5CSXFC5C6U23I7N - Cyclone V SX SoC FPGA, 85K LE | Intel
N.º da peça: 5CSXFC5C6U23I7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 250 | $225 | $56.250,00 |
| 500 | $210 | $105.000,00 |
5CSXFC5C6U23I7N Visão geral
An SoC FPGA is an integrated circuit that merges a general-purpose processor subsystem (typically ARM Cortex-A) with a programmable FPGA fabric on the same silicon die. This architectural class sits within the broader taxonomy of FPGAs > programmable logic > semiconductor ICs, and is purpose-built for designs that need both hardware-accelerated parallel logic (image processing, motor control, deterministic I/O) and a software-rich application processor (Linux, networking stacks, HMI) without a separate companion MPU. Cyclone V SX specifically targets low-power, cost-sensitive embedded applications.
Key differentiating features of the 5CSXFC5C6U23I7N include 85K logic elements (versus 110K LE on the closely-related 5CSXFC6C6U23I7N), 3,207 LABs, integrated transceivers supporting protocols such as PCIe Gen2 and Gigabit Ethernet, hard memory controllers for DDR3, and a hardened peripheral set including USB 2.0, EMAC, CAN, SPI, and UART. The HPS (Hard Processor System) block eliminates the need for an external processor MPU in many designs, reducing BOM count and board area.
The Cyclone V SX family is built on TSMC's 28 nm low-power process, which is the technology enabler for the 1.1 V core operation and the sub-1.5 W typical power profile of mid-density SX parts. The device targets applications that demand ARM Cortex-A9 software processing alongside custom hardware accelerators, including industrial machine vision, motor control, broadcast video, and automotive driver assistance prototypes.
Typical applications include industrial machine vision cameras, factory automation controllers, medical imaging pre-processors, broadcast video format converters, and automotive ADAS prototyping platforms. The dual-core ARM Cortex-A9 runs Linux or RTOS while the FPGA fabric handles deterministic real-time data paths in parallel.
When designing with this part, pay careful attention to power-rail sequencing between the HPS and FPGA fabric sections; consult the Cyclone V Device Family Pin Connection Guidelines. Decoupling requires a minimum of 24 low-ESL capacitors around the package perimeter and a dedicated 1.1 V core supply with sub-3% regulation accuracy for reliable transceiver operation.
This page synthesizes distributor pricing, drop-in alternatives within the same 672-UBGA footprint, and practical design notes not found in the standalone datasheet.
Alternativas drop-in para 5CSXFC5C6U23I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSXFC5C6U23I7N (mesmo formato e footprint) — diferindo em Package, Family, Logic Elements, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSXFC6C6U23I7N
✅ Drop-In✓ Em estoque
$92.1 / unidade
Ver ficha técnica →5CSXFC4C6U23I7N
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →5CSXFC5C6U23I7N
✅ Drop-In✓ Em estoque
$210 / unidade
Ver ficha técnica →5CGXFC5C6F27C7N
✅ Drop-In✓ Em estoque
$118 / unidade
Ver ficha técnica →5CSXFC5C6U23I7N Classificações máximas e características elétricas
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85,000 |
| Logic Array Blocks (LABs) | 3,207 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 800 MHz |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 28 nm low-power |
| Encapsulamento | 672-pin UBGA (23x23 mm) |
| Tipo de montagem | Surface Mount |
| Transceivers | Integrated (PCIe Gen2 / Gigabit Ethernet capable) |
| DSP Blocks | Variable-precision |
| Memory Controllers | Hard DDR3 controller |
| Hardened Peripherals | USB 2.0, EMAC, CAN, SPI, UART |
| Temperatura de operação | -40C to +100C (industrial) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5CSXFC5C6U23I7N 672-pin ubga (23x23 mm)
Configuração de pinos para 5CSXFC5C6U23I7N (pacote 672-pin ubga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSXFC5C6U23I7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSXFC5C6U23I7N é adequado para 6 aplicaçãos: Industrial Machine Vision Camera, Factory Automation PLC Controller, Medical Imaging Pre-Processor, Broadcast Video Format Converter, Automotive ADAS Prototyping Platform, Motor Control and Drive Inverter.
Industrial Machine Vision Camera
The 5CSXFC5C6U23I7N's 85K LE fabric handles real-time Bayer demosaicing, lens distortion correction, and object detection pipelines at GigE Vision frame rates, while the dual-core ARM Cortex-A9 HPS runs a Linux-based vision stack and Ethernet protocol stack. With 3,207 LABs supporting wide parallel datapaths and integrated transceivers capable of GigE Vision, the SoC FPGA eliminates the need for a separate image signal processor. Industrial temperature grade (-40C to +100C) supports factory floor deployment.
Recomendado
Factory Automation PLC Controller
The dual-core ARM Cortex-A9 runs a deterministic real-time OS for PLC ladder logic execution, while the FPGA fabric implements hardware-accelerated EtherCAT or PROFINET slave interfaces and high-speed encoder counters. The HPS hardened peripherals (CAN, SPI, UART) interface directly to motor drivers, sensors, and HMIs without external bridge ICs. Integrated DDR3 controller handles process data buffering at line speeds.
Recomendado
Medical Imaging Pre-Processor
The 85K LE fabric implements real-time ultrasound beamforming, CT reconstruction kernels, or MRI signal preprocessing pipelines at low latency, while the dual-core ARM Cortex-A9 runs the medical device UI stack and DICOM networking. Hardened DSP blocks accelerate FIR filters and FFT operations common in imaging signal chains. The 1.1 V low-power operation supports battery-powered portable imaging carts.
Recomendado
Broadcast Video Format Converter
The FPGA fabric handles real-time SDI/HDMI format conversion, color space transformation, and scaler pipelines at broadcast data rates, while the ARM Cortex-A9 HPS manages ancillary data extraction and IP-based control interfaces. Integrated transceivers support 3G-SDI and SMPTE 2022 video over IP. Variable-precision DSP blocks enable chroma/luma filtering with optimized resource utilization.
Recomendado
Automotive ADAS Prototyping Platform
The 85K LE fabric implements sensor fusion pre-processing for camera, radar, and lidar data streams at sub-frame latency, while the dual-core ARM Cortex-A9 runs AUTOSAR or QNX with automotive vision stacks. Hardened CAN peripherals interface directly with vehicle networks. Industrial temperature grade supports in-cabin prototype deployment, though production automotive AEC-Q100 qualification is not implied for this MPN.
Recomendado
Motor Control and Drive Inverter
The FPGA fabric implements field-oriented control (FOC) algorithms, PWM generation, and encoder interfaces at sub-microsecond loop times, while the ARM Cortex-A9 HPS handles commissioning, diagnostics, and industrial Ethernet connectivity. Hardened peripheral set (CAN, SPI, UART) integrates with safety subsystems. Variable-precision DSP blocks accelerate Park/Clarke transforms and PID loops for multi-axis drives.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSXFC5C6U23I7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSXFC6C6U23I7N | 5CSXFC4C6U23I7N | 5CGXFC5C6F27C7N |
|---|---|---|---|---|
| Package | 672-pin UBGA (U23, 23x23 mm) | 672-pin UBGA (U23, 23x23 mm) - same | 672-pin UBGA (U23, 23x23 mm) - same | 672-pin UBGA (U23, 23x23 mm) - same |
| Brand | Intel | Intel | Intel | Intel |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V GX FPGA (no HPS) |
| Logic Elements | 85,000 | 110,000 (+29%) | ~77,000 (-9%) | 85,000 (same) |
| HPS Processor | Dual-core ARM Cortex-A9 800 MHz | Dual-core ARM Cortex-A9 800 MHz | Dual-core ARM Cortex-A9 800 MHz | No HPS - soft core only |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
Principais diferenciais
- Integrated dual-core ARM Cortex-A9 HPS eliminates external MPU (vs Discrete MCU + FPGA design)
- 85K logic elements in mid-density tier of SX family (vs 5CSXFC6C6U23I7N (110K LE))
- Industrial temperature grade at 672-UBGA (vs 5CSXFC4C6U23C8N (commercial 0C to +85C))
Notas de projeto
Estimated: at 85K LE utilization with HPS active, typical power dissipation for the 5CSXFC5C6U23I7N is approximately 3-5 W. Provide a dedicated 1.1 V core supply with sub-3% regulation accuracy for reliable transceiver operation. The HPS and FPGA fabric sections have separate power rails that require sequenced power-up - consult the Cyclone V Device Family Pin Connection Guidelines. Decoupling requires a minimum of 24 low-ESL capacitors around the package perimeter.
The 672-pin UBGA package requires a 23x23 mm land pattern with controlled-impedance traces for the integrated transceiver channels. Use a high-layer-count PCB (at least 8 layers) with dedicated ground and power planes beneath the device. Breakout routing for the inner-row balls requires microvia or blind via technology to maintain signal integrity on DDR3 memory interfaces.
Do not assume the 5CSXFC5C6U23I7N is AEC-Q100 qualified for production automotive use - it is industrial temperature grade only. For automotive designs, validate against AEC-Q100 requirements separately. Also note that the 'I7N' suffix indicates industrial temperature grade; 'C8N' would indicate commercial grade, which has different thermal characteristics. Verify the OPN suffix against your deployment environment before PCB assembly.
Informações de conformidade
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - this is industrial temperature grade only. Production automotive designs require separate AEC-Q100 validation.