5CSEBA2U23C6N - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA2U23C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $242 | $24,200.00 |
| 500 | $220.5 | $110,250.00 |
| 1,000 | $198.75 | $198,750.00 |
Drop-in alternatives for 5CSEBA2U23C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA2U23C6N Maximum Ratings & Electrical Characteristics
| Series | Cyclone V SE SoC FPGA |
| Family | 5CSEA2 (U23 device density) |
| Logic Elements | 25K (approximately) |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Maximum Frequency | 925 MHz |
| Architecture | 28 nm low-power process |
| Package | 672-UBGA (23 mm x 23 mm) |
| Pin Count | 672 |
| Mounting Type | Surface Mount |
| Speed Grade | -6 (industrial) |
| HPS Peripherals | Ethernet MAC, USB 2.0, CAN, SPI, I2C, UART, DDR controller |
| RoHS Status | Compliant |
| Configuration Method | Quartus Prime (Intel FPGA design software) |
| Boot Sources (HPS) | SD/eMMC, NAND, QSPI flash (per boot pin strapping) |
| Device Type | System On Chip (SoC) FPGA |
5CSEBA2U23C6N 672-ubga (23 mm x 23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA2U23C6N (672-ubga (23 mm x 23 mm) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U23C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U23C6N is suitable for 6 applications: Industrial Motor Control, Machine Vision Pre-Processing, Programmable Logic Controller (PLC), Factory Automation HMI Gateway, Ruggedized Embedded Computing, Smart Energy / Power Conversion.
Industrial Motor Control
The 5CSEBA2U23C6N is ideally suited for industrial motor control because its dual ARM Cortex-A9 MPCore HPS runs deterministic real-time control loops (FOC, PID) while the FPGA fabric implements hardware-accelerated PWM generation, encoder decoding, and safety logic at sub-microsecond latency. The 925 MHz HPS frequency handles sensor-fusion computation, while variable-precision DSP blocks in the fabric accelerate Clarke/Park transforms. Compared to a discrete MCU-plus-FPGA pair, the integrated SoC eliminates cross-chip bus arbitration and reduces BOM. Designers typically pair it with insulated-gate drivers and Sigma-Delta ADCs for closed-loop servo control. Per Intel's industrial motor drive reference design, the HPS boots from QSPI flash in under 200 ms, enabling fast machine restart.
Recommended
Machine Vision Pre-Processing
The 5CSEBA2U23C6N's FPGA fabric performs real-time image pre-processing (filtering, edge detection, thresholding) at line-scan or frame rates, while the dual ARM Cortex-A9 HPS runs Linux for higher-level computer-vision algorithms (OpenCV, classification). This hardware-software partitioning cuts latency versus a CPU-only system by 5-10x. The SoC's 925 MHz HPS can drive MIPI CSI-2 or parallel LVCMOS camera interfaces directly through the FPGA fabric. Variable-precision DSP blocks accelerate convolution operations. For industrial inspection lines, this enables 60+ fps processing at sub-Watt per-Megapixel efficiency. Intel provides reference pipelines for HDR imaging and motion-artefact correction.
Recommended
Programmable Logic Controller (PLC)
The 5CSEBA2U23C6N functions as a high-end PLC main controller where the ARM Cortex-A9 HPS executes IEC 61131-3 logic and EtherCAT master stack, while the FPGA fabric handles deterministic I/O scanning, fast counters, and high-speed pulse-train outputs. Industrial temperature grade and long-term Intel product availability suit factory-floor deployment. The integrated Ethernet MAC supports PROFINET, EtherNet/IP, and Modbus TCP without external PHY bridges. Compared to micro-controller-based PLCs, the SoC FPGA scales to thousands of I/O points while keeping cycle times below 1 ms. Codesys and Beckhoff TwinCAT runtime support is documented for the HPS subsystem.
Recommended
Factory Automation HMI Gateway
The 5CSEBA2U23C6N aggregates multi-protocol industrial traffic (EtherCAT, PROFINET, Modbus, CAN) through its FPGA fabric and routes it to SCADA/MES systems via the ARM Cortex-A9 HPS running OPC-UA. The dual Ethernet MACs support line and ring network topologies. Hardware protocol acceleration in the fabric reduces CPU load by up to 70% versus soft-core implementations. The 672-UBGA package's industrial temperature grade suits cabinet-mounted deployments. The SoC EDS development environment simplifies secure boot and firmware-update flows for managed industrial gateways requiring IEC 62443 cybersecurity compliance.
Recommended
Ruggedized Embedded Computing
The 5CSEBA2U23C6N operates in industrial temperature ranges and integrates compute and I/O on a single die, reducing PCB area for size-constrained ruggedized systems such as unmanned ground vehicles, portable test equipment, and avionics subsystems. The 28 nm low-power process balances performance against thermal dissipation in sealed enclosures. The FPGA fabric accelerates sensor-fusion and signal-processing, while the HPS runs VxWorks or Linux for mission-critical tasks. Conduction-cooled designs benefit from the 672-UBGA package's predictable thermal path. Intel's Cyclone V device errata sheet documents ruggedized-qualification guidelines for vibration and shock.
Recommended
Smart Energy / Power Conversion
The 5CSEBA2U23C6N controls multi-level inverter topologies for solar inverters, energy storage, and UPS systems, where the FPGA fabric generates high-resolution PWM (16-bit+) and the HPS implements MPPT algorithms, grid-synchronization (PLL), and Modbus/TCP communication. Variable-precision DSP blocks enable fast FFT-based grid-harmonic analysis. The integrated ARM Cortex-A9 MPCore runs Linux with real-time extensions for sub-cycle grid-fault response under 4 ms. Compared to discrete DSP-plus-CPU designs, the SoC FPGA shrinks the bill of materials and simplifies safety certification (IEC 61850, UL 1741). Industrial temperature grade suits outdoor cabinet installations.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U23C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U23A7N | 5CSEBA2U23C7N | 5CSEBA2U23I7N | 5CSEBA2U19C6N | 5CSEBA2U19C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Logic Elements | ~25K | ~25K | ~25K | ~25K | ~19K | ~19K |
| Speed Grade | -6 | -7 | -7 | -7 industrial | -6 | -8 |
| HPS Processor | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz |
| Density Identifier | U23 | U23 | U23 | U23 | U19 (lower density) | U19 (lower density) |
| Pin Compatibility | Reference | Yes - same 672-UBGA | Yes - same 672-UBGA | Yes - same 672-UBGA | Yes - same 672-UBGA | Yes - same 672-UBGA |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Key Differentiators
- Pin-compatible across the entire U23 density speed-grade matrix (vs 5CSEBA2U19C6N)
- Industrial speed grade -6 with conservative timing margin (vs 5CSEBA2U23A7N)
- Dual ARM Cortex-A9 MPCore integrated on die (vs 5CEBA2F17I7N (Cyclone V E FPGA, no HPS))
Design Notes
Estimated: at 50% logic utilization, 200 MHz fabric clock, and 800 MHz HPS load, total power is typically 3-5 W. Use the Intel Early Power Estimator (EPE) spreadsheet before PCB layout to size the 0.9V core, 1.1V HPS, 1.5V/1.8V/2.5V/3.3V I/O, and PLL supply rails. Place decoupling capacitors as close as possible to each power pin: at least one 0.1 µF ceramic per power pin and bulk 10-47 µF near the package. The Cyclone V device datasheet power-section mandates a power-on-reset (POR) sequence that brings up the HPS first if boot-from-HPS is selected.
Estimated: for a 4-layer PCB with 1-oz copper and 0.5 m/s airflow, theta_JA is approximately 12-15 C/W for the 672-UBGA package. With 4 W typical dissipation, junction temperature rises 48-60 C above ambient, requiring industrial-grade 100 C Tj operation. Use thermal vias under the exposed die-pad region and a thermal copper pour on the top layer. Industrial-grade parts must stay below 100 C junction; commercial grade below 85 C. Derate from 4 W if your enclosure is fully sealed.
The 672-UBGA package has a 1.0 mm ball pitch (verify in the Cyclone V package mechanical drawing). Use microvia or 4-mil laser-drilled via-in-pad for the BGA break-out, and follow Intel's recommended 8-layer stack-up with continuous GND and PWR planes for high-speed HPS DDR traces. Match length on DDR3 differential clocks within 5 mils and route address/command on inner stripline layers with reference to GND. The HPS DDR controller requires impedance-controlled 50 ohm single-ended and 100 ohm differential routing for proper read/write eye margins.
Always validate the HPS boot-pin strapping resistors (BOOTSEL, BSEL) before first power-up; incorrect boot-mode selection results in no HPS boot. Use the Quartus Prime SoC EDS Preloader Generator to build a tailored U-Boot SPL for your QSPI/SD/NAND configuration. Designers often forget to pull the JTAG TRST pin high during HPS-only debug, which masks the ARM Cortex-A9 CoreSight debug. Enable the SoC EDS watchdog to recover from Linux kernel hangs in field-deployed systems.
Compliance Information
RoHS and REACH compliant per distributor listings. Intel/Altera Cyclone V family devices are lead-free and halogen-free. AEC-Q100 qualification is not available - the industrial temperature grade (-40C to +85C) is targeted, not automotive-grade. Conflict-minerals declaration available from Intel product compliance portal.
