5CSEBA2U23I7 - Cyclone V SE SoC FPGA 25K LE | Intel/Altera
N.º da peça: 5CSEBA2U23I7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $124.32 | $124,32 |
| 10 | $112.5 | $1.125,00 |
| 100 | $95.8 | $9.580,00 |
| 250 | $88.1 | $22.025,00 |
| 500 | $78.4 | $39.200,00 |
5CSEBA2U23I7 Visão geral
What is an SoC FPGA? An SoC FPGA is a heterogeneous computing device that integrates a hard processor system (HPS) with an FPGA fabric on the same die. The architecture combines the deterministic real-time performance and parallel processing of FPGA logic with the sequential software execution of an application-class processor, allowing designers to partition workloads between hardware acceleration and software. Within Intel's Cyclone V family, the SE sub-series emphasizes low-power operation, integrated transceivers on higher-density devices, and processor-rich SoC variants tailored for industrial, motor control, video surveillance, and machine-to-machine (M2M) communications.
Key features of the 5CSEBA2U23I7 include 25K logic elements, 188 user I/O pins, embedded M10K memory blocks, embedded 18x18 multipliers (DSP blocks), hardware SDRAM controller in the HPS, and support for DDR2/DDR3/LPDDR2 external memory. The Cyclone V SE family supports a hardened memory controller, PCI Express Gen2 hard IP (on selected SKUs), and 3.125 Gbps transceivers on related packages. The 'B' suffix in 5CSEBA2U23I7 denotes the SE SoC variant with HPS, and the 'I7' speed/temperature grade indicates industrial temperature range (-40C to +100C) with -7 speed grade timing closure.
Architecturally, the device partitions into HPS (ARM Cortex-A9 dual core @ up to 800 MHz with NEON/FPU, 32 KB L1 per core, 512 KB shared L2, system MMU, JTAG) and FPGA fabric (logic elements, M10K RAM blocks, MLABs, DSP blocks, PLLs, clock networks, IO banks). Communication between HPS and FPGA is via AXI/AVALON bridges offering hundreds of megabytes per second of throughput. This makes the part ideal for applications where software runs on Linux/RTOS while acceleration (image processing, motor control loops, signal conditioning) executes in the FPGA.
Typical applications include industrial motor control (servo drives, robotic arms), broadcast and pro-AV video processing, factory automation PLCs, machine vision, military/aerospace signal processing, medical imaging, and embedded HMI. The wide temperature grade and 28 nm low-power process also suit outdoor and ruggedized deployments. Compared with discrete processor-plus-FPGA designs, the SoC FPGA reduces BOM, board area, power, and signal-integrity risk on the HPS-FPGA interconnect.
Designers should pay attention to multi-rail power sequencing (1.1 V core, 2.5 V/3.3 V HPS IO, FPGA IO banks), thermal dissipation at high toggle rates, and DDR3 trace-length matching. Quartus Prime (Standard or Pro) is the supported toolchain for synthesis, place-and-route, HPS firmware generation, and debugging. For software development, Intel provides the SoC EDS toolset based on GCC and DS-5 debugger.
This page synthesizes distributor pricing, same-brand alternatives in the Cyclone V SE family, and practical design notes that complement the official datasheet and product family guide.
Alternativas drop-in para 5CSEBA2U23I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA2U23I7 (mesmo formato e footprint) — diferindo em Package, Process Technology, HPS Maximum Frequency, Speed Grade, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA2U23C8N
✅ Drop-In✓ Em estoque
$55.5 / unidade
Ver ficha técnica →5CSEBA2U23C7N
✅ Drop-In✓ Em estoque
$76.9 / unidade
Ver ficha técnica →5CSEBA2U23C6N
✅ Drop-In✓ Em estoque
$88.4 / unidade
Ver ficha técnica →5CSEBA2U23A7N
✅ Drop-In✓ Em estoque
$99.5 / unidade
Ver ficha técnica →5CSEBA2U23C8SN
✅ Drop-In✓ Em estoque
$69.8 / unidade
Ver ficha técnica →5CSEBA2U23C7SN
✅ Drop-In✓ Em estoque
$13.73 / unidade
Ver ficha técnica →5CSEBA2U23I7 Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Supply Voltage | 1.1 V |
| Encapsulamento | 672-UBGA (UBG), 23x23 mm |
| User I/O Count | 188 |
| Faixa de temperatura de operação | -40C to +100C (Industrial, I7 speed/temperature grade) |
| Speed Grade | -7 |
| Memory Interface | DDR2 / DDR3 / LPDDR2 (HPS hard controller) |
| DSP Blocks | Embedded 18x18 multipliers |
| Embedded RAM | M10K blocks + MLABs |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Toolchain | Quartus Prime (Standard/Pro), SoC EDS |
Guia de Configuração de Pinos do 5CSEBA2U23I7 672-ubga (ubg), 23x23 mm
Configuração de pinos para 5CSEBA2U23I7 (pacote 672-ubga (ubg), 23x23 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA2U23I7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA2U23I7 é adequado para 8 aplicaçãos: Industrial Motor Control, Machine Vision Systems, Broadcast Video Processing, Factory Automation PLCs, Embedded HMI Controllers, Medical Imaging Edge Nodes, Smart Energy / Substation Gateways, Aerospace Avionics Subsystems.
Industrial Motor Control
The 5CSEBA2U23I7 fits industrial motor control with dual Cortex-A9 HPS running vector-control firmware plus 25K LE FPGA fabric executing current-loop and PWM generation at sub-microsecond latency. The 672-UBGA U23 package provides 188 user I/O for multi-axis encoder and resolver interfaces, while the HPS DDR3 controller serves high-bandwidth feedback logging. Industrial -40C to +100C temperature grade supports cabinet-mounted servo drives. Power: typical 1.1 V core draws under 3 W for HPS+light FPGA fabric; budget up to 5 W with full utilization.
Recomendado
Machine Vision Systems
The 5CSEBA2U23I7 supports machine vision pipelines where the FPGA fabric implements Bayer demosaic, gamma correction, and edge detection on camera-link or MIPI streams while the HPS runs Linux-based object-detection inference. 25K logic elements handle line buffers (M10K blocks) and parallel pixel operations at 1080p60 throughput. The U23 UBG package supplies sufficient IO for multiple parallel camera sensors. Industrial temp grade suits factory-floor deployment. Quartus Prime + OpenCL/HLS accelerate algorithm development cycles.
Recomendado
Broadcast Video Processing
The 5CSEBA2U23I7 is well-suited to broadcast pro-AV routers, format converters, and SDI/HDMI bridges. The HPS handles TCP/IP control planes and EDID management, while the FPGA fabric performs color-space conversion, frame-rate conversion, and ancillary-data processing at SDI rates up to 3 Gbps. 188 user I/O and DDR3 external memory enable multi-channel HD-SDI aggregation in a single chip. Industrial temperature range supports air-conditioned broadcast racks. Power and pin density fit 1U chassis with forced-air cooling.
Recomendado
Factory Automation PLCs
The 5CSEBA2U23I7 is an excellent fit for PLC platforms requiring IEC 61131-3 logic execution on Cortex-A9 HPS paired with FPGA hardware accelerators for high-speed counters, PWM, and EtherCAT slave PHY interfaces. 188 user I/O accommodate dozens of digital/analog I/O channels plus communication ports (EtherCAT, PROFINET, Modbus TCP). Industrial -40C to +100C temperature range supports outdoor control cabinets. SoC EDS toolchain enables deterministic RTOS scheduling alongside Linux management interfaces.
Recomendado
Embedded HMI Controllers
The 5CSEBA2U23I7 powers HMI panels where the HPS runs Qt/Linux graphical stacks while the FPGA fabric drives TFT/LVDS displays, touch controllers, and backlight PWM at deterministic timing. DDR3 external memory supports high-resolution framebuffers; 188 user I/O enable rich connectivity (USB, Ethernet, CAN, RS-485). Industrial temp grade supports factory-floor and outdoor kiosks. The 672-UBGA package fits behind 7-10 inch LCDs with adequate routing channels for BGA escape.
Recomendado
Medical Imaging Edge Nodes
The 5CSEBA2U23I7 fits portable medical imaging devices such as ultrasound front-ends and endoscopy processors. Dual Cortex-A9 cores handle patient-data encryption, USB host, and LCD preview while FPGA fabric performs beamforming, FFT, and image reconstruction. Industrial -40C to +100C temperature grade supports mobile carts and outdoor clinics. The 672-UBGA footprint allows compact 4-layer PCB designs. Note: medical safety certification (IEC 60601) is a system-level effort; this part is the compute engine only.
Recomendado
Smart Energy / Substation Gateways
The 5CSEBA2U23I7 serves IEC 61850 substation gateways where dual Cortex-A9 cores run secure Linux with VPN/firewall and the FPGA fabric handles GOOSE message generation, SV (Sampled Values) timestamping, and parallel-IED polling. Industrial temperature grade supports unheated outdoor cabinets; DDR3 controller supports large data-acquisition buffers. The HPS Cortex-A9 also handles DNP3/Modbus translation. Quartus Prime IP for IEEE 1588 v2 supports sub-microsecond time synchronization across substations.
Recomendado
Aerospace Avionics Subsystems
The 5CSEBA2U23I7 fits avionics line-replaceable units (LRUs) such as flight-data recorders, environmental controllers, and mission-computer peripherals. Industrial -40C to +100C temperature range and 28 nm low-power process suit altitude and temperature cycling. The HPS handles ARINC 429/664 protocol stacks and embedded security; FPGA fabric performs sensor I/O aggregation and radiation-mitigation by triple-modular redundancy. Note: avionics DO-254/DO-178 qualification is a system-level program; this part is the COTS compute element.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA2U23I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA2U23C8N | 5CSEBA2U23C7N | 5CSEBA2U23C6N | 5CSEBA2U23A7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-UBGA (U23) | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| HPS | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz |
| User I/O | 188 | 188 | 188 | 188 | 188 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) |
| Speed Grade | -7 | -8 | -7 | -6 | -7 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process / Family | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC |
Principais diferenciais
- Integrated HPS + FPGA on a single 28 nm die eliminates inter-chip interconnect signal-integrity risk (vs Discrete ARM MCU + standalone FPGA design)
- Industrial -40C to +100C temperature range covers most industrial and outdoor-embedded use cases (vs 5CSEBA2U23C8N (commercial 0C to +85C))
- -7 speed grade balances timing closure margin and cost (vs 5CSEBA2U23C6N (-6 speed grade))
- 672-UBGA U23 footprint shared across density/temp variants enables single PCB platform (vs Lower-density Cyclone V SE packages (e.g. U19 UBG))
Notas de projeto
The 5CSEBA2U23I7 requires multiple regulated rails: 1.1 V core, 2.5 V HPS IO, 3.3 V FPGA IO, and a separate 1.5 V/1.8 V DDR3 supply for the HPS memory controller. Power sequencing must follow Intel's recommended order (typically 1.1 V core first, then HPS IO, then FPGA IO) to avoid latch-up. Use dedicated LDO or DC-DC converters for each rail; shared regulators risk crosstalk and brown-out reset glitches. Estimated typical power at 25% utilization with HPS active is 2-3 W; budget up to 6 W for worst-case utilization and HPS at 800 MHz with peripherals active.
Although the 28 nm low-power process keeps static dissipation modest, dynamic power scales with toggle rate. Forced airflow is recommended in enclosed chassis; in sealed outdoor enclosures, derate junction-to-ambient thermal headroom by 30%. The 672-UBGA package has a thermal pad that must be soldered to a copper pour on the PCB with thermal vias to inner planes; thermal simulation is recommended for designs operating above 70C ambient. Industrial -40C to +100C grade allows junction temperature up to 125C - size the thermal path accordingly.
BGA escape routing for the 672-UBGA U23 package requires HDI PCB stackup (microvias or laser-drilled vias). Use 8-layer stackup minimum with dedicated ground and power planes adjacent to the BGA fanout. DDR3 traces must be length-matched within the HPS controller specifications (typically +/-25 mil within a byte lane, +/-50 mil across byte lanes). Reference Intel's Cyclone V SoC PCB design guidelines for trace widths, spacing, and via pattern. Use X-ray inspection post-assembly to verify BGA solder joint quality.
Do not assume the 5CSEBA2U23I7 is drop-in compatible with non-SE Cyclone V SoC SKUs - the SE family lacks some features present in the SX/ST variants (such as high-speed transceivers on certain packages). When migrating between Cyclone V families, regenerate pin assignments in Quartus Prime; pin functions are not identical across families even within the same U23 package. Verify the HPS clock configuration early in the design - the 800 MHz figure requires proper PLL setup with the correct reference oscillator and feedback divider.
Decouple each power rail with a combination of bulk, mid-frequency, and high-frequency capacitors placed as close as possible to the BGA balls. Typical Cyclone V SoC FPGA decoupling: one 220 uF bulk cap per major rail, 22 uF mid-frequency ceramics every 10-15 balls, and 100 nF high-frequency ceramics distributed across the BGA perimeter. Keep switching regulator nodes away from sensitive HPS clock inputs. Separate analog and digital grounds with a single-point connection under the HPS analog pins.
Informações de conformidade
RoHS and lead-free per distributor listings. AEC-Q100 qualification applies only to the 5CSEBA2U23A7N automotive variant. Conflict-minerals compliance per Intel/Altera supplier statements.
