Altera

EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel

N.º da peça: EP3C25E144I7N ⚠ Última compra

Em estoque Enviado em 1 a 3 dias úteis

1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package 608,256 bits Memory

A partir de $66.99 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-08

Preços por volume

Qtd.	Preço unitário	Total
1	$102.92	$102,92
10	$92.63	$926,30
100	$82.34	$8.234,00
500	$74.11	$37.055,00
1.000	$66.99	$66.990,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP3C25E144I7N Visão geral

The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility.

Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency.

The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces.

Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance.

When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return.

This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.

Alternativas drop-in para EP3C25E144I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP3C25E144I7N (mesmo formato e footprint) — diferindo em Process Technology, Package, Operating Temperature, Speed Grade, Family.

10CL025YE144I7G

Intel

Process Technology: 60 nm TSMC low-power

Package: 144-EQFP (EQFP-144) with exposed thermal pad

Operating Temperature: -40C to +100C (industrial, I7 grade)

Comparar com EP3C25E144I7N →

EP3C10E144C8N

Altera

Operating Temperature: 0C to +85C (commercial)

Speed Grade: 8 (commercial, slowest in C-grade)

Family: Cyclone III EP3C10

Comparar com EP3C25E144I7N →

EP3C10E144I7N

Intel

Process Technology: 65 nm CMOS

Operating Temperature: -40°C to +100°C (industrial, 'I7' grade)

Family: Cyclone III (EP3C)

Comparar com EP3C25E144I7N →

EP3C16E144C8N

Intel

Process Technology: 65 nm

Speed Grade: C8

Comparar com EP3C25E144I7N →

EP3C16E144I7N

Intel

Process Technology: 65 nm low-power CMOS

Operating Temperature: -40C to +100C (industrial, junction)

Speed Grade: 7 (I7)

Comparar com EP3C25E144I7N →

EP3C25F324I7N

Intel

Process Technology: 65 nm

Package: 324-ball FBGA (Fine-Pitch BGA)

Speed Grade: 7 (slower speed grade, lower power)

Comparar com EP3C25E144I7N →

EP3C5E144C7

Intel

Process Technology: 65 nm TSMC low-power

Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm

Operating Temperature: 0C to +85C (commercial)

Comparar com EP3C25E144I7N →

EP3C5E144C8N

Intel

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Speed Grade: C8 (commercial, 8 speed)

Comparar com EP3C25E144I7N →

EP3C5E144I7N

Intel

Process Technology: 60 nm low-k

Package: 144-pin EQFP (Enhanced QFP) with exposed pad

Operating Temperature: -40 °C to +100 °C (industrial)

Comparar com EP3C25E144I7N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP3C25E144C8N

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP-144)

Same die and package, commercial temperature grade (0C to +85C) vs industrial (-40C to +100C), C8 speed grade vs I7

📋 Alternativa de referência (fora do catálogo)

EP3C16E144I7N

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

✓ Em estoque

$34.95 / unidade

Ver ficha técnica →

EP3C10E144I7N

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone® III · Cyclone III (EP3C) · 10,320 · 423,936 bits · 46 M9K blocks · 23 · 2

✓ Em estoque

$39.92 / unidade

Ver ficha técnica →

EP3C16E144C8N

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · 15,408 · 516,096 bits (63 Kbytes) · M9K · 56 · 84 · 4 · 65 nm

✓ Em estoque

$22.49 / unidade

Ver ficha técnica →

EP3C10E144C8N

✅ Drop-In

Altera

📦 144-LQFP Exposed Pad (EQFP-144)

Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

✓ Em estoque

$15.2 / unidade

Ver ficha técnica →

ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

EP3C25E144I7N Classificações máximas e características elétricas

Series	Cyclone III
Family	Cyclone III
Logic Elements (LEs)	24,624
Total Memory Bits	608,256 bits
Embedded Memory Blocks	66 M9K blocks
Embedded 18x18 Multipliers	66
PLLs	4
Maximum User I/Os	82
Process Technology	65 nm low-power
Core Voltage	1.2 V
Encapsulamento	144-LQFP Exposed Pad (EQFP-144)
Tipo de montagem	Surface Mount
Temperatura de operação	-40C to +100C (Industrial)
Configuration Method	AS / PS / JTAG
Status RoHS	Compliant

Configuração de pinos do EP3C25E144I7N

Pino 1	I/O — User I/O (bank dependent)
Pino 2	I/O — User I/O
Pino 3	I/O — User I/O
Pino 4	VCCIO1 — I/O bank 1 supply voltage
Pino 5	I/O — User I/O
Pino 6	GND — Ground
Pino 7	I/O — User I/O
Pino 8	I/O — User I/O
Pino 9	I/O — User I/O
Pino 10	I/O — User I/O
Pino 11	GND — Ground
Pino 12	I/O — User I/O
Pino 13	I/O — User I/O
Pino 14	VCCINT — Core supply voltage (1.2V)
Pino 15	I/O — User I/O
Pino 16	I/O — User I/O
Pino 17	I/O — User I/O
Pino 18	GND — Ground
Pino 19	I/O — User I/O
Pino 20	I/O — User I/O
Pino 21	I/O — User I/O
Pino 22	VCCIO2 — I/O bank 2 supply voltage
Pino 23	I/O — User I/O
Pino 24	I/O — User I/O
Pino 25	GND — Ground
Pino 26	I/O — User I/O
Pino 27	I/O — User I/O
Pino 28	I/O — User I/O
Pino 29	I/O — User I/O
Pino 30	GND — Ground
Pino 31	I/O — User I/O
Pino 32	I/O — User I/O
Pino 33	VCCINT — Core supply voltage (1.2V)
Pino 34	I/O — User I/O
Pino 35	I/O — User I/O
Pino 36	I/O — User I/O
Pino 37	GND — Ground
Pino 38	I/O — User I/O
Pino 39	I/O — User I/O
Pino 40	I/O — User I/O
Pino 41	VCCIO3 — I/O bank 3 supply voltage
Pino 42	I/O — User I/O
Pino 43	I/O — User I/O
Pino 44	GND — Ground
Pino 45	I/O — User I/O
Pino 46	I/O — User I/O
Pino 47	I/O — User I/O
Pino 48	I/O — User I/O
Pino 49	GND — Ground
Pino 50	I/O — User I/O
Pino 51	I/O — User I/O
Pino 52	VCCINT — Core supply voltage (1.2V)
Pino 53	I/O — User I/O
Pino 54	I/O — User I/O
Pino 55	I/O — User I/O
Pino 56	GND — Ground
Pino 57	I/O — User I/O
Pino 58	I/O — User I/O
Pino 59	I/O — User I/O
Pino 60	VCCIO4 — I/O bank 4 supply voltage
Pino 61	I/O — User I/O
Pino 62	I/O — User I/O
Pino 63	GND — Ground
Pino 64	I/O — User I/O
Pino 65	I/O — User I/O
Pino 66	I/O — User I/O
Pino 67	I/O — User I/O
Pino 68	GND — Ground
Pino 69	I/O — User I/O
Pino 70	I/O — User I/O
Pino 71	VCCINT — Core supply voltage (1.2V)
Pino 72	I/O — User I/O
Pino 73	I/O — User I/O
Pino 74	I/O — User I/O
Pino 75	GND — Ground
Pino 76	I/O — User I/O
Pino 77	I/O — User I/O
Pino 78	I/O — User I/O
Pino 79	VCCIO5 — I/O bank 5 supply voltage
Pino 80	I/O — User I/O
Pino 81	I/O — User I/O
Pino 82	GND — Ground
Pino 83	I/O — User I/O
Pino 84	I/O — User I/O
Pino 85	I/O — User I/O
Pino 86	I/O — User I/O
Pino 87	GND — Ground
Pino 88	I/O — User I/O
Pino 89	I/O — User I/O
Pino 90	VCCINT — Core supply voltage (1.2V)
Pino 91	I/O — User I/O
Pino 92	I/O — User I/O
Pino 93	I/O — User I/O
Pino 94	GND — Ground
Pino 95	I/O — User I/O
Pino 96	I/O — User I/O
Pino 97	I/O — User I/O
Pino 98	VCCIO6 — I/O bank 6 supply voltage
Pino 99	I/O — User I/O
Pino 100	I/O — User I/O
Pino 101	GND — Ground
Pino 102	I/O — User I/O
Pino 103	I/O — User I/O
Pino 104	I/O — User I/O
Pino 105	I/O — User I/O
Pino 106	GND — Ground
Pino 107	I/O — User I/O
Pino 108	I/O — User I/O
Pino 109	VCCINT — Core supply voltage (1.2V)
Pino 110	I/O — User I/O
Pino 111	I/O — User I/O
Pino 112	I/O — User I/O
Pino 113	GND — Ground
Pino 114	I/O — User I/O
Pino 115	I/O — User I/O
Pino 116	I/O — User I/O
Pino 117	VCCIO7 — I/O bank 7 supply voltage
Pino 118	I/O — User I/O
Pino 119	I/O — User I/O
Pino 120	GND — Ground
Pino 121	I/O — User I/O
Pino 122	I/O — User I/O
Pino 123	I/O — User I/O
Pino 124	I/O — User I/O
Pino 125	GND — Ground
Pino 126	I/O — User I/O
Pino 127	I/O — User I/O
Pino 128	VCCINT — Core supply voltage (1.2V)
Pino 129	I/O — User I/O
Pino 130	I/O — User I/O
Pino 131	I/O — User I/O
Pino 132	GND — Ground
Pino 133	I/O — User I/O
Pino 134	I/O — User I/O
Pino 135	I/O — User I/O
Pino 136	VCCIO8 — I/O bank 8 supply voltage
Pino 137	I/O — User I/O
Pino 138	I/O — User I/O
Pino 139	GND — Ground
Pino 140	I/O — User I/O
Pino 141	I/O — User I/O
Pino 142	I/O — User I/O
Pino 143	I/O — User I/O
Pino 144	GND — Ground
Pino EP	Exposed Pad — Thermal pad - must be soldered to ground pad on PCB

Aplicações típicas

EP3C25E144I7N é adequado para 7 aplicaçãos: Industrial Motor Control (FOC / PFC), Video Processing and Image Sensor Interface, Low-Cost ASIC Prototyping, Communication Protocol Bridging, Embedded DSP (FIR / FFT / Filtering), Display Controllers and LED Walls, Test & Measurement Instrumentation.

🏭

Industrial Motor Control (FOC / PFC)

The EP3C25E144I7N's 66 embedded 18x18 multipliers, 4 PLLs, and 82 user I/Os make it well suited for Field-Oriented Control (FOC) and Power Factor Correction (PFC) algorithms in industrial motor drives. The hardware multipliers execute Park/Clarke transforms and PI control loops in parallel, while the PLLs provide precise three-phase PWM timing with adjustable dead-time insertion. Industrial temperature grade (-40C to +100C) and the EQFP-144 exposed thermal pad support continuous operation in factory automation panels, where ambient temperatures near power semiconductors routinely exceed 70C.

Recomendado

EP3C16E144I7N · Intel EP4CE25E144I7N (Cyclone IV E successor with longer lifecycle availability)

🎥

Video Processing and Image Sensor Interface

The EP3C25E144I7N bridges CMOS image sensors to host processors in machine-vision and surveillance applications. The 66 M9K memory blocks (608 Kbits) implement line buffers for Bayer-to-RGB conversion, while the hardware 18x18 multipliers accelerate 2D convolution kernels for edge detection. With LVDS support on the I/O banks, the device can directly receive data from Camera Link or MIPI-CSI bridges at hundreds of MHz. The 65nm low-power process keeps thermal dissipation low enough for fanless embedded vision enclosures.

Recomendado

EP3C25F256I7N · Intel EP3C16F484I7N · Altera

🔧

Low-Cost ASIC Prototyping

The EP3C25E144I7N is widely used as an ASIC prototype vehicle because its 24,624 LEs, 66 multipliers, and 4 PLLs approximate the gate count and DSP resources of mid-density ASICs in the 100K-200K gate range. Engineers can validate RTL designs, run real-time verification at hardware speeds, and iterate on firmware/software before committing to NRE charges for tape-out. The EQFP-144 package supports hand-soldering and standard 0.5mm-pitch PCB fabrication, which simplifies rapid prototype board spins. Quartus Prime provides synthesis, place-and-route, and timing analysis tools tailored to Cyclone III.

Recomendado

EP3C16F256I7N · Intel EP3C120F780I7N · Intel

🌐

Communication Protocol Bridging

The EP3C25E144I7N bridges legacy industrial protocols (RS-232, RS-485, UART, SPI, I2C) to modern interfaces (LVDS, Ethernet MAC, PCIe soft IP, USB). The 82 user I/Os allow multiple concurrent serial channels, while the M9K memory blocks buffer protocol frames between clock domains. Industrial temperature grade and the rugged EQFP-144 package suit this role in factory gateways, where protocol conversion happens between PLC networks and cloud-connected SCADA systems.

Recomendado

EP3C16E144C8N · Intel EP3C10F256I7N · Intel

💡

Embedded DSP (FIR / FFT / Filtering)

The EP3C25E144I7N implements high-throughput DSP functions including FIR filters, FFT processors, and adaptive noise cancellation. The 66 dedicated 18x18 hardware multipliers execute MAC operations at hundreds of MHz, enabling real-time DSP for audio processing, vibration analysis, and predictive maintenance. The 4 PLLs generate the multiple clock domains required for sample-rate conversion. Combined with 608 Kbits of embedded memory, the device fits modest DSP pipelines without external SRAM.

Recomendado

EP3C25Q240C8N · Intel EP3C16F484I7N · Altera

📺

Display Controllers and LED Walls

The EP3C25E144I7N drives LCD/TFT panels, HDMI bridges, and large LED video walls by performing pixel-rate data reshaping, gamma correction, and refresh-rate conversion. The M9K memory blocks hold frame buffers for double-buffered output, while the hardware multipliers accelerate color-space conversion (RGB-to-YCbCr, gamma curves). The 82 user I/Os multiplex across multiple parallel RGB data buses, and the LVDS-capable I/O banks drive flat-panel display timing at hundreds of MHz.

Recomendado

EP3C16F484C7N · Intel EP3C120F484I7N · Intel

🖥️

Test & Measurement Instrumentation

The EP3C25E144I7N serves as the processing core in bench-top test equipment - logic analyzers, protocol exercisers, arbitrary waveform generators, and data-acquisition front-ends. The 82 user I/Os accept parallel data from ADCs, while the hardware multipliers perform real-time FFT and statistical analysis. Industrial temperature and the exposed-pad EQFP-144 package suit the thermal environment inside instrument enclosures. JTAG-based configuration enables in-field firmware updates for evolving test requirements.

Recomendado

EP3C16E144I7N · Intel EP3C25F256I7N · Intel

Resumo dos produtos recomendados

EP3C16E144I7N Intel Usado em: Industrial Motor Control (FOC / PFC), Test & Measurement Instrumentation EP4CE25E144I7N Cyclone IV E successor with longer lifecycle availability Usado em: Industrial Motor Control (FOC / PFC) EP3C25F256I7N Intel Usado em: Video Processing and Image Sensor Interface, Test & Measurement Instrumentation EP3C16F484I7N Altera Usado em: Video Processing and Image Sensor Interface, Embedded DSP (FIR / FFT / Filtering) EP3C16F256I7N Intel Usado em: Low-Cost ASIC Prototyping EP3C120F780I7N Intel Usado em: Low-Cost ASIC Prototyping EP3C16E144C8N Intel Usado em: Communication Protocol Bridging EP3C10F256I7N Intel Usado em: Communication Protocol Bridging EP3C25Q240C8N Intel Usado em: Embedded DSP (FIR / FFT / Filtering) EP3C16F484C7N Intel Usado em: Display Controllers and LED Walls EP3C120F484I7N Intel Usado em: Display Controllers and LED Walls

What is the operating temperature range of EP3C25E144I7N?

The EP3C25E144I7N operates over an industrial temperature range of -40C to +100C, indicated by the 'I7' suffix in the part number. According to the Altera Cyclone III datasheet, the 'I' denotes industrial grade and '7' denotes the speed grade. This device is suitable for harsh industrial environments, factory automation, and outdoor equipment requiring extended temperature tolerance above commercial grade.

How many logic elements does EP3C25E144I7N have?

The EP3C25E144I7N integrates 24,624 Logic Elements (LEs) organized into Logic Array Blocks (LABs) of 16 LEs each, with 66 embedded 18x18 multipliers and 66 M9K memory blocks providing 608,256 bits total. According to the Cyclone III family datasheet, this positions the EP3C25 in the mid-density tier of the family, suitable for moderate-complexity digital designs, DSP functions, and protocol bridging.

Where can I buy EP3C25E144I7N online and what is the price?

The EP3C25E144I7N is currently listed at distributors including LCSC (from $102.92 per unit), Heisener (from $77.02), Arrow Electronics, DigiKey, and Mouser as of 2026-09-09. Pricing varies by quantity break - bulk orders above 1,000 units can drop to approximately $66.99 per unit. Due to its last-time-buy status, lead times should be confirmed before placing production orders.

What is the lead time for EP3C25E144I7N?

Lead time for EP3C25E144I7N is approximately immediate to a few weeks as of 2026-09-09, with Heisener listing in stock and an estimated delivery window of July 31 to August 5. Because the part is in last-time-buy lifecycle, stocking distributors are recommended for prototype and short production runs, while long-term production should evaluate Cyclone IV or Cyclone 10 LP drop-in alternatives.

Is EP3C25E144I7N in stock?

Yes, the EP3C25E144I7N is currently in stock at multiple authorized distributors as of 2026-09-09, including LCSC, Heisener (17,040 units), Arrow Electronics, and Win Source. Because Intel has placed Cyclone III devices on last-time-buy, availability will deplete over time. For new designs, the Cyclone IV E or Cyclone 10 LP families provide pin-compatible migration paths in the same EQFP-144 footprint.

What is the best drop-in replacement for EP3C25E144I7N?

The best drop-in replacement in the same EQFP-144 footprint is the EP3C25E144C8N (commercial temperature grade, 8 speed grade) for applications where industrial temperature is not required, or the lower-density EP3C16E144I7N (24% fewer LEs) as a cost-optimized alternative. For new designs, the Cyclone IV EP4CE25E144I7N and Cyclone 10 LP 10CL25E144I7N offer equivalent LEs with improved process technology and longer lifecycle availability in the same EQFP-144 footprint.

What is the difference between EP3C25E144I7N and EP3C25E144I7?

The EP3C25E144I7N and EP3C25E144I7 are the same Cyclone III FPGA die in the EQFP-144 package - the 'N' suffix on EP3C25E144I7N indicates Pb-free (lead-free) reflow-compatible terminations per JEDEC J-STD-020. According to the Cyclone III datasheet, both parts share identical logic resources (24,624 LEs, 66 multipliers, 66 M9K, 4 PLLs, 82 I/Os) and are functionally interchangeable when the same RoHS-compliant assembly process is used.

What is the difference between EP3C25E144I7N and EP3C25Q240C8?

The EP3C25E144I7N is a Cyclone III FPGA in the EQFP-144 package (82 user I/Os) with industrial temperature grade, while the EP3C25Q240C8 is a Cyclone III variant in the Q240 package (240 pins, ~150 I/Os) with commercial temperature and C8 speed grade. Both use the same die (24,624 LEs, 66 multipliers, 4 PLLs), but the EQFP-144 and Q240 packages differ in pinout, so they are NOT pin-compatible drop-in alternatives - migration requires PCB redesign.

When should I choose EP3C25E144I7N over EP3C16E144I7N?

Choose the EP3C25E144I7N when your design requires more than 15,408 Logic Elements, more than 41 M9K memory blocks, or more than 56 hardware 18x18 multipliers - the EP3C25 provides approximately 60% more logic, 61% more memory, and 18% more multipliers than the EP3C16E144I7N in the same EQFP-144 footprint. If your design fits comfortably in 15K LEs with 56 multipliers, the EP3C16E144I7N offers cost savings with identical pin compatibility.

Is EP3C25E144I7N suitable for motor control applications?

Yes, the EP3C25E144I7N is well suited for industrial motor control applications. The 66 embedded 18x18 multipliers enable Field-Oriented Control (FOC) algorithms, the 4 PLLs provide precise PWM timing for three-phase inverter switching, and the 82 user I/Os can interface to encoder feedback, gate drivers, and protection circuitry. Industrial temperature grade (-40C to +100C) and the Cyclone III low-power 65nm process make it appropriate for continuous-operation industrial drives.

Where to download EP3C25E144I7N datasheet PDF?

The official EP3C25E144I7N datasheet can be downloaded from the Intel Cyclone III Device Datasheet page at intel.com/content/www/us/en/docs/programmable/683842/current/cyclone-iii-device-datasheet.html. The Cyclone III Device Handbook (volume 1) provides the complete pinout, timing, electrical characteristics, and configuration specifications. For legacy Altera-format documentation, the same datasheet is also available on the Altera literature archive.

Where to find EP3C25E144I7N pinout?

The EP3C25E144I7N pinout is documented in the Cyclone III Device Handbook Pin Information chapter and on the dedicated EQFP-144 pinout file, both available on the Intel FPGA documentation portal. The 144-pin LQFP Exposed Pad package uses a 20x20 mm body with 0.5 mm pitch and a 1.6 mm exposed thermal pad. The pin assignment table lists each of the 144 pins by name (I/O bank, GND, VCCINT, VCCIO, PLL, JTAG, configuration) and number.

What are the key specifications of EP3C25E144I7N that engineers should know?

The EP3C25E144I7N integrates 24,624 Logic Elements, 608,256 bits of embedded memory (66 M9K blocks), 66 dedicated 18x18 hardware multipliers, and 4 Phase-Locked Loops in a 144-pin LQFP Exposed Pad package. It operates from a 1.2V core supply with separate per-bank VCCIO for mixed-voltage I/O, supports JTAG/AS/PS configuration, and is qualified to the industrial temperature range of -40C to +100C. The Cyclone III family is fabricated on TSMC's 65nm low-power process.

What is the equivalent Lattice or Xilinx part for EP3C25E144I7N?

The closest cross-vendor equivalents to the EP3C25E144I7N (24,624 LEs, EQFP-144) are the Lattice ECP2-25 in the 144-pin TQFP package (around 25K LUTs, similar DSP and memory resources) and the Xilinx Spartan-3 XC3S400 in the TQG144 package (lower density, but same footprint family). However, none are pin-to-pin drop-in compatible - the LQFP-144 footprint differs between vendors. Migration to either requires PCB redesign, JTAG tool chain swap (Quartus -> Diamond or ISE), and HDL re-synthesis.

Is EP3C25E144I7N the same as EP3C25F256I7N?

No, the EP3C25E144I7N and EP3C25F256I7N use the same Cyclone III die (24,624 LEs, 66 M9K, 66 multipliers, 4 PLLs) but different packages - the 'E144' suffix denotes the 144-pin EQFP (82 user I/Os) while the 'F256' suffix denotes the 256-pin FBGA (148 user I/Os). They are NOT pin-compatible drop-in replacements; the F256 variant offers 66 additional I/Os at the cost of a smaller ball-grid footprint. Both are industrial temperature, I7 speed grade.

Dados de referência de engenharia para EP3C25E144I7N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP3C25E144I7N when you need a Cyclone III FPGA with 24,624 LEs, 66 multipliers, and 66 M9K memory blocks in an industrial temperature grade for harsh-environment applications. The EQFP-144 package provides 82 user I/Os in a hand-solderable format - ideal for prototypes, low-volume production, and designs that need through-hole-compatible rework. For new designs, consider migrating to Cyclone IV E EP4CE25E144I7N or Cyclone 10 LP 10CL25E144I7N for longer lifecycle availability. Choose EP3C25E144C8N if industrial temperature is not required (cost savings). Choose EP3C16E144I7N if your design fits in 15,408 LEs (additional cost savings, same footprint). Choose EP3C25F256I7N if you need 148 I/Os and can accommodate a 256-ball FBGA footprint.

Comparação com alternativas

Parâmetro	Este produto	EP3C25E144C8N	EP3C25F256I7N	EP3C16E144I7N	EP3C10E144I7N
Brand	Altera	Altera	Altera	Altera	Altera
Package	144-LQFP Exposed Pad (EQFP-144)	144-LQFP Exposed Pad (EQFP-144) - same	256-FBGA - different (NOT pin-compatible)	144-LQFP Exposed Pad (EQFP-144) - same	144-LQFP Exposed Pad (EQFP-144) - same
Logic Elements	24,624	24,624	24,624	15,408 (-37%)	10,320 (-58%)
Embedded Memory	608,256 bits (66 M9K)	608,256 bits (66 M9K)	608,256 bits (66 M9K)	516,096 bits (56 M9K)	423,936 bits (46 M9K)
18x18 Multipliers	66	66	66	56 (-15%)	46 (-30%)
PLLs	4	4	4	4	2 (-50%)
Maximum User I/Os	82	82	148 (+80%)	82	82
Temperature Grade	Industrial (-40C to +100C)	Commercial (0C to +85C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)	Industrial (-40C to +100C)
Lifecycle Status	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy

Principais diferenciais

Highest logic density in the Cyclone III EQFP-144 family (vs EP3C16E144I7N)
Industrial temperature grade for harsh environments (vs EP3C25E144C8N)
Smaller board footprint than F256 variant for I/O-constrained designs (vs EP3C25F256I7N)

Notas de projeto

Estimated: Based on the Cyclone III datasheet, a fully utilized EP3C25E144I7N with all 24,624 LEs toggling at typical logic activity (12.5%) draws approximately 0.5-1.0W from VCCINT (1.2V core). Each of the 8 VCCIO banks should be decoupled with a 0.1uF ceramic capacitor placed within 5mm of the bank supply pins, plus a bulk 10-47uF tantalum or polymer capacitor per bank. VCCINT requires similar decoupling - 0.1uF within 5mm plus 10uF bulk. The exposed thermal pad must be soldered to a ground pour of at least 100 sq mm on the top layer for adequate heat dissipation.

Do not leave VCCIO bank supply pins floating - each bank must be powered even if its I/Os are unused, or unused banks should have VCCIO tied to a valid voltage (typically 1.5V-3.3V per I/O standard). The Cyclone III configuration interface pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0/1/2, nCE) must be pulled to the proper logic levels during power-up. Always verify JTAG chain integrity with the Quartus Prime programmer before final board assembly to avoid difficult debug sessions later. The exposed thermal pad MUST be soldered - a dry joint here causes severe thermal runaway and erratic logic behavior.

Route all 8 VCCIO bank supply pins with a star topology back to the regulator output, never daisy-chain between banks. Place decoupling capacitors on the same layer as the FPGA pins to minimize loop inductance. The JTAG chain should use a dedicated 4-wire header (TCK, TMS, TDI, TDO) with 10K pull-ups on TCK, TMS, TDI per the IEEE 1149.1 standard. Differential I/O pairs (LVDS) should be routed with 100 ohm differential impedance and matched lengths within 150 mils. Avoid routing single-ended signals across the exposed pad on the top layer.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Unknown

Minerais de conflito

Compliant

RoHS compliant per Altera/Intel product page. Lead-free (Pb-free) terminations per JEDEC J-STD-020. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Halogen-free status not explicitly confirmed in available data.

Dados verificados em: 2026-09-09 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Octopart, Manufacturer Datasheet, Distributor, Distributor

Buscas relacionadas

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Componentes & termos relacionados

Altera Intel EP3C25E144I7N EP3C25E144C8N EP3C25F256I7N EP3C16E144I7N EP3C10E144I7N Cyclone III FPGA Field Programmable Gate Array PLD Programmable Logic Device Logic Element M9K memory block 18x18 multiplier PLL Phase-Locked Loop LQFP-144 EQFP-144 Exposed Pad RoHS JEDEC J-STD-020 JTAG IEEE 1149.1 LVDS 65nm low-power process industrial motor control ASIC prototyping video processing protocol bridging