EP1K30FC256-3N - ACEX 1K FPGA, 30K Gates, 256-BGA | Intel
N.º da peça: EP1K30FC256-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $27.99 | $27,99 |
| 10 | $25.19 | $251,90 |
| 100 | $21.8 | $2.180,00 |
| 250 | $19.62 | $4.905,00 |
| 500 | $17.5 | $8.750,00 |
EP1K30FC256-3N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can re-program in-system to implement arbitrary digital logic. ACEX 1K belongs to the broader programmable logic family hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit. ACEX 1K positioned itself as a 'system-on-a-programmable-chip' (SOPC) platform, combining logic, embedded memory, and dual-port RAM in a single device for glue-logic and low-volume ASIC replacement.
Key features of the EP1K30FC256-3N include the enhanced embedded array for implementing megafunctions such as efficient memory and specialized logic functions, dual-port RAM support, dedicated carry and cascade chains for high-performance arithmetic, JTAG-compliant boundary-scan testing per IEEE Std 1149.1, and 4-input look-up tables (LUTs) per logic element. The '3' speed grade offers typical propagation delays around 0.6 ns in the fastest paths.
Architecturally, the EP1K30FC256-3N combines a 'FastTrack' continuous interconnect fabric with a distributed embedded array that can be configured as ROM, RAM, dual-port RAM, or first-in-first-out (FIFO) buffers. The device is configured via a serial or parallel configuration scheme using an Altera configuration EPROM or controller, supporting in-system programmability (ISP) through JTAG.
Typical applications include digital signal processing glue logic, telecommunications interface bridging, peripheral bus expansion in PCI and embedded CPU systems, and industrial control logic where low unit cost, deterministic timing, and on-board reprogrammability outweigh the need for high logic density. The 171 user I/Os accommodate parallel buses, memory interfaces, and high-pin-count glue logic.
When designing with the EP1K30FC256-3N, pay attention to multi-voltage I/O bank planning — the ACEX 1K family supports mixed-voltage interfacing on designated banks via VCCIO pins. Adequate decoupling (0.1 µF + bulk) and a solid ground pour are essential because the 256-ball BGA package relies on inner-plane thermal dissipation rather than a top-side heat spreader.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes beyond the manufacturer datasheet, giving an engineer a complete purchase and migration reference for the ACEX 1K 30K-gate class.
Alternativas drop-in para EP1K30FC256-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K30FC256-3N (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Core Supply Voltage, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K30FC256-3
✅ Drop-In✓ Em estoque
$11.1 / unidade
Ver ficha técnica →EP1K30FC256-2N
✅ Drop-In✓ Em estoque
$21.45 / unidade
Ver ficha técnica →EP1K30FC256-1N
✅ Drop-In✓ Em estoque
$13.95 / unidade
Ver ficha técnica →EP1K100FC256-3N
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP1K100FC256-2N
✅ Drop-In✓ Em estoque
$78.1951 / unidade
Ver ficha técnica →EP1K30FI256-2N
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EP1K30FC256-3N Classificações máximas e características elétricas
| Family | ACEX 1K |
| Logic Elements / Cells | 17,288 logic elements (1,728 cells) |
| Typical Gates | 30,000 |
| Total RAM Bits | 24,576 |
| Number of LABs | 216 |
| User I/Os | 171 |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) |
| Technology | 0.22 µm CMOS, SRAM configuration |
| Speed Grade | -3 |
| Propagation Delay (typ.) | 0.6 ns |
| Maximum Frequency | 200 MHz |
| Encapsulamento | 256-ball FineLine BGA (FBGA-256) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 °C to +70 °C (commercial) |
| Configuration | SRAM, serial/parallel, JTAG ISP (IEEE 1149.1) |
Configuração de pinos do EP1K30FC256-3N
| Pino A1 | I/O — User I/O (Bank 1) |
| Pino A2 | I/O — User I/O (Bank 1) |
| Pino B1 | I/O — User I/O (Bank 1) |
| Pino B2 | VCCIO1 — I/O bank 1 supply |
| Pino C1 | I/O — User I/O (Bank 1) |
| Pino C2 | GND — Ground |
| Pino D1 | I/O — User I/O (Bank 1) |
| Pino D2 | I/O — User I/O (Bank 1) |
| Pino E1 | I/O — User I/O (Bank 1) |
| Pino E2 | I/O — User I/O (Bank 1) |
| Pino F1 | VCCINT — Core supply (2.5 V) |
| Pino F2 | I/O — User I/O (Bank 2) |
| Pino G1 | I/O — User I/O (Bank 2) |
| Pino G2 | GND — Ground |
| Pino H1 | I/O — User I/O (Bank 2) |
| Pino H2 | I/O — User I/O (Bank 2) |
| Pino J1 | I/O — User I/O (Bank 2) |
| Pino J2 | VCCIO2 — I/O bank 2 supply |
| Pino K1 | I/O — User I/O (Bank 2) |
| Pino K2 | I/O — User I/O (Bank 2) |
| Pino L1 | GND — Ground |
| Pino L2 | I/O — User I/O (Bank 3) |
| Pino M1 | I/O — User I/O (Bank 3) |
| Pino M2 | I/O — User I/O (Bank 3) |
| Pino N1 | VCCINT — Core supply (2.5 V) |
| Pino N2 | I/O — User I/O (Bank 3) |
| Pino TDI | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pino TDO | TDO — JTAG Test Data Out (IEEE 1149.1) |
| Pino TMS | TMS — JTAG Test Mode Select (IEEE 1149.1) |
| Pino TCK | TCK — JTAG Test Clock (IEEE 1149.1) |
| Pino nCONFIG | nCONFIG — Configuration reset (active low) |
| Pino nSTATUS | nSTATUS — Configuration status (active low) |
| Pino CONFIG_DONE | CONFIG_DONE — Configuration complete (open-drain) |
| Pino DCLK | DCLK — Configuration clock input |
| Pino DATA0 | DATA0 — Configuration data input (LSB) |
| Pino MSEL0 | MSEL0 — Configuration mode select 0 |
| Pino MSEL1 | MSEL1 — Configuration mode select 1 |
| Pino GND | GND — Ground (multiple balls) |
| Pino VCCINT | VCCINT — Core supply (2.5 V, multiple balls) |
| Pino VCCIO | VCCIO — I/O bank supply (per bank, multiple balls) |
Aplicações típicas
EP1K30FC256-3N é adequado para 7 aplicaçãos: Telecommunications Interface Bridging, Digital Signal Processing Glue Logic, Peripheral Bus Expansion (PCI / Embedded CPU), Industrial Control Logic, ASIC Replacement / Low-Volume Custom Logic, Legacy System Sustainment / Field Upgrades, Test & Measurement Backplane Bridging.
Telecommunications Interface Bridging
The EP1K30FC256-3N fits telecommunications interface bridging because its 171 user I/Os accommodate wide parallel buses (e.g., UTOPIA, H.110, MVIP) and its 24,576 RAM bits support small FIFO buffers for rate-adaptation between backplane and framer. At 200 MHz in the -3 speed grade, the device achieves deterministic timing suitable for TDM/SONET glue logic, and the multiple VCCIO banks allow direct 3.3 V/2.5 V/1.8 V interfacing to mixed-voltage framers and transceivers without external level shifters. SameFrame pin-migration to EP1K100 enables a future upgrade without PCB rework when channel counts grow.
Recomendado
Digital Signal Processing Glue Logic
For DSP glue logic between a fixed-function DSP processor and external memory, the EP1K30FC256-3N's 30K-gate capacity is well-matched to state-machine control, address decoding, and protocol conversion. Its 4-input LUTs and dedicated carry chains deliver efficient address-generation logic, while 24,576 embedded RAM bits can hold coefficient buffers for programmable filters. The 256-FBGA package's small footprint (17 mm × 17 mm) supports dense PCB layouts alongside DSP chips, and the -3 speed grade enables 200 MHz interfaces to SDRAM controllers without timing closure issues.
Recomendado
Peripheral Bus Expansion (PCI / Embedded CPU)
The EP1K30FC256-3N is well-suited for peripheral bus expansion in PCI and embedded CPU systems because its 171 I/Os easily accommodate 32-bit address/data buses plus control signals. Its 30K gates handle state machines for DMA controllers, bus arbiters, and protocol translators between local buses (e.g., ISA, VME, PC/104) and host CPUs. The 200 MHz fabric speed enables zero-wait-state bus bridges in the -3 speed grade, while the multiple VCCIO banks allow direct 5 V-tolerant interfacing via external resistors where required for legacy peripherals.
Recomendado
Industrial Control Logic
For industrial control and factory-automation controllers, the EP1K30FC256-3N's commercial temperature grade and 256-FBGA package provide reliable glue logic for PLCs, motor-control boards, and sensor aggregators. Its 30K gates can implement multiple encoder counters, PWM generators, and fieldbus state machines in a single device. With same-frame compatibility to the EP1K100 family, designers can migrate upward as I/O counts grow. For industrial-temperature deployments, the EP1K30FI256-2N is the pin-compatible drop-in alternative.
Recomendado
ASIC Replacement / Low-Volume Custom Logic
The EP1K30FC256-3N is ideal as an ASIC replacement in low-volume or prototype products because designers can iterate logic without respinning silicon, dramatically reducing NRE costs. Its 30K gates handle typical custom peripherals (timers, watchdogs, protocol engines) that would otherwise require a small ASIC. The SRAM-based configuration supports in-system reprogrammability via JTAG, enabling field firmware updates. SameFrame migration to EP1K100 protects the PCB investment when designs outgrow the 30K-gate capacity.
Recomendado
Legacy System Sustainment / Field Upgrades
For sustainment of legacy equipment originally designed around the ACEX 1K family, the EP1K30FC256-3N allows in-kind replacement of failed units without redesigning the PCB. Its 256-FBGA footprint matches the original Altera reference designs, and SRAM configuration means replacement boards can be loaded with the original firmware image via JTAG or configuration EPROM. Because the part is NRD, sourcing from authorized brokers is the primary channel; lifecycle migration to EP1K100FC256-3N is recommended for new production runs.
Recomendado
Test & Measurement Backplane Bridging
In test-and-measurement instruments, the EP1K30FC256-3N bridges parallel backplane buses (e.g., VXI, PXI, LXI trigger lines) to custom measurement ASICs. Its 171 I/Os handle wide data and trigger buses, and its 24,576 RAM bits buffer measurement samples. The -3 speed grade supports 200 MHz backplane operation, while the multiple VCCIO banks interface directly to 3.3 V and 1.8 V measurement ADCs without level shifters. SameFrame pin migration enables a quick upgrade to EP1K100FC256-3N when higher gate counts are needed for new measurement channels.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K30FC256-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K30FC256-3 | EP1K30FC256-2N | EP1K30FC256-1N | EP1K100FC256-3N | EP1K100FC256-2N | EP1K30FI256-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same (SameFrame) | FBGA-256 - same (SameFrame) | FBGA-256 - same |
| Typical Gates | 30K | 30K | 30K | 30K | 100K (+233 %) | 100K (+233 %) | 30K |
| Speed Grade | -3 (fastest) | -3 | -2 | -1 (slowest) | -3 | -2 | -2 |
| User I/Os | 171 | 171 | 171 | 171 | 171 (same) | 171 (same) | 171 |
| Core Voltage | 2.5 V (2.375–2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 49,152 (+100 %) | 49,152 (+100 %) | 24,576 |
| Temperature Grade | Commercial (0 °C to +70 °C) | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40 °C to +85 °C) |
| Lead-Free / RoHS | Lead-free ('N' suffix) | Lead-bearing (no 'N') | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free |
| Lifecycle Status | NRD (Not Recommended for New Designs) | NRD | NRD | NRD | NRD | NRD | NRD |
Principais diferenciais
- SameFrame pin-compatible upgrade path to 100K gates on the same 256-FBGA (vs EP1K10FC256-3N)
- Largest embedded RAM (24,576 bits) in the ACEX 1K 30K-gate class (vs EP1K30FC256-2N)
- Lead-free / RoHS-compliant packaging ('N' suffix) (vs EP1K30FC256-3)
- Commercial temperature grade for cost-sensitive designs (vs EP1K30FI256-2N)
Notas de projeto
The EP1K30FC256-3N requires three supply rails: VCCINT (2.5 V core, 2.375–2.625 V) and per-bank VCCIO supplies (1.8 V, 2.5 V, or 3.3 V depending on interfacing logic). Decouple each VCCINT ball with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the ball, plus a 10 µF bulk tantalum or polymer capacitor per supply plane. Estimate (core current ~50–150 mA typical, scales with toggle rate and LAB utilization): Iccint ≈ 50 mA + 0.3 mA per utilized LAB at 100 MHz; verify against the datasheet's ICC vs frequency curves for production designs.
The 256-ball FineLine BGA has a 1.0 mm ball pitch and requires a 4–6 layer PCB with microvia or via-in-pad technology for reliable assembly. Use a solid ground plane on layer 2 directly beneath the BGA to provide a low-impedance return path and thermal dissipation. Route all signal traces on layers 3 and above; keep BGA escape traces short (≤ 5 mm). Per the Altera ACEX 1K datasheet, an exposed copper pad array of at least 100 mm² on the top side is recommended to keep junction temperature below 100 °C at maximum power.
Three common pitfalls when designing with the EP1K30FC256-3N: (1) confusing speed grade ordering — '-3' is the FASTEST bin, not the slowest (Altera convention reversed vs some competitors); (2) omitting the external configuration EPROM — the device is SRAM-based and loses its design on every power-down, so a serial configuration PROM (e.g., EPC2) or JTAG loader is mandatory; (3) mixing VCCIO voltages incorrectly — each bank must be powered to a single uniform voltage; mixing 3.3 V and 1.8 V within the same bank damages the I/O cells. Always consult the Bank VCCIO table before PCB layout.
The 256-FBGA package dissipates heat through the PCB rather than a top-side heat spreader. Estimate (junction-to-ambient thermal resistance θJA ≈ 18 °C/W for a 256-BGA on a 4-layer JEDEC test board): at 0.5 W typical dissipation, junction temperature rise above ambient is ~9 °C; at 1.5 W worst-case, rise is ~27 °C. For commercial-grade (0 °C to +70 °C) operation, ambient up to 70 °C is achievable at 1 W dissipation. Above 1.5 W, reduce ambient or add airflow to keep Tj below 100 °C.
JTAG signals (TDI, TDO, TMS, TCK) must be routed with 4.7 kΩ pull-ups to VCCIO and matched lengths within 25 mm to preserve signal integrity per IEEE 1149.1. The nCONFIG and nSTATUS signals are open-drain and require external 10 kΩ pull-ups to VCCIO. Place the configuration EPROM (EPC2 or compatible) within 50 mm of the FPGA to keep configuration trace impedance matched; long configuration traces (>100 mm) require series termination.
Informações de conformidade
'N' suffix indicates lead-free RoHS-compliant solder balls per Altera/Intel packaging convention. AEC-Q100 not applicable — FPGAs are not qualified for automotive AEC-Q100 by Altera/Intel; use automotive-grade Cyclone or other families for that purpose. Halogen-free and conflict-minerals status not stated in retrieved data.
