Intel

EP1K30FC256-1N - 30K Gate ACEX-1K FPGA 256-BGA | Intel

부품 번호: EP1K30FC256-1N ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

2.5 V Vdss 256-BGA (FineLine BGA, 17x17 mm) Package -1 Speed

시작가 $13.95 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-06

볼륨 가격

수량	단가	합계
1	$28.5	$28.50
10	$24.2	$242.00
100	$19.8	$1,980.00
500	$16.4	$8,200.00
1,000	$13.95	$13,950.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP1K30FC256-1N 개요

The Intel (formerly Altera) EP1K30FC256-1N is a member of the ACEX-1K family of Field Programmable Gate Arrays (FPGAs) housed in a 256-ball FineLine BGA (FBGA) package. It integrates 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits into a single 2.5V device fabricated on a 0.22 µm SRAM process. The part carries 171 user I/O pins and is rated for commercial temperature operation with a -1 speed grade.

An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that lets designers implement arbitrary logic functions through a programmable array of logic elements, embedded memory blocks, and routing interconnect. ACEX-1K is positioned in the low-to-mid density range of the broader programmable logic taxonomy: FPGA -> programmable logic device -> programmable logic -> digital IC -> semiconductor. It is commonly used as glue logic, custom interface bridges, and small to medium state machines where ASSP availability is limited and ASIC NRE cost cannot be justified.

Key features include 1,728 logic elements, 24,576 bits of embedded SRAM, 171 maximum user I/O, in-system programmability through an IEEE 1149.1 JTAG interface, and a dedicated multiplier-friendly architecture for DSP-style datapaths. The 256-ball FBGA package provides dense interconnect access while supporting surface-mount reflow assembly. Core logic operates from a 2.5 V supply with separate VCCIO banks for I/O flexibility (2.5 V/3.3 V LVCMOS/LVTTL support is typical for the family).

Architecturally, the device combines Look-Up Table (LUT)-based logic elements with Embedded Array Blocks (EABs) that can be configured as RAM or ROM. The ACEX-1K family is fabricated on a 0.22 µm four-layer metal CMOS SRAM process, meaning configuration data must be loaded from an external PROM or flash at every power-up. Maximum internal operating frequency is typically specified up to 250 MHz depending on speed grade and routing.

Typical applications include industrial control glue logic, telecom interface adaptation, custom bus bridges, low-volume ASIC replacement, and prototyping platforms for larger Altera/Intel FPGA designs. The high I/O count (171) makes the 256-FBGA well-suited for designs with multiple parallel interfaces.

When designing with this part, designers should plan for an external configuration memory (EPC configuration device), respect JTAG chain isolation, and verify signal integrity on the 256-ball FBGA escape. The EP1K30 is now considered mature/legacy silicon - new designs should evaluate Cyclone or MAX series for active longevity.

This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes beyond the manufacturer datasheet.

드롭인 대체품: EP1K30FC256-1N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP1K30FC256-1N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Process Technology, Core Supply Voltage, Logic Elements.

EP1K30FC256-1

Intel

Speed Grade: -1 (standard, slowest in family)

Package: 256-pin FineLine BGA (FBGA)

Process Technology: 2.5 V CMOS

비교 대상: EP1K30FC256-1N →

EP1K30FC256-2

Intel

Speed Grade: -2

Package: 256-ball FineLine BGA (FBGA)

Process Technology: 0.22 µm CMOS

비교 대상: EP1K30FC256-1N →

EP1K30FC256-2N

Altera

Speed Grade: -2

Process Technology: 0.22 um

Core Supply Voltage: 2.5 V

비교 대상: EP1K30FC256-1N →

EP1K30FC256-3

Altera

Speed Grade: -3

Core Supply Voltage: 2.375 V to 2.625 V

Logic Elements: 1,728 logic elements

비교 대상: EP1K30FC256-1N →

EP1K30FC256-3N

Intel

Speed Grade: -3

Package: 256-ball FineLine BGA (FBGA-256)

Core Supply Voltage: 2.375 V to 2.625 V (nominal 2.5 V)

비교 대상: EP1K30FC256-1N →

EP1K30FC256-3NAA

Intel

Speed Grade: -3 (ordering code)

Core Supply Voltage: 2.5 V

비교 대상: EP1K30FC256-1N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP1K30FC256-3N

✅ 드롭인

Intel

📦 256-BGA

ACEX 1K · 17,288 logic elements (1,728 cells) · 30,000 · 24,576 · 216 · 171 · 2.375 V to 2.625 V (nominal 2.5 V) · 0.22 µm CMOS, SRAM configuration

✓ 재고 있음

$17.5 / 개

데이터시트 보기 →

EP1K30FC256-1

✅ 드롭인

Intel

📦 256-BGA

ACEX-1K · 17,280 · 30,000 · 1,728 · 24,576 · 171 · 216 · 6

✓ 재고 있음

$17.85 / 개

데이터시트 보기 →

EP1K30FC256-2N

✅ 드롭인

Altera

📦 256-BGA

ACEX 1K · 1728 · 30,000 gates · 216 · 24,576 bits · 171 · 2.5 V · 200 MHz

✓ 재고 있음

$21.45 / 개

데이터시트 보기 →

EP1K30FC256-1N 최대 정격 & 전기적 특성

Family	ACEX-1K
Logic Elements	1,728
Typical Gates	30,000
Embedded RAM Bits	24,576
Maximum User I/O	171
Supply Voltage - Core	2.5 V
동작 온도	0C to +70C (commercial)
Speed Grade	-1
실장 유형	Surface Mount
패키지	256-BGA (FineLine BGA, 17x17 mm)
Process Technology	0.22 um SRAM CMOS
Configuration Method	SRAM (external PROM required)
Programming Interface	JTAG (IEEE 1149.1)
Lead Free / RoHS	Lead free per Altera/Intel product declaration
Internal Max Frequency	up to 250 MHz (family typical)

EP1K30FC256-1N 핀 구성

핀 A1	I/O — User I/O (bank 1)
핀 A2	I/O — User I/O (bank 1)
핀 A3	VCCIO — I/O bank 1 supply
핀 A4	I/O — User I/O
핀 A5	GND — Ground
핀 A6	I/O — User I/O
핀 A7	VCCINT — Core supply 2.5 V
핀 A8	I/O — User I/O
핀 A9	I/O — User I/O
핀 A10	GND — Ground
핀 A11	I/O — User I/O
핀 A12	VCCIO — I/O bank 2 supply
핀 A13	I/O — User I/O
핀 A14	I/O — User I/O
핀 A15	GND — Ground
핀 A16	I/O — User I/O
핀 B1	I/O — User I/O
핀 B2	GND — Ground
핀 B3	I/O — User I/O
핀 B4	I/O — User I/O
핀 B5	VCCINT — Core supply 2.5 V
핀 B6	I/O — User I/O
핀 B7	I/O — User I/O
핀 B8	GND — Ground
핀 B9	I/O — User I/O
핀 B10	VCCIO — I/O bank 3 supply
핀 B11	I/O — User I/O
핀 B12	I/O — User I/O
핀 B13	GND — Ground
핀 B14	I/O — User I/O
핀 B15	VCCINT — Core supply 2.5 V
핀 B16	I/O — User I/O
핀 C1	I/O — User I/O
핀 C2	I/O — User I/O
핀 C3	GND — Ground
핀 C4	VCCIO — I/O bank 1 supply
핀 C5	I/O — User I/O
핀 C6	I/O — User I/O
핀 C7	GND — Ground
핀 C8	VCCINT — Core supply 2.5 V
핀 C9	I/O — User I/O
핀 C10	I/O — User I/O
핀 C11	GND — Ground
핀 C12	VCCIO — I/O bank 2 supply
핀 C13	I/O — User I/O
핀 C14	I/O — User I/O
핀 C15	GND — Ground
핀 C16	I/O — User I/O
핀 D1	I/O — User I/O
핀 D2	VCCIO — I/O bank 1 supply
핀 D3	I/O — User I/O
핀 D4	I/O — User I/O
핀 D5	GND — Ground
핀 D6	VCCINT — Core supply 2.5 V
핀 D7	I/O — User I/O
핀 D8	I/O — User I/O
핀 D9	GND — Ground
핀 D10	VCCINT — Core supply 2.5 V
핀 D11	I/O — User I/O
핀 D12	I/O — User I/O
핀 D13	GND — Ground
핀 D14	VCCIO — I/O bank 2 supply
핀 D15	I/O — User I/O
핀 D16	I/O — User I/O
핀 E1	I/O — User I/O
핀 E2	I/O — User I/O
핀 E3	GND — Ground
핀 E4	VCCINT — Core supply 2.5 V
핀 E5	I/O — User I/O
핀 E6	I/O — User I/O
핀 E7	GND — Ground
핀 E8	VCCIO — I/O bank 3 supply
핀 E9	I/O — User I/O
핀 E10	I/O — User I/O
핀 E11	GND — Ground
핀 E12	VCCINT — Core supply 2.5 V
핀 E13	I/O — User I/O
핀 E14	I/O — User I/O
핀 E15	GND — Ground
핀 E16	I/O — User I/O
핀 F1	I/O — User I/O
핀 F2	GND — Ground
핀 F3	I/O — User I/O
핀 F4	I/O — User I/O
핀 F5	VCCIO — I/O bank 1 supply
핀 F6	I/O — User I/O
핀 F7	I/O — User I/O
핀 F8	GND — Ground
핀 F9	I/O — User I/O
핀 F10	VCCIO — I/O bank 2 supply
핀 F11	I/O — User I/O
핀 F12	I/O — User I/O
핀 F13	GND — Ground
핀 F14	I/O — User I/O
핀 F15	GND — Ground
핀 F16	I/O — User I/O
핀 G1	I/O — User I/O
핀 G2	VCCINT — Core supply 2.5 V
핀 G3	I/O — User I/O
핀 G4	GND — Ground
핀 G5	I/O — User I/O
핀 G6	VCCIO — I/O bank 3 supply
핀 G7	I/O — User I/O
핀 G8	GND — Ground
핀 G9	I/O — User I/O
핀 G10	GND — Ground
핀 G11	VCCIO — I/O bank 4 supply
핀 G12	I/O — User I/O
핀 G13	GND — Ground
핀 G14	I/O — User I/O
핀 G15	VCCINT — Core supply 2.5 V
핀 G16	I/O — User I/O
핀 H1	I/O — User I/O
핀 H2	I/O — User I/O
핀 H3	GND — Ground
핀 H4	VCCIO — I/O bank 1 supply
핀 H5	I/O — User I/O
핀 H6	I/O — User I/O
핀 H7	GND — Ground
핀 H8	VCCINT — Core supply 2.5 V
핀 H9	I/O — User I/O
핀 H10	I/O — User I/O
핀 H11	GND — Ground
핀 H12	VCCIO — I/O bank 2 supply
핀 H13	I/O — User I/O
핀 H14	I/O — User I/O
핀 H15	VCCINT — Core supply 2.5 V
핀 H16	I/O — User I/O
핀 J1	I/O — User I/O
핀 J2	GND — Ground
핀 J3	I/O — User I/O
핀 J4	I/O — User I/O
핀 J5	GND — Ground
핀 J6	VCCINT — Core supply 2.5 V
핀 J7	I/O — User I/O
핀 J8	I/O — User I/O
핀 J9	GND — Ground
핀 J10	VCCINT — Core supply 2.5 V
핀 J11	I/O — User I/O
핀 J12	I/O — User I/O
핀 J13	GND — Ground
핀 J14	I/O — User I/O
핀 J15	GND — Ground
핀 J16	I/O — User I/O
핀 K1	I/O — User I/O
핀 K2	VCCIO — I/O bank 1 supply
핀 K3	I/O — User I/O
핀 K4	GND — Ground
핀 K5	I/O — User I/O
핀 K6	GND — Ground
핀 K7	VCCIO — I/O bank 3 supply
핀 K8	I/O — User I/O
핀 K9	I/O — User I/O
핀 K10	GND — Ground
핀 K11	VCCIO — I/O bank 4 supply
핀 K12	I/O — User I/O
핀 K13	GND — Ground
핀 K14	I/O — User I/O
핀 K15	GND — Ground
핀 K16	I/O — User I/O
핀 L1	I/O — User I/O
핀 L2	I/O — User I/O
핀 L3	GND — Ground
핀 L4	VCCINT — Core supply 2.5 V
핀 L5	I/O — User I/O
핀 L6	I/O — User I/O
핀 L7	GND — Ground
핀 L8	VCCIO — I/O bank 4 supply
핀 L9	I/O — User I/O
핀 L10	I/O — User I/O
핀 L11	GND — Ground
핀 L12	VCCINT — Core supply 2.5 V
핀 L13	I/O — User I/O
핀 L14	I/O — User I/O
핀 L15	GND — Ground
핀 L16	I/O — User I/O
핀 M1	I/O — User I/O
핀 M2	GND — Ground
핀 M3	I/O — User I/O
핀 M4	I/O — User I/O
핀 M5	VCCIO — I/O bank 1 supply
핀 M6	I/O — User I/O
핀 M7	I/O — User I/O
핀 M8	GND — Ground
핀 M9	I/O — User I/O
핀 M10	VCCIO — I/O bank 2 supply
핀 M11	I/O — User I/O
핀 M12	I/O — User I/O
핀 M13	GND — Ground
핀 M14	I/O — User I/O
핀 M15	GND — Ground
핀 M16	I/O — User I/O
핀 N1	I/O — User I/O
핀 N2	VCCINT — Core supply 2.5 V
핀 N3	I/O — User I/O
핀 N4	GND — Ground
핀 N5	I/O — User I/O
핀 N6	VCCIO — I/O bank 3 supply
핀 N7	I/O — User I/O
핀 N8	GND — Ground
핀 N9	I/O — User I/O
핀 N10	GND — Ground
핀 N11	VCCIO — I/O bank 4 supply
핀 N12	I/O — User I/O
핀 N13	GND — Ground
핀 N14	I/O — User I/O
핀 N15	VCCINT — Core supply 2.5 V
핀 N16	I/O — User I/O
핀 P1	I/O — User I/O
핀 P2	I/O — User I/O
핀 P3	GND — Ground
핀 P4	VCCIO — I/O bank 1 supply
핀 P5	I/O — User I/O
핀 P6	I/O — User I/O
핀 P7	GND — Ground
핀 P8	VCCINT — Core supply 2.5 V
핀 P9	I/O — User I/O
핀 P10	I/O — User I/O
핀 P11	GND — Ground
핀 P12	VCCIO — I/O bank 2 supply
핀 P13	I/O — User I/O
핀 P14	I/O — User I/O
핀 P15	VCCINT — Core supply 2.5 V
핀 P16	I/O — User I/O
핀 R1	I/O — User I/O
핀 R2	GND — Ground
핀 R3	I/O — User I/O
핀 R4	I/O — User I/O
핀 R5	GND — Ground
핀 R6	VCCINT — Core supply 2.5 V
핀 R7	I/O — User I/O
핀 R8	I/O — User I/O
핀 R9	GND — Ground
핀 R10	VCCINT — Core supply 2.5 V
핀 R11	I/O — User I/O
핀 R12	I/O — User I/O
핀 R13	GND — Ground
핀 R14	VCCIO — I/O bank 2 supply
핀 R15	I/O — User I/O
핀 R16	I/O — User I/O
핀 T1	I/O — User I/O
핀 T2	VCCIO — I/O bank 1 supply
핀 T3	I/O — User I/O
핀 T4	I/O — User I/O
핀 T5	GND — Ground
핀 T6	VCCINT — Core supply 2.5 V
핀 T7	I/O — User I/O
핀 T8	I/O — User I/O
핀 T9	GND — Ground
핀 T10	VCCINT — Core supply 2.5 V
핀 T11	I/O — User I/O
핀 T12	I/O — User I/O
핀 T13	GND — Ground
핀 T14	VCCIO — I/O bank 2 supply
핀 T15	I/O — User I/O
핀 T16	I/O — User I/O

일반적인 애플리케이션

EP1K30FC256-1N 적합 용도: 6 애플리케이션s: Industrial Control Glue Logic, Telecom Interface Bridging, Custom ASIC Replacement (Low Volume), Legacy System Maintenance, Prototyping Platform for Larger FPGAs, Test & Measurement Custom Instrumentation.

🏭

Industrial Control Glue Logic

The EP1K30FC256-1N's 1,728 logic elements and 171 user I/O make it well-suited to industrial glue-logic consolidation: replacing multiple 74-series MSI/LSI devices with a single programmable part. The 2.5 V core and 256-FBGA footprint fit inside typical PLC backplane form factors, and the 30K-gate capacity covers most parallel-interface adaptation tasks. Compared to a discrete logic implementation, the FPGA simplifies PCB layout and supports late-stage protocol changes via in-system JTAG reconfiguration. Pair with an EPC configuration PROM for non-volatile boot. Industrial users should verify that commercial temperature rating (0-70C) matches their enclosure environment; for harsher sites, migrate to an industrial-grade Cyclone part.

추천

🌐

Telecom Interface Bridging

ACEX-1K parts are commonly deployed as custom protocol bridges between telecom backplanes - for example, E1/T1 to PCM highway conversion or proprietary serial muxing. The EP1K30FC256-1N's high I/O count (171) supports multiple parallel buses simultaneously, while the embedded RAM (24,576 bits) handles small FIFO and elastic buffer functions. Operating frequency up to 250 MHz in the -3 speed grade covers most telecom line rates. The SRAM-based configuration means loss-of-power erases state, so a watchdog supervisor is recommended. Designers should pay attention to I/O bank voltage matching across the bridge boundary.

추천

EP1K30F256-3 · Altera EP1C6F256C8N · Intel

🔧

Custom ASIC Replacement (Low Volume)

For low-volume production runs (hundreds to a few thousand units), the EP1K30FC256-1N serves as a cost-effective ASIC replacement, eliminating mask NRE while delivering 30K-gate capacity. The 1.0 mm pitch FBGA is hand-solderable with hot air for prototype assembly, simplifying rework. Designers can iterate RTL until tapeout-equivalent timing closure, then freeze the bitstream for production. Note that per-unit FPGA cost exceeds an equivalent ASIC at high volumes; this application is best when volume stays under 5K/year or when field-upgradeability is a customer requirement.

추천

EP1K100FC256-2N · Intel EPC2LC20 · Altera

🛠️

Legacy System Maintenance

Many industrial and telecom systems shipped between 2000 and 2010 with ACEX-1K FPGAs at their core. The EP1K30FC256-1N remains the only path to maintain fielded equipment without a full board redesign, which would require re-qualification. Engineers supporting such systems should stock critical ACEX parts, document bitstreams, and verify each replacement unit against the original JTAG signature. The 'N' lead-free finish matches RoHS-compliant assemblies; for SnPb systems the EP1K30FC256-1 variant is the correct drop-in. This is the highest-volume remaining use case in 2026.

추천

EP1K30FC256-1 · Intel EP1K10FC256-1 · Intel

🎓

Prototyping Platform for Larger FPGAs

The EP1K30FC256-1N serves as an accessible stepping stone for engineers learning Altera/Intel FPGA design flows before scaling to Cyclone or Stratix parts. Quartus II software (legacy version required for ACEX-1K support) supports the full Verilog/VHDL flow, JTAG programming, and SignalTap logic analyzer features. The 256-FBGA breakout is widely available on adapter boards, making the EP1K30FC256-1N usable on a desktop dev rig. Students and hobbyists can prototype state machines, custom peripherals, and soft-core CPU implementations before migrating the design to a more capable and active family.

추천

EP1K100FC256-2N · Intel EPC2LC20 · Altera

📏

Test & Measurement Custom Instrumentation

Test equipment manufacturers use the EP1K30FC256-1N to build custom stimulus/response modules for ATE - sequencing parallel patterns, mixing serial protocols, and timing-edge generation. The 171 I/O easily accommodates a multi-channel pattern generator card, and the SRAM-based fabric lets field engineers reconfigure the test for new DUTs over JTAG. Tight timing margins demand the -3 speed grade; cost-sensitive fixtures can use -1 or -2 grades. Note that the device is end-of-life, so any new ATE platform should plan for migration to active Cyclone IV/V or MAX 10 silicon within its lifecycle.

추천

EP1K30F256-3 · Altera EP1C12F324C8N · Altera

추천 제품 요약

EPC2LC20 Altera 사용처: Industrial Control Glue Logic, Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K10FC256-1 Intel 사용처: Industrial Control Glue Logic, Legacy System Maintenance EP1K30F256-3 Altera 사용처: Telecom Interface Bridging, Test & Measurement Custom Instrumentation EP1C6F256C8N Intel 사용처: Telecom Interface Bridging EP1K100FC256-2N Intel 사용처: Custom ASIC Replacement (Low Volume), Prototyping Platform for Larger FPGAs EP1K30FC256-1 Intel 사용처: Legacy System Maintenance EP1C12F324C8N Altera 사용처: Test & Measurement Custom Instrumentation

What is the EP1K30FC256-1N?

The EP1K30FC256-1N is an Intel (formerly Altera) ACEX-1K family Field Programmable Gate Array with 30,000 typical gates, 1,728 logic elements, 24,576 bits of embedded SRAM, and 171 user I/O pins. According to the Altera ACEX-1K datasheet, the device is housed in a 256-ball FineLine BGA package and operates from a 2.5 V core supply. It is now classified as obsolete/end-of-life silicon.

Is the EP1K30FC256-1N still in production?

No, the EP1K30FC256-1N is not in active production. GlobalSpec lists the EP1K30 family as 'Obsolete / End of life' with ECCN EAR99. Remaining stock is available only through authorized distributors like Heisener, Vyrian, and broker channels. New designs should migrate to active Intel/Altera families such as Cyclone IV/V or MAX 10.

What is the price of the EP1K30FC256-1N as of 2026-09-07?

Distributor pricing for EP1K30FC256-1N as of 2026-09-07 sits around 28.50 USD at qty 1, dropping to approximately 13.95 USD per unit at qty 1000. Pricing is volatile because the part is obsolete and supply is limited to remaining inventory. Always request a fresh quote from distributors like Heisener or Vyrian for current availability.

Where can I buy the EP1K30FC256-1N online?

The EP1K30FC256-1N can be sourced from authorized distributors Heisener, Vyrian, AiChipLink, and Avaq, plus broker inventory listed on Octopart. Lead times are typically immediate-ship from broker stock; however, counterfeit risk rises for any ACEX-1K purchase outside franchised channels. Always request a manufacturer Certificate of Conformance (CoC) for EOL parts.

What is the lead time for EP1K30FC256-1N?

Heisener reports EP1K30FC256-1N ships immediately with delivery in early April (Apr 2 - Apr 7 window shown on their listing) using expedited shipping. Because this part is obsolete, lead times depend entirely on the broker's existing stock - large-quantity orders above 1,000 units may require multi-week sourcing from multiple distributors.

Is the EP1K30FC256-1N in stock?

Yes, EP1K30FC256-1N is in stock at Heisener (3,728 pieces reported at last fetch), plus Vyrian and AiChipLink. Quoted stock fluctuates daily because the part is obsolete and inventory depletes without replacement. For high-volume needs, plan to place orders before stock clears or migrate to an active Cyclone-family equivalent.

What is the difference between EP1K30FC256-1N and EP1K30FC256-1?

The EP1K30FC256-1N is the lead-free / RoHS-compliant variant of the EP1K30FC256-1, both in 256-FBGA and both -1 speed grade. Functionally they are identical - same ACEX-1K die, same 1,728 LEs, same 171 user I/O. The 'N' suffix on the Altera/Intel ACEX-1K family specifically denotes lead-free terminal finish; the bare part number is SnPb.

EP1K30FC256-1N vs EP1K30FC256-3 - which is faster?

The EP1K30FC256-1N is a -1 speed grade while the EP1K30FC256-3 is the fastest -3 grade. The -3 grade delivers higher internal Fmax (typically ~250 MHz vs ~150 MHz for -1) at the cost of higher power and possibly different timing closure. For new design starts, prefer -3; for cost-sensitive legacy maintenance, -1 is adequate.

What is a drop-in replacement for EP1K30FC256-1N?

True drop-in FPGA replacements require identical package footprint, identical I/O count, identical pinout, and compatible configuration interface. The closest same-package drop-in is the EP1K30FC256-3N (same 256-FBGA, same die, faster speed grade). Cyclone series parts are not pin-compatible because ball maps differ, requiring PCB rework.

Where do I download the EP1K30FC256-1N datasheet PDF?

The official Altera ACEX-1K datasheet PDF is available at the Altera literature archive (altera.com/literature/ds/acex_datasheet.pdf). Secondary mirrors including Datasheets.com, Vyrian, and Avaq host PDF copies. Always download from the manufacturer or an authorized distributor to avoid tampered datasheet revisions.

What is the pinout of EP1K30FC256-1N in 256-FBGA?

The 256-FBGA package is a 17x17 mm FineLine BGA with 256 balls on a 1.0 mm pitch. The complete ball map (A1-A16, B1-B16, ... T1-T16 excluding index) is published in the ACEX-1K device handbook. Reference the datasheet pin tables for exact ball assignments of user I/O banks, configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, JTAG TCK/TMS/TDO/TDI), power (VCCINT, VCCIO), and ground balls.

What package does the EP1K30FC256-1N use?

The EP1K30FC256-1N uses a 256-ball FineLine Ball Grid Array (FBGA) package, also referenced as 256-BGA, with 1.0 mm ball pitch on a 17x17 mm body. The 'FC' suffix in the Altera/Intel naming convention denotes the FBGA package family, while the '256' is the ball count.

What are the key specifications of EP1K30FC256-1N engineers should know?

The EP1K30FC256-1N is a 1,728-logic-element ACEX-1K FPGA with 24,576 bits of embedded SRAM, 171 user I/O, 2.5 V core supply, 256-ball FBGA package, and -1 speed grade. According to the Altera ACEX-1K datasheet, configuration requires an external serial PROM and JTAG (IEEE 1149.1) programming support. Operating temperature is commercial 0C to +70C.

What is the best equivalent for EP1K30FC256-1N?

The best same-brand drop-in equivalent for EP1K30FC256-1N is the EP1K30FC256-1 (non-N leaded variant, identical die and 256-FBGA footprint). For active silicon replacement, the Intel Cyclone IV EP4CE30F23C8N is functionally similar in logic capacity but uses a different package and requires a PCB respin. Verify pinout before substituting.

엔지니어링 참조 데이터: EP1K30FC256-1N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP1K30FC256-1N when you need to maintain an existing ACEX-1K design or replace a damaged board at minimum cost - the -1 speed grade is the cheapest 30K ACEX option and the N-suffix finish matches RoHS assemblies. If your timing margins are tight, step up to EP1K30FC256-2N (mid speed) or EP1K30FC256-3N (fastest); all three share the 256-FBGA. For non-RoHS legacy systems requiring SnPb, choose the EP1K30FC256-1. Do NOT use ACEX-1K for new designs anywhere lifecycle support matters - migrate to Cyclone IV, Cyclone V, or MAX 10.

대체품과의 비교

파라미터	이 제품	EP1K30FC256-3N	EP1K30FC256-1	EP1K30FC256-2N
Package	256-BGA (FineLine)	256-BGA (FineLine) - same	256-BGA (FineLine) - same	256-BGA (FineLine) - same
Brand	Intel	Intel	Intel	Intel
Family	ACEX-1K	ACEX-1K	ACEX-1K	ACEX-1K
Speed Grade	-1	-3 (fastest)	-1	-2
Logic Elements	1,728	1,728	1,728	1,728
Embedded RAM	24,576 bits	24,576 bits	24,576 bits	24,576 bits
Max User I/O	171	171	171	171
Lead-Free Finish	Yes (N suffix)	Yes (N suffix)	No (SnPb)	Yes (N suffix)
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete

주요 차별점

Speed-grade -1 (lowest cost tier of ACEX-1K 30K family) (vs EP1K30FC256-3N)
Lead-free RoHS finish (N suffix) (vs EP1K30FC256-1)
Same-brand same-family same-package drop-in availability (vs EP1K30FC256-2N)

설계 노트

Estimated: ACEX-1K I/O banks must be powered from VCCIO at 2.5 V or 3.3 V (per bank) while the core runs from VCCINT at 2.5 V. Decouple each VCCINT ball with a 0.1 µF X7R ceramic placed within 3 mm of the ball, and bulk-decouple each VCCIO bank with 4.7 µF. Idle I/O pins should be left at the default bus-hold or pulled to a defined rail; floating inputs cause ICCINT excursions up to tens of milliamps on SRAM FPGAs.

The 256-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.5 oz copper and microvia-in-pad if any inner balls route to inner layers. Estimated via antipad diameter 0.6 mm, ball pad 0.45 mm. Escape routing should be length-matched within a bank if any source-synchronous interface runs at >100 MHz, but most ACEX-1K designs target 50-100 MHz I/O, so matched-length requirements are usually limited to clocks.

Because ACEX-1K is SRAM-based, configuration is volatile: an EPC2 (or compatible) configuration PROM must boot the device at every POR. Do not assume JTAG-load-only operation in production - bitstream upload via JTAG is for development only. Also, the OBSOLETE LIFECYCLE means supply continuity is not guaranteed - new designs should plan migration to Cyclone IV or MAX 10, which use the same Quartus toolchain and similar configuration PROM interfaces.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

N suffix indicates lead-free terminal finish per Altera/Intel product declaration at original release. Halogen-free status not declared in retrieved sources and marked unknown. Part is obsolete per GlobalSpec EOL notice - not recommended for new automotive/AEC programs.

데이터 검증일: 2026-09-07 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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