-8 isolated PHY interfaces plus GPIO and serial fieldbus lines, and the M20K block RAM buffers deterministic cycle data at microsecond rates. PCIe Gen2 x4 connects to an application processor, while the transceivers drive optional SFP fiber uplinks for factory backbone traffic. The commercial 0-100C temperature envelope suits most control cabinet environments.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments leverage the 10CX150YF672E5G's combination of transceivers up to 6.144 Gbps, 490 DSP blocks, and 8.5 Mbits of M20K block RAM to implement multi-channel arbitrary waveform generators, protocol analyzers, and high-speed digitizers. The hard PCIe Gen2 x4 streams captured data to a host at sustained 1.6 GB/s, while the LE fabric accommodates custom triggering, sequencing, and on-the-fly signal processing (FIR/IIR filtering, decimation). The 672-FCBGA footprint allows multi-board instruments with shared clock and trigger buses, and the commercial temperature range suits laboratory and ATE environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CX150YF672E5G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CX105YF672E5G | 10CX085YF672E5G | 10CX150YF672E6G | 10CX150YF672I5G | 10CX150YF672I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FCBGA (F672) | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same |
| Logic Elements | 150,000 | 105,000 (-30%) | 85,000 (-43%) | 150,000 (same) | 150,000 (same) | 150,000 (same) |
| Embedded Memory (bits) | 10,907,648 | 7,024,640 (approx -36%) | 5,810,048 (approx -47%) | 10,907,648 (same) | 10,907,648 (same) | 10,907,648 (same) |
| DSP Blocks | 490 | 320 (approx -35%) | 266 (approx -46%) | 490 (same) | 490 (same) | 490 (same) |
| Speed Grade | 5 | 5 (same) | 5 (same) | 6 (faster) | 5 (same) | 6 (faster) |
| Operating Temperature | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceiver Data Rate | Up to 6.144 Gbps | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) |
| User I/O | 236 | 236 (same) | 236 (same) | 236 (same) | 236 (same) | 236 (same) |
Principais diferenciais
- Highest-density Cyclone 10 GX in the F672 package (vs 10CX105YF672E5G)
- Higher DSP density than smaller Cyclone 10 GX siblings (vs 10CX085YF672E5G)
- Balanced performance and operating temperature envelope (vs 10CX150YF672E6G)
Notas de projeto
The 672-ball FCBGA with 1.0 mm ball pitch requires a high-density PCB stack-up; use microvia (laser-drilled) vias for inner-to-outer breakout and at least a 6-layer board to fan out the transceiver signals. Follow Intel's Cyclone 10 GX pin connection guidelines for unused pin tie-offs (GND on most unused balls, with explicit NC exceptions documented in the pin-out file). Estimate: a 6-layer 1-oz copper stack-up with 4 mil dielectrics keeps transceiver loss under 1 dB/inch at 6 Gbps.
Estimated: at typical 1.0 W static plus 0.5 W dynamic dissipation for a 50%-utilization Cyclone 10 GX design, total junction heating is around 1.5 W. With a 4-layer JEDEC EIA/JESD51 test board theta_JA of approximately 12 C/W for the F672 FCBGA, junction temperature rise is ~18 C above ambient - comfortable for the commercial 0C to +100C window. For industrial or sealed-enclosure designs, derate ambient by 10-15 C or add a small heatsink; refer to Intel's 'AN 740: Thermal Management' for the official theta_JA values.
Do not mix Cyclone 10 GX bitstreams with Cyclone IV or Cyclone V devices - configuration file formats and JTAG IDs differ. When migrating from Cyclone 10 LP to Cyclone 10 GX, the F672 package is not pin-compatible with the U484 or F484 footprints used on 10 LP devices; the PCB must be re-laid-out. Always run Quartus Prime I/O Assignment Analysis before tape-out to catch unassigned pin, voltage-standard, and current-strength conflicts that can damage the device.
Informações de conformidade
RoHS and REACH compliance per Intel's Cyclone 10 GX product page; lead-free FCBGA with Pb-free SAC solder balls; no AEC-Q100 qualification for this OPN (industrial I-grade variant available for extended temperature).
