10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel
N.º da peça: 10M04SCE144A7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $17.5 | $17,50 |
| 10 | $15.4 | $154,00 |
| 100 | $13.2 | $1.320,00 |
| 500 | $11.5 | $5.750,00 |
| 1.000 | $10.1 | $10.100,00 |
10M04SCE144A7G Visão geral
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between discrete logic ICs and custom ASICs: faster to integrate than ASICs, more flexible than fixed-function ICs, and increasingly power-efficient for parallel workloads. The MAX 10 family further integrates analog-to-digital converters (ADCs), flash configuration, and on-chip voltage regulation into a single die, allowing single-chip system control with deterministic power-up behavior.
Key features of the 10M04SCE144A7G include 4,000 logic elements (LEs), 193,536 bits (Kb) of embedded user flash, single 3.0V/3.3V supply operation with on-chip voltage regulators, integrated ADC capability, automotive AEC-Q100 qualification, and an extended -40°C to +125°C industrial/automotive operating temperature range. The 144-EQFP exposed-pad footprint improves thermal dissipation while preserving the LQFP handling and reflow characteristics familiar to mid-volume SMT lines.
Architecturally, the device pairs a non-volatile configuration block with dual-configuration flash image support, optional real-time ISP via JTAG, and an analog front end supporting temperature-sensor and general-purpose ADC inputs. Designers gain instant-on determinism for motor control, sensor fusion, and human-machine interface (HMI) glue logic, while software-defined peripheral replacement remains possible without NRE charges.
Typical applications include industrial control boards, automotive body and chassis subsystems, low-cost video processing, I/O expansion and bridging in legacy MCUs, and portable medical instruments requiring instant-on logic. The AEC-Q100 automotive grade extends suitability to in-cabin HMI and body controllers.
When designing with the 10M04SCE144A7G, allocate the exposed pad (EP) to a continuous copper pour on top and inner PCB layers to keep the silicon junction within the AEC-Q100 thermal envelope. JTAG pinout should follow the Intel MAX 10 pin connection guidelines to retain dual-boot and remote upgrade paths.
This page synthesizes distributor pricing, automotive-grade qualification notes, drop-in MAX 10 family alternatives, and PCB layout guidance not collected in any single manufacturer datasheet, giving engineers a single decision-ready reference.
Alternativas drop-in para 10M04SCE144A7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M04SCE144A7G (mesmo formato e footprint) — diferindo em Package, Configuration Memory, Logic Elements (LE), Speed Grade, Core Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M04SCE144C8G
✅ Drop-In✓ Em estoque
$12.1 / unidade
Ver ficha técnica →10M04SCE144I7G
✅ Drop-In✓ Em estoque
$10.26 / unidade
Ver ficha técnica →10M08SCE144A7G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M02SCE144A7G
✅ Drop-In✓ Em estoque
$4.62 / unidade
Ver ficha técnica →10M04DCU324A7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.85 / unidade
Ver ficha técnica →10M04SCE144A7G Classificações máximas e características elétricas
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LEs) | 4,000 |
| Embedded Memory (RAM bits) | 193,536 |
| Number of Logic Cells | 4,000 |
| Number of User I/O Pins | 101 |
| Tensão de alimentação de operação | 3.0 V / 3.3 V (single supply) |
| Encapsulamento | 144-EQFP (LQFP with Exposed Pad), 20x20 mm |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40 °C to +125 °C (automotive/industrial) |
| Configuration Memory | On-chip flash, non-volatile |
| Automotive Qualification | AEC-Q100 |
| Status RoHS | Compliant |
| Nível MSL | 3 |
| Speed Grade | 7 (lower-power tier within MAX 10 family) |
Configuração de pinos do 10M04SCE144A7G
| Pino 1 | I/O — User I/O bank 1 |
| Pino 2 | I/O — User I/O bank 1 |
| Pino 3 | GND — Ground |
| Pino 4 | I/O — User I/O bank 1 |
| Pino 5 | I/O — User I/O bank 1 |
| Pino 6 | VCCIO1 — Bank 1 I/O supply |
| Pino 7 | I/O — User I/O bank 1 |
| Pino 8 | I/O — User I/O bank 1 |
| Pino 9 | I/O — User I/O bank 1 |
| Pino 10 | I/O — User I/O bank 1 |
| Pino 11 | I/O — User I/O bank 1 |
| Pino 12 | I/O — User I/O bank 1 |
| Pino 13 | GND — Ground |
| Pino 14 | I/O — User I/O bank 2 |
| Pino 15 | I/O — User I/O bank 2 |
| Pino 16 | VCCIO2 — Bank 2 I/O supply |
| Pino 17 | I/O — User I/O bank 2 |
| Pino 18 | I/O — User I/O bank 2 |
| Pino 19 | I/O — User I/O bank 2 |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O bank 2 |
| Pino 22 | I/O — User I/O bank 2 |
| Pino 23 | I/O — User I/O bank 2 |
| Pino 24 | I/O — User I/O bank 2 |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O bank 3 |
| Pino 27 | I/O — User I/O bank 3 |
| Pino 28 | VCCIO3 — Bank 3 I/O supply |
| Pino 29 | I/O — User I/O bank 3 |
| Pino 30 | I/O — User I/O bank 3 |
| Pino 31 | I/O — User I/O bank 3 |
| Pino 32 | I/O — User I/O bank 3 |
| Pino 33 | GND — Ground |
| Pino 34 | I/O — User I/O bank 4 |
| Pino 35 | I/O — User I/O bank 4 |
| Pino 36 | VCCIO4 — Bank 4 I/O supply |
| Pino 37 | I/O — User I/O bank 4 |
| Pino 38 | I/O — User I/O bank 4 |
| Pino 39 | I/O — User I/O bank 4 |
| Pino 40 | I/O — User I/O bank 4 |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O bank 5 |
| Pino 43 | I/O — User I/O bank 5 |
| Pino 44 | VCCIO5 — Bank 5 I/O supply |
| Pino 45 | I/O — User I/O bank 5 |
| Pino 46 | I/O — User I/O bank 5 |
| Pino 47 | I/O — User I/O bank 5 |
| Pino 48 | I/O — User I/O bank 5 |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O bank 6 |
| Pino 51 | I/O — User I/O bank 6 |
| Pino 52 | VCCIO6 — Bank 6 I/O supply |
| Pino 53 | I/O — User I/O bank 6 |
| Pino 54 | I/O — User I/O bank 6 |
| Pino 55 | I/O — User I/O bank 6 |
| Pino 56 | I/O — User I/O bank 6 |
| Pino 57 | GND — Ground |
| Pino 58 | I/O — User I/O bank 7 |
| Pino 59 | I/O — User I/O bank 7 |
| Pino 60 | VCCIO7 — Bank 7 I/O supply |
| Pino 61 | I/O — User I/O bank 7 |
| Pino 62 | I/O — User I/O bank 7 |
| Pino 63 | I/O — User I/O bank 7 |
| Pino 64 | I/O — User I/O bank 7 |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — User I/O bank 8 |
| Pino 67 | I/O — User I/O bank 8 |
| Pino 68 | VCCIO8 — Bank 8 I/O supply |
| Pino 69 | I/O — User I/O bank 8 |
| Pino 70 | I/O — User I/O bank 8 |
| Pino 71 | I/O — User I/O bank 8 |
| Pino 72 | I/O — User I/O bank 8 |
| Pino 73 | GND — Ground |
| Pino 74 | TCK — JTAG test clock |
| Pino 75 | TMS — JTAG test mode select |
| Pino 76 | TDI — JTAG test data in |
| Pino 77 | TDO — JTAG test data out |
| Pino 78 | nCONFIG — Configuration control (active low) |
| Pino 79 | nSTATUS — Configuration status (active low) |
| Pino 80 | CONF_DONE — Configuration done |
| Pino 81 | DCLK — Configuration clock |
| Pino 82 | DATA0 — Configuration data input |
| Pino 83 | MSEL0 — Configuration mode select 0 |
| Pino 84 | MSEL1 — Configuration mode select 1 |
| Pino 85 | MSEL2 — Configuration mode select 2 |
| Pino 86 | VCCA — Analog supply for ADC/PLL |
| Pino 87 | VCCA_ADC — ADC analog supply |
| Pino 88 | REF_GND — Analog reference ground |
| Pino 89 | ADCIN1 — ADC analog input channel 1 |
| Pino 90 | ADCIN2 — ADC analog input channel 2 |
| Pino 91 | ADCIN3 — ADC analog input channel 3 |
| Pino 92 | ADCIN4 — ADC analog input channel 4 |
| Pino 93 | ADCIN5 — ADC analog input channel 5 |
| Pino 94 | ADCIN6 — ADC analog input channel 6 |
| Pino 95 | ADCIN7 — ADC analog input channel 7 |
| Pino 96 | ADCIN8 — ADC analog input channel 8 |
| Pino 97 | GND — Ground |
| Pino 98 | VCC — Core supply (3.0/3.3 V) |
| Pino 99 | VCC — Core supply (3.0/3.3 V) |
| Pino 100 | GND — Ground |
| Pino 101 | I/O — User I/O bank 1 |
| Pino 102 | I/O — User I/O bank 1 |
| Pino 103 | VCCIO1 — Bank 1 I/O supply |
| Pino 104 | I/O — User I/O bank 1 |
| Pino 105 | I/O — User I/O bank 1 |
| Pino 106 | I/O — User I/O bank 1 |
| Pino 107 | I/O — User I/O bank 1 |
| Pino 108 | GND — Ground |
| Pino 109 | I/O — User I/O bank 2 |
| Pino 110 | I/O — User I/O bank 2 |
| Pino 111 | VCCIO2 — Bank 2 I/O supply |
| Pino 112 | I/O — User I/O bank 2 |
| Pino 113 | I/O — User I/O bank 2 |
| Pino 114 | I/O — User I/O bank 2 |
| Pino 115 | I/O — User I/O bank 2 |
| Pino 116 | GND — Ground |
| Pino 117 | I/O — User I/O bank 3 |
| Pino 118 | I/O — User I/O bank 3 |
| Pino 119 | VCCIO3 — Bank 3 I/O supply |
| Pino 120 | I/O — User I/O bank 3 |
| Pino 121 | I/O — User I/O bank 3 |
| Pino 122 | I/O — User I/O bank 3 |
| Pino 123 | I/O — User I/O bank 3 |
| Pino 124 | GND — Ground |
| Pino 125 | I/O — User I/O bank 4 |
| Pino 126 | I/O — User I/O bank 4 |
| Pino 127 | VCCIO4 — Bank 4 I/O supply |
| Pino 128 | I/O — User I/O bank 4 |
| Pino 129 | I/O — User I/O bank 4 |
| Pino 130 | I/O — User I/O bank 4 |
| Pino 131 | I/O — User I/O bank 4 |
| Pino 132 | GND — Ground |
| Pino 133 | I/O — User I/O bank 5 |
| Pino 134 | I/O — User I/O bank 5 |
| Pino 135 | VCCIO5 — Bank 5 I/O supply |
| Pino 136 | I/O — User I/O bank 5 |
| Pino 137 | I/O — User I/O bank 5 |
| Pino 138 | I/O — User I/O bank 5 |
| Pino 139 | I/O — User I/O bank 5 |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — User I/O bank 6 |
| Pino 142 | I/O — User I/O bank 6 |
| Pino 143 | VCCIO6 — Bank 6 I/O supply |
| Pino 144 | EP — Exposed thermal pad (must connect to GND pour) |
Aplicações típicas
10M04SCE144A7G é adequado para 6 aplicaçãos: Industrial Motor Control, Automotive Body and Chassis Controllers, I/O Expansion and Bridging for MCUs, Human-Machine Interface (HMI) and Display Control, Portable Medical and Wellness Devices, Industrial Sensor Aggregation and Edge I/O.
Industrial Motor Control
The 10M04SCE144A7G fits industrial motor-control state machines where 4,000 LEs and 101 user I/O pins are sufficient to host position counters, PWM generators, and encoder interfaces. Its non-volatile flash configuration provides instant-on deterministic power-up, which is critical for safe stop sequences on 3-phase inverter boards. The AEC-Q100 automotive grade extends the same part to harsh industrial environments with -40 °C to +125 °C operation, and the 144-EQFP package simplifies SMT assembly on conventional lines.
Recomendado
Automotive Body and Chassis Controllers
The 10M04SCE144A7G suits body and chassis modules (BCM, HVAC, lighting controllers) because AEC-Q100 qualification, 4,000 LEs, and 193,536 bits of embedded flash allow the FPGA to replace multiple discrete logic ICs and small CPLDs. Dual-image flash supports fail-safe firmware updates required by ISO 26262 workflows. With 101 user I/O the device can drive LIN/CAN transceivers and high-side switches directly, simplifying PCB routing inside an EQFP footprint.
Recomendado
I/O Expansion and Bridging for MCUs
The 10M04SCE144A7G acts as a programmable I/O expander or bus bridge for legacy microcontrollers. Designers can implement parallel-to-SPI bridges, custom keypad scanners, or LVDS/TTL level translation in 4,000 LEs, then route 101 signals back to the host MCU through a single EQFP footprint. Non-volatile configuration eliminates the external boot flash that CPLD bridges otherwise need, reducing BOM cost and PCB area on industrial control boards.
Recomendado
Human-Machine Interface (HMI) and Display Control
The 10M04SCE144A7G drives simple HMI panels, segment LCDs, and small TFT displays by combining on-chip oscillators, dedicated user flash for frame buffers (193,536 bits), and 101 user I/O to connect touch sensors and keypads. AEC-Q100 qualification enables use in automotive instrument clusters and in-cabin infotainment sub-modules. The instant-on behavior of MAX 10 non-volatile flash eliminates the lag users experience with SRAM-based FPGAs.
Recomendado
Portable Medical and Wellness Devices
The 10M04SCE144A7G integrates sensor front-end glue logic for portable medical and wellness devices such as blood-pressure monitors, pulse oximeters, and home-diagnostic tools. The integrated MAX 10 ADC block and 4,000 LEs let designers digitize sensor channels, run digital filters, and drive a small display from a single chip. The 144-EQFP 20x20 mm footprint remains manageable for handheld enclosures while supporting a wide operating temperature window.
Recomendado
Industrial Sensor Aggregation and Edge I/O
The 10M04SCE144A7G aggregates multiple industrial sensors (temperature, pressure, flow) and forwards them to a host controller over EtherCAT, PROFINET, or serial protocols. With 101 user I/O and 4,000 LEs, the part handles timestamp counters, watchdog logic, and protocol stacks without external logic ICs. AEC-Q100 qualification supports deployments in factory automation cells where -40 °C to +125 °C swings are routine, and the 144-EQFP allows reflow on conventional lines.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M04SCE144A7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M04SCE144C8G | 10M04SCE144I7G | 10M08SCE144A7G | 10M02SCE144A7G |
|---|---|---|---|---|---|
| Package | 144-EQFP (20x20 mm) | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 (same) | 4,000 (same) | 8,000 (+100%) | 2,000 (-50%) |
| Operating Temperature | -40 °C to +125 °C (automotive) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) |
| Supply Voltage | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V |
| AEC-Q100 Automotive | Yes | No (commercial) | No (industrial) | Yes | Yes |
Principais diferenciais
- AEC-Q100 automotive grade with extended -40 to +125 °C temperature range (vs 10M04SCE144C8G)
- Maximized logic capacity within the 144-EQFP footprint (vs 10M02SCE144A7G)
- Higher LE count upgrade path on identical footprint (vs 10M08SCE144A7G)
Notas de projeto
Estimated: at continuous 3.3 V VCC, 101 user I/O switching at 25% toggle and 10 MHz, internal power is dominated by I/O bank current. With a 144-EQFP theta_JA of approximately 25 °C/W on a 4-layer JEDEC board, internal dissipation must stay below ~1.6 W to keep junction rise under 40 °C above 85 °C ambient. Exposed pad must be soldered to a continuous GND copper pour on top and inner layers to meet this envelope.
Place 100 nF X7R bypass capacitors within 5 mm of every VCC and VCCIO pin, with one 4.7 uF bulk capacitor per supply rail. Decouple VCCA_ADC from VCCA through a ferrite bead for ADC accuracy. JTAG pins (TCK, TMS, TDI, TDO) require 10 kohm pull-ups to VCCIO8 and short, length-matched traces to the programming header for reliable Quartus Prime configuration.
Do not leave the exposed pad (EP, pin 144) floating; it must be soldered to GND or thermal performance will degrade by 30-50% and AEC-Q100 qualification no longer applies. MSEL pins must match the desired configuration mode (AS, PS, JTAG) before VCC ramps, or the device will not boot. Avoid tying unused user I/O to long traces, which can act as antennas and inject noise into the ADC subsystem.
Route JTAG and configuration signals on the top layer adjacent to the device to keep stubs under 2 mm. Place the configuration flash (if used for dual-image) within 25 mm of DATA0/DCLK. Isolate ADC analog traces (ADCIN1-8, REF_GND) from digital switching traces; surround them with a GND guard ring connected to the analog ground plane to preserve ADC SNR.
Informações de conformidade
AEC-Q100 automotive grade per Intel MAX 10 datasheet ordering information. RoHS compliant per JLCPCB listing. MSL 3 per JEDEC J-STD-020.
