5CSEBA2U23C7SN - Cyclone V SE SoC FPGA 25K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA2U23C7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $21.45 | $21.45 |
| 10 | $19.31 | $193.10 |
| 100 | $17.16 | $1,716.00 |
| 500 | $15.44 | $7,720.00 |
| 1,000 | $13.73 | $13,730.00 |
Drop-in alternatives for 5CSEBA2U23C7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA2U23C7N
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View Datasheet →5CSEBA2U23C6N
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View Datasheet →5CSEBA2U23A7N
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View Datasheet →5CSEBA2U19C7SN
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View Datasheet →5CSEBA2U19C7N
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View Datasheet →5CGXBC7C6F23C7N
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View Datasheet →5CSEBA2U23C7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25K |
| Processor Core | Single ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 800 MHz |
| Package | 672-UBGA (23x23 mm) |
| Pin Count | 672 |
| Embedded Memory | 1.4 Mbits |
| Speed Grade | -7 |
| Temperature Grade | Industrial |
| Process Technology | 28 nm low-power |
| Mounting Type | Surface Mount (BGA) |
| Transceivers | Integrated high-speed transceivers |
| Hard Memory Controller | DDR3 (via HPS) |
| MSL Level | 3 |
| RoHS Status | Compliant |
5CSEBA2U23C7SN 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA2U23C7SN (672-ubga (23x23 mm) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U23C7SN.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U23C7SN is suitable for 6 applications: Industrial Motor Control, Factory Automation Gateway, Video Processing Pipeline, Software Defined Radio (SDR), Portable Medical Instrumentation, IoT Edge Gateway.
Industrial Motor Control
The 5CSEBA2U23C7SN fits industrial motor control because its 800 MHz ARM Cortex-A9 handles the FOC (field-oriented control) software loop while the 25K LE FPGA fabric implements high-resolution PWM, encoder quadrature decoding, and safety shutoff hardware. The single-core HPS runs Linux with PREEMPT_RT for the slow control loop, while FPGA logic deterministically samples current sensors at 100 kHz without jitter. Hardened DDR3 controller simplifies memory subsystem design, and the industrial temperature grade ensures operation on the factory floor. Companion parts include ACS71020 current sensor and AMT103 encoder.
Recommended
Factory Automation Gateway
For factory automation gateways, the 5CSEBA2U23C7SN integrates industrial Ethernet protocols (EtherCAT, PROFINET) on the HPS side while the FPGA fabric handles time-critical I/O such as digital input sampling and pulse-stretching. The 800 MHz Cortex-A9 runs a containerized protocol stack (e.g., Docker on Yocto Linux), and the FPGA fabric implements a deterministic I/O hub bridging legacy fieldbus to OPC UA. Single-chip integration reduces bill-of-materials cost versus a discrete processor+FPGA design. The 672-UBGA package suits ruggedized industrial housings.
Recommended
Video Processing Pipeline
The 5CSEBA2U23C7SN handles video processing where the FPGA fabric performs pixel-rate operations (color space conversion, scaling, gamma correction) while the ARM core runs the application stack and network protocols. The 1.4 Mbit embedded memory buffers multiple lines of 720p video, and HPS-FPGA shared memory enables zero-copy pipeline handoff. The integrated transceivers support Camera Link or MIPI CSI-2 input via FPGA GPIO bridges. This architecture suits industrial inspection cameras and video conferencing endpoints.
Recommended
Software Defined Radio (SDR)
For SDR applications, the 5CSEBA2U23C7SN provides FPGA fabric for the digital down-conversion and modulation/demodulation paths, while the ARM Cortex-A9 runs the MAC layer and network stack. The integrated high-speed transceivers accept ADC samples at 100+ MSPS, and the FPGA fabric implements FIR filters and FFT engines in parallel. The HPS hosts a lightweight Linux (Buildroot) running GNU Radio companion blocks. This partition suits portable SDR prototypes and small-cell wireless infrastructure.
Recommended
Portable Medical Instrumentation
In portable medical devices such as patient monitors or ultrasound front-ends, the 5CSEBA2U23C7SN pairs ARM Cortex-A9 processing with FPGA-accelerated signal conditioning. The FPGA fabric implements FIR decimation and envelope detection for biosignals, while the HPS runs the user interface and communications (BLE/Wi-Fi). Industrial temperature grade supports clinical environments, and the 28 nm low-power process enables battery operation. The 672-UBGA package fits compact handheld enclosures with 6-layer PCB stack-ups.
Recommended
IoT Edge Gateway
For IoT edge gateways, the 5CSEBA2U23C7SN aggregates sensor data on the ARM Cortex-A9 HPS running lightweight container orchestration (e.g., K3s), while the FPGA fabric implements time-sensitive industrial protocols and pre-processing. Hardened DDR3 controller and Ethernet MAC reduce external component count, while integrated transceivers provide isolated fieldbus connectivity. Power consumption fits fanless enclosures, and the 23x23 mm 672-UBGA package fits DIN-rail housings. Suitable for smart-factory and building-automation gateways.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U23C7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U23C7N | 5CSEBA2U23C6N | 5CSEBA2U23A7N | 5CSEBA2U19C7SN | 5CSEBA2U19C7N | 5CGXBC7C6F23C7N |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA family - same | 672-UBGA family - same | 672-FBGA equivalent - same BGA class |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V GX SoC |
| Logic Elements | 25K | 25K | 25K | 25K | 19K | 19K | [DATA_NEEDED] |
| Processor Core | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 | Single ARM Cortex-A9 |
| Speed Grade | -7 | -7 | -6 | A7 | -7 | -7 | -6 |
| Maximum HPS Clock | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Unit Price (1 pc) | $21.45 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Single-core ARM Cortex-A9 HPS paired with 25K LE in 672-UBGA (vs 5CSEBA2U19C7SN)
- -7 speed grade timing margin over -6/A7 alternatives (vs 5CSEBA2U23C6N)
- Cyclone V SE SoC integrates ARM HPS for reduced BOM (vs 5CGXBC7C6F23C7N)
Design Notes
The 672-UBGA package requires at least a 6-layer PCB with 1.0 mm ball pitch. Use Intel's Cyclone V pin connection guidelines to fan out the BGA: outer balls route on the top layer, inner balls break out through microvias to inner layers. Decoupling capacitors must be placed within 100 mil of each power ball cluster; use 0402-size 0.1 µF X7R ceramics with 10 µF bulk on each rail.
Estimated: With VCC_HPS at 1.0 V drawing 1.5 A under load and VCC_FPGA_CORE at 1.1 V drawing 0.8 A, the total core power is approximately 2.4 W. Combined with I/O power (DDR3 PHY, transceivers) the total board consumption typically reaches 5-8 W. Use a multi-rail PMIC such as the Intel EN6347QI or LTM4677 to sequence the 1.0 V HPS, 1.1 V FPGA core, and 2.5 V/3.3 V I/O rails in the correct order per the datasheet.
The 5CSEBA2U23C7SN requires correct boot mode selection via MSEL pins at power-up; incorrect MSEL strapping causes HPS boot failure with no JTAG-visible error. The FPGA configuration source (typically HPS) must be loaded with a valid SOF/PERIPH bitstream. Ensure the JTAG chain order is preserved if other devices share the TCK/TMS lines. DDR3 traces require 50 Ω impedance control and length matching within 25 mil.
Compliance Information
RoHS compliant per Intel product declaration. Industrial temperature grade; not AEC-Q100 qualified (not automotive).
