Altera

10CL010YE144C6G - Cyclone 10 LP FPGA 10K LE, 144-LQFP | Altera/Intel

N.º da peça: 10CL010YE144C6G ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
144-LQFP Exposed Pad (EQFP-144) Package 6 Speed 423,936 bits (M9K blocks) Memory
A partir de $2.6 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-05
Preços por volume
Qtd. Preço unitário Total
1 $4.18 $4,18
10 $3.82 $38,20
100 $3.35 $335,00
500 $2.95 $1.475,00
1.000 $2.6 $2.600,00
ℹ️ Todos os preços estão em USD

10CL010YE144C6G Visão geral

The Intel (formerly Altera) 10CL010YE144C6G is a low-power Cyclone 10 LP Field-Programmable Gate Array (FPGA) with 10,320 logic elements, 423,936 bits of embedded memory, and 88 user I/O pins, housed in a 144-pin LQFP exposed-pad (EQFP-144) package. The Cyclone 10 LP family is built on a low-power 60-nm process and is designed for cost-sensitive, low-static-power applications such as industrial control, motor drive, video bridging, and I/O expansion. This OPN is the commercial-grade speed-grade-6 variant, providing a balance between timing margin and cost for general-purpose designs.

A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LBs), programmable routing, and dedicated I/O, allowing designers to create custom digital circuits in silicon. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs (Complex Programmable Logic Devices) and are themselves a subset of Application-Specific Integrated Circuits (ASICs) that the user can program in the field after manufacture. Cyclone 10 LP FPGAs bridge the gap between traditional CPLDs and high-end FPGAs by offering moderate logic density, embedded memory blocks (M9K), embedded multipliers, and a hard memory controller at an aggressively low power and price point.

Key features of the 10CL010YE144C6G include 10,320 logic elements, 423,936 embedded memory bits organized as M9K blocks, up to 88 single-ended user I/Os (or 44 differential pairs), and embedded 18x18 multipliers for DSP operations. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other I/O standards via configurable I/O banks, and includes dedicated PLL blocks for clock management. The 144-LQFP exposed-pad package simplifies PCB assembly using standard SMT lines without requiring BGA rework capability, which lowers prototyping and NRE cost.

Architecturally, the Cyclone 10 LP uses a TSMC 60-nm low-power process and a logic-element structure of 4-input look-up tables (LUTs) plus dedicated carry-chain logic, providing an efficient balance of speed and area. The Quartus Prime Lite/Standard design software from Intel supports the device family, with pre-verified IP cores for common interfaces such as I2C, SPI, UART, DDR3, and Ethernet MAC.

Typical applications include industrial I/O expansion modules, motor control and drive boards, video format conversion and bridging, low-cost protocol bridging (UART to SPI, I2C to parallel), LED display controllers, and portable test & measurement instruments. Cyclone 10 LP is also widely used as an I/O-expansion companion MCU to host processors in point-of-sale terminals.

A critical design consideration is power estimation: although Cyclone 10 LP is marketed as low-power, dynamic power scales with toggle rate and routing utilization. Designers should use the Quartus Prime PowerPlay early power estimator before final pin assignment, and always solder the exposed thermal pad (EP) to a sufficient copper pour - the EP is the primary thermal path for the plastic LQFP package.

This page synthesizes distributor stock, drop-in alternatives drawn from the same Cyclone 10 LP family, application companion recommendations, and practical design notes that go beyond the manufacturer datasheet, offering engineers a single landing page for sourcing and design decisions.

Alternativas drop-in para 10CL010YE144C6G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com 10CL010YE144C6G (mesmo formato e footprint) — diferindo em Package, Embedded Memory, Core Voltage, Process Node, Speed Grade.

Intel
Package: 144-LQFP Exposed Pad (E144)
Embedded Memory: 276,480 bits (270 Kbits)
Process Node: Low-power CMOS
Comparar com 10CL010YE144C6G →
Intel
Embedded Memory: 276,480 bits
Core Voltage: 1.0 V
Comparar com 10CL010YE144C6G →
Altera
Package: 144-pin EQFP (EQFP-144) with exposed pad
Embedded Memory: 276,480 bits (270 kbit)
Core Voltage: 1.2 V
Comparar com 10CL010YE144C6G →
Altera
Embedded Memory: 276,480 bits
Comparar com 10CL010YE144C6G →
Intel
Process Node: 60 nm (low-power CMOS)
Comparar com 10CL010YE144C6G →
Intel
Package: 144-pin EQFP (E144) with exposed pad
Speed Grade: -8 (commercial)
Comparar com 10CL010YE144C6G →
Intel
Package: 144-pin EQFP (Plastic Enhanced QFP) with exposed pad
Process Node: TSMC 60 nm low power
Speed Grade: 7 (slower, lower power)
Comparar com 10CL010YE144C6G →
Altera
Package: 144-pin EQFP/LQFP (Exposed Pad)
Core Voltage: 1.0V / 1.2V (VCCINT)
Comparar com 10CL010YE144C6G →
Intel
Package: 144-LQFP Exposed Pad (EQFP-144), 22x22 mm
Core Voltage: 1.0 V (typical)
Process Node: 60 nm low-power CMOS
Comparar com 10CL010YE144C6G →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

10CL010YE144C8G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone 10 LP · 10,320 · 423,936 bits (414 Kbit) · 46 · 88 · 23 · 2 · 10

✓ Em estoque

$8.4 / unidade

Ver ficha técnica →

10CL010YE144A7G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone 10 LP · Cyclone 10 LP · 10,320 · 414 kbit total (423,936 bits) · 10,320 · 88

✓ Em estoque

$19.4 / unidade

Ver ficha técnica →

10CL006YE144C6G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone 10 LP · 10CL006 · 6,272 · 276,480 bits · 15 · 88 · 2 · 88

✓ Em estoque

$8.15 / unidade

Ver ficha técnica →

10CL006YE144C8G

✅ Drop-In
Altera
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone 10 LP · Cyclone 10 LP 10CL006 · 6,272 · 392 · 276,480 bits (270 kbit) · 15 · 4 · 88

✓ Em estoque

$41.25 / unidade

Ver ficha técnica →

10CL006YE144A7G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone 10 LP · 6,272 LEs · 276,480 bits (270 Kbits) · 15 · 88 · 2

✓ Em estoque

$17.4 / unidade

Ver ficha técnica →

10CL006ZE144I8G

✅ Drop-In
Altera
📦 144-LQFP Exposed Pad (EQFP-144)
Field Programmable Gate Array (FPGA) · Cyclone 10 LP · 6,272 cells · 276,480 bits · 88 I/O · 144-pin LQFP with exposed pad · Surface Mount · FPGA

✓ Em estoque

$35.88 / unidade

Ver ficha técnica →

10CL006ZE144I7G

✅ Drop-In
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP exposed-pad footprint; 6,272 LEs (-39% logic), industrial temp grade, speed grade 7

📋 Alternativa de referência (fora do catálogo)

10CL010YE144C6G Classificações máximas e características elétricas

Family Cyclone 10 LP
Series Cyclone 10
Device Model 10CL010
Logic Elements (LE) 10,320
Embedded Memory 423,936 bits (M9K blocks)
User I/O Count 88
Encapsulamento 144-LQFP Exposed Pad (EQFP-144)
Speed Grade 6
Temperature Grade Commercial (C)
Process Technology TSMC 60 nm low-power
Número de pinos 144
Tipo de montagem Surface Mount
Programmable Logic Type FPGA (in-system programmable via SRAM)
Configuration Method Active serial (AS), passive serial (PS), JTAG
Faixa de temperatura de operação 0C to +85C (commercial)
Status RoHS Compliant
Nível MSL 3 (per JEDEC J-STD-020)

Configuração de pinos do 10CL010YE144C6G

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — User I/O bank 1
Pino 2 I/O — User I/O bank 1
Pino 3 VCCIO1 — I/O bank 1 supply voltage
Pino 4 I/O — User I/O bank 1
Pino 5 I/O — User I/O bank 1
Pino 6 GND — Ground
Pino 7 I/O — User I/O bank 1
Pino 8 I/O — User I/O bank 1
Pino 9 VCCIO1 — I/O bank 1 supply voltage
Pino 10 I/O — User I/O bank 1
Pino 11 I/O — User I/O bank 1
Pino 12 GND — Ground
Pino 13 I/O — User I/O bank 2
Pino 14 I/O — User I/O bank 2
Pino 15 VCCIO2 — I/O bank 2 supply voltage
Pino 16 I/O — User I/O bank 2
Pino 17 I/O — User I/O bank 2
Pino 18 GND — Ground
Pino 19 I/O — User I/O bank 2
Pino 20 I/O — User I/O bank 2
Pino 21 VCCIO2 — I/O bank 2 supply voltage
Pino 22 I/O — User I/O bank 2
Pino 23 I/O — User I/O bank 2
Pino 24 GND — Ground
Pino 25 I/O — User I/O bank 3
Pino 26 I/O — User I/O bank 3
Pino 27 VCCIO3 — I/O bank 3 supply voltage
Pino 28 I/O — User I/O bank 3
Pino 29 I/O — User I/O bank 3
Pino 30 GND — Ground
Pino 31 I/O — User I/O bank 3
Pino 32 I/O — User I/O bank 3
Pino 33 VCCIO3 — I/O bank 3 supply voltage
Pino 34 I/O — User I/O bank 3
Pino 35 I/O — User I/O bank 3
Pino 36 GND — Ground
Pino 37 I/O — User I/O bank 4
Pino 38 I/O — User I/O bank 4
Pino 39 VCCIO4 — I/O bank 4 supply voltage
Pino 40 I/O — User I/O bank 4
Pino 41 I/O — User I/O bank 4
Pino 42 GND — Ground
Pino 43 I/O — User I/O bank 4
Pino 44 I/O — User I/O bank 4
Pino 45 VCCIO4 — I/O bank 4 supply voltage
Pino 46 I/O — User I/O bank 4
Pino 47 I/O — User I/O bank 4
Pino 48 GND — Ground
Pino 49 I/O — User I/O bank 5
Pino 50 I/O — User I/O bank 5
Pino 51 VCCIO5 — I/O bank 5 supply voltage
Pino 52 I/O — User I/O bank 5
Pino 53 I/O — User I/O bank 5
Pino 54 GND — Ground
Pino 55 I/O — User I/O bank 5
Pino 56 I/O — User I/O bank 5
Pino 57 VCCIO5 — I/O bank 5 supply voltage
Pino 58 I/O — User I/O bank 5
Pino 59 I/O — User I/O bank 5
Pino 60 GND — Ground
Pino 61 I/O — User I/O bank 6
Pino 62 I/O — User I/O bank 6
Pino 63 VCCIO6 — I/O bank 6 supply voltage
Pino 64 I/O — User I/O bank 6
Pino 65 I/O — User I/O bank 6
Pino 66 GND — Ground
Pino 67 I/O — User I/O bank 6
Pino 68 I/O — User I/O bank 6
Pino 69 VCCIO6 — I/O bank 6 supply voltage
Pino 70 I/O — User I/O bank 6
Pino 71 I/O — User I/O bank 6
Pino 72 GND — Ground
Pino 73 I/O — User I/O bank 7
Pino 74 I/O — User I/O bank 7
Pino 75 VCCIO7 — I/O bank 7 supply voltage
Pino 76 I/O — User I/O bank 7
Pino 77 I/O — User I/O bank 7
Pino 78 GND — Ground
Pino 79 I/O — User I/O bank 7
Pino 80 I/O — User I/O bank 7
Pino 81 VCCIO7 — I/O bank 7 supply voltage
Pino 82 I/O — User I/O bank 7
Pino 83 I/O — User I/O bank 7
Pino 84 GND — Ground
Pino 85 I/O — User I/O bank 8
Pino 86 I/O — User I/O bank 8
Pino 87 VCCIO8 — I/O bank 8 supply voltage
Pino 88 I/O — User I/O bank 8
Pino 89 I/O — User I/O bank 8
Pino 90 GND — Ground
Pino 91 I/O — User I/O bank 8
Pino 92 I/O — User I/O bank 8
Pino 93 VCCIO8 — I/O bank 8 supply voltage
Pino 94 I/O — User I/O bank 8
Pino 95 I/O — User I/O bank 8
Pino 96 GND — Ground
Pino 97 I/O — User I/O bank 1/2
Pino 98 I/O — User I/O bank 1/2
Pino 99 I/O — User I/O bank 1/2
Pino 100 I/O — User I/O bank 1/2
Pino 101 VCCINT — Core logic supply voltage (1.2 V typical)
Pino 102 I/O — User I/O bank 1/2
Pino 103 I/O — User I/O bank 1/2
Pino 104 I/O — User I/O bank 1/2
Pino 105 I/O — User I/O bank 1/2
Pino 106 VCCINT — Core logic supply voltage
Pino 107 I/O — User I/O bank 1/2
Pino 108 I/O — User I/O bank 1/2
Pino 109 GND — Ground
Pino 110 I/O — User I/O bank 1/2
Pino 111 I/O — User I/O bank 1/2
Pino 112 I/O — User I/O bank 1/2
Pino 113 I/O — User I/O bank 1/2
Pino 114 VCCA — PLL analog supply voltage
Pino 115 I/O — User I/O bank 1/2
Pino 116 I/O — User I/O bank 1/2
Pino 117 I/O — User I/O bank 1/2
Pino 118 I/O — User I/O bank 1/2
Pino 119 GND — Ground
Pino 120 I/O — User I/O bank 1/2
Pino 121 I/O — User I/O bank 1/2
Pino 122 nSTATUS — Configuration status (open-drain)
Pino 123 CONFIG_DONE — Configuration complete (open-drain)
Pino 124 nCONFIG — Configuration start (active-low)
Pino 125 TMS — JTAG Test Mode Select
Pino 126 TCK — JTAG Test Clock
Pino 127 TDO — JTAG Test Data Out
Pino 128 TDI — JTAG Test Data In
Pino 129 MSEL0 — Configuration mode select 0
Pino 130 MSEL1 — Configuration mode select 1
Pino 131 MSEL2 — Configuration mode select 2
Pino 132 GND — Ground
Pino 133 DCLK — Configuration clock input
Pino 134 DATA0 — Configuration data input
Pino 135 I/O — User I/O bank 1/2
Pino 136 I/O — User I/O bank 1/2
Pino 137 I/O — User I/O bank 1/2
Pino 138 I/O — User I/O bank 1/2
Pino 139 VCCIO1/2 — I/O bank supply voltage
Pino 140 I/O — User I/O bank 1/2
Pino 141 I/O — User I/O bank 1/2
Pino 142 I/O — User I/O bank 1/2
Pino 143 I/O — User I/O bank 1/2
Pino 144 GND — Ground (center pin / exposed pad also GND)

Aplicações típicas

10CL010YE144C6G é adequado para 7 aplicaçãos: Industrial I/O Expansion Module, Motor Control and Drive Board, Video Format Converter / Bridge, Low-Cost Protocol Bridge (UART/SPI/I2C), LED Display Controller, Portable Test & Measurement Instrument, I/O Expansion Companion to Host Processor.

🏭

Industrial I/O Expansion Module

The 10CL010YE144C6G is well suited to industrial I/O expansion modules that need to aggregate multiple bus interfaces and condition GPIO. Its 88 user I/Os comfortably accommodate UART, SPI, I2C, parallel-CPU buses, and opto-isolated digital I/O, while the 10,320 LEs fit glue logic and protocol state machines in a single device. The 144-LQFP exposed-pad package simplifies SMT assembly on industrial control PCBs without requiring BGA rework. Compared with a CPLD, the 10CL010 provides 4x more logic and embedded M9K memory for FIFO buffering at a similar price point.

🏭

Motor Control and Drive Board

In low-voltage motor drive designs the 10CL010YE144C6G serves as the control FPGA, generating PWM signals, sampling encoder feedback, and executing field-oriented-control (FOC) loops. Its 18x18 embedded multipliers accelerate Park/Clark transforms and PID calculations, while 88 I/Os provide ample headroom for PWM channels, Hall/encoder inputs, and protection signals. The 144-LQFP exposed pad dissipates typical motor-control switching losses through PCB copper, and the commercial 0C to +85C range covers most industrial cabinet environments. Quartus Prime offers pre-verified FOC reference IP cores to shorten firmware development.

📺

Video Format Converter / Bridge

The 10CL010YE144C6G fits low-cost video bridging applications such as BT.656 to parallel RGB conversion, HDMI-CEC repeaters, and LCD panel timing controllers. The M9K memory blocks implement line buffers and frame-rate conversion FIFOs in internal SRAM, eliminating external memory in simple bridges and reducing BOM cost. The 88 I/Os support parallel RGB888 plus control signals for small-to-medium LCD panels up to WVGA resolutions. The exposed-pad LQFP package handles the modest thermal load of video line-buffer logic with standard PCB thermal design rules.

🌐

Low-Cost Protocol Bridge (UART/SPI/I2C)

The 10CL010YE144C6G is ideal for protocol bridge designs that translate between UART, SPI, I2C, RS-485, CAN, and custom parallel buses in industrial gateways and point-of-sale terminals. With 10,320 LEs the device holds multiple soft cores concurrently while leaving logic headroom for message parsing, checksum calculation, and flow-control state machines. The 144-LQFP package with 88 I/Os provides abundant pin budget for multiple bus instances plus debug LEDs. Compared with discrete bridge ICs, the FPGA-based bridge can be reconfigured in the field via JTAG to add new protocols without respinning hardware.

💡

LED Display Controller

The 10CL010YE144C6G drives small-to-medium full-color LED matrix displays by generating multiplexing waveforms, gamma correction tables, and refresh control logic. The 10,320 LEs implement row decoders, color-depth mapping, and Brightness/Chromaticity correction while the M9K memory holds per-pixel lookup tables and animation frame buffers. With 88 I/Os the device can directly drive 16-bit RGB parallel panels plus row-select lines, eliminating an external shift-register chain. The LQFP exposed-pad package handles the moderate switching load of display multiplexing without an additional heatsink.

🔧

Portable Test & Measurement Instrument

The 10CL010YE144C6G acts as the capture and processing core in portable oscilloscope data loggers, logic analyzers, and protocol testers. Its 88 I/Os accept multiple digital probe channels sampled by on-chip PLLs, while the 10,320 LEs and 423 Kbit of M9K memory implement trigger logic, run-length compression, and USB packetization. The exposed-pad LQFP package fits compact handheld enclosures and dissipates typical 0.5 to 1 W logic loads through PCB copper without active cooling. Quartus Prime Lite provides free synthesis support that minimizes NRE cost for low-volume T&M products.

🖥️

I/O Expansion Companion to Host Processor

The 10CL010YE144C6G is widely deployed as a low-cost I/O expansion companion to ARM-based host processors in point-of-sale terminals, kiosk controllers, and industrial HMIs. The host CPU loads FPGA bitstreams and register maps over SPI or parallel, and the FPGA fans out GPIO, manages keypad scanning, drives character LCDs, and times pulse counters in hardware offload. The exposed-pad LQFP package simplifies field-repairable designs in service-depot environments, while 10,320 LEs leave headroom for future peripheral additions without an FPGA upgrade.

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What is the logic element count of the 10CL010YE144C6G?
The 10CL010YE144C6G contains 10,320 logic elements (LEs), according to the Intel Cyclone 10 LP device handbook. It also includes 423,936 bits of embedded memory organized as M9K blocks, suitable for buffer FIFOs, small lookup tables, and on-chip register files typical of low-cost industrial designs.
How many user I/O pins does 10CL010YE144C6G provide?
The 10CL010YE144C6G provides 88 user I/O pins in the 144-pin LQFP exposed-pad package. These I/Os are organized into multiple banks and support LVCMOS, LVTTL, SSTL, and LVDS standards, allowing direct interface to DDR/DDR2 memories and common low-voltage peripherals without external level shifters.
What package does the 10CL010YE144C6G use?
The 10CL010YE144C6G uses a 144-pin LQFP with an exposed thermal pad (also called EQFP-144). The exposed pad is the dominant heat-dissipation path and must be soldered to a PCB copper pour of at least 100 mm^2 to keep junction temperature within spec under typical loads.
Where can I buy the 10CL010YE144C6G online?
The 10CL010YE144C6G can be purchased from DigiKey, Mouser, LCSC Electronics, Suntsu, and other authorized distributors, with stock levels fluctuating by region. As of 2026-09-05, LCSC lists the part from $4.1793 in low quantities, and Micro-Semiconductor reports 6665 pieces in stock for immediate shipment.
What is the price of the 10CL010YE144C6G?
Pricing for the 10CL010YE144C6G starts at approximately $4.18 per unit at qty 1 and drops to roughly $2.60 at qty 1000, as of 2026-09-05 from authorized distributors. Volume pricing varies by lead time, packaging option (tray or tape-and-reel), and distributor stock; always request a formal quote for production quantities.
What is the lead time for 10CL010YE144C6G orders?
Authorized distributors including DigiKey and Mouser list 10CL010YE144C6G with same-day shipping for small quantities as of 2026-09-05. For production volumes above 1000 units, lead times typically range from 4 to 8 weeks depending on whether the order is fulfilled from distributor stock or factory backlog.
Is the 10CL010YE144C6G the same as 10CL010YE144C8G?
The 10CL010YE144C6G and 10CL010YE144C8G share the same 10,320-LE silicon die, the same 144-LQFP exposed-pad package, and identical pinout. They differ only in speed grade - the C8G is the slowest speed grade while C6G is faster, so C6G provides better Fmax and timing margin at the same cost.
What is the difference between 10CL010YE144C6G and 10CL006YE144C6G?
The 10CL010YE144C6G and 10CL006YE144C6G both use the 144-LQFP exposed-pad package, but the 10CL010 has 10,320 logic elements versus 6,272 for the 10CL006 - approximately 65% more logic capacity. Both share 88 user I/O pins and the same M9K memory block architecture, making them pin-compatible drops for scalable product families.
When should I choose 10CL010YE144C6G over 10CL006YE144C6G?
Choose the 10CL010YE144C6G when your design requires more than 6000 logic elements, larger on-chip memory, or more DSP multipliers - the 10CL010 provides roughly 65% more logic at the same price point. Choose 10CL006YE144C6G if your design fits in 6000 LEs and you want to optimize BOM cost or leave more logic headroom unused for future expansion.
What is the best drop-in replacement for 10CL010YE144C6G?
The best drop-in replacement for the 10CL010YE144C6G is the 10CL010YE144A7G, which shares the same 144-LQFP exposed-pad footprint and pinout but offers the industrial temperature grade (-40C to +85C) instead of commercial. The same Cyclone 10 LP silicon die is preserved, so timing closure and Quartus Prime compilation results are bit-for-bit identical.
Can a 10CL010YE144A7G replace the 10CL010YE144C6G without PCB changes?
Yes, the 10CL010YE144A7G is a true pin-compatible drop-in replacement for the 10CL010YE144C6G, sharing the same 144-LQFP exposed-pad package, the same pinout, and the same 10,320-LE silicon die. The only difference is the industrial temperature grade, which is a strict superset of commercial and requires no PCB layout change.
Where to download the 10CL010YE144C6G datasheet PDF?
The official 10CL010YE144C6G datasheet is available as the Cyclone 10 LP Device Handbook PDF on the Intel FPGA literature site at the URL listed in our data sources. The handbook covers electrical characteristics, pin tables, configuration timing, thermal specifications, and Quartus Prime programming guidelines for the entire Cyclone 10 LP family including the 10CL010 device.
Where can I find the 10CL010YE144C6G pinout?
The 10CL010YE144C6G pinout is documented in the Cyclone 10 LP Device Handbook pin tables, accessible from the Intel FPGA product page for the 10CL010 device. Quartus Prime also generates a per-design pinout file (.pin) during compilation which lists the exact pin assignments for your synthesized design.
What are the key specifications of 10CL010YE144C6G that engineers should know?
Engineers evaluating the 10CL010YE144C6G should focus on five key numbers: 10,320 logic elements, 423,936 bits of embedded M9K memory, 88 user I/Os, 144-LQFP exposed-pad package, and commercial 0C to +85C temperature range. Together these define the design envelope - capacity, interface breadth, manufacturability, and operating environment - for any Cyclone 10 LP 144-pin application.

Dados de referência de engenharia para 10CL010YE144C6G — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the 10CL010YE144C6G when you need 10,000+ logic elements in a surface-mountable LQFP package for cost-sensitive commercial-temperature designs such as I/O expansion, protocol bridging, motor control, video bridging, or LED display controllers. The exposed-pad 144-LQFP allows standard reflow soldering without BGA rework, making it ideal for low-NRE prototypes and small-to-medium production runs. Choose 10CL010YE144A7G instead if your enclosure sees temperatures outside 0 to +85 C, or 10CL010YE144C8G if timing margin is unimportant and you want the lowest-cost Cyclone 10 LP variant. If your design fits within 6,272 LEs, drop to 10CL006YE144C6G to save cost while keeping the same PCB footprint.

Comparação com alternativas

Parâmetro Este produto 10CL010YE144C8G 10CL010YE144A7G 10CL006YE144C6G 10CL006YE144C8G 10CL006YE144A7G
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same
Logic Elements 10,320 10,320 10,320 6,272 6,272 6,272
Embedded Memory (bits) 423,936 423,936 423,936 270,336 270,336 270,336
User I/Os 88 88 88 88 88 88
Speed Grade 6 (faster) 8 (slowest) 7 6 (faster) 8 (slowest) 7
Temperature Grade Commercial (0C to +85C) Commercial Industrial (-40C to +85C) Commercial Commercial Industrial
Parametric Match (vs target) 100% ~95% (slower speed grade) ~95% (industrial temp) ~80% (-39% logic, same package) ~75% (less logic, slower speed) ~75% (less logic, industrial temp)

Principais diferenciais

  • Lowest static power in 144-LQFP Cyclone 10 LP family (vs 10CL006YE144C6G)
  • Faster speed grade than the slowest Cyclone 10 LP variant (vs 10CL010YE144C8G)
  • Commercial temperature grade optimized for cost-sensitive designs (vs 10CL010YE144A7G)

Notas de projeto

Estimated: the 144-LQFP exposed-pad package has a typical theta_JA of approximately 25 C/W with a 100 mm^2 copper pour on the EP, per the Cyclone 10 LP thermal model. At a typical 0.7 W core dissipation (commercial temp grade), junction rise is approximately 17 C above ambient, well within the 0C to +85C commercial limit. For designs pushing 1.5 W or above, expand the EP copper pour to 250 mm^2 or add small top-side copper islands stitched with thermal vias to keep Tj below 100 C.

Estimated: Cyclone 10 LP core current at 1.2 V scales linearly with toggle rate; a typical design with 50% utilization at 100 MHz core clocks draws 0.5 to 0.8 A on VCCINT and approximately 50 mA per active I/O bank on VCCIO. Use the Quartus Prime PowerPlay early power estimator before final pin assignment, and provide a dedicated 1.2 V LDO (such as a 1.5 A part) with at least 22 uF of bulk plus 0.1 uF high-frequency decoupling within 5 mm of each VCCINT pin group.

Estimated: place one 0.1 uF X7R 0402 or 0603 decoupling capacitor adjacent to every VCCIO and VCCINT pin, with trace lengths under 5 mm. Stitch the EP copper with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) arranged in a 3x3 array under the package, plated shut or tented to prevent solder wicking during reflow. Keep JTAG and configuration signals (TCK, TMS, TDI, TDO, nSTATUS, nCONFIG, CONFIG_DONE, DCLK, DATA0, MSEL[2:0]) on the same PCB layer and avoid routing across plane splits to prevent configuration failures during power-up.

Estimated: the most common Cyclone 10 LP design error is omitting the exposed-pad (EP) solder connection, which causes thermal runaway and 15 to 25 C higher junction temperatures in production. Other frequent mistakes include driving MSEL[2:0] to the wrong mode for the chosen configuration scheme (AS vs PS vs JTAG), failing to pull nCONFIG up with a 10 kohm resistor, and using a shared VCCIO rail across banks that require different voltages. Always check the Quartus Prime pin planner output against the schematic before tape-out.

Estimated: route all single-ended I/O signals with 50 ohm controlled impedance referenced to the VCCIO plane, and keep differential pair lengths matched within 150 mil for LVDS signaling. The 144-LQFP package has 0.5 mm pitch, which permits escape routing on a 4-layer PCB using 4 mil traces and 8 mil spaces between LQFP pads without microvia or HDI stack-up. Add a ground ring around the JTAG header to reduce noise injection on TCK/TMS during boundary-scan testing.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

Cyclone 10 LP family is RoHS compliant per Intel product documentation; halogen-free status not stated in provided web data. AEC-Q100 not applicable because the part targets industrial/consumer FPGA applications, not automotive safety-critical designs.

Dados verificados em: 2026-09-05 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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Componentes & termos relacionados

Altera Intel 10CL010YE144C6G 10CL010YE144C8G 10CL010YE144A7G 10CL006YE144C6G Cyclone 10 LP Cyclone 10 FPGA Field-Programmable Gate Array PLD ASIC logic element M9K memory block Quartus Prime LQFP-144 EQFP-144 exposed pad JTAG LVDS AEC-Q100 RoHS REACH TSMC 60 nm
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