5CSEBA2U23I7 - Cyclone V SE SoC FPGA 25K LE | Intel/Altera
MPN: 5CSEBA2U23I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $124.32 | $124.32 |
| 10 | $112.5 | $1,125.00 |
| 100 | $95.8 | $9,580.00 |
| 250 | $88.1 | $22,025.00 |
| 500 | $78.4 | $39,200.00 |
Drop-in alternatives for 5CSEBA2U23I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA2U23I7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Process Technology | 28 nm TSMC low-power |
| Core Supply Voltage | 1.1 V |
| Package | 672-UBGA (UBG), 23x23 mm |
| User I/O Count | 188 |
| Operating Temperature Range | -40C to +100C (Industrial, I7 speed/temperature grade) |
| Speed Grade | -7 |
| Memory Interface | DDR2 / DDR3 / LPDDR2 (HPS hard controller) |
| DSP Blocks | Embedded 18x18 multipliers |
| Embedded RAM | M10K blocks + MLABs |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Toolchain | Quartus Prime (Standard/Pro), SoC EDS |
5CSEBA2U23I7 672-ubga (ubg), 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSEBA2U23I7 (672-ubga (ubg), 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U23I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U23I7 is suitable for 8 applications: Industrial Motor Control, Machine Vision Systems, Broadcast Video Processing, Factory Automation PLCs, Embedded HMI Controllers, Medical Imaging Edge Nodes, Smart Energy / Substation Gateways, Aerospace Avionics Subsystems.
Industrial Motor Control
The 5CSEBA2U23I7 fits industrial motor control with dual Cortex-A9 HPS running vector-control firmware plus 25K LE FPGA fabric executing current-loop and PWM generation at sub-microsecond latency. The 672-UBGA U23 package provides 188 user I/O for multi-axis encoder and resolver interfaces, while the HPS DDR3 controller serves high-bandwidth feedback logging. Industrial -40C to +100C temperature grade supports cabinet-mounted servo drives. Power: typical 1.1 V core draws under 3 W for HPS+light FPGA fabric; budget up to 5 W with full utilization.
Recommended
Machine Vision Systems
The 5CSEBA2U23I7 supports machine vision pipelines where the FPGA fabric implements Bayer demosaic, gamma correction, and edge detection on camera-link or MIPI streams while the HPS runs Linux-based object-detection inference. 25K logic elements handle line buffers (M10K blocks) and parallel pixel operations at 1080p60 throughput. The U23 UBG package supplies sufficient IO for multiple parallel camera sensors. Industrial temp grade suits factory-floor deployment. Quartus Prime + OpenCL/HLS accelerate algorithm development cycles.
Recommended
Broadcast Video Processing
The 5CSEBA2U23I7 is well-suited to broadcast pro-AV routers, format converters, and SDI/HDMI bridges. The HPS handles TCP/IP control planes and EDID management, while the FPGA fabric performs color-space conversion, frame-rate conversion, and ancillary-data processing at SDI rates up to 3 Gbps. 188 user I/O and DDR3 external memory enable multi-channel HD-SDI aggregation in a single chip. Industrial temperature range supports air-conditioned broadcast racks. Power and pin density fit 1U chassis with forced-air cooling.
Recommended
Factory Automation PLCs
The 5CSEBA2U23I7 is an excellent fit for PLC platforms requiring IEC 61131-3 logic execution on Cortex-A9 HPS paired with FPGA hardware accelerators for high-speed counters, PWM, and EtherCAT slave PHY interfaces. 188 user I/O accommodate dozens of digital/analog I/O channels plus communication ports (EtherCAT, PROFINET, Modbus TCP). Industrial -40C to +100C temperature range supports outdoor control cabinets. SoC EDS toolchain enables deterministic RTOS scheduling alongside Linux management interfaces.
Recommended
Embedded HMI Controllers
The 5CSEBA2U23I7 powers HMI panels where the HPS runs Qt/Linux graphical stacks while the FPGA fabric drives TFT/LVDS displays, touch controllers, and backlight PWM at deterministic timing. DDR3 external memory supports high-resolution framebuffers; 188 user I/O enable rich connectivity (USB, Ethernet, CAN, RS-485). Industrial temp grade supports factory-floor and outdoor kiosks. The 672-UBGA package fits behind 7-10 inch LCDs with adequate routing channels for BGA escape.
Recommended
Medical Imaging Edge Nodes
The 5CSEBA2U23I7 fits portable medical imaging devices such as ultrasound front-ends and endoscopy processors. Dual Cortex-A9 cores handle patient-data encryption, USB host, and LCD preview while FPGA fabric performs beamforming, FFT, and image reconstruction. Industrial -40C to +100C temperature grade supports mobile carts and outdoor clinics. The 672-UBGA footprint allows compact 4-layer PCB designs. Note: medical safety certification (IEC 60601) is a system-level effort; this part is the compute engine only.
Recommended
Smart Energy / Substation Gateways
The 5CSEBA2U23I7 serves IEC 61850 substation gateways where dual Cortex-A9 cores run secure Linux with VPN/firewall and the FPGA fabric handles GOOSE message generation, SV (Sampled Values) timestamping, and parallel-IED polling. Industrial temperature grade supports unheated outdoor cabinets; DDR3 controller supports large data-acquisition buffers. The HPS Cortex-A9 also handles DNP3/Modbus translation. Quartus Prime IP for IEEE 1588 v2 supports sub-microsecond time synchronization across substations.
Recommended
Aerospace Avionics Subsystems
The 5CSEBA2U23I7 fits avionics line-replaceable units (LRUs) such as flight-data recorders, environmental controllers, and mission-computer peripherals. Industrial -40C to +100C temperature range and 28 nm low-power process suit altitude and temperature cycling. The HPS handles ARINC 429/664 protocol stacks and embedded security; FPGA fabric performs sensor I/O aggregation and radiation-mitigation by triple-modular redundancy. Note: avionics DO-254/DO-178 qualification is a system-level program; this part is the COTS compute element.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U23I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U23C8N | 5CSEBA2U23C7N | 5CSEBA2U23C6N | 5CSEBA2U23A7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-UBGA (U23) | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| HPS | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz |
| User I/O | 188 | 188 | 188 | 188 | 188 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) |
| Speed Grade | -7 | -8 | -7 | -6 | -7 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process / Family | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC | 28 nm Cyclone V SE SoC |
Key Differentiators
- Integrated HPS + FPGA on a single 28 nm die eliminates inter-chip interconnect signal-integrity risk (vs Discrete ARM MCU + standalone FPGA design)
- Industrial -40C to +100C temperature range covers most industrial and outdoor-embedded use cases (vs 5CSEBA2U23C8N (commercial 0C to +85C))
- -7 speed grade balances timing closure margin and cost (vs 5CSEBA2U23C6N (-6 speed grade))
- 672-UBGA U23 footprint shared across density/temp variants enables single PCB platform (vs Lower-density Cyclone V SE packages (e.g. U19 UBG))
Design Notes
The 5CSEBA2U23I7 requires multiple regulated rails: 1.1 V core, 2.5 V HPS IO, 3.3 V FPGA IO, and a separate 1.5 V/1.8 V DDR3 supply for the HPS memory controller. Power sequencing must follow Intel's recommended order (typically 1.1 V core first, then HPS IO, then FPGA IO) to avoid latch-up. Use dedicated LDO or DC-DC converters for each rail; shared regulators risk crosstalk and brown-out reset glitches. Estimated typical power at 25% utilization with HPS active is 2-3 W; budget up to 6 W for worst-case utilization and HPS at 800 MHz with peripherals active.
Although the 28 nm low-power process keeps static dissipation modest, dynamic power scales with toggle rate. Forced airflow is recommended in enclosed chassis; in sealed outdoor enclosures, derate junction-to-ambient thermal headroom by 30%. The 672-UBGA package has a thermal pad that must be soldered to a copper pour on the PCB with thermal vias to inner planes; thermal simulation is recommended for designs operating above 70C ambient. Industrial -40C to +100C grade allows junction temperature up to 125C - size the thermal path accordingly.
BGA escape routing for the 672-UBGA U23 package requires HDI PCB stackup (microvias or laser-drilled vias). Use 8-layer stackup minimum with dedicated ground and power planes adjacent to the BGA fanout. DDR3 traces must be length-matched within the HPS controller specifications (typically +/-25 mil within a byte lane, +/-50 mil across byte lanes). Reference Intel's Cyclone V SoC PCB design guidelines for trace widths, spacing, and via pattern. Use X-ray inspection post-assembly to verify BGA solder joint quality.
Do not assume the 5CSEBA2U23I7 is drop-in compatible with non-SE Cyclone V SoC SKUs - the SE family lacks some features present in the SX/ST variants (such as high-speed transceivers on certain packages). When migrating between Cyclone V families, regenerate pin assignments in Quartus Prime; pin functions are not identical across families even within the same U23 package. Verify the HPS clock configuration early in the design - the 800 MHz figure requires proper PLL setup with the correct reference oscillator and feedback divider.
Decouple each power rail with a combination of bulk, mid-frequency, and high-frequency capacitors placed as close as possible to the BGA balls. Typical Cyclone V SoC FPGA decoupling: one 220 uF bulk cap per major rail, 22 uF mid-frequency ceramics every 10-15 balls, and 100 nF high-frequency ceramics distributed across the BGA perimeter. Keep switching regulator nodes away from sensitive HPS clock inputs. Separate analog and digital grounds with a single-point connection under the HPS analog pins.
Compliance Information
RoHS and lead-free per distributor listings. AEC-Q100 qualification applies only to the 5CSEBA2U23A7N automotive variant. Conflict-minerals compliance per Intel/Altera supplier statements.
