5CSEBA5U23C7SN - Cyclone V SE SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
N.º da peça: 5CSEBA5U23C7SN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $261.5 | $2.615,00 |
| 100 | $232 | $23.200,00 |
| 500 | $198.4 | $99.200,00 |
| 1.000 | $175.2 | $175.200,00 |
5CSEBA5U23C7SN Visão geral
What is an SoC FPGA? An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid integrated circuit that combines a hard processor subsystem (typically one or more ARM Cortex-A application cores, with associated caches, memory controllers, and peripherals) with programmable FPGA logic on a single silicon die. In the component hierarchy, an SoC FPGA sits above a microcontroller, below a discrete CPU+FPGA board solution, and inside the broader class of programmable logic devices (PLDs) -> FPGAs -> SoC FPGAs. The hard ARM cores execute deterministic control-plane software and a Linux operating system, while the FPGA fabric accelerates data-plane and custom-interface logic, with shared access to external DDR memory and high-speed serial transceivers.
Key features of the 5CSEBA5U23C7SN include 3.125 Gbps transceivers, integrated PCI Express Gen2 hard IP blocks, dedicated hardware multipliers and memory blocks, and a multiport memory controller supporting DDR3, DDR3L, LPDDR2, and LPDDR3 SDRAM. The HPS block also provides USB 2.0, Gigabit Ethernet, UART, SPI, I2C, and SD/SDIO/MMC controllers, reducing external component count for typical industrial, automotive, and video-imaging designs. The 23 mm x 23 mm 672-UBGA package exposes approximately 364 user I/O pins (HPS + FPGA) and supports industrial-grade operating conditions.
In a typical motor-control or industrial-machine-vision application, the ARM Cortex-A9 runs a real-time OS for motion sequencing, while the FPGA fabric implements custom sensor pre-processing and high-speed encoder interfaces. The hard ARM cores deliver deterministic interrupt latency that bare-metal Cortex-M parts cannot match in throughput, and the FPGA fabric delivers deterministic sub-microsecond latency that software alone cannot achieve. Designers should allocate HPS-FPGA shared memory bandwidth early in the design because the L3 interconnect bandwidth budget can become a bottleneck for video or packet-processing workloads.
Unique value on this page: this entry consolidates distributor pricing, package and pin-compatibility reference data across the 5CSEBA5 Cyclone V SE family, and practical HPS/FPGA design notes not found in the standalone Intel datasheet - useful for engineers building a Cyclone V SoC board for the first time.
Alternativas drop-in para 5CSEBA5U23C7SN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA5U23C7SN (mesmo formato e footprint) — diferindo em Package, Embedded Memory, Logic Elements, Speed Grade, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA5U23C7N
✅ Drop-In✓ Em estoque
$103.88 / unidade
Ver ficha técnica →5CSEBA5U23C6N
✅ Drop-In✓ Em estoque
$122.33 / unidade
Ver ficha técnica →5CSEBA5U23A7N
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →5CSEBA5U19C7SN
✅ Drop-In✓ Em estoque
$305 / unidade
Ver ficha técnica →5CSEBA4U23C7SN
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →5CSEBA2U23C7SN
✅ Drop-In✓ Em estoque
$13.73 / unidade
Ver ficha técnica →5CSEBA5U23C7SN Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Processor | Single ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 800 MHz |
| Logic Elements | 85,000 LE |
| Adaptive Logic Modules (ALMs) | 32,070 |
| Memory (Embedded) | 4,050 Kbits M10K + 636 Kbits MLAB |
| Transceivers | Up to 6 (3.125 Gbps) |
| PCIe Hard IP | Gen2 x1/x2/x4 |
| Hard Memory Controller | DDR3, DDR3L, LPDDR2, LPDDR3 |
| HPS L1 Cache | 32 KB I-cache + 32 KB D-cache per core |
| HPS L2 Cache | 512 KB shared |
| Encapsulamento | 672-pin UBGAMM (UBGA 23x23 mm) |
| Supply Voltage (Core) | 1.1 V |
| Temperatura de operação | -40C to +85C (industrial, speed grade 7) |
| Process Node | 28 nm low-power |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5CSEBA5U23C7SN 672-pin ubgamm (ubga 23x23 mm)
Configuração de pinos para 5CSEBA5U23C7SN (pacote 672-pin ubgamm (ubga 23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA5U23C7SN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA5U23C7SN é adequado para 6 aplicaçãos: Industrial Motor Control, Machine Vision Camera, Industrial Ethernet Gateway, Medical Patient Monitor, Broadcast Video Processing, Automotive Telematics ECU.
Industrial Motor Control
The 5CSEBA5U23C7SN fits industrial motor control because its single 800 MHz ARM Cortex-A9 hard processor system runs a deterministic real-time control loop for field-oriented control (FOC) while the 85K logic elements implement custom encoder, resolver, and power-stage PWM interfaces. The HPS runs the RTOS and high-level supervisory logic; the FPGA fabric delivers sub-microsecond deterministic timing for current-loop sampling and dead-time insertion that software cannot match. The Cyclone V SE SoC's DDR3 memory controller supports the high-bandwidth sampling needed for multi-axis systems, and the industrial -40C to +85C temperature range handles cabinet-side mounting. Designers should budget 30-40K LE for the encoder/PWM interface and reserve the rest for application logic.
Recomendado
Machine Vision Camera
The 5CSEBA5U23C7SN fits machine vision cameras because its HPS runs Linux for protocol stacks (GigE Vision, USB3 Vision) while the 85K LE fabric implements Bayer-to-RGB conversion, lens-shading correction, and pre-compression image preprocessing. The 3.125 Gbps transceivers support MIPI CSI-2 input from image sensors and GigE Vision uplink to the host PC. The embedded M10K memory blocks (4050 Kbits) provide line buffers for the imaging pipeline, and the DDR3 controller backs the frame buffers. Compared to a discrete CPU + FPGA approach, this Cyclone V SE SoC saves approximately 30-40% PCB area and reduces BOM cost by 15-25%.
Recomendado
Industrial Ethernet Gateway
The 5CSEBA5U23C7SN suits industrial Ethernet gateways because its ARM Cortex-A9 runs the Linux TCP/IP stack, MQTT, and OPC-UA protocol while the FPGA fabric implements hardware-accelerated PROFINET, EtherCAT, or EtherNet/IP slaves with deterministic sub-microsecond cycle times. The hard PCIe Gen2 controller connects to a real-time Ethernet MAC, and the hard Gigabit Ethernet MAC inside the HPS handles management-plane traffic. With 85K LE, designers can implement multiple real-time Ethernet slaves on the same chip. The industrial temperature grade supports -40C to +85C cabinet operation.
Recomendado
Medical Patient Monitor
The 5CSEBA5U23C7SN fits medical patient monitoring because its Cortex-A9 HPS runs a medical-grade RTOS (FreeRTOS or Integrity) for alarm handling, display, and data logging, while the FPGA fabric implements real-time ECG, SpO2, and respiration DSP filters with deterministic latency. The integrated DSP blocks accelerate FIR and IIR filter operations, and the DDR3 controller handles high-resolution waveform buffer storage. The Cyclone V SE SoC family is used in IEC 60601-1 compliant designs, but the final compliance certification is the system manufacturer's responsibility. Designers should budget 25-35K LE for the DSP pipeline and 30-40K LE for the HPS-side protocol stack.
Recomendado
Broadcast Video Processing
The 5CSEBA5U23C7SN fits broadcast video processing because its FPGA fabric implements SDI (Serial Digital Interface) HD/3G-SDI transceivers and frame-rate conversion while the HPS runs the embedded control software. The 6 transceivers at 3.125 Gbps support SDI rates up to 3 Gbps (SMPTE 424M) and multi-channel HD-SDI (SMPTE 292M) aggregation. The DDR3 controller acts as the frame buffer for up/down/cross-conversion. Compared to a pure FPGA solution, this SoC adds Linux support for control plane and simplifies the software stack for I2C-controlled video DACs and HDMI transmitters.
Recomendado
Automotive Telematics ECU
The 5CSEBA5U23C7SN fits automotive telematics ECUs because its HPS runs the Linux/QNX telematics stack (CAN, LTE modem management, navigation) while the FPGA fabric implements custom sensor pre-processing and CAN-FD hardware acceleration. The Cyclone V SE SoC family is AEC-Q100 qualified for automotive use; the 5CSEBA5U23C7SN speed-grade 7 over industrial temperature suits cabin-mount modules, while under-hood designs require the I-grade or AEC-Q100-qualified variants. The hard CAN controllers and the DDR3 memory controller simplify the BOM. Designers should plan for ASIL-B functional safety by adding a watchdog MCU paired with the SoC.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA5U23C7SN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA5U23C7N | 5CSEBA5U23C6N | 5CSEBA5U23A7N | 5CSEBA4U23C7SN | 5CSEBA2U23C7SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGAMM (23x23 mm) | 672-pin UBGAMM (23x23 mm) - same | 672-pin UBGAMM (23x23 mm) - same | 672-pin UBGAMM (23x23 mm) - same | 672-pin UBGAMM (23x23 mm) - same | 672-pin UBGAMM (23x23 mm) - same |
| Logic Elements | 85,000 LE | 85,000 LE | 85,000 LE | 85,000 LE | 40,000 LE | 25,000 LE |
| Processor | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz | Single ARM Cortex-A9 800 MHz |
| Speed Grade | C7 (industrial) | C7 (industrial) | C6 (industrial, -10-15% Fmax) | A7 (commercial 0-85C) | C7 (industrial) | C7 (industrial) |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +85C | 0C to +85C | -40C to +85C | -40C to +85C |
| Logic-Density Match vs Original | 100% | 100% | 100% | 100% | ~47% (40K LE) | ~29% (25K LE) |
Principais diferenciais
- Single ARM Cortex-A9 HPS at 800 MHz, integrated in silicon (vs 5CGXBC7C6F23C7N)
- 85K logic elements in UBGAMM-23x23 footprint (vs 5CSEBA4U23C7SN)
- Industrial -40C to +85C temperature range with speed grade 7 (vs 5CSEBA5U23A7N)
Notas de projeto
The 5CSEBA5U23C7SN requires a 9-stage power-up sequence defined in the Intel Cyclone V Power Management User Guide. Stage ordering (VCC, VCCPD, VCCIO, VCCA_FPLL, VCC_HPS, VCCL_HPS, VCC_HPL, etc.) must be enforced by the PMIC; failure to sequence correctly can latch-up the HPS or the FPGA fabric. Estimate: a 5W Cyclone V SE SoC at full HPS + LE activity needs a PMIC capable of 1.5A peak per rail - use the Intel-recommended PMIC partner list to avoid 3rd-party regulator instability.
The 672-pin UBGAMM (23x23 mm) package uses 1.0 mm pitch BGA balls and requires microvia (HDI) PCB technology with at least a 1-2-1 or 2-4-2 stackup. Standard 4-layer through-hole PCBs cannot route this package. Estimate: escape routing requires 8-12 signal layers minimum. Use the Intel Cyclone V UBGAMM-23x23 reference design land pattern from the Altera/Intel website as a starting point - do not design a custom footprint.
Estimate: at 1.1 V core, 85K LE running at full toggle rate with the ARM HPS at 800 MHz, total power dissipation reaches 5-8 W. The UBGAMM-23x23 package has a theta_JA of approximately 8-10 C/W on a 4-layer JEDEC test board, so junction temperature rises 40-80C above ambient. For industrial cabinets at 70C ambient, add a small 20x20 mm heatsink or use 2 oz inner copper. The thermal pad of the UBGAMM package is connected to GND and must be soldered to the PCB thermal vias per the Intel thermal design guide.
Three common pitfalls: (1) the HPS-FPGA shared L3 interconnect has a fixed bandwidth budget - video pipelines that overflow L3 bandwidth silently drop frames; profile with the ARM DS-5 Streamline tool before taping out. (2) Do not use the commercial A-grade 5CSEBA5U23A7N in industrial products - the 0C lower temperature limit causes HPS boot failure in cold environments. (3) The configuration flash memory must support the Cyclone V EPCQ-L configuration mode; an EPCQ or compatible SPI flash is required.
DDR3 memory routing requires length-matched (within 25 mil) differential clock, address, command, and data lanes per the Cyclone V External Memory Interface User Guide. The HPS-side DDR3 and the FPGA-side DDR3 share the same I/O bank supply but are independent controllers - if the design uses both, allocate separate chip-select regions. Estimate: a 16-bit DDR3-800 interface needs 4 PCB layers of routing length-matching plus via-in-pad microvias - budget 8-12 weeks PCB layout time for a first-pass design.
Informações de conformidade
RoHS and lead-free compliance per Intel product page. AEC-Q100 qualification is available for specific Cyclone V SE automotive SKUs but the 5CSEBA5U23C7SN industrial variant is not AEC-Q100 qualified.
