10CX150YF672I6G - Cyclone 10 GX FPGA, 150K LE, 672-BGA | Intel
MPN: 10CX150YF672I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $248 | $24,800.00 |
| 500 | $232 | $116,000.00 |
| 1,000 | $215 | $215,000.00 |
Drop-in alternatives for 10CX150YF672I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CX150YF672I5G
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View Datasheet →10CX105YF672I6G
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View Datasheet →10CX150YF672I6G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 |
| Adaptive Logic Modules (ALM) | 54,770 |
| Embedded Memory (bits) | 10,907,648 (6.6 Mb M20K + 4.6 Mb MLAB) |
| User I/O Pins | 236 |
| DSP Blocks | Variable-precision, 18x18 and 27x27 multipliers |
| Package | 672-FCBGA (27x27 mm, 1.0 mm pitch) |
| Operating Temperature | -40C to +100C (Industrial, 'I' suffix) |
| Speed Grade | 6 (fastest industrial) |
| Transceivers | Up to 6.144 Gbps multi-gigabit transceivers |
| Hard Memory Controllers | DDR3 with ECC, up to DDR3-1866 |
| Hard PCIe | PCIe Gen2 x4 |
| Process Node | 20 nm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10CX150YF672I6G 672-fcbga (27x27 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10CX150YF672I6G (672-fcbga (27x27 mm, 1.0 mm pitch) package) with 236 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YF672I6G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 236 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX150YF672I6G is suitable for 6 applications: Industrial Machine Vision Cameras, Video Broadcast and ProAV Processing, Low-Cost PCIe Add-In Cards, Factory Automation and Motor Control, 4K/8K Video Wall Controllers, IoT Gateways with Deterministic Networking.
Industrial Machine Vision Cameras
The 10CX150YF672I6G fits industrial machine vision applications because its hard PCIe Gen2 x4 block and 6.144 Gbps transceivers handle GigE Vision, CoaXPress, and 10 GigE Vision over SFP+ without burning logic fabric. The 10,907,648 bits of embedded memory (6.6 Mb M20K plus 4.6 Mb MLAB) absorb full-line buffers for 4K sensors at 60 fps. The 150K LEs and variable-precision DSP blocks execute Bayer demosaic, gamma correction, and defect detection in a single device. Industrial temperature grade -40C to +100C ensures stable operation near CNC machines and outdoor inspection cells.
Recommended
Video Broadcast and ProAV Processing
The 10CX150YF672I6G suits ProAV and broadcast routers because its 6.144 Gbps transceivers carry 3G-SDI/HD-SDI signals directly, while the 54,770 ALMs implement audio embedding/de-embedding and multiviewer layout engines. Hard DDR3-1866 controllers with ECC support large frame buffers for 4K/UHD switching and color-space conversion. The 672-ball FCBGA with 1.0 mm pitch provides ample power and ground pins for the simultaneous switching of multiple SDI streams. Industrial temperature grade supports both rack-mounted broadcast and portable live-event rigs.
Recommended
Low-Cost PCIe Add-In Cards
The 10CX150YF672I6G's hard PCIe Gen2 x4 block integrates PCIe as a turnkey endpoint, reducing soft-logic consumption and simplifying compliance. With 150K LEs available, designers can add protocol acceleration (NVMe, custom DMA), data encryption, or interface bridging to USB 3.0, SATA, or 10 Gigabit Ethernet. The 6.144 Gbps transceivers handle SFP+ or QSFP+ connectivity for off-board networking. Industrial temperature grade makes the same card deployable in industrial PCs and edge servers without separate SKU management.
Recommended
Factory Automation and Motor Control
The 10CX150YF672I6G serves high-axis-count motion controllers because its 150K LEs implement multiple instances of field-oriented control, PID loops, and EtherCAT/EtherNetIP slave stacks in one device. Hard DDR3 controllers hold real-time motion profiles, while the FPGA fabric executes encoder feedback at high update rates with sub-microsecond jitter. Industrial temperature grade (-40C to +100C) suits the cabinet environment inside CNC machines, robotic cells, and conveyor systems. The 672-ball package provides robust power integrity for switching IGBT gate drive signals.
Recommended
4K/8K Video Wall Controllers
The 10CX150YF672I6G's 10,907,648 bits of embedded memory plus hard DDR3-1866 controllers provide the bandwidth needed to stitch multiple 4K streams into a single tiled display, while 54,770 ALMs handle chroma blending, edge feathering, and bezel compensation in real time. The 6.144 Gbps transceivers receive uncompressed video over HDMI 2.0-to-FPGA bridge chips or 12G-SDI for broadcast-grade walls. The 672-ball FCBGA delivers stable power to the DSP and memory fabric during full-screen 4K60 video refresh.
Recommended
IoT Gateways with Deterministic Networking
The 10CX150YF672I6G consolidates multiple deterministic Ethernet protocols (TSN, EtherCAT, PROFINET) alongside Linux-class soft processor cores in a single FPGA, making it ideal for industrial IoT gateways. The 6.144 Gbps transceivers support fiber or copper backhaul, and the hard PCIe Gen2 x4 block connects to an SoC host for higher-layer protocol termination. Industrial temperature grade enables deployment in outdoor enclosures, factory floors, and energy substations. The Cyclone 10 GX's low static and dynamic power profile keeps gateway thermal envelopes small.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YF672I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX150YF672I5G | 10CX105YF672I6G | 10CX085YF672I6G | 10CX150YF672E6G | 10CX150YF672E5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FCBGA (F672, 27x27 mm, 1.0 mm pitch) | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same |
| Logic Elements (LE) | 150,000 | 150,000 | 105,000 | 85,000 | 150,000 | 150,000 |
| Adaptive Logic Modules (ALM) | 54,770 | 54,770 | 38,310 | 31,000 | 54,770 | 54,770 |
| Embedded Memory (bits) | 10,907,648 | 10,907,648 | 7,135,744 | 5,662,720 | 10,907,648 | 10,907,648 |
| User I/O Pins | 236 | 236 | 236 | 236 | 236 | 236 |
| Transceiver Data Rate (max) | 6.144 Gbps | 6.144 Gbps | 6.144 Gbps | 6.144 Gbps | 6.144 Gbps | 6.144 Gbps |
| Hard PCIe | Gen2 x4 | Gen2 x4 | Gen2 x4 | Gen2 x4 | Gen2 x4 | Gen2 x4 |
| Hard Memory Controller | DDR3 up to 1866 with ECC | DDR3 up to 1866 with ECC | DDR3 up to 1866 with ECC | DDR3 up to 1866 with ECC | DDR3 up to 1866 with ECC | DDR3 up to 1866 with ECC |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +100C | Commercial 0C to +100C |
| Speed Grade | 6 (fastest industrial) | 5 | 6 | 6 | 6 | 5 |
Key Differentiators
- Highest-density Cyclone 10 GX in the F672 FCBGA footprint (vs 10CX105YF672I6G)
- Industrial temperature grade (-40C to +100C) with speed grade 6 (fastest) (vs 10CX150YF672E6G)
- Hard PCIe Gen2 x4 and DDR3-1866 hard memory controllers free logic for application code (vs Cyclone V E FPGA (no hard PCIe, no hard DDR3))
- 6.144 Gbps transceivers enable 3G-SDI, GigE Vision, and CPRI in a low-cost part (vs Cyclone 10 LP (no transceivers))
Design Notes
The 672-ball FCBGA at 1.0 mm pitch requires an 8-layer minimum stack-up with continuous GND planes adjacent to all high-speed signal layers. Use 0.5 oz outer copper with 1.0 oz inner power planes to control impedance on 6 Gbps transceiver channels. Recommended via-in-pad with filled-and-capped microvias for the BGA escape pattern. Differential pairs should be length-matched within 5 mils for PCIe Gen2 compliance.
Power-on sequencing for the Cyclone 10 GX requires VCC_CORE to ramp before VCCA_PLL to avoid latch-up. Intel's reference design uses a 4-msec POR delay. Decoupling: place 100 nF X7R capacitors within 2 mm of every VCC pin, with bulk 47 uF polymer tantalum capacitors on each voltage rail. The transceiver rails (VCCR, VCCT) require ferrite-bead isolation from the core rail to meet the 6 Gbps jitter mask.
Do not reuse Cyclone V Quartus projects directly. The 20 nm process node in Cyclone 10 GX requires Quartus Prime 17.1 or later. Pin assignments for the F672 FCBGA differ from the F780 or F484 packages even though part numbers share the F672 designator - always export pin assignments from the new project's Pin Planner. Also note that 'I6G' speed-grade 6 means fastest industrial; do not substitute into a design that specified speed-grade 8 without rerunning timing analysis.
For 6.144 Gbps transceiver operation, reference clock jitter must remain below 100 fs RMS (12 kHz to 20 MHz integration band) to meet PCIe Gen2 jitter specifications. Use a dedicated low-jitter clock generator such as the Si5332 or equivalent, isolated from switching power supplies by a guard ring and a separate ground pour. Maintain 100-ohm differential impedance on transceiver pairs with a maximum intra-pair skew of 2 mils.
Estimated: at 100% logic utilization with 6 Gbps transceivers active, the 10CX150YF672I6G draws approximately 6-8 W. Without a heatsink and with the standard 27x27 mm FCBGA footprint, theta_JA is approximately 15 C/W, resulting in a junction-to-ambient rise of 90-120 C above ambient. For industrial temperature compliance at +85C ambient, either reduce logic activity, lower transceiver count, or attach a small clip-on heatsink with thermal interface material.
Compliance Information
RoHS and REACH compliance per Intel Cyclone 10 GX product page. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade IC with that specific qualification. Lead-free (Pb-free) BGA balls per the F suffix designation. Halogen-free status not explicitly stated in the available data and is recorded as 'unknown'.
