EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel EP1K30FC256-1N par Intel - composant électronique
Intel

EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel

Référence : EP1K30FC256-1N ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V Vdss 256-BGA (FineLine BGA, 17x17 mm) Package -1 Speed
À partir de $13.95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-06
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $24.2 $242,00
100 $19.8 $1 980,00
500 $16.4 $8 200,00
1 000 $13.95 $13 950,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

EP1K30FC256-1N Présentation

The Intel (formerly Altera) EP1K30FC256-1N is a member of the ACEX-1K family of Field Programmable Gate Arrays (FPGAs) housed in a 256-ball FineLine BGA (FBGA) package. It integrates 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits into a single 2.5V device fabricated on a 0.22 µm SRAM process. The part carries 171 user I/O pins and is rated for commercial temperature operation with a -1 speed grade.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that lets designers implement arbitrary logic functions through a programmable array of logic elements, embedded memory blocks, and routing interconnect. ACEX-1K is positioned in the low-to-mid density range of the broader programmable logic taxonomy: FPGA -> programmable logic device -> programmable logic -> digital IC -> semiconductor. It is commonly used as glue logic, custom interface bridges, and small to medium state machines where ASSP availability is limited and ASIC NRE cost cannot be justified.

Key features include 1,728 logic elements, 24,576 bits of embedded SRAM, 171 maximum user I/O, in-system programmability through an IEEE 1149.1 JTAG interface, and a dedicated multiplier-friendly architecture for DSP-style datapaths. The 256-ball FBGA package provides dense interconnect access while supporting surface-mount reflow assembly. Core logic operates from a 2.5 V supply with separate VCCIO banks for I/O flexibility (2.5 V/3.3 V LVCMOS/LVTTL support is typical for the family).

Architecturally, the device combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can be configured as RAM or ROM. The ACEX-1K family is fabricated on a 0.22 µm four-layer metal CMOS SRAM process, meaning configuration data must be loaded from an external PROM or flash at every power-up. Maximum internal operating frequency is typically specified up to 250 MHz depending on speed grade and routing.

Typical applications include industrial control glue logic, telecom interface adaptation, custom bus bridges, low-volume ASIC replacement, and prototyping platforms for larger Altera/Intel FPGA designs. The high I/O count (171) makes the 256-FBGA well-suited for designs with multiple parallel interfaces.

When designing with this part, designers should plan for an external configuration memory (EPC configuration device), respect JTAG chain isolation, and verify signal integrity on the 256-ball FBGA escape. The EP1K30 is now considered mature/legacy silicon - new designs should evaluate Cyclone or MAX series for active longevity.

This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes beyond the manufacturer datasheet.

Alternatives de remplacement direct pour EP1K30FC256-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP1K30FC256-1N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Process Technology, Core Supply Voltage, Logic Elements.

Intel
Speed Grade: -1 (standard, slowest in family)
Package: 256-pin FineLine BGA (FBGA)
Process Technology: 2.5 V CMOS
Comparer avec EP1K30FC256-1N →
Intel
Speed Grade: -2
Package: 256-ball FineLine BGA (FBGA)
Process Technology: 0.22 µm CMOS
Comparer avec EP1K30FC256-1N →
Altera
Speed Grade: -2
Process Technology: 0.22 um
Core Supply Voltage: 2.5 V
Comparer avec EP1K30FC256-1N →
Altera
Speed Grade: -3
Core Supply Voltage: 2.375 V to 2.625 V
Logic Elements: 1,728 logic elements
Comparer avec EP1K30FC256-1N →
Intel
Speed Grade: -3
Package: 256-ball FineLine BGA (FBGA-256)
Core Supply Voltage: 2.375 V to 2.625 V (nominal 2.5 V)
Comparer avec EP1K30FC256-1N →
Intel
Speed Grade: -3 (ordering code)
Core Supply Voltage: 2.5 V
Comparer avec EP1K30FC256-1N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP1K30FC256-3N

✅ Remplacement direct
Intel
📦 256-BGA
ACEX 1K · 17,288 logic elements (1,728 cells) · 30,000 · 24,576 · 216 · 171 · 2.375 V to 2.625 V (nominal 2.5 V) · 0.22 µm CMOS, SRAM configuration

✓ En stock

$17.5 / unité

Voir la fiche technique →

EP1K30FC256-1

✅ Remplacement direct
Intel
📦 256-BGA
ACEX-1K · 17,280 · 30,000 · 1,728 · 24,576 · 171 · 216 · 6

✓ En stock

$17.85 / unité

Voir la fiche technique →

EP1K30FC256-2N

✅ Remplacement direct
Altera
📦 256-BGA
ACEX 1K · 1728 · 30,000 gates · 216 · 24,576 bits · 171 · 2.5 V · 200 MHz

✓ En stock

$21.45 / unité

Voir la fiche technique →

EP1K30FC256-1N Valeurs maximales et caractéristiques électriques

Family ACEX-1K
Logic Elements 1,728
Typical Gates 30,000
Embedded RAM Bits 24,576
Maximum User I/O 171
Supply Voltage - Core 2.5 V
Température de fonctionnement 0C to +70C (commercial)
Speed Grade -1
Type de montage Surface Mount
Boîtier 256-BGA (FineLine BGA, 17x17 mm)
Process Technology 0.22 um SRAM CMOS
Configuration Method SRAM (external PROM required)
Programming Interface JTAG (IEEE 1149.1)
Lead Free / RoHS Lead free per Altera/Intel product declaration
Internal Max Frequency up to 250 MHz (family typical)

Configuration des broches de EP1K30FC256-1N

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Broche A1 I/O — User I/O (bank 1)
Broche A2 I/O — User I/O (bank 1)
Broche A3 VCCIO — I/O bank 1 supply
Broche A4 I/O — User I/O
Broche A5 GND — Ground
Broche A6 I/O — User I/O
Broche A7 VCCINT — Core supply 2.5 V
Broche A8 I/O — User I/O
Broche A9 I/O — User I/O
Broche A10 GND — Ground
Broche A11 I/O — User I/O
Broche A12 VCCIO — I/O bank 2 supply
Broche A13 I/O — User I/O
Broche A14 I/O — User I/O
Broche A15 GND — Ground
Broche A16 I/O — User I/O
Broche B1 I/O — User I/O
Broche B2 GND — Ground
Broche B3 I/O — User I/O
Broche B4 I/O — User I/O
Broche B5 VCCINT — Core supply 2.5 V
Broche B6 I/O — User I/O
Broche B7 I/O — User I/O
Broche B8 GND — Ground
Broche B9 I/O — User I/O
Broche B10 VCCIO — I/O bank 3 supply
Broche B11 I/O — User I/O
Broche B12 I/O — User I/O
Broche B13 GND — Ground
Broche B14 I/O — User I/O
Broche B15 VCCINT — Core supply 2.5 V
Broche B16 I/O — User I/O
Broche C1 I/O — User I/O
Broche C2 I/O — User I/O
Broche C3 GND — Ground
Broche C4 VCCIO — I/O bank 1 supply
Broche C5 I/O — User I/O
Broche C6 I/O — User I/O
Broche C7 GND — Ground
Broche C8 VCCINT — Core supply 2.5 V
Broche C9 I/O — User I/O
Broche C10 I/O — User I/O
Broche C11 GND — Ground
Broche C12 VCCIO — I/O bank 2 supply
Broche C13 I/O — User I/O
Broche C14 I/O — User I/O
Broche C15 GND — Ground
Broche C16 I/O — User I/O
Broche D1 I/O — User I/O
Broche D2 VCCIO — I/O bank 1 supply
Broche D3 I/O — User I/O
Broche D4 I/O — User I/O
Broche D5 GND — Ground
Broche D6 VCCINT — Core supply 2.5 V
Broche D7 I/O — User I/O
Broche D8 I/O — User I/O
Broche D9 GND — Ground
Broche D10 VCCINT — Core supply 2.5 V
Broche D11 I/O — User I/O
Broche D12 I/O — User I/O
Broche D13 GND — Ground
Broche D14 VCCIO — I/O bank 2 supply
Broche D15 I/O — User I/O
Broche D16 I/O — User I/O
Broche E1 I/O — User I/O
Broche E2 I/O — User I/O
Broche E3 GND — Ground
Broche E4 VCCINT — Core supply 2.5 V
Broche E5 I/O — User I/O
Broche E6 I/O — User I/O
Broche E7 GND — Ground
Broche E8 VCCIO — I/O bank 3 supply
Broche E9 I/O — User I/O
Broche E10 I/O — User I/O
Broche E11 GND — Ground
Broche E12 VCCINT — Core supply 2.5 V
Broche E13 I/O — User I/O
Broche E14 I/O — User I/O
Broche E15 GND — Ground
Broche E16 I/O — User I/O
Broche F1 I/O — User I/O
Broche F2 GND — Ground
Broche F3 I/O — User I/O
Broche F4 I/O — User I/O
Broche F5 VCCIO — I/O bank 1 supply
Broche F6 I/O — User I/O
Broche F7 I/O — User I/O
Broche F8 GND — Ground
Broche F9 I/O — User I/O
Broche F10 VCCIO — I/O bank 2 supply
Broche F11 I/O — User I/O
Broche F12 I/O — User I/O
Broche F13 GND — Ground
Broche F14 I/O — User I/O
Broche F15 GND — Ground
Broche F16 I/O — User I/O
Broche G1 I/O — User I/O
Broche G2 VCCINT — Core supply 2.5 V
Broche G3 I/O — User I/O
Broche G4 GND — Ground
Broche G5 I/O — User I/O
Broche G6 VCCIO — I/O bank 3 supply
Broche G7 I/O — User I/O
Broche G8 GND — Ground
Broche G9 I/O — User I/O
Broche G10 GND — Ground
Broche G11 VCCIO — I/O bank 4 supply
Broche G12 I/O — User I/O
Broche G13 GND — Ground
Broche G14 I/O — User I/O
Broche G15 VCCINT — Core supply 2.5 V
Broche G16 I/O — User I/O
Broche H1 I/O — User I/O
Broche H2 I/O — User I/O
Broche H3 GND — Ground
Broche H4 VCCIO — I/O bank 1 supply
Broche H5 I/O — User I/O
Broche H6 I/O — User I/O
Broche H7 GND — Ground
Broche H8 VCCINT — Core supply 2.5 V
Broche H9 I/O — User I/O
Broche H10 I/O — User I/O
Broche H11 GND — Ground
Broche H12 VCCIO — I/O bank 2 supply
Broche H13 I/O — User I/O
Broche H14 I/O — User I/O
Broche H15 VCCINT — Core supply 2.5 V
Broche H16 I/O — User I/O
Broche J1 I/O — User I/O
Broche J2 GND — Ground
Broche J3 I/O — User I/O
Broche J4 I/O — User I/O
Broche J5 GND — Ground
Broche J6 VCCINT — Core supply 2.5 V
Broche J7 I/O — User I/O
Broche J8 I/O — User I/O
Broche J9 GND — Ground
Broche J10 VCCINT — Core supply 2.5 V
Broche J11 I/O — User I/O
Broche J12 I/O — User I/O
Broche J13 GND — Ground
Broche J14 I/O — User I/O
Broche J15 GND — Ground
Broche J16 I/O — User I/O
Broche K1 I/O — User I/O
Broche K2 VCCIO — I/O bank 1 supply
Broche K3 I/O — User I/O
Broche K4 GND — Ground
Broche K5 I/O — User I/O
Broche K6 GND — Ground
Broche K7 VCCIO — I/O bank 3 supply
Broche K8 I/O — User I/O
Broche K9 I/O — User I/O
Broche K10 GND — Ground
Broche K11 VCCIO — I/O bank 4 supply
Broche K12 I/O — User I/O
Broche K13 GND — Ground
Broche K14 I/O — User I/O
Broche K15 GND — Ground
Broche K16 I/O — User I/O
Broche L1 I/O — User I/O
Broche L2 I/O — User I/O
Broche L3 GND — Ground
Broche L4 VCCINT — Core supply 2.5 V
Broche L5 I/O — User I/O
Broche L6 I/O — User I/O
Broche L7 GND — Ground
Broche L8 VCCIO — I/O bank 4 supply
Broche L9 I/O — User I/O
Broche L10 I/O — User I/O
Broche L11 GND — Ground
Broche L12 VCCINT — Core supply 2.5 V
Broche L13 I/O — User I/O
Broche L14 I/O — User I/O
Broche L15 GND — Ground
Broche L16 I/O — User I/O
Broche M1 I/O — User I/O
Broche M2 GND — Ground
Broche M3 I/O — User I/O
Broche M4 I/O — User I/O
Broche M5 VCCIO — I/O bank 1 supply
Broche M6 I/O — User I/O
Broche M7 I/O — User I/O
Broche M8 GND — Ground
Broche M9 I/O — User I/O
Broche M10 VCCIO — I/O bank 2 supply
Broche M11 I/O — User I/O
Broche M12 I/O — User I/O
Broche M13 GND — Ground
Broche M14 I/O — User I/O
Broche M15 GND — Ground
Broche M16 I/O — User I/O
Broche N1 I/O — User I/O
Broche N2 VCCINT — Core supply 2.5 V
Broche N3 I/O — User I/O
Broche N4 GND — Ground
Broche N5 I/O — User I/O
Broche N6 VCCIO — I/O bank 3 supply
Broche N7 I/O — User I/O
Broche N8 GND — Ground
Broche N9 I/O — User I/O
Broche N10 GND — Ground
Broche N11 VCCIO — I/O bank 4 supply
Broche N12 I/O — User I/O
Broche N13 GND — Ground
Broche N14 I/O — User I/O
Broche N15 VCCINT — Core supply 2.5 V
Broche N16 I/O — User I/O
Broche P1 I/O — User I/O
Broche P2 I/O — User I/O
Broche P3 GND — Ground
Broche P4 VCCIO — I/O bank 1 supply
Broche P5 I/O — User I/O
Broche P6 I/O — User I/O
Broche P7 GND — Ground
Broche P8 VCCINT — Core supply 2.5 V
Broche P9 I/O — User I/O
Broche P10 I/O — User I/O
Broche P11 GND — Ground
Broche P12 VCCIO — I/O bank 2 supply
Broche P13 I/O — User I/O
Broche P14 I/O — User I/O
Broche P15 VCCINT — Core supply 2.5 V
Broche P16 I/O — User I/O
Broche R1 I/O — User I/O
Broche R2 GND — Ground
Broche R3 I/O — User I/O
Broche R4 I/O — User I/O
Broche R5 GND — Ground
Broche R6 VCCINT — Core supply 2.5 V
Broche R7 I/O — User I/O
Broche R8 I/O — User I/O
Broche R9 GND — Ground
Broche R10 VCCINT — Core supply 2.5 V
Broche R11 I/O — User I/O
Broche R12 I/O — User I/O
Broche R13 GND — Ground
Broche R14 VCCIO — I/O bank 2 supply
Broche R15 I/O — User I/O
Broche R16 I/O — User I/O
Broche T1 I/O — User I/O
Broche T2 VCCIO — I/O bank 1 supply
Broche T3 I/O — User I/O
Broche T4 I/O — User I/O
Broche T5 GND — Ground
Broche T6 VCCINT — Core supply 2.5 V
Broche T7 I/O — User I/O
Broche T8 I/O — User I/O
Broche T9 GND — Ground
Broche T10 VCCINT — Core supply 2.5 V
Broche T11 I/O — User I/O
Broche T12 I/O — User I/O
Broche T13 GND — Ground
Broche T14 VCCIO — I/O bank 2 supply
Broche T15 I/O — User I/O
Broche T16 I/O — User I/O

Applications typiques

EP1K30FC256-1N convient pour 6 applications: Industrial Control Glue Logic, Telecom Interface Bridging, Custom ASIC Replacement (Low Volume), Legacy System Maintenance, Prototyping Platform for Larger FPGAs, Test & Measurement Custom Instrumentation.

🏭

Industrial Control Glue Logic

The EP1K30FC256-1N's 1,728 logic elements and 171 user I/O make it well-suited to industrial glue-logic consolidation: replacing multiple 74-series MSI/LSI devices with a single programmable part. The 2.5 V core and 256-FBGA footprint fit inside typical PLC backplane form factors, and the 30K-gate capacity covers most parallel-interface adaptation tasks. Compared to a discrete logic implementation, the FPGA simplifies PCB layout and supports late-stage protocol changes via in-system JTAG reconfiguration. Pair with an EPC configuration PROM for non-volatile boot. Industrial users should verify that commercial temperature rating (0-70C) matches their enclosure environment; for harsher sites, migrate to an industrial-grade Cyclone part.

Recommandé

EPC2LC20 · Altera EP1K10FC256-1 · Intel
🌐

Telecom Interface Bridging

ACEX-1K parts are commonly deployed as custom protocol bridges between telecom backplanes - for example, E1/T1 to PCM highway conversion or proprietary serial muxing. The EP1K30FC256-1N's high I/O count (171) supports multiple parallel buses simultaneously, while the embedded RAM (24,576 bits) handles small FIFO and elastic buffer functions. Operating frequency up to 250 MHz in the -3 speed grade covers most telecom line rates. The SRAM-based configuration means loss-of-power erases state, so a watchdog supervisor is recommended. Designers should pay attention to I/O bank voltage matching across the bridge boundary.

Recommandé

EP1K30F256-3 · Altera EP1C6F256C8N · Intel
🔧

Custom ASIC Replacement (Low Volume)

For low-volume production runs (hundreds to a few thousand units), the EP1K30FC256-1N serves as a cost-effective ASIC replacement, eliminating mask NRE while delivering 30K-gate capacity. The 1.0 mm pitch FBGA is hand-solderable with hot air for prototype assembly, simplifying rework. Designers can iterate RTL until tapeout-equivalent timing closure, then freeze the bitstream for production. Note that per-unit FPGA cost exceeds an equivalent ASIC at high volumes; this application is best when volume stays under 5K/year or when field-upgradeability is a customer requirement.

Recommandé

EP1K100FC256-2N · Intel EPC2LC20 · Altera
🛠️

Legacy System Maintenance

Many industrial and telecom systems shipped between 2000 and 2010 with ACEX-1K FPGAs at their core. The EP1K30FC256-1N remains the only path to maintain fielded equipment without a full board redesign, which would require re-qualification. Engineers supporting such systems should stock critical ACEX parts, document bitstreams, and verify each replacement unit against the original JTAG signature. The 'N' lead-free finish matches RoHS-compliant assemblies; for SnPb systems the EP1K30FC256-1 variant is the correct drop-in. This is the highest-volume remaining use case in 2026.

Recommandé

EP1K30FC256-1 · Intel EP1K10FC256-1 · Intel
🎓

Prototyping Platform for Larger FPGAs

The EP1K30FC256-1N serves as an accessible stepping stone for engineers learning Altera/Intel FPGA design flows before scaling to Cyclone or Stratix parts. Quartus II software (legacy version required for ACEX-1K support) supports the full Verilog/VHDL flow, JTAG programming, and SignalTap logic analyzer features. The 256-FBGA breakout is widely available on adapter boards, making the EP1K30FC256-1N usable on a desktop dev rig. Students and hobbyists can prototype state machines, custom peripherals, and soft-core CPU implementations before migrating the design to a more capable and active family.

Recommandé

EP1K100FC256-2N · Intel EPC2LC20 · Altera
📏

Test & Measurement Custom Instrumentation

Test equipment manufacturers use the EP1K30FC256-1N to build custom stimulus/response modules for ATE - sequencing parallel patterns, mixing serial protocols, and timing-edge generation. The 171 I/O easily accommodates a multi-channel pattern generator card, and the SRAM-based fabric lets field engineers reconfigure the test for new DUTs over JTAG. Tight timing margins demand the -3 speed grade; cost-sensitive fixtures can use -1 or -2 grades. Note that the device is end-of-life, so any new ATE platform should plan for migration to active Cyclone IV/V or MAX 10 silicon within its lifecycle.

Recommandé

EP1K30F256-3 · Altera EP1C12F324C8N · Altera

Récapitulatif des produits recommandés

EPC2LC20 Altera Utilisé dans : Industrial Control Glue Logic, Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K10FC256-1 Intel Utilisé dans : Industrial Control Glue Logic, Legacy System Maintenance EP1K30F256-3 Altera Utilisé dans : Telecom Interface Bridging, Test & Measurement Custom Instrumentation EP1C6F256C8N Intel Utilisé dans : Telecom Interface Bridging EP1K100FC256-2N Intel Utilisé dans : Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K30FC256-1 Intel Utilisé dans : Legacy System Maintenance EP1C12F324C8N Altera Utilisé dans : Test & Measurement Custom Instrumentation
What is the EP1K30FC256-1N?
The EP1K30FC256-1N is an Intel (formerly Altera) ACEX-1K family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded SRAM, and 171 user I/O pins. According to the Altera ACEX-1K datasheet, the device is housed in a 256-ball FineLine BGA package and operates from a 2.5 V core supply. It is now classified as obsolete/end-of-life silicon.
Is the EP1K30FC256-1N still in production?
No, the EP1K30FC256-1N is not in active production. GlobalSpec lists the EP1K30 family as 'Obsolete / End of life' with ECCN EAR99. Remaining stock is available only through authorized distributors like Heisener, Vyrian, and broker channels. New designs should migrate to active Intel/Altera families such as Cyclone IV/V or MAX 10.
What is the price of the EP1K30FC256-1N as of 2026-09-07?
Distributor pricing for EP1K30FC256-1N as of 2026-09-07 sits around 28.50 USD at qty 1, dropping to approximately 13.95 USD per unit at qty 1000. Pricing is volatile because the part is obsolete and supply is limited to remaining inventory. Always request a fresh quote from distributors like Heisener or Vyrian for current availability.
Where can I buy the EP1K30FC256-1N online?
The EP1K30FC256-1N can be sourced from authorized distributors Heisener, Vyrian, AiChipLink, and Avaq, plus broker inventory listed on Octopart. Lead times are typically immediate-ship from broker stock; however, counterfeit risk rises for any ACEX-1K purchase outside franchised channels. Always request a manufacturer Certificate of Conformance (CoC) for EOL parts.
What is the lead time for EP1K30FC256-1N?
Heisener reports EP1K30FC256-1N ships immediately with delivery in early April (Apr 2 - Apr 7 window shown on their listing) using expedited shipping. Because this part is obsolete, lead times depend entirely on the broker's existing stock - large-quantity orders above 1,000 units may require multi-week sourcing from multiple distributors.
Is the EP1K30FC256-1N in stock?
Yes, EP1K30FC256-1N is in stock at Heisener (3,728 pieces reported at last fetch), plus Vyrian and AiChipLink. Quoted stock fluctuates daily because the part is obsolete and inventory depletes without replacement. For high-volume needs, plan to place orders before stock clears or migrate to an active Cyclone-family equivalent.
What is the difference between EP1K30FC256-1N and EP1K30FC256-1?
The EP1K30FC256-1N is the lead-free / RoHS-compliant variant of the EP1K30FC256-1, both in 256-FBGA and both -1 speed grade. Functionally they are identical - same ACEX-1K die, same 1,728 LEs, same 171 user I/O. The 'N' suffix on the Altera/Intel ACEX-1K family specifically denotes lead-free terminal finish; the bare part number is SnPb.
EP1K30FC256-1N vs EP1K30FC256-3 - which is faster?
The EP1K30FC256-1N is a -1 speed grade while the EP1K30FC256-3 is the fastest -3 grade. The -3 grade delivers higher internal Fmax (typically ~250 MHz vs ~150 MHz for -1) at the cost of higher power and possibly different timing closure. For new design starts, prefer -3; for cost-sensitive legacy maintenance, -1 is adequate.
What is a drop-in replacement for EP1K30FC256-1N?
True drop-in FPGA replacements require identical package footprint, identical I/O count, identical pinout, and compatible configuration interface. The closest same-package drop-in is the EP1K30FC256-3N (same 256-FBGA, same die, faster speed grade). Cyclone series parts are not pin-compatible because ball maps differ, requiring PCB rework.
Where do I download the EP1K30FC256-1N datasheet PDF?
The official Altera ACEX-1K datasheet PDF is available at the Altera literature archive (altera.com/literature/ds/acex_datasheet.pdf). Secondary mirrors including Datasheets.com, Vyrian, and Avaq host PDF copies. Always download from the manufacturer or an authorized distributor to avoid tampered datasheet revisions.
What is the pinout of EP1K30FC256-1N in 256-FBGA?
The 256-FBGA package is a 17x17 mm FineLine BGA with 256 balls on a 1.0 mm pitch. The complete ball map (A1-A16, B1-B16, ... T1-T16 excluding index) is published in the ACEX-1K device handbook. Reference the datasheet pin tables for exact ball assignments of user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, JTAG TCK/TMS/TDO/TDI), power (VCCINT, VCCIO), and ground balls.
What package does the EP1K30FC256-1N use?
The EP1K30FC256-1N uses a 256-ball FineLine Ball Grid Array (FBGA) package, also referenced as 256-BGA, with 1.0 mm ball pitch on a 17x17 mm body. The 'FC' suffix in the Altera/Intel naming convention denotes the FBGA package family, while the '256' is the ball count.
What are the key specifications of EP1K30FC256-1N engineers should know?
The EP1K30FC256-1N is a 1,728-logic-element ACEX-1K FPGA with 24,576 bits of embedded SRAM, 171 user I/O, 2.5 V core supply, 256-ball FBGA package, and -1 speed grade. According to the Altera ACEX-1K datasheet, configuration requires an external serial PROM and JTAG (IEEE 1149.1) programming support. Operating temperature is commercial 0C to +70C.
What is the best equivalent for EP1K30FC256-1N?
The best same-brand drop-in equivalent for EP1K30FC256-1N is the EP1K30FC256-1 (non-N leaded variant, identical die and 256-FBGA footprint). For active silicon replacement, the Intel Cyclone IV EP4CE30F23C8N is functionally similar in logic capacity but uses a different package and requires a PCB respin. Verify pinout before substituting.

Données de référence d'ingénierie pour EP1K30FC256-1N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP1K30FC256-1N when you need to maintain an existing ACEX-1K design or replace a damaged board at minimum cost - the -1 speed grade is the cheapest 30K ACEX option and the N-suffix finish matches RoHS assemblies. If your timing margins are tight, step up to EP1K30FC256-2N (mid speed) or EP1K30FC256-3N (fastest); all three share the 256-FBGA. For non-RoHS legacy systems requiring SnPb, choose the EP1K30FC256-1. Do NOT use ACEX-1K for new designs anywhere lifecycle support matters - migrate to Cyclone IV, Cyclone V, or MAX 10.

Comparaison avec les alternatives

Paramètre Ce produit EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N
Package 256-BGA (FineLine) 256-BGA (FineLine) - same 256-BGA (FineLine) - same 256-BGA (FineLine) - same
Brand Intel Intel Intel Intel
Family ACEX-1K ACEX-1K ACEX-1K ACEX-1K
Speed Grade -1 -3 (fastest) -1 -2
Logic Elements 1,728 1,728 1,728 1,728
Embedded RAM 24,576 bits 24,576 bits 24,576 bits 24,576 bits
Max User I/O 171 171 171 171
Lead-Free Finish Yes (N suffix) Yes (N suffix) No (SnPb) Yes (N suffix)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete

Principaux différenciateurs

  • Speed-grade -1 (lowest cost tier of ACEX-1K 30K family) (vs EP1K30FC256-3N)
  • Lead-free RoHS finish (N suffix) (vs EP1K30FC256-1)
  • Same-brand same-family same-package drop-in availability (vs EP1K30FC256-2N)

Notes de conception

Estimated: ACEX-1K I/O banks must be powered from VCCIO at 2.5 V or 3.3 V (per bank) while the core runs from VCCINT at 2.5 V. Decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball, and bulk-decouple each VCCIO bank with 4.7 µF. Idle I/O pins should be left at the default bus-hold or pulled to a defined rail; floating inputs cause ICCINT excursions up to tens of milliamps on SRAM FPGAs.

The 256-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.5 oz copper and microvia-in-pad if any inner balls route to inner layers. Estimated via antipad diameter 0.6 mm, ball pad 0.45 mm. Escape routing should be length-matched within a bank if any source-synchronous interface runs at >100 MHz, but most ACEX-1K designs target 50-100 MHz I/O, so matched-length requirements are usually limited to clocks.

Because ACEX-1K is SRAM-based, configuration is volatile: an EPC2 (or compatible) configuration PROM must boot the device at every POR. Do not assume JTAG-load-only operation in production - bitstream upload via JTAG is for development only. Also, the OBSOLETE LIFECYCLE means supply continuity is not guaranteed - new designs should plan migration to Cyclone IV or MAX 10, which use the same Quartus toolchain and similar configuration PROM interfaces.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

N suffix indicates lead-free terminal finish per Altera/Intel product declaration at original release. Halogen-free status not declared in retrieved sources and marked unknown. Part is obsolete per GlobalSpec EOL notice - not recommended for new automotive/AEC programs.

Données vérifiées le : 2026-09-07 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EP1K30FC256-1N EP1K30FC256-1N datasheet Altera EP1K30FC256-1N Intel ACEX-1K FPGA 256-BGA ACEX-1K 30K gate FPGA EP1K30FC256-1N obsolete replacement EP1K30FC256-1N vs EP1K30FC256-3N EP1K30FC256-1N pinout 256-FBGA buy EP1K30FC256-1N EP1K30 lead-free RoHS ACEX-1K configuration PROM EPC2 EP1K30FC256-1N industrial control Cyclone IV replacement ACEX-1K what is EP1K30FC256-1N EP1K30FC256-1N price 1000

Composants & termes associés

Intel Altera EP1K30FC256-1N EP1K30FC256-3N EP1K30FC256-1 EP1K30FC256-2N ACEX-1K FPGA Field Programmable Gate Array Programmable Logic Device BGA FineLine BGA 256-ball FBGA Logic Element Embedded Array Block EAB SRAM JTAG IEEE 1149.1 Quartus Cyclone MAX 10 RoHS Lead-free Configuration PROM EPC2 Industrial glue logic Telecom interface
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