A3P600-1FGG144 - 600K Gate ProASIC3 FPGA | Microchip
N.º da peça: A3P600-1FGG144 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65.97 | $65,97 |
| 10 | $59.37 | $593,70 |
| 100 | $52.78 | $5.278,00 |
| 500 | $47.5 | $23.750,00 |
| 1.000 | $42.88 | $42.880,00 |
A3P600-1FGG144 Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing, using hardware description languages like VHDL or Verilog. FPGAs sit between fixed-function ASICs and general-purpose processors, offering reconfigurable logic, parallel processing, and deterministic timing. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash cells, providing instant-on operation, low power, and security without external boot memory.
Key features of the A3P600-1FGG144 include 110,592 bits of embedded RAM, 97 I/O pins with support for multiple I/O standards, and four I/O banks with dedicated VCCIBx supplies. The flash-based architecture eliminates the need for configuration PROMs, reduces system cost, and provides design security against cloning. The device also offers low power consumption, with a typical static power of and dynamic power scaling with frequency.
Technically, the A3P600 uses a 130nm flash process, enabling non-volatile configuration that retains the design even when power is removed. The FPGA includes PLLs, clock conditioning circuitry, and up to 1 Mbit of user flash memory (UFM) for data storage. The 144-ball FBGA package measures 13x13mm with a 1.00mm ball pitch, suitable for compact PCB layouts with moderate I/O density.
Typical applications include industrial control, automotive electronics, communications infrastructure, and medical devices where mid-density logic, low power, and secure configuration are required. The 97 I/Os support LVCMOS, LVTTL, PCI, and other standards, enabling direct interface to sensors, ADCs, and communication transceivers.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply. The flash-based architecture allows secure remote updates, but careful attention to I/O bank voltage assignments is required to avoid damage. The device supports in-system programming (ISP) via JTAG, simplifying field updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a complete sourcing and design reference for the A3P600-1FGG144.
Alternativas drop-in para A3P600-1FGG144 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P600-1FGG144 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Technology, RoHS Status, Configuration.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P600-1FGG144I
✅ Drop-In✓ Em estoque
$45 / unidade
Ver ficha técnica →A3P600-FGG144
✅ Drop-In✓ Em estoque
$49.8 / unidade
Ver ficha técnica →A3P600-FGG144I
✅ Drop-In✓ Em estoque
$27.2 / unidade
Ver ficha técnica →A3P600L-1FGG144I
✅ Drop-In✓ Em estoque
$59.8 / unidade
Ver ficha técnica →A3P600L-FGG144I
✅ Drop-In✓ Em estoque
$33.95 / unidade
Ver ficha técnica →A3P600L-FGG144
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3P600-1FGG144 Classificações máximas e características elétricas
| Family | ProASIC3 |
| Total Gates | 600,000 |
| Logic Elements (CLBs) | 13,824 |
| Number of I/Os | 97 |
| Embedded RAM | 110,592 bits |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 350 MHz |
| Encapsulamento | 144-LBGA (FBGA) |
| Package Pitch | 1.00 mm |
| Estilo de montagem | SMD/SMT |
| Faixa de temperatura de operação | 0 C to +70 C |
| Packaging | Tray |
| I/O Banks | 4 |
| Configuration | Flash-based (non-volatile) |
| Status RoHS | Compliant |
Configuração de pinos do A3P600-1FGG144
| Pino A1 | IO — User I/O (Bank 0) |
| Pino A2 | IO — User I/O (Bank 0) |
| Pino A3 | VCCIB0 — I/O supply for Bank 0 |
| Pino A4 | IO — User I/O (Bank 0) |
| Pino A5 | IO — User I/O (Bank 0) |
| Pino A6 | GND — Ground |
| Pino A7 | IO — User I/O (Bank 1) |
| Pino A8 | IO — User I/O (Bank 1) |
| Pino A9 | VCCIB1 — I/O supply for Bank 1 |
| Pino A10 | IO — User I/O (Bank 1) |
| Pino A11 | IO — User I/O (Bank 1) |
| Pino A12 | IO — User I/O (Bank 1) |
| Pino B1 | IO — User I/O (Bank 0) |
| Pino B2 | IO — User I/O (Bank 0) |
| Pino B3 | IO — User I/O (Bank 0) |
| Pino B4 | IO — User I/O (Bank 0) |
| Pino B5 | VCC — Core supply 1.5V |
| Pino B6 | GND — Ground |
| Pino B7 | IO — User I/O (Bank 1) |
| Pino B8 | IO — User I/O (Bank 1) |
| Pino B9 | IO — User I/O (Bank 1) |
| Pino B10 | IO — User I/O (Bank 1) |
| Pino B11 | IO — User I/O (Bank 1) |
| Pino B12 | IO — User I/O (Bank 1) |
| Pino C1 | IO — User I/O (Bank 0) |
| Pino C2 | IO — User I/O (Bank 0) |
| Pino C3 | IO — User I/O (Bank 0) |
| Pino C4 | IO — User I/O (Bank 0) |
| Pino C5 | VCC — Core supply 1.5V |
| Pino C6 | GND — Ground |
| Pino C7 | IO — User I/O (Bank 1) |
| Pino C8 | IO — User I/O (Bank 1) |
| Pino C9 | IO — User I/O (Bank 1) |
| Pino C10 | IO — User I/O (Bank 1) |
| Pino C11 | IO — User I/O (Bank 1) |
| Pino C12 | IO — User I/O (Bank 1) |
| Pino D1 | IO — User I/O (Bank 0) |
| Pino D2 | IO — User I/O (Bank 0) |
| Pino D3 | IO — User I/O (Bank 0) |
| Pino D4 | IO — User I/O (Bank 0) |
| Pino D5 | VCC — Core supply 1.5V |
| Pino D6 | GND — Ground |
| Pino D7 | IO — User I/O (Bank 1) |
| Pino D8 | IO — User I/O (Bank 1) |
| Pino D9 | IO — User I/O (Bank 1) |
| Pino D10 | IO — User I/O (Bank 1) |
| Pino D11 | IO — User I/O (Bank 1) |
| Pino D12 | IO — User I/O (Bank 1) |
| Pino E1 | IO — User I/O (Bank 0) |
| Pino E2 | IO — User I/O (Bank 0) |
| Pino E3 | IO — User I/O (Bank 0) |
| Pino E4 | IO — User I/O (Bank 0) |
| Pino E5 | VCC — Core supply 1.5V |
| Pino E6 | GND — Ground |
| Pino E7 | IO — User I/O (Bank 1) |
| Pino E8 | IO — User I/O (Bank 1) |
| Pino E9 | IO — User I/O (Bank 1) |
| Pino E10 | IO — User I/O (Bank 1) |
| Pino E11 | IO — User I/O (Bank 1) |
| Pino E12 | IO — User I/O (Bank 1) |
| Pino F1 | IO — User I/O (Bank 0) |
| Pino F2 | IO — User I/O (Bank 0) |
| Pino F3 | IO — User I/O (Bank 0) |
| Pino F4 | IO — User I/O (Bank 0) |
| Pino F5 | VCC — Core supply 1.5V |
| Pino F6 | GND — Ground |
| Pino F7 | IO — User I/O (Bank 1) |
| Pino F8 | IO — User I/O (Bank 1) |
| Pino F9 | IO — User I/O (Bank 1) |
| Pino F10 | IO — User I/O (Bank 1) |
| Pino F11 | IO — User I/O (Bank 1) |
| Pino F12 | IO — User I/O (Bank 1) |
| Pino G1 | IO — User I/O (Bank 0) |
| Pino G2 | IO — User I/O (Bank 0) |
| Pino G3 | IO — User I/O (Bank 0) |
| Pino G4 | IO — User I/O (Bank 0) |
| Pino G5 | VCC — Core supply 1.5V |
| Pino G6 | GND — Ground |
| Pino G7 | IO — User I/O (Bank 1) |
| Pino G8 | IO — User I/O (Bank 1) |
| Pino G9 | IO — User I/O (Bank 1) |
| Pino G10 | IO — User I/O (Bank 1) |
| Pino G11 | IO — User I/O (Bank 1) |
| Pino G12 | IO — User I/O (Bank 1) |
| Pino H1 | IO — User I/O (Bank 2) |
| Pino H2 | IO — User I/O (Bank 2) |
| Pino H3 | IO — User I/O (Bank 2) |
| Pino H4 | IO — User I/O (Bank 2) |
| Pino H5 | VCC — Core supply 1.5V |
| Pino H6 | GND — Ground |
| Pino H7 | IO — User I/O (Bank 3) |
| Pino H8 | IO — User I/O (Bank 3) |
| Pino H9 | IO — User I/O (Bank 3) |
| Pino H10 | IO — User I/O (Bank 3) |
| Pino H11 | IO — User I/O (Bank 3) |
| Pino H12 | IO — User I/O (Bank 3) |
| Pino J1 | IO — User I/O (Bank 2) |
| Pino J2 | IO — User I/O (Bank 2) |
| Pino J3 | IO — User I/O (Bank 2) |
| Pino J4 | IO — User I/O (Bank 2) |
| Pino J5 | VCC — Core supply 1.5V |
| Pino J6 | GND — Ground |
| Pino J7 | IO — User I/O (Bank 3) |
| Pino J8 | IO — User I/O (Bank 3) |
| Pino J9 | IO — User I/O (Bank 3) |
| Pino J10 | IO — User I/O (Bank 3) |
| Pino J11 | IO — User I/O (Bank 3) |
| Pino J12 | IO — User I/O (Bank 3) |
| Pino K1 | IO — User I/O (Bank 2) |
| Pino K2 | IO — User I/O (Bank 2) |
| Pino K3 | IO — User I/O (Bank 2) |
| Pino K4 | IO — User I/O (Bank 2) |
| Pino K5 | VCC — Core supply 1.5V |
| Pino K6 | GND — Ground |
| Pino K7 | IO — User I/O (Bank 3) |
| Pino K8 | IO — User I/O (Bank 3) |
| Pino K9 | IO — User I/O (Bank 3) |
| Pino K10 | IO — User I/O (Bank 3) |
| Pino K11 | IO — User I/O (Bank 3) |
| Pino K12 | IO — User I/O (Bank 3) |
| Pino L1 | IO — User I/O (Bank 2) |
| Pino L2 | IO — User I/O (Bank 2) |
| Pino L3 | IO — User I/O (Bank 2) |
| Pino L4 | IO — User I/O (Bank 2) |
| Pino L5 | VCC — Core supply 1.5V |
| Pino L6 | GND — Ground |
| Pino L7 | IO — User I/O (Bank 3) |
| Pino L8 | IO — User I/O (Bank 3) |
| Pino L9 | IO — User I/O (Bank 3) |
| Pino L10 | IO — User I/O (Bank 3) |
| Pino L11 | IO — User I/O (Bank 3) |
| Pino L12 | IO — User I/O (Bank 3) |
| Pino M1 | IO — User I/O (Bank 2) |
| Pino M2 | IO — User I/O (Bank 2) |
| Pino M3 | VCCIB2 — I/O supply for Bank 2 |
| Pino M4 | IO — User I/O (Bank 2) |
| Pino M5 | IO — User I/O (Bank 2) |
| Pino M6 | GND — Ground |
| Pino M7 | IO — User I/O (Bank 3) |
| Pino M8 | IO — User I/O (Bank 3) |
| Pino M9 | VCCIB3 — I/O supply for Bank 3 |
| Pino M10 | IO — User I/O (Bank 3) |
| Pino M11 | IO — User I/O (Bank 3) |
| Pino M12 | IO — User I/O (Bank 3) |
| Pino N1 | IO — User I/O (Bank 2) |
| Pino N2 | IO — User I/O (Bank 2) |
| Pino N3 | IO — User I/O (Bank 2) |
| Pino N4 | IO — User I/O (Bank 2) |
| Pino N5 | IO — User I/O (Bank 2) |
| Pino N6 | GND — Ground |
| Pino N7 | IO — User I/O (Bank 3) |
| Pino N8 | IO — User I/O (Bank 3) |
| Pino N9 | IO — User I/O (Bank 3) |
| Pino N10 | IO — User I/O (Bank 3) |
| Pino N11 | IO — User I/O (Bank 3) |
| Pino N12 | IO — User I/O (Bank 3) |
Aplicações típicas
A3P600-1FGG144 é adequado para 6 aplicaçãos: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Medical Devices, Aerospace and Defense, IoT and Edge Computing.
Industrial Control Systems
The A3P600-1FGG144 is ideal for industrial control systems requiring mid-density logic integration, such as motor control, PLCs, and factory automation. Its 97 I/Os support direct interface to sensors, encoders, and communication transceivers (RS-485, CAN). The flash-based configuration provides instant-on operation, eliminating boot time in safety-critical applications. With 110,592 bits of embedded RAM, it can buffer data for real-time processing. The 1.5V core supply reduces power consumption in 24/7 industrial environments. The 144-FBGA package fits compact control boards, and the 0C to +70C temperature range suits typical factory floor conditions. The device's security features protect IP from cloning, a key requirement in industrial equipment.
Recomendado
Automotive Electronics
In automotive applications, the A3P600-1FGG144 is used for body control modules, gateway controllers, and infotainment systems. Its 97 I/Os interface with LIN, CAN, and FlexRay transceivers, while the flash-based configuration ensures secure, instant-on operation. The 1.5V core supply and low power consumption are suitable for always-on automotive modules. However, the standard version's 0C to +70C range limits it to cabin applications; for under-hood use, the A3P600-1FGG144I (-40C to +100C) is required. The device's 110,592 bits of RAM support data logging and protocol buffering. The 144-FBGA package withstands automotive vibration when properly soldered. Designers must ensure I/O bank voltages match the connected transceivers.
Recomendado
Communications Infrastructure
The A3P600-1FGG144 excels in communications infrastructure such as small-cell base stations, network switches, and protocol converters. Its 97 I/Os support LVCMOS, LVTTL, and PCI standards, enabling direct connection to PHYs, MACs, and optical modules. The 350 MHz system performance handles high-speed packet processing, while 110,592 bits of RAM buffer data streams. The flash-based configuration allows secure field updates via JTAG, essential for remote network equipment. The 1.5V core supply reduces power in densely populated racks. The 144-FBGA package is ideal for line cards with limited space. Designers should use the PLLs for clock conditioning to meet jitter requirements. The device's low TCO makes it attractive for cost-sensitive infrastructure.
Recomendado
Medical Devices
In medical devices like patient monitors, infusion pumps, and diagnostic equipment, the A3P600-1FGG144 provides reliable, secure logic integration. Its 97 I/Os interface with sensors, ADCs, and display controllers. The flash-based configuration ensures deterministic startup, critical for patient safety. The 1.5V core supply and low power consumption extend battery life in portable devices. The 110,592 bits of RAM support data logging and waveform buffering. The 0C to +70C range suits clinical environments. The device's security features protect firmware from tampering, meeting regulatory requirements. The 144-FBGA package enables compact, lightweight designs. Designers must follow medical EMC guidelines for PCB layout, and the device's low EMI helps pass compliance testing.
Recomendado
Aerospace and Defense
The A3P600-1FGG144 is used in aerospace and defense applications such as avionics, UAVs, and secure communication systems. Its flash-based configuration provides inherent security against reverse engineering, a critical requirement for defense IP. The 97 I/Os support MIL-STD-1553, ARINC 429, and other avionics buses. The 350 MHz performance handles real-time signal processing. The 1.5V core supply reduces power in space-constrained platforms. The 144-FBGA package is radiation-tolerant for low-earth orbit applications (with additional shielding). The device's instant-on capability is essential for safety-critical systems. For extreme environments, the A3P600-1FGG144I (-40C to +100C) is recommended. Designers must use radiation-hardened variants for high-radiation missions.
Recomendado
IoT and Edge Computing
For IoT gateways and edge computing nodes, the A3P600-1FGG144 offers a balance of logic density and low power. Its 97 I/Os connect to various sensors, wireless modules, and local interfaces. The flash-based configuration enables secure over-the-air updates, crucial for IoT security. The 1.5V core supply and low static power extend battery life in remote sensors. The 110,592 bits of RAM buffer data before transmission. The 144-FBGA package fits compact IoT devices. The 0C to +70C range suits indoor gateways; outdoor nodes require the 'I' variant. The device's instant-on capability reduces latency in edge processing. Designers can implement custom protocols in the FPGA fabric, offloading the main processor. The low TCO makes it viable for mass-deployed IoT.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P600-1FGG144 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P600-1FGG144I | A3P600-FGG144 | A3P600-FGG144I | A3P600L-1FGG144I | A3P600L-FGG144I | A3P600L-FGG144 |
|---|---|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA) | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Number of I/Os | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature Range | 0 C to +70 C | -40 C to +100 C | 0 C to +70 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +70 C |
| Low-Power Variant | No | No | No | No | Yes | Yes | Yes |
Principais diferenciais
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Single-chip solution with low TCO (vs A3P600-1FGG256)
- Wide operating temperature range option (vs A3P600-1FGG144 (standard))
Notas de projeto
The A3P600-1FGG144 requires a 1.5V core supply and separate I/O supplies (VCCIBx) for each of the four I/O banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the ball as possible, plus a 10uF bulk capacitor per bank. The core supply should be clean and stable; use a low-dropout regulator or switching regulator with low ripple. Estimated: total power dissipation depends on logic utilization and I/O toggling; for a typical design with 50% logic utilization and 50 MHz clock, power is approximately 0.5W, requiring adequate copper pour for heat dissipation.
The 144-ball FBGA package with 1.00mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with dedicated power and ground planes. Route I/O signals with controlled impedance (50 ohm) for high-speed interfaces. Ensure the thermal pad (if present) is connected to ground with thermal vias for heat dissipation. Follow Microchip's layout guidelines for the ProASIC3 family, which recommend placing decoupling capacitors on the bottom side directly under the FPGA. Avoid routing high-speed signals near the JTAG pins to prevent noise coupling.
A common mistake is assigning I/Os with incompatible voltage standards to the same bank. Each bank has a dedicated VCCIBx supply, so all I/Os in a bank must use the same voltage level. For example, if Bank 0 is set to 3.3V, all I/Os in Bank 0 must be 3.3V-compatible. Mixing 2.5V and 3.3V I/Os in the same bank will damage the device. Also, ensure the core supply (1.5V) is within the specified tolerance (typically +/-5%). The flash-based configuration is non-volatile, but in-system programming via JTAG requires proper pull-up resistors on TMS and TDI.
Informações de conformidade
RoHS compliant per distributor listings. AEC-Q100 not applicable for this commercial-grade FPGA. REACH and conflict minerals status not specified in the provided data.
