10CX150YF672E6G - Cyclone 10 GX 150K LE FPGA, 672-FCBGA | Intel
MPN: 10CX150YF672E6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $176.35 | $176.35 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152.8 | $15,280.00 |
| 500 | $138.2 | $69,100.00 |
| 1,000 | $124.9 | $124,900.00 |
Drop-in alternatives for 10CX150YF672E6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10CX150YF672E6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 150,000 |
| Embedded Memory Bits | 10,907,648 (10.9 Mbit) |
| Embedded Multipliers (18x18) | 236 |
| Package | 672-ball FCBGA |
| Speed Grade | -6 (Enhanced) |
| Operating Temperature | Industrial: -40C to +100C |
| Process Node | 20 nm |
| Transceivers | Up to 12.5 Gbps multi-protocol |
| Hard PCIe Gen2 Controller | Yes |
| DSP Block Type | Variable-precision, 27-bit pre-adder |
| Memory Type | M20K block memory + LUTRAM |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes / Compliant |
| Tray Packaging | Yes (per Arrow listing) |
10CX150YF672E6G 672-ball fcbga Pin Configuration Guide
Complete pinout information for 10CX150YF672E6G (672-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YF672E6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX150YF672E6G is suitable for 7 applications: Industrial Machine Vision, Broadcast Video Processing, Low-Cost 10G Ethernet Aggregation, Motor Control and Digital Drive, PCI Express Endpoint Card, Radar and LiDAR Baseband Processing, Software-Defined Radio Baseband.
Industrial Machine Vision
The 10CX150YF672E6G's combination of 150K logic elements, 236 (18x18) multipliers, and up to 12.5 Gbps transceivers makes it ideal for industrial machine vision over CoaXPress, GigE Vision, or Camera Link HS interfaces. The hard PCIe Gen2 controller enables direct connection to a host PC without an external bridge chip. At 672-ball FCBGA the package supports multiple high-speed serial links plus parallel sensor LVDS lanes. Industrial temperature range (-40C to +100C) suits factory-floor enclosures. Compared to a software-driven GPU pipeline, this FPGA delivers deterministic latency and lower BOM cost for multi-camera aggregation.
Recommended
Broadcast Video Processing
For broadcast 12G-SDI, DisplayPort 1.2, and HDMI 2.0 bridging, the 10CX150YF672E6G provides enough logic to implement multi-channel video processing pipelines, color-space conversion, and frame-rate conversion in a single device. The variable-precision DSP blocks handle chroma resampling and scaling, while the M20K block memory (10.9 Mbit total) buffers active video frames. Transceivers support 12G-SDI at 11.88 Gbps directly. The industrial temperature grade suits studio and outside-broadcast equipment. Quartus Prime reference designs for video IP cores accelerate development.
Recommended
Low-Cost 10G Ethernet Aggregation
The 10CX150YF672E6G's 12.5 Gbps transceivers natively support 10GBASE-R and 1GBASE-R Ethernet without external PHY devices, making it a compact aggregator for industrial switches, network appliances, and 5G fronthaul equipment. The 150K LE budget supports L2/L3 forwarding, MAC learning, and basic traffic shaping. Hard PCIe Gen2 controllers enable line-rate connection to a CPU host. The 672-ball FCBGA package accommodates multiple SFP+ cages on the same PCB. Compared to an ASSP switch, this FPGA offers flexible port-count and protocol customization.
Recommended
Motor Control and Digital Drive
The 10CX150YF672E6G handles multi-axis field-oriented control (FOC) and direct torque control (DTC) for industrial servo drives, robotics, and CNC machines. The 236 (18x18) multipliers execute the Park/Clarke transforms and PI loops in hardware at sub-microsecond rates. Industrial temperature rating (-40C to +100C) suits motor enclosures and ambient-rich cabinets. The FPGA's parallel structure outperforms microcontrollers on multi-axis systems. Pairing with external ADCs and power modules creates a complete drive reference design available from Intel FPGA partner ecosystem.
Recommended
PCI Express Endpoint Card
With hard PCI Express Gen2 x4 controllers, the 10CX150YF672E6G drops directly into PCIe endpoint cards for data acquisition, software-defined radio, hardware acceleration, and protocol bridging. The Gen2 x4 lanes provide 16 Gbps of host bandwidth, while the 150K logic elements implement application-specific accelerators. The 672-ball FCBGA footprint fits standard PCIe form factors. Industrial temperature grading suits test-and-measurement cards deployed in laboratory and factory environments. Quartus Prime PCIe IP cores are pre-validated for common enumeration scenarios.
Recommended
Radar and LiDAR Baseband Processing
The 10CX150YF672E6G's combination of 12.5 Gbps transceivers and 236 (18x18) multipliers is well-suited to automotive and industrial radar preprocessing (FFT, CFAR detection) and LiDAR point-cloud aggregation. JESD204B and CPRI transceiver support interfaces directly to RF ADCs and DACs from major vendors. The industrial temperature grade and 20 nm low-power process suit embedded vehicle and outdoor installations. The 672-ball FCBGA package allows integration of multiple sensor interfaces on a single device. Reference designs from the Cyclone 10 GX partner ecosystem accelerate radar prototyping.
Recommended
Software-Defined Radio Baseband
The 10CX150YF672E6G's transceivers support CPRI, JESD204B, and 10G Ethernet to digital RF front-ends, while the 150K logic elements implement channelizers, modulators, and baseband signal processing pipelines. The 10.9 Mbit embedded memory buffers complex I/Q samples between DSP stages. Industrial temperature rating supports outdoor base-station and tactical-radio deployment. Compared to DSP processors, the FPGA's deterministic latency and parallel architecture enable multi-channel operation per watt. Reference designs from Altera/Intel IP partners accelerate waveform bring-up.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YF672E6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX105YF672E6G | 10CX085YF672E6G | 10CX150YF672E5G | 10CX105YF672I6G | 10CX085YF672I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FCBGA | 672-ball FCBGA - same | 672-ball FCBGA - same | 672-ball FCBGA - same | 672-ball FCBGA - same | 672-ball FCBGA - same |
| Logic Elements | 150,000 | 105,000 (-30%) | 85,000 (-43%) | 150,000 (same) | 105,000 (-30%) | 85,000 (-43%) |
| Speed Grade | -6 (Enhanced) | -6 (Enhanced) - same | -6 (Enhanced) - same | -5 (slower) | -I6 (Industrial) | -I6 (Industrial) |
| Embedded Memory (Mbit) | 10.9 | [DATA_NEEDED] | [DATA_NEEDED] | 10.9 (same) | [DATA_NEEDED] | [DATA_NEEDED] |
| 18x18 Multipliers | 236 | [DATA_NEEDED] | [DATA_NEEDED] | 236 (same) | [DATA_NEEDED] | [DATA_NEEDED] |
| Transceiver Speed | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps | Up to 12.5 Gbps |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (qty 1, USD) | 176.35 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest density in the 672-ball FCBGA Cyclone 10 GX family (vs 10CX105YF672E6G)
- Enhanced speed grade -6 timing margin vs -I6 industrial (vs 10CX105YF672I6G)
- Hard PCIe Gen2 controllers reduce logic and routing complexity (vs 10CL120YF780I7G (Cyclone 10 LP))
Design Notes
The Cyclone 10 GX family uses multiple power rails: VCC (core), VCCPT (programmable power technology), VCCR_GXB and VCCT_GXB (transceiver receive and transmit), VCCIO (I/O banks), and VCCPD (I/O pre-drivers). Per Intel Cyclone 10 GX device datasheet, all rails must power up monotonically and sequence within the limits defined in the Power Management User Guide. Estimated: at 150K LE utilization with active transceivers at 10 Gbps, core current can exceed 2 A and total board power can reach 8-12 W, requiring a multi-phase buck regulator and at least 4-layer PCB with dedicated power planes.
The 672-ball FCBGA has a fine 1.0 mm ball pitch. PCB layout must follow the Cyclone 10 GX High Speed Board Design Guidelines for BGA escape routing - 0.4-0.5 mm trace width, 0.4-0.5 mm via pad, and microvia-in-pad is strongly recommended. Matched-length routing (within 150 mils) is required for transceiver differential pairs to maintain 12.5 Gbps signal integrity. AC coupling capacitors should be placed near the transmitter balls. Use the Quartus Prime pin planner to verify I/O assignment before layout finalization.
The 672-ball FCBGA exposes a thermal pad to the top of the package. For designs operating above ~6 W total power dissipation, attach a heat spreader with thermal interface material rated for industrial temperature. Estimated: at 8 W dissipation and typical theta_JA around 15 C/W for FCBGA with heat spreader, junction temperature rises 120C above ambient - acceptable in industrial environments but requires derating at high ambient. Use the Cyclone 10 GX PowerPlay Early Power Estimator to size thermal solutions before PCB layout.
Do not leave transceiver reference resistor pins floating - each GXB block requires a 1.5 kohm +/-1% external reference resistor connected to GND. Missing pull-ups on configuration pins (nCONFIG, nSTATUS, CONF_DONE) will prevent the device from entering user mode. Always generate the .sof/.pof using Quartus Prime version 18.1 or later for full Cyclone 10 GX support. Early versions of Quartus do not support the -6 speed grade timing models and will fail timing closure.
Compliance Information
RoHS compliance confirmed by distributor listings (DigiKey, Arrow). Industrial temperature rating per -E6G speed grade designation. AEC-Q100 qualification not applicable - this is a non-automotive FPGA; automotive-grade Cyclone 10 GX variants use different ordering codes.
