Intel

5CSXFC6C6U23C6N - Cyclone V SX SoC FPGA, 110K LE, 925MHz | Intel

MPN: 5CSXFC6C6U23C6N ✓ Active
In Stock Ships in 1-3 business days
1.1 V Vdss 672-UBGA (UFBGA) 23x23 mm Package 925 MHz Speed approximately 4,160 Kbits Memory
From $285 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $412 $412.00
10 $388.5 $3,885.00
100 $355 $35,500.00
500 $318.75 $159,375.00
1,000 $285 $285,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 5CSXFC6C6U23C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

5CSXFC6C6U23A7N

✅ Drop-In
Intel
📦 672-UBGA (UFBGA) 23x23 mm
Cyclone V SX SoC FPGA · 110,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 5,140 Kbit · 224 · 364 LVDS-capable pins · 6 (up to 3.125 Gbps) · 672-pin UBGAFBGA (23 x 23 mm)

✓ In Stock

$328.75 / Unit

View Datasheet →

5CSXFC6C6U23C7N

✅ Drop-In
Intel
📦 672-UBGA (UFBGA) 23x23 mm
Cyclone V SX SoC FPGA · 110,000 · Dual ARM Cortex-A9 MPCore · 800 MHz · 5,140 Kbits · 224 · 6 (up to 3.125 Gbps) · 145

✓ In Stock

$215.8 / Unit

View Datasheet →

5CSXFC6C6U23C8N

✅ Drop-In
Intel
📦 672-UBGA (UFBGA) 23x23 mm
Cyclone V SX (SoC FPGA) · Cyclone V SX · MCU + FPGA (Hard Processor System + FPGA fabric) · 110,000 · 28 nm low-power (TSMC) · 1.1 V · Dual-core ARM Cortex-A9 MPCore with CoreSight · 600 MHz

✓ In Stock

$445 / Unit

View Datasheet →

5CSXFC5C6U23C6N

✅ Drop-In
Intel
📦 672-UBGA (UFBGA) 23x23 mm
Cyclone V SX SoC FPGA · 85,000 LE · 32,070 ALM · 3.88 Mbit · 145 I/O · Dual ARM Cortex-A9 MPCore with CoreSight · 2 · 925 MHz

✓ In Stock

$175 / Unit

View Datasheet →

5CSXFC4C6U23C6N

✅ Drop-In
Intel
📦 672-UBGA (UFBGA) 23x23 mm
Cyclone V SX · Cyclone V SoC FPGA · System On Chip (SoC) FPGA · MCU, FPGA (HPS + Logic) · 40,000 · 224 · Dual ARM Cortex-A9 MPCore with CoreSight · 925 MHz

✓ In Stock

$215.4 / Unit

View Datasheet →

5CSXFC6C6U23C6N Maximum Ratings & Electrical Characteristics

Series Cyclone V SX SoC FPGA
Family Cyclone V SX
Logic Elements 110,000
Processor Core Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Fabric Frequency 925 MHz
Process Technology 28 nm low-power
Core Supply Voltage 1.1 V
Package 672-UBGA (UFBGA) 23x23 mm
Mounting Type Surface Mount (BGA)
Operating Temperature 0 C to +85 C (commercial)
Number of I/O 145 (per JAK Electronics comparison)
Embedded Memory approximately 4,160 Kbits
DSP Blocks approximately 112
RoHS Status Compliant
MSL Level 3 (per typical BGA handling)

5CSXFC6C6U23C6N 672-ubga (ufbga) 23x23 mm Pin Configuration Guide

Complete pinout information for 5CSXFC6C6U23C6N (672-ubga (ufbga) 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

672-ubga (ufbga) 23x23 mm package pinout diagram for 5CSXFC6C6U23C6N

No detailed pinout data available for 5CSXFC6C6U23C6N.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 5CSXFC6C6U23C6N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5CSXFC6C6U23C6N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Industrial Drives, Software Defined Radio Front End, Factory Automation Controllers, Broadcast Video Processing, Automotive ADAS Prototyping.

🏭

Industrial Machine Vision

The 5CSXFC6C6U23C6N fits industrial machine vision because the Dual ARM Cortex-A9 HPS runs the vision stack (OpenCV, Linux, image acquisition) while the 110K LE FPGA fabric implements parallel pixel pipelines, Bayer demosaicing, and object detection at line rate. The integrated HPS-FPGA AXI bridges deliver 128-bit data paths between the ARM cores and custom datapath, eliminating external processor-to-FPGA interconnect. The 672-UBGA package exposes sufficient GPIO and high-speed transceiver lanes to drive dual Camera Link or MIPI CSI-2 cameras simultaneously. Industrial temperature operation and the 28 nm low-power process suit 24/7 factory deployments.

🏭

Motor Control and Industrial Drives

The 5CSXFC6C6U23C6N is well matched to industrial motor control because the FPGA fabric executes field-oriented control (FOC), PWM generation, and encoder feedback at sub-microsecond latency, while the ARM Cortex-A9 HPS runs the higher-level motion profiler and EtherCAT/MODBUS stack. The approximately 112 DSP blocks provide ample multiply-accumulate throughput for the current-loop math, and the on-chip DDR3 controller streams parameter tables without external memory contention. The wide 145-I/O budget in UFBGA-672 supports three-phase inverter feedback and resolver excitation simultaneously.

📱

Software Defined Radio Front End

The 5CSXFC6C6U23C6N supports software defined radio front ends because the FPGA fabric implements DDC/DUC, channelization filters, and digital predistortion at baseband sample rates, offloading the ARM Cortex-A9 HPS to handle network protocols and control plane. The Cyclone V SX fabric runs approximately 925 MHz internal performance, suitable for LTE and tactical radio baseband. Hard transceivers on the device family provide the SerDes lanes needed for ADC/DAC interfacing, while the HPS runs Linux for waveform configuration. Lower static power than Arria/Cyclone 10 GX parts makes it attractive for portable SDR.

🏭

Factory Automation Controllers

The 5CSXFC6C6U23C6N suits factory automation controllers because the dual ARM Cortex-A9 MPCore runs a deterministic RTOS or LinuxCNC for PLC logic and HMI, while the FPGA fabric implements deterministic EtherCAT, PROFINET, or EtherNet/IP slave nodes with hardware-cycle timing. The hard Ethernet MACs in the HPS simplify integration with industrial Ethernet stacks, and the abundant GPIO through the 672-UBGA package supports parallel field-bus signaling. The 28 nm low-power process reduces thermal load in sealed control cabinets, and the 110K LEs provide headroom for custom protocol extensions.

📺

Broadcast Video Processing

The 5CSXFC6C6U23C6N handles broadcast video processing because the FPGA fabric implements SDI/HDMI bridging, color space conversion, and audio embedding at full 1080p60 rates without CPU intervention, while the ARM HPS handles control plane and metadata insertion. The DDR3 hard controller streams uncompressed video frames between FPGA logic and ARM memory, and the 4,160 Kbits embedded RAM provides line buffers for cross-conversion. The wide UFBGA-672 footprint exposes sufficient high-speed LVDS pairs for multi-channel SDI at 3 Gbps.

🚗

Automotive ADAS Prototyping

The 5CSXFC6C6U23C6N enables automotive ADAS prototyping because the dual ARM Cortex-A9 HPS runs sensor fusion and obstacle classification algorithms while the FPGA fabric implements low-latency radar FFT, lidar point-cloud clustering, and camera pre-processing. The Cyclone V SX architecture supports multiple sensor data streams in parallel, and the HPS-FPGA AXI fabric provides deterministic latency for safety-critical paths. Note that for production automotive designs, the Cyclone V automotive grade variant (typically designated by an A-speed grade or specific ordering code) is recommended over the commercial 5CSXFC6C6U23C6N.

What is the 5CSXFC6C6U23C6N?
The 5CSXFC6C6U23C6N is an Intel Cyclone V SX System-on-Chip (SoC) FPGA integrating a Dual ARM Cortex-A9 MPCore hard processor system with CoreSight debug alongside an FPGA fabric of 110,000 logic elements, in a 672-ball UFBGA 23x23 mm package. Per the Cyclone V device datasheet, the SoC combines the HPS and FPGA fabric on a single 28 nm low-power die, enabling tight hardware/software co-design for embedded applications up to 925 MHz fabric operation.
What processor core is integrated inside 5CSXFC6C6U23C6N?
The 5CSXFC6C6U23C6N integrates a Dual ARM Cortex-A9 MPCore with CoreSight debug and trace as the Hard Processor System (HPS). According to the Cyclone V datasheet, the HPS includes L1 caches per core, an NEON media engine, a single/double-precision FPU, and bridges to the FPGA fabric, allowing the ARM cores to access FPGA-implemented peripherals via AXI. This eliminates the need for a discrete processor companion on the board.
How many logic elements does 5CSXFC6C6U23C6N have?
The 5CSXFC6C6U23C6N contains 110,000 logic elements (LEs) in its Cyclone V SX FPGA fabric. Per DigiKey listing and the Cyclone V datasheet, this places the device in the mid-density tier of the Cyclone V SX family, sufficient for moderate DSP pipelines, custom peripherals, and glue logic alongside the ARM Cortex-A9 HPS.
What package does 5CSXFC6C6U23C6N use?
The 5CSXFC6C6U23C6N ships in a 672-ball Ultra-Fine BGA (UFBGA) package measuring 23x23 mm, with a 1.0 mm ball pitch. According to the Cyclone V device datasheet pinout tables, this 672-UBGA package is shared across multiple Cyclone V SX density points, simplifying PCB reuse when migrating between densities within the family.
Where to buy 5CSXFC6C6U23C6N at distributor pricing?
The 5CSXFC6C6U23C6N is available through authorized distributors including DigiKey and Mouser, both listing active stock of the part as of 2026-09-06. Per distributor pages, the qty-1 unit price is approximately 412 USD with tier breaks at 10/100/500/1000 units. Lead time is typically 8-12 weeks from authorized stock at the time of this writing.
What is the price of 5CSXFC6C6U23C6N?
The 5CSXFC6C6U23C6N prices at approximately 412 USD at qty-1, scaling to roughly 285 USD at 1000 units as of 2026-09-06 from DigiKey and Mouser listings. The Cyclone V SX family sits in Intel's mid-range SoC FPGA pricing tier, well below Cyclone 10 GX but above the smaller Cyclone V SE density points.
What is the lead time for 5CSXFC6C6U23C6N?
Lead time for 5CSXFC6C6U23C6N from authorized distributors is typically 8-12 weeks as of 2026-09-06, though stock-on-hand is occasionally available for immediate shipment from DigiKey and Mouser. For long-lead production planning, request a scheduled order directly with Intel or through franchised distributors to secure allocation.
5CSXFC6C6U23C6N vs 5CSXFC6C6U23A7N - what is the difference?
5CSXFC6C6U23C6N and 5CSXFC6C6U23A7N share the same Cyclone V SX family, same 110K logic element count, and same 672-UBGA 23x23 mm package. The C6 vs A7 speed grade designation typically differentiates operating temperature and speed, with C-grade indicating commercial temperature range per Cyclone V datasheet ordering information. Both parts are pin-compatible drop-in replacements on the same UFBGA-672 footprint.
What is the difference between 5CSXFC6C6U23C6N and 5CSEBA6U23C7N?
The 5CSXFC6C6U23C6N is a Cyclone V SX SoC FPGA with 110K logic elements and ARM Cortex-A9 HPS, while the 5CSEBA6U23C7N is a Cyclone V SE SoC FPGA with 110K logic elements in a different speed/temperature grade. Per the Cyclone V datasheet, SX and SE are distinct sub-families - SX emphasizes higher DSP throughput while SE focuses on lower static power, with some package and feature differences.
What is the best drop-in replacement for 5CSXFC6C6U23C6N?
The best drop-in replacement for 5CSXFC6C6U23C6N is the 5CSXFC6C6U23A7N from Intel, sharing the identical 672-UBGA 23x23 mm package, 110K logic element count, and SX family architecture. The A7 vs C6 ordering suffix typically maps to temperature/speed grade only; pinout and FPGA fabric remain identical per the Cyclone V datasheet, allowing direct board swap.
Where to download 5CSXFC6C6U23C6N datasheet PDF?
The Cyclone V device datasheet covering 5CSXFC6C6U23C6N is hosted at https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/cyclone-v/cv_5v2.pdf on the official Altera/Intel literature server. Per the Intel literature ordering, the Cyclone V device datasheet consolidates DC, switching characteristics, and pinout for the entire Cyclone V family including this part number.
Where to find 5CSXFC6C6U23C6N pinout information?
The complete pinout for 5CSXFC6C6U23C6N is documented in the Cyclone V device datasheet pin tables, organized by bank for the 672-UBGA 23x23 mm package. Engineers can also use the Quartus Prime Pin Planner tool, which loads the exact pin assignments for this specific ordering code and exports them to design files.
What software is required to program 5CSXFC6C6U23C6N?
The 5CSXFC6C6U23C6N is programmed using Intel Quartus Prime design software, available in free Quartus Prime Lite/Standard editions for Cyclone V device support. Quartus Prime handles HDL synthesis, place-and-route, timing closure, bitstream generation for the FPGA fabric, and HPS first-stage bootloader (preloader) compilation. The SoC EDS toolkit adds ARM Development Studio 5 (DS-5) or downstream ARM toolchains for HPS C/C++ development.
Hey Google, what can replace 5CSXFC6C6U23C6N if stock is unavailable?
If 5CSXFC6C6U23C6N stock is unavailable, the direct drop-in replacement is 5CSXFC6C6U23A7N, the same Intel Cyclone V SX SoC FPGA in the identical 672-UBGA 23x23 mm package with 110K logic elements. Per distributor comparison data, both ordering codes share pin compatibility; the suffix only affects speed/temperature grade. For cost reduction, 5CSXFC5C6U23C6N is a lower-density 85K LE alternative in the same UFBGA-672 footprint.
What are the key specifications of 5CSXFC6C6U23C6N that engineers should know?
Engineers evaluating 5CSXFC6C6U23C6N should focus on: 110K logic elements, Dual ARM Cortex-A9 HPS at up to 925 MHz fabric operation, 672-UBGA 23x23 mm package at 1.0 mm pitch, 28 nm low-power process at 1.1 V core, and approximately 4,160 Kbits embedded RAM with roughly 112 DSP blocks. Per the Cyclone V datasheet, the part integrates DDR3 hard memory controllers, PCIe Gen2 endpoint, EMAC, USB 2.0 OTG, and NAND flash controller in the HPS, making it a true single-chip SoC FPGA.

Engineering reference data for 5CSXFC6C6U23C6N — comparison, design guidance, and compliance information.

Selection Guide

Choose 5CSXFC6C6U23C6N when you need a mid-density Cyclone V SX SoC FPGA with 110K logic elements and the dual ARM Cortex-A9 HPS for software-defined control planes alongside FPGA datapath. The C6 commercial temperature grade suits indoor industrial designs, factory automation prototypes, and broadcast video equipment where ambient stays below 85 C. If your design needs wider temperature, switch to 5CSXFC6C6U23A7N with identical pinout. For cost reduction when the design fits in 85K LEs, drop to 5CSXFC5C6U23C6N. For tighter timing closure, choose 5CSXFC6C6U23C7N or 5CSXFC6C6U23C8N (C7/C8 speed grades). All five listed alternatives share the UFBGA-672 footprint, enabling PCB reuse across the density curve.

Comparison with Alternatives

Parameter This Product 5CSXFC6C6U23A7N 5CSXFC6C6U23C7N 5CSXFC6C6U23C8N 5CSXFC5C6U23C6N 5CSXFC4C6U23C6N
Brand Intel Intel Intel Intel Intel Intel
Package 672-UBGA (UFBGA) 23x23 mm 672-UBGA (UFBGA) 23x23 mm - same 672-UBGA (UFBGA) 23x23 mm - same 672-UBGA (UFBGA) 23x23 mm - same 672-UBGA (UFBGA) 23x23 mm - same 672-UBGA (UFBGA) 23x23 mm - same
Family Cyclone V SX Cyclone V SX Cyclone V SX Cyclone V SX Cyclone V SX Cyclone V SX
Logic Elements 110,000 110,000 110,000 110,000 85,000 (-23%) 49,000 (-55%)
Processor Core Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9
Speed/Temperature Grade C6 (commercial) A7 (automotive/industrial) C7 (commercial, faster) C8 (commercial, fastest) C6 (commercial) C6 (commercial)
Maximum Fabric Frequency 925 MHz 925 MHz 925 MHz 925 MHz 925 MHz 925 MHz
Typical Unit Price (qty 1) approximately 412 USD [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] lower (fewer LEs) lowest (smallest die)

Key Differentiators

  • Highest density SX SoC option at the C6 speed grade in the same UFBGA-672 footprint (vs 5CSXFC5C6U23C6N)
  • Industrial/automotive temperature drop-in available in identical footprint (vs 5CSXFC6C6U23A7N)
  • Cyclone V SX sub-family provides higher DSP count than SE alternatives (vs 5CSEBA6U23I7N)

Design Notes

The 672-UBGA 23x23 mm package uses a 1.0 mm ball pitch, which requires microvia or via-in-pad PCB technology for reliable breakout. Use at least a 4-2-4 stacked-via construction with 0.4 mm laser-drilled microvias, and ensure the BGA land pads meet IPC-7095 nominal-diameter specifications. Plan for at least 6 PCB layers to route out 145 user I/O plus DDR3, transceivers, and clock signals without excessive via stubs. Decoupling must follow the Intel Cyclone V pin connection guidelines with bulk 220 uF polymer caps near each GPIO bank supply pin.

Estimated: at heavy DSP utilization consuming the full 110K LE fabric at approximately 85% toggle rate with all 112 DSP blocks active, the 5CSXFC6C6U23C6N dissipates approximately 3-5 W. With the UFBGA-672 theta-JA typically around 15-20 C/W on a JEDEC JESD51 4-layer test board, junction temperature rises 45-100 C above ambient. For closed-enclosure industrial designs, evaluate thermal performance in-system with thermocouples on the package top. Consider attaching a heatsink or thermal pad to the package top side if ambient temperature exceeds 60 C.

Three common pitfalls when designing with the 5CSXFC6C6U23C6N: (1) Forgetting to instantiate the HPS first-stage bootloader (preloader) before Linux boots - the HPS cannot boot without valid preloader code in QSPI or SD card. (2) Mixing 1.1 V core and 1.2 V transceiver supplies without proper sequencing - the Cyclone V datasheet mandates power-on sequence with the HPS core rail stable before FPGA fabric enters user mode. (3) Routing DDR3 signals without matching the 50 ohm impedance and length-matching per the Cyclone V external memory interface guidelines - failures here are notoriously hard to debug post-tapeout.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliance per DigiKey product listing. C6 grade is commercial temperature; for AEC-Q100 automotive applications, choose the automotive-grade ordering variant or 5CSXFC6C6U23A7N for extended industrial/automotive temperature.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 5CSXFC6C6U23C6N 5CSXFC6C6U23A7N 5CSXFC5C6U23C6N 5CSXFC4C6U23C6N 5CSEBA6U23I7N Cyclone V SX SoC FPGA ARM Cortex-A9 CoreSight MPCore UFBGA-672 logic element DSP block embedded memory DDR3 controller PCIe Gen2 Quartus Prime 28 nm low-power process RoHS machine vision industrial motor control software defined radio AEC-Q100
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