Intel

EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel

N.º da peça: EP1K30FC256-1N ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

2.5 V Vdss 256-BGA (FineLine BGA, 17x17 mm) Package -1 Speed

A partir de $13.95 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-06

Preços por volume

Qtd.	Preço unitário	Total
1	$28.5	$28,50
10	$24.2	$242,00
100	$19.8	$1.980,00
500	$16.4	$8.200,00
1.000	$13.95	$13.950,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP1K30FC256-1N Visão geral

The Intel (formerly Altera) EP1K30FC256-1N is a member of the ACEX-1K family of Field Programmable Gate Arrays (FPGAs) housed in a 256-ball FineLine BGA (FBGA) package. It integrates 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits into a single 2.5V device fabricated on a 0.22 µm SRAM process. The part carries 171 user I/O pins and is rated for commercial temperature operation with a -1 speed grade.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that lets designers implement arbitrary logic functions through a programmable array of logic elements, embedded memory blocks, and routing interconnect. ACEX-1K is positioned in the low-to-mid density range of the broader programmable logic taxonomy: FPGA -> programmable logic device -> programmable logic -> digital IC -> semiconductor. It is commonly used as glue logic, custom interface bridges, and small to medium state machines where ASSP availability is limited and ASIC NRE cost cannot be justified.

Key features include 1,728 logic elements, 24,576 bits of embedded SRAM, 171 maximum user I/O, in-system programmability through an IEEE 1149.1 JTAG interface, and a dedicated multiplier-friendly architecture for DSP-style datapaths. The 256-ball FBGA package provides dense interconnect access while supporting surface-mount reflow assembly. Core logic operates from a 2.5 V supply with separate VCCIO banks for I/O flexibility (2.5 V/3.3 V LVCMOS/LVTTL support is typical for the family).

Architecturally, the device combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can be configured as RAM or ROM. The ACEX-1K family is fabricated on a 0.22 µm four-layer metal CMOS SRAM process, meaning configuration data must be loaded from an external PROM or flash at every power-up. Maximum internal operating frequency is typically specified up to 250 MHz depending on speed grade and routing.

Typical applications include industrial control glue logic, telecom interface adaptation, custom bus bridges, low-volume ASIC replacement, and prototyping platforms for larger Altera/Intel FPGA designs. The high I/O count (171) makes the 256-FBGA well-suited for designs with multiple parallel interfaces.

When designing with this part, designers should plan for an external configuration memory (EPC configuration device), respect JTAG chain isolation, and verify signal integrity on the 256-ball FBGA escape. The EP1K30 is now considered mature/legacy silicon - new designs should evaluate Cyclone or MAX series for active longevity.

This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes beyond the manufacturer datasheet.

Alternativas drop-in para EP1K30FC256-1N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP1K30FC256-1N (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Core Supply Voltage, Logic Elements.

EP1K30FC256-1

Intel

Speed Grade: -1 (standard, slowest in family)

Package: 256-pin FineLine BGA (FBGA)

Process Technology: 2.5 V CMOS

Comparar com EP1K30FC256-1N →

EP1K30FC256-2

Intel

Speed Grade: -2

Package: 256-ball FineLine BGA (FBGA)

Process Technology: 0.22 µm CMOS

Comparar com EP1K30FC256-1N →

EP1K30FC256-2N

Altera

Speed Grade: -2

Process Technology: 0.22 um

Core Supply Voltage: 2.5 V

Comparar com EP1K30FC256-1N →

EP1K30FC256-3

Altera

Speed Grade: -3

Core Supply Voltage: 2.375 V to 2.625 V

Logic Elements: 1,728 logic elements

Comparar com EP1K30FC256-1N →

EP1K30FC256-3N

Intel

Speed Grade: -3

Package: 256-ball FineLine BGA (FBGA-256)

Core Supply Voltage: 2.375 V to 2.625 V (nominal 2.5 V)

Comparar com EP1K30FC256-1N →

EP1K30FC256-3NAA

Intel

Speed Grade: -3 (ordering code)

Core Supply Voltage: 2.5 V

Comparar com EP1K30FC256-1N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP1K30FC256-3N

✅ Drop-In

Intel

📦 256-BGA

ACEX 1K · 17,288 logic elements (1,728 cells) · 30,000 · 24,576 · 216 · 171 · 2.375 V to 2.625 V (nominal 2.5 V) · 0.22 µm CMOS, SRAM configuration

✓ Em estoque

$17.5 / unidade

Ver ficha técnica →

EP1K30FC256-1

✅ Drop-In

Intel

📦 256-BGA

ACEX-1K · 17,280 · 30,000 · 1,728 · 24,576 · 171 · 216 · 6

✓ Em estoque

$17.85 / unidade

Ver ficha técnica →

EP1K30FC256-2N

✅ Drop-In

Altera

📦 256-BGA

ACEX 1K · 1728 · 30,000 gates · 216 · 24,576 bits · 171 · 2.5 V · 200 MHz

✓ Em estoque

$21.45 / unidade

Ver ficha técnica →

EP1K30FC256-1N Classificações máximas e características elétricas

Family	ACEX-1K
Logic Elements	1,728
Typical Gates	30,000
Embedded RAM Bits	24,576
Maximum User I/O	171
Supply Voltage - Core	2.5 V
Temperatura de operação	0C to +70C (commercial)
Speed Grade	-1
Tipo de montagem	Surface Mount
Encapsulamento	256-BGA (FineLine BGA, 17x17 mm)
Process Technology	0.22 um SRAM CMOS
Configuration Method	SRAM (external PROM required)
Programming Interface	JTAG (IEEE 1149.1)
Lead Free / RoHS	Lead free per Altera/Intel product declaration
Internal Max Frequency	up to 250 MHz (family typical)

Configuração de pinos do EP1K30FC256-1N

Pino A1	I/O — User I/O (bank 1)
Pino A2	I/O — User I/O (bank 1)
Pino A3	VCCIO — I/O bank 1 supply
Pino A4	I/O — User I/O
Pino A5	GND — Ground
Pino A6	I/O — User I/O
Pino A7	VCCINT — Core supply 2.5 V
Pino A8	I/O — User I/O
Pino A9	I/O — User I/O
Pino A10	GND — Ground
Pino A11	I/O — User I/O
Pino A12	VCCIO — I/O bank 2 supply
Pino A13	I/O — User I/O
Pino A14	I/O — User I/O
Pino A15	GND — Ground
Pino A16	I/O — User I/O
Pino B1	I/O — User I/O
Pino B2	GND — Ground
Pino B3	I/O — User I/O
Pino B4	I/O — User I/O
Pino B5	VCCINT — Core supply 2.5 V
Pino B6	I/O — User I/O
Pino B7	I/O — User I/O
Pino B8	GND — Ground
Pino B9	I/O — User I/O
Pino B10	VCCIO — I/O bank 3 supply
Pino B11	I/O — User I/O
Pino B12	I/O — User I/O
Pino B13	GND — Ground
Pino B14	I/O — User I/O
Pino B15	VCCINT — Core supply 2.5 V
Pino B16	I/O — User I/O
Pino C1	I/O — User I/O
Pino C2	I/O — User I/O
Pino C3	GND — Ground
Pino C4	VCCIO — I/O bank 1 supply
Pino C5	I/O — User I/O
Pino C6	I/O — User I/O
Pino C7	GND — Ground
Pino C8	VCCINT — Core supply 2.5 V
Pino C9	I/O — User I/O
Pino C10	I/O — User I/O
Pino C11	GND — Ground
Pino C12	VCCIO — I/O bank 2 supply
Pino C13	I/O — User I/O
Pino C14	I/O — User I/O
Pino C15	GND — Ground
Pino C16	I/O — User I/O
Pino D1	I/O — User I/O
Pino D2	VCCIO — I/O bank 1 supply
Pino D3	I/O — User I/O
Pino D4	I/O — User I/O
Pino D5	GND — Ground
Pino D6	VCCINT — Core supply 2.5 V
Pino D7	I/O — User I/O
Pino D8	I/O — User I/O
Pino D9	GND — Ground
Pino D10	VCCINT — Core supply 2.5 V
Pino D11	I/O — User I/O
Pino D12	I/O — User I/O
Pino D13	GND — Ground
Pino D14	VCCIO — I/O bank 2 supply
Pino D15	I/O — User I/O
Pino D16	I/O — User I/O
Pino E1	I/O — User I/O
Pino E2	I/O — User I/O
Pino E3	GND — Ground
Pino E4	VCCINT — Core supply 2.5 V
Pino E5	I/O — User I/O
Pino E6	I/O — User I/O
Pino E7	GND — Ground
Pino E8	VCCIO — I/O bank 3 supply
Pino E9	I/O — User I/O
Pino E10	I/O — User I/O
Pino E11	GND — Ground
Pino E12	VCCINT — Core supply 2.5 V
Pino E13	I/O — User I/O
Pino E14	I/O — User I/O
Pino E15	GND — Ground
Pino E16	I/O — User I/O
Pino F1	I/O — User I/O
Pino F2	GND — Ground
Pino F3	I/O — User I/O
Pino F4	I/O — User I/O
Pino F5	VCCIO — I/O bank 1 supply
Pino F6	I/O — User I/O
Pino F7	I/O — User I/O
Pino F8	GND — Ground
Pino F9	I/O — User I/O
Pino F10	VCCIO — I/O bank 2 supply
Pino F11	I/O — User I/O
Pino F12	I/O — User I/O
Pino F13	GND — Ground
Pino F14	I/O — User I/O
Pino F15	GND — Ground
Pino F16	I/O — User I/O
Pino G1	I/O — User I/O
Pino G2	VCCINT — Core supply 2.5 V
Pino G3	I/O — User I/O
Pino G4	GND — Ground
Pino G5	I/O — User I/O
Pino G6	VCCIO — I/O bank 3 supply
Pino G7	I/O — User I/O
Pino G8	GND — Ground
Pino G9	I/O — User I/O
Pino G10	GND — Ground
Pino G11	VCCIO — I/O bank 4 supply
Pino G12	I/O — User I/O
Pino G13	GND — Ground
Pino G14	I/O — User I/O
Pino G15	VCCINT — Core supply 2.5 V
Pino G16	I/O — User I/O
Pino H1	I/O — User I/O
Pino H2	I/O — User I/O
Pino H3	GND — Ground
Pino H4	VCCIO — I/O bank 1 supply
Pino H5	I/O — User I/O
Pino H6	I/O — User I/O
Pino H7	GND — Ground
Pino H8	VCCINT — Core supply 2.5 V
Pino H9	I/O — User I/O
Pino H10	I/O — User I/O
Pino H11	GND — Ground
Pino H12	VCCIO — I/O bank 2 supply
Pino H13	I/O — User I/O
Pino H14	I/O — User I/O
Pino H15	VCCINT — Core supply 2.5 V
Pino H16	I/O — User I/O
Pino J1	I/O — User I/O
Pino J2	GND — Ground
Pino J3	I/O — User I/O
Pino J4	I/O — User I/O
Pino J5	GND — Ground
Pino J6	VCCINT — Core supply 2.5 V
Pino J7	I/O — User I/O
Pino J8	I/O — User I/O
Pino J9	GND — Ground
Pino J10	VCCINT — Core supply 2.5 V
Pino J11	I/O — User I/O
Pino J12	I/O — User I/O
Pino J13	GND — Ground
Pino J14	I/O — User I/O
Pino J15	GND — Ground
Pino J16	I/O — User I/O
Pino K1	I/O — User I/O
Pino K2	VCCIO — I/O bank 1 supply
Pino K3	I/O — User I/O
Pino K4	GND — Ground
Pino K5	I/O — User I/O
Pino K6	GND — Ground
Pino K7	VCCIO — I/O bank 3 supply
Pino K8	I/O — User I/O
Pino K9	I/O — User I/O
Pino K10	GND — Ground
Pino K11	VCCIO — I/O bank 4 supply
Pino K12	I/O — User I/O
Pino K13	GND — Ground
Pino K14	I/O — User I/O
Pino K15	GND — Ground
Pino K16	I/O — User I/O
Pino L1	I/O — User I/O
Pino L2	I/O — User I/O
Pino L3	GND — Ground
Pino L4	VCCINT — Core supply 2.5 V
Pino L5	I/O — User I/O
Pino L6	I/O — User I/O
Pino L7	GND — Ground
Pino L8	VCCIO — I/O bank 4 supply
Pino L9	I/O — User I/O
Pino L10	I/O — User I/O
Pino L11	GND — Ground
Pino L12	VCCINT — Core supply 2.5 V
Pino L13	I/O — User I/O
Pino L14	I/O — User I/O
Pino L15	GND — Ground
Pino L16	I/O — User I/O
Pino M1	I/O — User I/O
Pino M2	GND — Ground
Pino M3	I/O — User I/O
Pino M4	I/O — User I/O
Pino M5	VCCIO — I/O bank 1 supply
Pino M6	I/O — User I/O
Pino M7	I/O — User I/O
Pino M8	GND — Ground
Pino M9	I/O — User I/O
Pino M10	VCCIO — I/O bank 2 supply
Pino M11	I/O — User I/O
Pino M12	I/O — User I/O
Pino M13	GND — Ground
Pino M14	I/O — User I/O
Pino M15	GND — Ground
Pino M16	I/O — User I/O
Pino N1	I/O — User I/O
Pino N2	VCCINT — Core supply 2.5 V
Pino N3	I/O — User I/O
Pino N4	GND — Ground
Pino N5	I/O — User I/O
Pino N6	VCCIO — I/O bank 3 supply
Pino N7	I/O — User I/O
Pino N8	GND — Ground
Pino N9	I/O — User I/O
Pino N10	GND — Ground
Pino N11	VCCIO — I/O bank 4 supply
Pino N12	I/O — User I/O
Pino N13	GND — Ground
Pino N14	I/O — User I/O
Pino N15	VCCINT — Core supply 2.5 V
Pino N16	I/O — User I/O
Pino P1	I/O — User I/O
Pino P2	I/O — User I/O
Pino P3	GND — Ground
Pino P4	VCCIO — I/O bank 1 supply
Pino P5	I/O — User I/O
Pino P6	I/O — User I/O
Pino P7	GND — Ground
Pino P8	VCCINT — Core supply 2.5 V
Pino P9	I/O — User I/O
Pino P10	I/O — User I/O
Pino P11	GND — Ground
Pino P12	VCCIO — I/O bank 2 supply
Pino P13	I/O — User I/O
Pino P14	I/O — User I/O
Pino P15	VCCINT — Core supply 2.5 V
Pino P16	I/O — User I/O
Pino R1	I/O — User I/O
Pino R2	GND — Ground
Pino R3	I/O — User I/O
Pino R4	I/O — User I/O
Pino R5	GND — Ground
Pino R6	VCCINT — Core supply 2.5 V
Pino R7	I/O — User I/O
Pino R8	I/O — User I/O
Pino R9	GND — Ground
Pino R10	VCCINT — Core supply 2.5 V
Pino R11	I/O — User I/O
Pino R12	I/O — User I/O
Pino R13	GND — Ground
Pino R14	VCCIO — I/O bank 2 supply
Pino R15	I/O — User I/O
Pino R16	I/O — User I/O
Pino T1	I/O — User I/O
Pino T2	VCCIO — I/O bank 1 supply
Pino T3	I/O — User I/O
Pino T4	I/O — User I/O
Pino T5	GND — Ground
Pino T6	VCCINT — Core supply 2.5 V
Pino T7	I/O — User I/O
Pino T8	I/O — User I/O
Pino T9	GND — Ground
Pino T10	VCCINT — Core supply 2.5 V
Pino T11	I/O — User I/O
Pino T12	I/O — User I/O
Pino T13	GND — Ground
Pino T14	VCCIO — I/O bank 2 supply
Pino T15	I/O — User I/O
Pino T16	I/O — User I/O

Aplicações típicas

EP1K30FC256-1N é adequado para 6 aplicaçãos: Industrial Control Glue Logic, Telecom Interface Bridging, Custom ASIC Replacement (Low Volume), Legacy System Maintenance, Prototyping Platform for Larger FPGAs, Test & Measurement Custom Instrumentation.

🏭

Industrial Control Glue Logic

The EP1K30FC256-1N's 1,728 logic elements and 171 user I/O make it well-suited to industrial glue-logic consolidation: replacing multiple 74-series MSI/LSI devices with a single programmable part. The 2.5 V core and 256-FBGA footprint fit inside typical PLC backplane form factors, and the 30K-gate capacity covers most parallel-interface adaptation tasks. Compared to a discrete logic implementation, the FPGA simplifies PCB layout and supports late-stage protocol changes via in-system JTAG reconfiguration. Pair with an EPC configuration PROM for non-volatile boot. Industrial users should verify that commercial temperature rating (0-70C) matches their enclosure environment; for harsher sites, migrate to an industrial-grade Cyclone part.

Recomendado

🌐

Telecom Interface Bridging

ACEX-1K parts are commonly deployed as custom protocol bridges between telecom backplanes - for example, E1/T1 to PCM highway conversion or proprietary serial muxing. The EP1K30FC256-1N's high I/O count (171) supports multiple parallel buses simultaneously, while the embedded RAM (24,576 bits) handles small FIFO and elastic buffer functions. Operating frequency up to 250 MHz in the -3 speed grade covers most telecom line rates. The SRAM-based configuration means loss-of-power erases state, so a watchdog supervisor is recommended. Designers should pay attention to I/O bank voltage matching across the bridge boundary.

Recomendado

EP1K30F256-3 · Altera EP1C6F256C8N · Intel

🔧

Custom ASIC Replacement (Low Volume)

For low-volume production runs (hundreds to a few thousand units), the EP1K30FC256-1N serves as a cost-effective ASIC replacement, eliminating mask NRE while delivering 30K-gate capacity. The 1.0 mm pitch FBGA is hand-solderable with hot air for prototype assembly, simplifying rework. Designers can iterate RTL until tapeout-equivalent timing closure, then freeze the bitstream for production. Note that per-unit FPGA cost exceeds an equivalent ASIC at high volumes; this application is best when volume stays under 5K/year or when field-upgradeability is a customer requirement.

Recomendado

EP1K100FC256-2N · Intel EPC2LC20 · Altera

🛠️

Legacy System Maintenance

Many industrial and telecom systems shipped between 2000 and 2010 with ACEX-1K FPGAs at their core. The EP1K30FC256-1N remains the only path to maintain fielded equipment without a full board redesign, which would require re-qualification. Engineers supporting such systems should stock critical ACEX parts, document bitstreams, and verify each replacement unit against the original JTAG signature. The 'N' lead-free finish matches RoHS-compliant assemblies; for SnPb systems the EP1K30FC256-1 variant is the correct drop-in. This is the highest-volume remaining use case in 2026.

Recomendado

EP1K30FC256-1 · Intel EP1K10FC256-1 · Intel

🎓

Prototyping Platform for Larger FPGAs

The EP1K30FC256-1N serves as an accessible stepping stone for engineers learning Altera/Intel FPGA design flows before scaling to Cyclone or Stratix parts. Quartus II software (legacy version required for ACEX-1K support) supports the full Verilog/VHDL flow, JTAG programming, and SignalTap logic analyzer features. The 256-FBGA breakout is widely available on adapter boards, making the EP1K30FC256-1N usable on a desktop dev rig. Students and hobbyists can prototype state machines, custom peripherals, and soft-core CPU implementations before migrating the design to a more capable and active family.

Recomendado

EP1K100FC256-2N · Intel EPC2LC20 · Altera

📏

Test & Measurement Custom Instrumentation

Test equipment manufacturers use the EP1K30FC256-1N to build custom stimulus/response modules for ATE - sequencing parallel patterns, mixing serial protocols, and timing-edge generation. The 171 I/O easily accommodates a multi-channel pattern generator card, and the SRAM-based fabric lets field engineers reconfigure the test for new DUTs over JTAG. Tight timing margins demand the -3 speed grade; cost-sensitive fixtures can use -1 or -2 grades. Note that the device is end-of-life, so any new ATE platform should plan for migration to active Cyclone IV/V or MAX 10 silicon within its lifecycle.

Recomendado

EP1K30F256-3 · Altera EP1C12F324C8N · Altera

Resumo dos produtos recomendados

EPC2LC20 Altera Usado em: Industrial Control Glue Logic, Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K10FC256-1 Intel Usado em: Industrial Control Glue Logic, Legacy System Maintenance EP1K30F256-3 Altera Usado em: Telecom Interface Bridging, Test & Measurement Custom Instrumentation EP1C6F256C8N Intel Usado em: Telecom Interface Bridging EP1K100FC256-2N Intel Usado em: Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K30FC256-1 Intel Usado em: Legacy System Maintenance EP1C12F324C8N Altera Usado em: Test & Measurement Custom Instrumentation

What is the EP1K30FC256-1N?

The EP1K30FC256-1N is an Intel (formerly Altera) ACEX-1K family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded SRAM, and 171 user I/O pins. According to the Altera ACEX-1K datasheet, the device is housed in a 256-ball FineLine BGA package and operates from a 2.5 V core supply. It is now classified as obsolete/end-of-life silicon.

Is the EP1K30FC256-1N still in production?

No, the EP1K30FC256-1N is not in active production. GlobalSpec lists the EP1K30 family as 'Obsolete / End of life' with ECCN EAR99. Remaining stock is available only through authorized distributors like Heisener, Vyrian, and broker channels. New designs should migrate to active Intel/Altera families such as Cyclone IV/V or MAX 10.

What is the price of the EP1K30FC256-1N as of 2026-09-07?

Distributor pricing for EP1K30FC256-1N as of 2026-09-07 sits around 28.50 USD at qty 1, dropping to approximately 13.95 USD per unit at qty 1000. Pricing is volatile because the part is obsolete and supply is limited to remaining inventory. Always request a fresh quote from distributors like Heisener or Vyrian for current availability.

Where can I buy the EP1K30FC256-1N online?

The EP1K30FC256-1N can be sourced from authorized distributors Heisener, Vyrian, AiChipLink, and Avaq, plus broker inventory listed on Octopart. Lead times are typically immediate-ship from broker stock; however, counterfeit risk rises for any ACEX-1K purchase outside franchised channels. Always request a manufacturer Certificate of Conformance (CoC) for EOL parts.

What is the lead time for EP1K30FC256-1N?

Heisener reports EP1K30FC256-1N ships immediately with delivery in early April (Apr 2 - Apr 7 window shown on their listing) using expedited shipping. Because this part is obsolete, lead times depend entirely on the broker's existing stock - large-quantity orders above 1,000 units may require multi-week sourcing from multiple distributors.

Is the EP1K30FC256-1N in stock?

Yes, EP1K30FC256-1N is in stock at Heisener (3,728 pieces reported at last fetch), plus Vyrian and AiChipLink. Quoted stock fluctuates daily because the part is obsolete and inventory depletes without replacement. For high-volume needs, plan to place orders before stock clears or migrate to an active Cyclone-family equivalent.

What is the difference between EP1K30FC256-1N and EP1K30FC256-1?

The EP1K30FC256-1N is the lead-free / RoHS-compliant variant of the EP1K30FC256-1, both in 256-FBGA and both -1 speed grade. Functionally they are identical - same ACEX-1K die, same 1,728 LEs, same 171 user I/O. The 'N' suffix on the Altera/Intel ACEX-1K family specifically denotes lead-free terminal finish; the bare part number is SnPb.

EP1K30FC256-1N vs EP1K30FC256-3 - which is faster?

The EP1K30FC256-1N is a -1 speed grade while the EP1K30FC256-3 is the fastest -3 grade. The -3 grade delivers higher internal Fmax (typically ~250 MHz vs ~150 MHz for -1) at the cost of higher power and possibly different timing closure. For new design starts, prefer -3; for cost-sensitive legacy maintenance, -1 is adequate.

What is a drop-in replacement for EP1K30FC256-1N?

True drop-in FPGA replacements require identical package footprint, identical I/O count, identical pinout, and compatible configuration interface. The closest same-package drop-in is the EP1K30FC256-3N (same 256-FBGA, same die, faster speed grade). Cyclone series parts are not pin-compatible because ball maps differ, requiring PCB rework.

Where do I download the EP1K30FC256-1N datasheet PDF?

The official Altera ACEX-1K datasheet PDF is available at the Altera literature archive (altera.com/literature/ds/acex_datasheet.pdf). Secondary mirrors including Datasheets.com, Vyrian, and Avaq host PDF copies. Always download from the manufacturer or an authorized distributor to avoid tampered datasheet revisions.

What is the pinout of EP1K30FC256-1N in 256-FBGA?

The 256-FBGA package is a 17x17 mm FineLine BGA with 256 balls on a 1.0 mm pitch. The complete ball map (A1-A16, B1-B16, ... T1-T16 excluding index) is published in the ACEX-1K device handbook. Reference the datasheet pin tables for exact ball assignments of user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, JTAG TCK/TMS/TDO/TDI), power (VCCINT, VCCIO), and ground balls.

What package does the EP1K30FC256-1N use?

The EP1K30FC256-1N uses a 256-ball FineLine Ball Grid Array (FBGA) package, also referenced as 256-BGA, with 1.0 mm ball pitch on a 17x17 mm body. The 'FC' suffix in the Altera/Intel naming convention denotes the FBGA package family, while the '256' is the ball count.

What are the key specifications of EP1K30FC256-1N engineers should know?

The EP1K30FC256-1N is a 1,728-logic-element ACEX-1K FPGA with 24,576 bits of embedded SRAM, 171 user I/O, 2.5 V core supply, 256-ball FBGA package, and -1 speed grade. According to the Altera ACEX-1K datasheet, configuration requires an external serial PROM and JTAG (IEEE 1149.1) programming support. Operating temperature is commercial 0C to +70C.

What is the best equivalent for EP1K30FC256-1N?

The best same-brand drop-in equivalent for EP1K30FC256-1N is the EP1K30FC256-1 (non-N leaded variant, identical die and 256-FBGA footprint). For active silicon replacement, the Intel Cyclone IV EP4CE30F23C8N is functionally similar in logic capacity but uses a different package and requires a PCB respin. Verify pinout before substituting.

Dados de referência de engenharia para EP1K30FC256-1N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP1K30FC256-1N when you need to maintain an existing ACEX-1K design or replace a damaged board at minimum cost - the -1 speed grade is the cheapest 30K ACEX option and the N-suffix finish matches RoHS assemblies. If your timing margins are tight, step up to EP1K30FC256-2N (mid speed) or EP1K30FC256-3N (fastest); all three share the 256-FBGA. For non-RoHS legacy systems requiring SnPb, choose the EP1K30FC256-1. Do NOT use ACEX-1K for new designs anywhere lifecycle support matters - migrate to Cyclone IV, Cyclone V, or MAX 10.

Comparação com alternativas

Parâmetro	Este produto	EP1K30FC256-3N	EP1K30FC256-1	EP1K30FC256-2N
Package	256-BGA (FineLine)	256-BGA (FineLine) - same	256-BGA (FineLine) - same	256-BGA (FineLine) - same
Brand	Intel	Intel	Intel	Intel
Family	ACEX-1K	ACEX-1K	ACEX-1K	ACEX-1K
Speed Grade	-1	-3 (fastest)	-1	-2
Logic Elements	1,728	1,728	1,728	1,728
Embedded RAM	24,576 bits	24,576 bits	24,576 bits	24,576 bits
Max User I/O	171	171	171	171
Lead-Free Finish	Yes (N suffix)	Yes (N suffix)	No (SnPb)	Yes (N suffix)
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete

Principais diferenciais

Speed-grade -1 (lowest cost tier of ACEX-1K 30K family) (vs EP1K30FC256-3N)
Lead-free RoHS finish (N suffix) (vs EP1K30FC256-1)
Same-brand same-family same-package drop-in availability (vs EP1K30FC256-2N)

Notas de projeto

Estimated: ACEX-1K I/O banks must be powered from VCCIO at 2.5 V or 3.3 V (per bank) while the core runs from VCCINT at 2.5 V. Decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball, and bulk-decouple each VCCIO bank with 4.7 µF. Idle I/O pins should be left at the default bus-hold or pulled to a defined rail; floating inputs cause ICCINT excursions up to tens of milliamps on SRAM FPGAs.

The 256-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.5 oz copper and microvia-in-pad if any inner balls route to inner layers. Estimated via antipad diameter 0.6 mm, ball pad 0.45 mm. Escape routing should be length-matched within a bank if any source-synchronous interface runs at >100 MHz, but most ACEX-1K designs target 50-100 MHz I/O, so matched-length requirements are usually limited to clocks.

Because ACEX-1K is SRAM-based, configuration is volatile: an EPC2 (or compatible) configuration PROM must boot the device at every POR. Do not assume JTAG-load-only operation in production - bitstream upload via JTAG is for development only. Also, the OBSOLETE LIFECYCLE means supply continuity is not guaranteed - new designs should plan migration to Cyclone IV or MAX 10, which use the same Quartus toolchain and similar configuration PROM interfaces.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Unknown

Minerais de conflito

Compliant

N suffix indicates lead-free terminal finish per Altera/Intel product declaration at original release. Halogen-free status not declared in retrieved sources and marked unknown. Part is obsolete per GlobalSpec EOL notice - not recommended for new automotive/AEC programs.

Dados verificados em: 2026-09-07 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Octopart, Distributor, Distributor, Manufacturer Product Page, Distributor, Distributor

Buscas relacionadas

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Componentes & termos relacionados

Intel Altera EP1K30FC256-1N EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N ACEX-1K FPGA Field Programmable Gate Array Programmable Logic Device BGA FineLine BGA 256-ball FBGA Logic Element Embedded Array Block EAB SRAM JTAG IEEE 1149.1 Quartus Cyclone MAX 10 RoHS Lead-free Configuration PROM EPC2 Industrial glue logic Telecom interface